CN203871319U - Novel lead frame of chip mounting power device - Google Patents
Novel lead frame of chip mounting power device Download PDFInfo
- Publication number
- CN203871319U CN203871319U CN201420209033.2U CN201420209033U CN203871319U CN 203871319 U CN203871319 U CN 203871319U CN 201420209033 U CN201420209033 U CN 201420209033U CN 203871319 U CN203871319 U CN 203871319U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- intercell connector
- power device
- slide glass
- district
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims description 21
- 210000003205 muscle Anatomy 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The utility model provides a novel lead frame of a chip mounting power device. The lead frame comprises upper and lower edge belts (1) and a plurality of lead frame unit bodies arranged in a matrix way in the edge belts (1); each of the lead frame unit bodies comprises a chip carrying area (2) used for installing a chip and eight lead wire feet (3) equally arranged on upper and lower sides of the chip carrying area (2); and the four lead wire feet (3) on one side are connected with each other via a first connecting rib (4), three of the other four lead wire feet (3) are connected together via a routing area (5) and the surface of the bonding area of the rest one is plated with a silver layer (6). The lead frame is strong in binding force during wire welding and high in firmness during plastic package.
Description
Technical field
The utility model relates to a kind of semiconductor lead frame version, is specifically related to a kind of Novel patch power device lead frame.
Background technology
Paster power device lead frame is the basic element of character of manufacturing integration circuit semiconductor element.At present, paster power device lead frame is all generally naked copper technique, and lead frame surface is without any other the coat of metal, bad in conjunction with firmness between lead-in wire and lead frame when this makes follow-up solder taul, easily comes off.In addition, current paster power device lead frame, its slide glass district, terminal pin are in conplane substantially, this is unfavorable for the plastic packaging of follow-up plastic packaging material, easily comes off, thereby affect finished product combination property between plastic packaging material and lead frame.
Utility model content
The strong Novel patch power device lead frame of firmness when strong, the plastic packaging of adhesion when technical problem to be solved in the utility model is to provide a kind of bonding wire.
The technical scheme that the utility model adopts is:
A kind of Novel patch power device lead frame, it comprises upper and lower two sidebands and is positioned at multiple lead frame cell cubes that are matrix arrangement of sideband, described lead frame cell cube comprises slide glass district for chip is installed, is arranged at the terminal pin of upper and lower both sides, slide glass district, the quantity of described terminal pin is eight, each four of every side, wherein four of a side terminal pins connect muscle by first and connect together, and in four terminal pins of opposite side, to electroplate front surface silver coated three bonding regions that connect together, remain a terminal pin by routing district; Between described two adjacent row lead frame cell cubes, be provided with the first intercell connector or the second intercell connector, described the first intercell connector and the second intercell connector are spaced; The left and right sides in described slide glass district connects muscle by slide glass district and is connected with the first intercell connector and the second intercell connector respectively; The described first two ends, left and right that connect muscle are connected with the first intercell connector and the second intercell connector respectively.
Compared with prior art, the utlity model has following remarkable advantage and beneficial effect: in eight terminal pins of the utility model paster power device lead frame, four connect together, other three also connect together, so this Novel patch power device lead frame can be used for substituting direct insertion low-power transistor.The bonding region silver coating of a terminal pin of lead frame cell cube, by require high functional wire bonds on this terminal pin to conjugation, can significantly improve the adhesion of this lead-in wire and lead frame like this, and guarantee follow-up function is normally implemented; And only at the bonding region of terminal pin silver coating, silver-plated all terminal pins are carried out, under the normal prerequisite of implementing of assurance function, can effectively save cost.In addition, being provided with of the first intercell connector and the second intercell connector is beneficial to the adhesion between power device and capsulation material while improving follow-up plastic packaging, improves the comprehensive firmness of product; The first intercell connector is spaced with the second intercell connector (face shaping is different), while making this power device of longitudinal cutting, easily locates, and is difficult for makeing mistakes; The left and right sides in slide glass district connects muscle by slide glass district and is connected with the first intercell connector and the second intercell connector respectively, this is conducive to improve the coplanarity of whole Novel patch power device lead frame, make slide glass district be not easy to occur perk or position and the situation such as move, ensure finished product combination property; First connects the two ends, left and right of muscle is connected with the first intercell connector and the second intercell connector respectively, and the coplanarity that this is conducive to improve whole Novel patch power device lead frame makes terminal pin be not easy to occur perk or position and the situation, guarantee finished product combination property such as moves.
As preferably, described by routing district connect together three terminal pins with residue a terminal pin in same plane, and this plane is higher than lead frame cell cube body and sideband place plane, miscellaneous part on other parts of lead frame cell cube except above four terminal pins, sideband, Novel patch power device lead frame etc. is all in same datum plane, and above-mentioned four terminal pin place planes are higher than this datum plane.This is conducive to improve the adhesion of this Novel patch power device lead frame in the time of plastic packaging, makes between power device and capsulation material adhesion strong, and firmness is high, is difficult for throwing off, thereby improves product combination property.
As preferably, the both sides at the back side, described slide glass district are inwardly provided with little groove.This is conducive to improve the adhesion between this Novel patch power device lead frame and plastic packaging material, makes to be difficult for throwing off, and plastic packaging is good.
Brief description of the drawings
Shown in Fig. 1 is the structural representation of the utility model Novel patch power device lead frame;
Shown in Fig. 2 is the structure for amplifying schematic diagram of A part in Fig. 1.
Wherein: 1, sideband; 2, slide glass district; 3, terminal pin; 4, first connects muscle; 5, routing district; 6, silver layer; 7, the first intercell connector; 8, the second intercell connector; 9, slide glass district connects muscle.
Embodiment
Below in conjunction with embodiment, the utility model is further described in detail, but is not limited to this.
As shown in Figure 1-2, the present embodiment Novel patch power device lead frame comprises, lower two sidebands 1 and the multiple lead frame cell cubes that are matrix arrangement that are positioned at sideband 1, described lead frame cell cube (shown in Fig. 2) comprises the slide glass district 2 for chip is installed, be arranged at the terminal pin 3 of both sides Shang Xia 2, slide glass district, the quantity of described terminal pin 3 is eight, each four of every side, wherein four of a side terminal pins 3 connect together by first company's muscle 4, in four terminal pins 3 of opposite side, three connect together by routing district 5, the bonding region front surface silver coated 6 of a terminal pin 3 of residue.Describedly connect together a terminal pin 3 of three terminal pins 3 and residue in same plane by routing district 5, and this plane is higher than lead frame cell cube body and sideband 1 place plane.The both sides at 2 back sides, described slide glass district are inwardly provided with little groove.Between described two adjacent row lead frame cell cubes, be provided with the first intercell connector 7 or the second intercell connector 8, described the first intercell connector 7 and the second intercell connector 8 are spaced.The left and right sides in described slide glass district 2 connects muscle 9 by slide glass district and is connected with the first intercell connector 7 and the second intercell connector 8 respectively.The described first two ends, left and right that connect muscle 4 are connected with the first intercell connector 7 and the second intercell connector 8 respectively.Describedly connect together by routing district 5 that four its tail ends of pin of three terminal pin 3 place sides connect together and two ends are connected with the first intercell connector 7 and the second intercell connector 8 respectively.
Above-described embodiment of the present utility model is can not be used for limiting the utility model to explanation of the present utility model, and any change in implication and the scope suitable with claims of the present utility model, all should think to be included in the scope of claims.
Claims (3)
1. a Novel patch power device lead frame, comprise, lower two sidebands (1) and be positioned at sideband (1) be multiplely the lead frame cell cubes that matrix is arranged, described lead frame cell cube comprises the slide glass district (2) for chip is installed, be arranged at the terminal pin (3) of upper and lower both sides, slide glass district (2), it is characterized in that: the quantity of described terminal pin (3) is eight, each four of every side, wherein four of a side terminal pins (3) connect together by first company's muscle (4), in four terminal pins (3) of opposite side, three connect together by routing district (5), remain the bonding region front surface silver coated (6) of a terminal pin (3), between described two adjacent row lead frame cell cubes, be provided with the first intercell connector (7) or the second intercell connector (8), described the first intercell connector (7) and the second intercell connector (8) are spaced, the left and right sides in described slide glass district (2) connects muscle (9) by slide glass district and is connected with the first intercell connector (7) and the second intercell connector (8) respectively, the described first two ends, left and right that connect muscle (4) are connected with the first intercell connector (7) and the second intercell connector (8) respectively.
