CN205069685U - Flat LED lead frame - Google Patents
Flat LED lead frame Download PDFInfo
- Publication number
- CN205069685U CN205069685U CN201520897480.6U CN201520897480U CN205069685U CN 205069685 U CN205069685 U CN 205069685U CN 201520897480 U CN201520897480 U CN 201520897480U CN 205069685 U CN205069685 U CN 205069685U
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- lead frame
- led lead
- sheet
- type led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a flat LED lead frame, including a plurality of frame unit (2) that are used for bearing LED chip (1), all be equipped with between two adjacent frame unit (2) passageway (3), passageway (3) in all be equipped with epoxy piece (4), every frame unit (2) all include two copper sheets, two copper sheets between connect through epoxy piece (5). Above -mentioned flat LED lead frame's preparation simple process, heat -conduction are efficient and can guarantee that the luminous angle is big.
Description
Technical field
The utility model relates to a kind of lead frame, is specifically a kind of plate type LED lead frame.
Background technology
Lead frame, as the chip carrier of integrated circuit, is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material, forms the key structure part of electric loop.It serves the function served as bridge be connected with outer lead, and all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
The flat LED lead frame of prior art is ceramic-type LED lead frame, namely pottery is adopted to make, a positive pole copper sheet and a negative pole copper sheet is equipped with in the ceramic top and bottom of dull and stereotyped inner use, also be provided with for electric conductor through hole at upper and lower end copper sheet, two panels positive pole copper sheet, two panels negative pole copper sheet are all connected by electric conductor.The ceramic-type LED lead frame of said structure has the following disadvantages: 1, due to the complex manufacturing technology of pottery, therefore can cause that the production cost of existing ceramic-type LED lead frame is high and production efficiency is low.2, the thermal conductivity due to pottery is poor compared with metal, therefore delivered heat need be gone out by copper sheet, electric conductor, copper sheet three by ceramic-type LED lead frame, because its radiator structure is comparatively complicated, therefore its heat conduction efficiency is low, thus can only make the little LED lead frame of power output.3, because the LED chip of existing ceramic-type LED lead frame is in bowl bodies, therefore its light sent easily is covered by bowl bodies, thus makes its lighting angle less.
Utility model content
The technical problems to be solved in the utility model is, provides that a kind of manufacture craft is simple, heat conduction efficiency is high and can ensure the plate type LED lead frame that light source luminescent angle is large.
The technical solution of the utility model is, provides a kind of plate type LED lead frame, comprises multiple frame unit for carrying LED chip, is equipped with passage, is equipped with epoxy resin block in described passage between adjacent two frame units; Each frame unit includes two panels copper sheet, is connected between described two panels copper sheet by epoxy sheet.
Described two panels copper sheet is made up of the first copper sheet and the second copper sheet, and the area of described first copper sheet is more than or equal to the area of the second copper sheet.
The upper surface of described epoxy sheet and lower surface respectively with the upper surface of two panels copper sheet and lower surface in same level.
After adopting above structure, the utility model compared with prior art, has the following advantages:
The each frame unit of the utility model plate type LED lead frame includes two panels copper sheet, is connected between described two panels copper sheet by epoxy sheet.1, the manufacture craft due to epoxy sheet is simple, therefore ensure that the production cost of the utility model plate type LED lead frame is low and production efficiency is high.2, because the heat radiation of the utility model plate type LED lead frame is directly undertaken by copper sheet, instead of delivered heat is gone out by copper sheet, electric conductor, copper sheet three in the past, because radiator structure is simple, therefore its heat conduction efficiency is high, thus can make the large LED lead frame of power output.3, because LED chip is connected directly between on copper sheet, therefore its light sent can not be covered by other objects, thus makes its lighting angle larger.
Accompanying drawing explanation
Fig. 1 is the part-structure schematic diagram (etched frame) of the utility model plate type LED lead frame.
Fig. 2 is the part-structure schematic diagram (shaping frame) of the utility model plate type LED lead frame.
Fig. 3 is the johning knot composition of frame unit and LED chip.
