CN203720871U - Intelligent card - Google Patents
Intelligent card Download PDFInfo
- Publication number
- CN203720871U CN203720871U CN201420002573.3U CN201420002573U CN203720871U CN 203720871 U CN203720871 U CN 203720871U CN 201420002573 U CN201420002573 U CN 201420002573U CN 203720871 U CN203720871 U CN 203720871U
- Authority
- CN
- China
- Prior art keywords
- carrier band
- chip
- smart card
- pads
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 14
- 239000004831 Hot glue Substances 0.000 claims description 13
- 229920003023 plastic Polymers 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 13
- 239000011888 foil Substances 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000004697 Polyetherimide Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 229920001601 polyetherimide Polymers 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
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Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model provides an intelligent card, comprising an intelligent card module and a card base. The intelligent card module comprises a chip and a carrier tape, wherein the chip is provided with a plurality of chip function pads, and the carrier tape comprises a carrier tape contact surface and a carrier tape pad surface; the carrier tape pad surface is provided with a plurality of carrier tape function pads corresponding with the plurality of chip function pads of the chip; the carrier tape contact surface is provided with a plurality of carrier tape pads with conductive electrical property and corresponding with the plurality of carrier tape function pads; the plurality of chip function pads of the chip respectively correspond with the carrier tape function pads on the carrier tape through bump solders; the intelligent card module is arranged in the cavity of the card base. The intelligent card employs a welding mode to package the intelligent card chip and forms a finished product; compared with an intelligent card prepared by traditional process, the intelligent card of the utility model has higher reliability and stronger versatility; in addition, the lead bonding process in the traditional process is eliminated. The intelligent card possesses the characteristics of simple production process, high production efficiency and low production cost.
Description
Technical field
The utility model relates to the encapsulation technology of a kind of semiconductor microelectronics and integrated circuit, particularly relates to a kind of smart card.
Background technology
Continuous progress along with integrated antenna package technology, the integrated level of integrated circuit improves day by day, function is also more and more abundanter, and also more and more harsher for the requirement of product applications, and this coordinates new demand with regard to requiring integrated antenna package enterprise can develop novel packing forms.
For example, in Intelligent card package field, domestic and foreign market is all very large to the demand of smart card, at present, smart card industry just develops towards the route of technological innovation, new technology continues to bring out, new manufacture is also more and more, and many old manufacturing technologies are also updated and strengthen, thereby requires also inevitable to the lifting of the function of smart card and performance.
The method for packing of traditional smart card (being method for making) is: first, with chip attachment equipment by chip attachment on the carrier band of smart card, then, use Bonding equipment that the pad of the function pads of chip and carrier band is electrically connected, again the complete smart card module of Bonding is carried out to injecting glue or molded packages afterwards, again packaged smart card module is carried out die-cutly, finally adopt card maker that smart card module is made to card form.But there are many shortcomings in this method for packing: as production cost is high, material cost is high, complex manufacturing, and product reliability is poor, and production efficiency is low inferior.
Therefore, provide the smart card that a kind of reliability is high, production cost is low to become the technical barrier that affiliated technical field is needed solution badly.
Summary of the invention
The shortcoming of prior art in view of the above, the technical problems to be solved in the utility model is to provide the smart card that a kind of production cost is low, reliability is high, and the method for making of the smart card that production technology is simple, production efficiency is high, to overcome the above-mentioned defect of prior art.
In order to solve the problems of the technologies described above, the utility model provides a kind of smart card, comprises smart card module and Ka Ji, and described smart card module comprises chip and carrier band;
Described chip is provided with a plurality of chip functions pads;
Described carrier band comprises carrier band surface of contact and carrier band pad face, described carrier band pad face is provided with a plurality of carrier band function pads corresponding with a plurality of chip functions pads of described chip, and described carrier band surface of contact is provided with a plurality of carrier band pads corresponding with a plurality of described carrier band function pads and that electrically conduct;
A plurality of chip functions pads of described chip weld together by salient point scolder and carrier band function pads on described carrier band are corresponding one by one respectively;
Described smart card module is located in a cavity of described card base.
Preferably, the material of described salient point scolder is welding material of metal.
Further, the material of described salient point scolder is billon, nickel alloy or tin alloy material.
Preferably, the surface of described carrier band function pads is provided with layer of metal plated film.
Preferably, in the space between described chip and described carrier band, be filled with chip bottom packing material.
Preferably, between described smart card module and described card base, be provided with one deck hot melt adhesive.
Preferably, the thickness of described hot melt adhesive is 0.05mm～0.40mm.
Preferably, described card base is selected plastic membrane of polyvinyl chloride insulated substrate, polyethylene terephthalate plastic foil insulated substrate, polyimide plastic film insulated substrate or polyetherimide plastic foil insulated substrate.
As mentioned above, a kind of smart card of the present utility model, has following beneficial effect:
The utility model adopts the mode of welding that intelligent card chip is encapsulated, and make finished product smart card, the smart card that the finished product smart card of making is made than traditional handicraft has higher reliability and stronger versatility, and rejected the lead key closing process in traditional handicraft, therefore smart card production technology of the present utility model is simple, production efficiency is high, production cost is low.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of smart card of the present utility model.
Fig. 2 is shown as smart card module chip schematic diagram of arranging on carrier band before not carrying out punching separation of smart card of the present utility model.
Fig. 3 is shown as the process flow diagram of the method for making of smart card of the present utility model.
Fig. 4 is shown as the mode that packs the in flakes schematic diagram of the method for making of smart card of the present utility model.
Element numbers explanation
10 smart card modules
1 chip
11 salient point scolders
2 carrier bands
21 carrier band function pads
22 carrier band pads
3 conductive adhesives
4 chip bottom packing materials
5 hot melt adhesives
6 card bases
Embodiment
By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this instructions.
Refer to Fig. 1 to Fig. 4.Notice, appended graphic the illustrated structure of this instructions, ratio, size etc., equal contents in order to coordinate instructions to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this instructions, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the utility model.
As shown in Figure 1, the utility model provides a kind of smart card, comprises smart card module 10 and Ka Ji 6, and described smart card module 10 comprises chip 1 and carrier band 2.
Described chip 1 is provided with a plurality of chip functions pad (not shown)s, on a plurality of described chip functions pads, is respectively equipped with salient point scolder 11; Described carrier band comprises carrier band surface of contact (not shown) and carrier band pad face (not shown), described carrier band pad face is provided with a plurality of carrier band function pads 21 corresponding with a plurality of chip functions pads of described chip 1, and described carrier band surface of contact is provided with a plurality of carrier band pads 22 corresponding with a plurality of described carrier band function pads 21 and that electrically conduct.
A plurality of chip functions pads of described chip 1 weld together by salient point scolder 11 and carrier band function pads 21 on described carrier band 2 are corresponding one by one respectively, form described smart card module 10.
Described smart card module 10 is located in a cavity of described card base 6.
Because the effect of described salient point scolder 11 is to allow a plurality of chip functions pads of described chip 1 and the carrier band function pads on described carrier band 2 21 realize electrically conduct, so the material of described salient point scolder 11 should be selected preferably welding material of metal of electrical conductivity; Further, the optional use of the material of described salient point scolder 11 has billon or the nickel alloy material of good electric conductivity and being welded to connect property; And due to the restriction of material cost, the material of salient point scolder 11 often adopts lower-cost tin alloy material.
Preferably, described carrier band of the present utility model 2 is for take the double-sided metal plate carrier band that polymer composite is base material.Wherein, the base material of described polymer composite can be selected polyethylene terephthalate (being called for short PET) plastic foil insulated substrate, also can select in polyimide (being called for short PI) plastic foil insulated substrate, ceramic thin plate or glass-epoxy (being called for short FR4) thin plate any.The material selection copper product of described sheet metal, the double-sided metal plate of described carrier band 2 is carrier band function pads 21 on described carrier band pad face and the carrier band pad 22 on described carrier band surface of contact.Described carrier band function pads 21 is to realize by via hole is set on the substrate at described carrier band 2 with electrically conducting of described carrier band pad 22: at via hole inwall, be also provided with sheet metal, the sheet metal of the sheet metal of via hole inwall and described carrier band function pads 21 links together, simultaneously, also link together with the sheet metal of described carrier band pad 22, thereby described carrier band function pads 21 and described carrier band pad 22 are realized, electrically conduct.
Surface oxidation-resistant and increase surperficial reliability when carrier band 2 was used in the later stage, described carrier band function pads 21 adopts craft of gildings to carry out surface treatment, makes the surface of described carrier band function pads 21 form layer of metal plated film.
Referring to Fig. 2, in order to reach in process of production the effect of production efficiency optimum, the carrier band of described carrier band 2 for supplying to weld together with chip 1 in enormous quantities, described chip 1 is arranged with array on described carrier band 2, to reach the disposable object that can encapsulate a plurality of products.
In order to reinforce the structure between described chip 1 and described carrier band 2, in the space between described chip 1 and described carrier band 2, be filled with chip bottom packing material 4.Described chip bottom packing material 4 not only can protect described chip 1 and described carrier band in use not by damage; and can also make described chip 1 surface and air insulation; in order to avoid cause unnecessary oxidation or short circuit phenomenon, the phenomenons such as layering, cavity have also been avoided occurring in follow-up use.
Firmly reliable for what described smart card module 10 and described card base 6 were fixed, avoid described smart card module 10 to come off in the cavity of described card base 6, between described smart card module 10 and described card base 6, be provided with the existing fastness of one deck hot melt adhesive 5 of flexible again.The thickness of described hot melt adhesive is 0.05mm～0.40mm, so that described smart card module 10 and described card base 6 compare is smooth bonding.
In order to make smart card of the present utility model be applicable to using in any environment, the material of described card base 6 can be selected Polyvinylchloride (being called for short PVC) plastic foil insulated substrate, polyethylene terephthalate (being called for short PET) plastic foil insulated substrate, polyimide (being called for short PI) plastic foil insulated substrate, polyetherimide (being called for short PEI) plastic foil insulated substrate etc.
Referring to Fig. 1 to Fig. 4, smart card of the present utility model is made according to following steps:
A, by supplying the carrier band welding together with chip 1 in enormous quantities, get ready, at the surface of the described carrier band function pads 21 of carrier band coating one deck conductive adhesive 3, the chip functions pad of described chip 1 is corresponding with described carrier band function pads 21, make conductive adhesive 3 laminatings of the salient point scolder 11 of described chip functions pad and the surface coating of described carrier band function pads 21, by automatic welding device, heat, first make to be combined with described conductive adhesive after described salient point solder fusing, continue again heating, described conductive adhesive 3 is solidified, make the existing electric connection of chip functions pad and carrier band function pads real 21, thereby realize the welding of chip 1 in enormous quantities and carrier band,
B, adopt bottom surface to rush described chip 1 that gluing equipment butt welding connects and the injection of chip bottom packing material 4 is carried out in the space between described carrier band, make described chip 1 in enormous quantities and described carrier band form the piece smart card module linking together;
C, smart card module 10 described in a piece is carried out to the back side stick hot melt adhesive, a side that is the chip place of smart card module 10 described in a piece sticks one deck hot melt adhesive 5;
D, adopt die cutting device to carry out punching separation to sticking smart card module 10 described in the piece linking together of hot melt adhesive 5, generate independently smart card module 10 of a piece;
E, as shown in Figure 4, adopt the mode that packs in flakes to a piece that completes punching separation independently smart card module 10 pack; The mode that packs in flakes of the present utility model adopts round braid mode to pack, and carries out round pan feeding and with mechanical arm automatic Picking product while being conducive to like this smart card module fabrication of next step;
F, adopt automatic Picking equipment to pick up seal-packed smart card module 10 in flakes, and adopt the heat pressing process of the pressurization of heating that hot melt adhesive 5 is melted, make hot melt adhesive 5 produce cohesive force, smart card module 10 is bonded in the cavity of described card base 6, realizes the fixing of smart card module 10 and described card base 6.
Wherein, in step b, interference-free in order to guarantee the electric connection between described chip 1 and described carrier band 2, simultaneously, injection for the ease of the chip bottom packing material 4 in the space between described chip 1 and described carrier band 2, described chip bottom packing material 4 can be selected epoxy base fluid body packing material, after filling, need described epoxy radicals liquid packing material to be cured processing, in order to make to solidify, described chip 1 and described carrier band 2 are not caused to serious temperature impact, thereby have influence on the performance of described chip 1 and described carrier band 2, the solidification temperature scope of described chip bottom packing material 4 is 60 ℃～250 ℃.
In step f, the processing temperature of described hot melt adhesive 5 is 100 ℃～250 ℃, to guarantee that described smart card module 10 and described card base 6 can not be subject to serious temperature impact in bonding process, and then has influence on the performance of described smart card module 10.
In sum, the utility model adopts the mode of welding that intelligent card chip is encapsulated, and make finished product smart card, the smart card that the finished product smart card of making is made than traditional handicraft has higher reliability and stronger versatility, and rejected the lead key closing process in traditional handicraft, therefore smart card production technology of the present utility model is simple, production efficiency is high, production cost is low.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (9)
1. a smart card, is characterized in that, comprises smart card module and Ka Ji, and described smart card module comprises chip and carrier band;
Described chip is provided with a plurality of chip functions pads;
Described carrier band comprises carrier band surface of contact and carrier band pad face, described carrier band pad face is provided with a plurality of carrier band function pads corresponding with a plurality of chip functions pads of described chip, and described carrier band surface of contact is provided with a plurality of carrier band pads corresponding with a plurality of described carrier band function pads and that electrically conduct;
A plurality of chip functions pads of described chip weld together by salient point scolder and carrier band function pads on described carrier band are corresponding one by one respectively;
Described smart card module is located in a cavity of described card base.
2. smart card according to claim 1, is characterized in that: the material of described salient point scolder is welding material of metal.
3. smart card according to claim 2, is characterized in that: the material of described salient point scolder is billon, nickel alloy or tin alloy material.
4. smart card according to claim 1, is characterized in that: the surface of described carrier band function pads is provided with layer of metal plated film.
5. smart card according to claim 1, is characterized in that: in the space between described chip and described carrier band, be filled with chip bottom packing material.
6. smart card according to claim 1, is characterized in that: between described smart card module and described card base, be provided with one deck hot melt adhesive.
7. smart card according to claim 6, is characterized in that: the thickness of described hot melt adhesive is 0.05mm～0.40mm.
8. smart card according to claim 1, is characterized in that: described carrier band is for take the double-sided metal plate carrier band that polymer composite is base material; The base material of described polymer composite is selected polyethylene terephthalate plastic foil insulated substrate, polyimide plastic film insulated substrate, ceramic thin plate or glass-epoxy thin plate.
9. smart card according to claim 1, is characterized in that: described card base is selected plastic membrane of polyvinyl chloride insulated substrate, polyethylene terephthalate plastic foil insulated substrate, polyimide plastic film insulated substrate or polyetherimide plastic foil insulated substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420002573.3U CN203720871U (en) | 2013-11-06 | 2014-01-02 | Intelligent card |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310545844 | 2013-11-06 | ||
| CN201310545844.X | 2013-11-06 | ||
| CN201420002573.3U CN203720871U (en) | 2013-11-06 | 2014-01-02 | Intelligent card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203720871U true CN203720871U (en) | 2014-07-16 |
Family
ID=51160008
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420002573.3U Expired - Fee Related CN203720871U (en) | 2013-11-06 | 2014-01-02 | Intelligent card |
| CN201410002606.9A Pending CN104636793A (en) | 2013-11-06 | 2014-01-02 | Intelligent card and method for manufacturing same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410002606.9A Pending CN104636793A (en) | 2013-11-06 | 2014-01-02 | Intelligent card and method for manufacturing same |
Country Status (1)
| Country | Link |
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| CN (2) | CN203720871U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602461A (en) * | 2014-12-15 | 2015-05-06 | 苏州海博智能系统有限公司 | IC (Integrated Circuit) card carrier tape welding machining method |
| CN104636793A (en) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | Intelligent card and method for manufacturing same |
| CN105648622A (en) * | 2015-12-25 | 2016-06-08 | 广东生益科技股份有限公司 | Making method of IC carrier band base material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112862048A (en) * | 2019-11-12 | 2021-05-28 | 江西安缔诺科技有限公司 | Smart card and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
| CN101355075A (en) * | 2007-07-25 | 2009-01-28 | 三星半导体(中国)研究开发有限公司 | Loading belt for smart card, encapsulation module for smart card using the same and manufacturing method thereof |
| CN101551871B (en) * | 2008-04-01 | 2012-02-22 | 上海长丰智能卡有限公司 | Novel mobile phone card and implementation method thereof |
| CN102646606B (en) * | 2011-02-16 | 2014-12-24 | 中电智能卡有限责任公司 | Packaging method of integrated circuit (IC) card module |
| CN102663481A (en) * | 2012-03-24 | 2012-09-12 | 上海祯显电子科技有限公司 | Novel double-interface intelligent card module |
| CN102891089B (en) * | 2012-10-11 | 2015-01-14 | 北京大拙至诚科技发展有限公司 | Encapsulating method of intelligent card |
| CN203720871U (en) * | 2013-11-06 | 2014-07-16 | 上海蓝沛新材料科技股份有限公司 | Intelligent card |
-
2014
- 2014-01-02 CN CN201420002573.3U patent/CN203720871U/en not_active Expired - Fee Related
- 2014-01-02 CN CN201410002606.9A patent/CN104636793A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104636793A (en) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | Intelligent card and method for manufacturing same |
| CN104602461A (en) * | 2014-12-15 | 2015-05-06 | 苏州海博智能系统有限公司 | IC (Integrated Circuit) card carrier tape welding machining method |
| CN105648622A (en) * | 2015-12-25 | 2016-06-08 | 广东生益科技股份有限公司 | Making method of IC carrier band base material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104636793A (en) | 2015-05-20 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151208 Address after: 201815 Shanghai City, Jiading District Hui Fu Road No. 946 Building 2 Room 201 Patentee after: SHANGHAI ADEL TECHNOLOGY CO.,LTD. Address before: Songjiang District Minyi road 201262 Shanghai City No. 201 building 12 Room 401 Patentee before: SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 |
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| CF01 | Termination of patent right due to non-payment of annual fee |