2. Novel patch power device lead frame according to claim 1, it is characterized in that: described by routing district (5) connect together three terminal pins (3) with a terminal pin of residue (3) in same plane, and this plane is higher than lead frame cell cube body and sideband (1) place plane.
3. Novel patch power device lead frame according to claim 1, is characterized in that: the both sides at the back side, described slide glass district (2) are inwardly provided with little groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209033.2U CN203871319U (en) | 2014-04-25 | 2014-04-25 | Novel lead frame of chip mounting power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209033.2U CN203871319U (en) | 2014-04-25 | 2014-04-25 | Novel lead frame of chip mounting power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203871319U true CN203871319U (en) | 2014-10-08 |
Family
ID=51652244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420209033.2U Expired - Lifetime CN203871319U (en) | 2014-04-25 | 2014-04-25 | Novel lead frame of chip mounting power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203871319U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600184A (en) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | Ceramic substrate electroplated with gloss silver and method for electroplating gloss silver on ceramic substrate |
-
2014
- 2014-04-25 CN CN201420209033.2U patent/CN203871319U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600184A (en) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | Ceramic substrate electroplated with gloss silver and method for electroplating gloss silver on ceramic substrate |
| CN104600184B (en) * | 2014-12-31 | 2017-07-07 | 东莞市凯昶德电子科技股份有限公司 | A kind of method that silver lustre is electroplated on ceramic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102646606B (en) | Packaging method of integrated circuit (IC) card module | |
| CN204144243U (en) | A kind of structure of chip diode | |
| CN103682030B (en) | LED, LED matrix and LED manufacture crafts | |
| CN203871319U (en) | Novel lead frame of chip mounting power device | |
| CN102339404B (en) | A kind of Novel intelligent card module and production technology thereof | |
| CN203760460U (en) | Integrated circuit lead frame board | |
| CN203826370U (en) | Lead framework for small power device | |
| CN105703100B (en) | It is a kind of by the connector being electrically connected between line end and plate end and its manufacturing method | |
| CN202977380U (en) | Line type pressure welding clamp used for QFN, DFN integrated circuit packaging | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN204348715U (en) | A kind of ultrathin package device | |
| CN203720871U (en) | Intelligent card | |
| CN202678303U (en) | Lead frame | |
| CN203839407U (en) | Paster type diode | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| CN203787414U (en) | Small-power paster lead frame member | |
| CN203774306U (en) | Large power device leading wire framework | |
| CN203774304U (en) | Combined direct-inserting type power device lead wire framework | |
| CN101483163B (en) | Window type ball grid array encapsulation construction and substrate thereof | |
| CN203826425U (en) | Metallic material band, LED support, LED support structure and LED lamp | |
| CN205383447U (en) | Take lens can all -round paster chip LED | |
| CN208522133U (en) | The M.2 connector of direct insertion welding | |
| CN204928740U (en) | Photovoltaic terminal box convenient to mass production | |
| CN203386741U (en) | Pin frame | |
| CN204144251U (en) | A kind of LED lamp bead of multifaceted light-emitting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 315000 No. 68 Changcao Road, Dongqianhu Industrial Zone, Ningbo City, Zhejiang Province Patentee after: NINGBO HUALONG ELECTRONICS Co.,Ltd. Address before: 315124 Zhejiang city in Ningbo province Dongqian Lake resort Jiuzhai Village Industrial Park Co-patentee before: TAIZHOU HUALONG ELECTRONIC Co.,Ltd. Patentee before: NINGBO HUALONG ELECTRONICS Co.,Ltd. |