Shown in figure 1, LED chip, 2, frame unit, 3, passage, 4, epoxy resin block, 5, epoxy sheet, the 6, first copper sheet, the 7, second copper sheet, 8, contiguous block.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, a kind of plate type LED lead frame of the utility model, comprising multiple frame unit 2 for carrying LED chip 1, being equipped with passage 3 between adjacent two frame units 2; In the present embodiment, be equipped with contiguous block 8 between adjacent two frame units 2, but this contiguous block 8 can be fractureed; Epoxy resin block 4 is equipped with in described passage 3; Each frame unit 2 includes two panels copper sheet, is connected between described two panels copper sheet by epoxy sheet 5.In the present embodiment, epoxy resin block 4 and epoxy sheet 5 are one-shot forming.
Described two panels copper sheet is made up of the first copper sheet 6 and the second copper sheet 7, the area of described first copper sheet 6 is more than or equal to the area of the second copper sheet 7, namely the area of described first copper sheet 6 is greater than the area of the second copper sheet 7, or the area of described first copper sheet 6 equals the area of the second copper sheet 7.
The upper surface of described epoxy sheet 5 and lower surface respectively with the upper surface of two panels copper sheet and lower surface in same level.
Below only just most preferred embodiment of the present utility model is described, but can not be interpreted as it is limitations on claims.The utility model is not limited only to above embodiment, and its concrete structure allows to change.In every case the various change done in the protection range of the utility model independent claims is all in protection range of the present utility model.
Claims (3)
1. a plate type LED lead frame, it is characterized in that: comprise multiple frame unit (2) for carrying LED chip (1), be equipped with passage (3) between adjacent two frame units (2), in described passage (3), be equipped with epoxy resin block (4); Each frame unit (2) includes two panels copper sheet, is connected between described two panels copper sheet by epoxy sheet (5).
2. plate type LED lead frame according to claim 1, it is characterized in that: described two panels copper sheet is made up of the first copper sheet (6) and the second copper sheet (7), the area of described first copper sheet (6) is more than or equal to the area of the second copper sheet (7).
3. plate type LED lead frame according to claim 1, is characterized in that: the upper surface of described epoxy sheet (5) and lower surface respectively with the upper surface of two panels copper sheet and lower surface in same level.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520897480.6U CN205069685U (en) | 2015-11-12 | 2015-11-12 | Flat LED lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520897480.6U CN205069685U (en) | 2015-11-12 | 2015-11-12 | Flat LED lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205069685U true CN205069685U (en) | 2016-03-02 |
Family
ID=55396198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520897480.6U Active CN205069685U (en) | 2015-11-12 | 2015-11-12 | Flat LED lead frame |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205069685U (en) |
-
2015
- 2015-11-12 CN CN201520897480.6U patent/CN205069685U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201787386U (en) | Metal substrate LED module for illumination | |
CN201599769U (en) | LED street lamp with over-current heat-dissipating function | |
CN202972633U (en) | Packaging structure capable of realizing omni-directional LED (Light Emitting Diode) lighting by utilizing transparent ceramic COB (Chip on Board) substrate | |
CN202719394U (en) | Ceramic seat light-emitting diode (LED) illuminating lamp | |
CN205264699U (en) | Energy -efficient LED filament | |
CN201910445U (en) | Light-emitting diode (LED) packaging structure | |
CN205069685U (en) | Flat LED lead frame | |
CN205248302U (en) | LED photo engine structure | |
CN205065472U (en) | A superconductive aluminium base board of thermoelectric separation for projecting lamp | |
CN205261246U (en) | LED (light -emitting diode) lamp component | |
CN204011481U (en) | The separated also high reflectance circuit board of integrated LED chip of electric heating | |
CN203950803U (en) | Luminescent device | |
CN203812909U (en) | LED filament transparent ceramic substrate | |
CN203367274U (en) | LED packaging structure | |
CN102544300A (en) | LED packaging structure | |
CN201884982U (en) | Novel LED (light-emitting diode) light source module encapsulation structure | |
CN201732809U (en) | Encapsulating structure of LED lighting source | |
CN205264751U (en) | Low thermal resistance LED light source | |
CN205069686U (en) | LED punctiform formula COB module | |
CN204592990U (en) | For the multicore array integrated morphology of LED light source | |
CN205050873U (en) | Exchange LED light source | |
CN203596351U (en) | LED-COB (chip on board) light source | |
CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
CN204011480U (en) | A kind of electric heating separates the also circuit board of integrated LED chip | |
CN203927821U (en) | A kind of high-efficiency heat radiating LED aluminium base |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |