CN104617052A - Smart card module packaged through adhesive film pre-arranging technology and packaging method - Google Patents
Smart card module packaged through adhesive film pre-arranging technology and packaging method Download PDFInfo
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- CN104617052A CN104617052A CN201410855172.7A CN201410855172A CN104617052A CN 104617052 A CN104617052 A CN 104617052A CN 201410855172 A CN201410855172 A CN 201410855172A CN 104617052 A CN104617052 A CN 104617052A
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- chip
- glued membrane
- smart card
- carrier band
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a smart card module packaged through an adhesive film pre-arranging technology and a packaging method. The smart card module comprises an insulation smart card carrier band, a chip and a packaging element. The chip is arranged in the chip bearing region of the carrier band, a function bonding pad of the chip and a bonding pad of the carrier band are welded and connected through a lead, and the chip and the lead are packaged through the packaging element to form a reliable protection element. The chip is arranged in the chip bearing region of the carrier band reliably through the pre-arranged adhesive film. By means of the smart card module and the packaging method, the adhesive dispensing process can be omitted, and accordingly, the production efficiency is improved greatly; meanwhile, the reject ratio produced by the adhesive dispensing process is prevented, the product cost is reduced effectively, and the whole production process can continue to use existing equipment, and large-batch production can be performed.
Description
Technical field
The present invention relates to a kind of integrated antenna package technology, particularly a kind of encapsulation technology of smart card module.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.For the new opplication demand constantly occurred, require that integrated antenna package enterprise can design novel packing forms to coordinate new demand.
At present, in field of semiconductor package, the mode of die bond mostly adopts the mode of silver slurry point glue die bond; Particularly in smart card module encapsulation field, chip is installed on carrier band by traditional smart card module mode of silver slurry die bond that all adopts without exception, by heating by the solidification of silver slurry, then carries out the operations such as follow-up wire bonds, encapsulation, test.Adopt the technique of silver slurry point glue, there is complex production process, material cost is high, spillage of material is large, the shortcomings such as production efficiency is low.
For this reason, develop new production technology and new technology, that this area needs the problem that will solve badly, also occurred in industry adopting the technique of encapsulation to carry out the production that alternative traditional wire bonds technique realizes smart card module, but this mode has its limitation, the versatility of such as carrier band is not strong, the belt for smart card that often kind of necessary Aided design of chip is special, pad on carrier band and the necessary one_to_one corresponding of chip, change chip must change carrier band simultaneously, this mode is for small batch, and the production of polytypic is very unfavorable.
Summary of the invention
The problem such as high and production efficiency is low for the complex production process existing for existing smart card module, production cost, an object of the present invention is to provide a kind of smart card module adopting preset glued membrane technique to encapsulate.
Two of object of the present invention is the method for packing providing a kind of above-mentioned smart card module.
Can the production procedure of effective simplified intelligent card module by scheme provided by the invention, enhance productivity, more reduce the production cost of product.
In order to achieve the above object, the present invention adopts following technical scheme:
Object 1: adopt the smart card module that preset glued membrane technique encapsulates, comprise insulation belt for smart card, chip and packaging body, chip is arranged on the chip bearing region of carrier band, the function pads of chip and the pad of carrier band adopt wire bonds conducting, chip and lead-in wire are encapsulated on insulation belt for smart card by packaging body, are installed between the chip bearing region of described chip and carrier band by preset glued membrane.
In the preferred version of smart card module, described glued membrane is preset in the chip bearing region of belt for smart card.
Preferably, described glued membrane is preset at the circuit layer reverse side of chip.
Preferably, described glued membrane has the characteristic varying with temperature and produce state and viscosity change, and under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the melt temperature of glued membrane is between 50-100 DEG C.
Preferably, in solid-state under described glued membrane normal temperature, after 50-100 DEG C of low-temperature heat, glued membrane possesses stronger viscosity, the requirement that this state can provide the chip seat of honour fixing, after reach final solidification through 100-200 DEG C of quick baking, Baking out can not melt again, has the characteristic that can not recall.
Preferably, the normal temperature cure after a heating and melting of described glued membrane, no longer melts when post bake.
Preferably, described glued membrane can repeatedly melt after heating for multiple times.
Preferably, described film thickness is 5 ~ 30um.
Preferably, described carrier band is the structure of continuous strip indefinite extension.
Object 2: the method for packing of the smart card module adopting preset glued membrane technique to encapsulate, described method for packing comprises the steps:
(1) the chip seat of honour: the chip bearing region by seat apparatus on full-automatic chip, chip being installed to carrier band, and from carrier band bottom-heated, heating-up temperature is 50-100 DEG C, the glued membrane between chip and carrier band is melted, bonding chip and carrier band, and be cured;
(2) wire bonds: pad corresponding on the function pads on chip and carrier band is coupled together by full-automatic lead welding equipment by semi-finished product step (1) completed, and makes the function pads on chip extend on carrier band;
(3) encapsulate: encapsulated moulding is carried out to the semi-finished product obtained by step (2);
(4) test: carry out electric performance test by automation chip testing devices to module to the semi-finished product obtained by step (3), marked by defective item, qualified product are put in storage, complete the production process of module.
Preferably, when melting the solidification of shape glued membrane in described step (1), after leaving heating region after by carrier band stepping, by natural cooling, colloid solidification makes chip and carrier band be bonded together securely; Or reach final solidification through 100-200 DEG C of quick baking.
Preferably, when encapsulating in described step (3), by the epoxide-resin glue point glue of ultraviolet curing, lead-in wire and chip package are got up, and adopts Ultraviolet radiation that colloid is solidified; Or adopt molded packages technique, solid molded feed liquid is sealed lead-in wire and chip in die material, after the demoulding, namely forms reliably packaging body.
Smart card module provided by the invention and packaging technology thereof, the technique of the silver slurry point glue in die bond process can be saved, the processing procedure be heating and curing more can be eliminated under partial picture, greatly save the production time, improve production efficiency, also reduce due to a glue debugging and the raw material loss of waste simultaneously, and thoroughly solve the fraction defective problem in a glue process, for the batch production of product provides technical guarantee.
Scheme provided by the invention can adapt to the encapsulation requirement in smart card module field, is more suitable for the innovation and application in smart card module field, greatly will promote the development of global smart card module Packaging Industry, and have good application prospect.
Accompanying drawing explanation
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is the smart card module profile of the preset glued membrane of employing carrier band of the present invention and ultraviolet packaging body;
Fig. 2 is the continuous carrier band schematic diagram being prefixed glued membrane of the present invention;
Fig. 3 is the chip schematic diagram being prefixed glued membrane of the present invention;
Fig. 4 is the smart card module profile of the preset glued membrane of employing chip of the present invention and molded packages body;
Fig. 5 is belt for smart card chip installed surface schematic diagram;
Fig. 6 is belt for smart card conductor planes schematic diagram.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the present invention further.
See Fig. 1 and Fig. 4, it is depicted as the structural representation of the smart card module of the preset glued membrane technique encapsulation of employing provided by the invention.
As seen from the figure, smart card module provided by the invention mainly comprises insulation belt for smart card 1, chip 6 and packaging body, chip 6 is arranged on the chip bearing region of carrier band, is bondd reliably install between the chip bearing region of chip and carrier band by preset glued membrane 5; The function pads of chip 6 and the pad of carrier band adopt lead-in wire 7 to weld conducting, and chip and lead-in wire are encapsulated on insulation belt for smart card by packaging body 8.
Wherein, in the chip bearing region that glued membrane 5 can be set in advance in belt for smart card or be arranged on the circuit layer reverse side of chip, can determine according to the actual requirements.
This glued membrane 5 thickness is even, and thickness is 5 ~ 30um.
Moreover this glued membrane has the characteristic varying with temperature and produce state and viscosity change, under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the melt temperature of glued membrane is between 50-100 DEG C.
Further, this glued membrane is solid-state under adopting normal temperature, after 50-100 DEG C of low-temperature heat, glued membrane possesses stronger viscosity, the requirement that this state can provide the chip seat of honour fixing, after reach final solidification through 100-200 DEG C of quick baking, Baking out can not melt again, has the glued membrane of the characteristic that can not recall.
As an alternative, this glued membrane can adopt normal temperature cure after a heating and melting, the glued membrane no longer melted when post bake.
As another replacement scheme, this glued membrane can adopt the glued membrane that can repeatedly melt after heating for multiple times.
In this smart card module for encapsulating fixing packaging body 8, specifically can adopt ultraviolet packaging body or molded packages body, can determine according to the actual requirements.
For the smart card module of said structure and characteristic, the invention provides a kind of corresponding method for packing, its process is as follows:
(1) the chip seat of honour: the chip bearing region by seat apparatus on full-automatic chip, chip being installed to carrier band, and from carrier band bottom-heated, heating-up temperature is 50-100 DEG C, and the glued membrane between chip and carrier band is melted; Colloid curing mode has two kinds of situations, leaves heating region after the stepping of first carrier band, and by natural cooling, colloid solidification makes chip and carrier band be bonded together securely; It two is through 100-200 DEG C of quick baking and reaches final solidification;
(2) wire bonds: pad corresponding on the function pads on chip and carrier band is coupled together by full-automatic lead welding equipment by semi-finished product step (1) completed, and makes the function pads on chip extend on carrier band;
(3) encapsulate: encapsulation is carried out to the semi-finished product obtained by step (2) and fixes.According to the difference adopting encapsulating material, different packaging technologies can be adopted: lead-in wire and chip package, by the epoxide-resin glue point glue of ultraviolet curing, get up, and adopt Ultraviolet radiation that colloid is solidified by (a); B () adopts molded packages technique, solid molded feed liquid is sealed lead-in wire and chip in die material, after the demoulding, namely forms reliably packaging body;
(4) test: carry out electric performance test by automation chip testing devices to module to the semi-finished product obtained by step (3), marked by defective item, qualified product are put in storage, complete the production process of module.
The scheme of further instruction this programme is carried out below by way of instantiation:
Embodiment one:
See Fig. 5 and Fig. 6, it is depicted as chip installed surface schematic diagram and the conductor planes schematic diagram of belt for smart card in this example, is provided with several evenly distributed perforations 2, for equipment stepping, carrier band is moved forward on the long limit of carrier band 1.In the middle part of the chip installed surface of carrier band, be provided with several wire bonds holes 4, for the function pads on chip being communicated with the conductive pattern on carrier band.The central area in wire bonds hole 4 is chip bearing region.In conductor planes, be provided with conductive pattern 3.
See Fig. 2, carrier band 1 presets corresponding glued membrane 5 in each chip bearing region thereon, and this glued membrane 5 matches with chip bearing region, covers the surface in chip bearing region.The thickness of glued membrane 5 is even, and concrete large I is determined according to the actual requirements, in order to ensure the reliability bondd and the size not affecting final module, is generally 5 ~ 30um.
Based on this carrier band 1 when carrying out encapsulation and forming smart card module, see Fig. 1 and Fig. 2, first by seat apparatus on full-automatic chip, chip 6 is installed on glued membrane 5 preset in the chip bearing region of carrier band 1; Make to be heated bottom carrier band, heating-up temperature is 80 DEG C simultaneously, and the glued membrane 5 between chip 6 and carrier band 1 is melted.
Then, guide carrier band stepping forward by the perforation 2 on carrier band 1, after carrier band stepping, leave heating region, by natural cooling, the glued membrane 5 melted is solidified, thus chip and carrier band are bonded together securely.
Again then, by full-automatic lead welding equipment, pad corresponding in the function pads on chip 6 and carrier band 1 is coupled together, the tie point at the pad on lead-in wire 7 connection chip and wire bonds hole 4 place of conductive layer 3, makes the function pads on chip extend on carrier band.
Again then, by the semi-finished product of good for welding lead-in wire, by automatically dropping glue equipment, ultraviolet hardening epoxide-resin glue 8 is got up lead-in wire and chip package, and adopt Ultraviolet radiation that colloid is solidified, form reliably packaging body 8.
Finally, packaged module is carried out electric performance test by automation chip testing devices to module, is marked by defective item, qualified product are put in storage, complete the production process of module.
Embodiment two:
See Fig. 5 and Fig. 6, it is depicted as chip installed surface schematic diagram and the conductor planes schematic diagram of belt for smart card in this example, is provided with several evenly distributed perforations 2, for equipment stepping, carrier band is moved forward on the long limit of carrier band 1.In the middle part of the chip installed surface of carrier band, be provided with several wire bonds holes 4, for the function pads on chip being communicated with the conductive pattern on carrier band.The central area in wire bonds hole 4 is chip bearing region.In conductor planes, be provided with conductive pattern 3.
See Fig. 3, it is depicted as the structural representation of the chip 6 in this example.As seen from the figure, this example chips 6 presets corresponding glued membrane 5 at the reverse side of its circuit layer, and this glued membrane 5 matches with the reverse side of chip 6 circuit layer, covers the reverse side of chip 6 circuit layer completely.Its thickness is even, and concrete large I is determined according to the actual requirements, in order to ensure the reliability bondd and the size not affecting final module, is generally 5 ~ 30um.
Based on the chip 6 of above-mentioned carrier band 1 and preset glued membrane when carrying out encapsulation and forming smart card module, see Fig. 3 and Fig. 4, by seat apparatus on full-automatic chip, the chip 6 being prefixed glued membrane is installed on the chip bearing region of carrier band 1; Make to be heated bottom carrier band, heating-up temperature is 60 DEG C simultaneously, and the glued membrane 5 between chip 6 and carrier band 1 is melted.
Then, guide carrier band stepping forward by the perforation 2 on carrier band 1, after carrier band stepping, leave heating region, carry out 180 DEG C of quick bakings, reach final solidification.This glued membrane 5 has again Baking out and can not melt and can not recall characteristic, because heating glue-line melts or softeningly cause chip to rock to cause failure welding when can solve wire bonds like this, be heated in encapsulation process and cause glue-line and chip silicon layer or strip face hole and lamination problem, thus avoid affecting subsequent product reliability.The solidification of glued membrane makes chip and carrier band be bonded together securely.
Again then, by full-automatic lead welding equipment, pad corresponding in the function pads on chip 6 and carrier band 1 is coupled together, the tie point at the pad on lead-in wire 7 connection chip and wire bonds hole 4 place of conductive layer 3, makes the function pads on chip extend on carrier band.
Again then, by the semi-finished product of good for welding lead-in wire, adopt molded packages technique, solid molded material post liquefaction is sealed lead-in wire and chip in die material, after the demoulding, namely form reliably packaging body lead-in wire and chip package, form reliably packaging body 8.
Finally, packaged module is carried out electric performance test by automation chip testing devices to module, is marked by defective item, qualified product are put in storage, complete the production process of module.
Known by above-mentioned example, scheme provided by the invention is utilized to carry out the production of smart card module, the operation of equipment point glue can be saved, procedure for producing can not only be made like this to simplify, the prior problem being that of avoiding the fraction defective produced due to some glue processing procedure, improve qualification rate and the production efficiency of product, effectively reduce product cost, and whole production process can adopt existing equipment produces in enormous quantities.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (10)
1. adopt the smart card module of preset glued membrane technique encapsulation, comprise insulation belt for smart card, chip and packaging body, chip is arranged on the chip bearing region of carrier band, the function pads of chip and the pad of carrier band adopt wire bonds conducting, chip and lead-in wire are encapsulated on insulation belt for smart card by packaging body, it is characterized in that, installed by preset glued membrane between the chip bearing region of described chip and carrier band.
2. the smart card module of employing according to claim 1 preset glued membrane technique encapsulation, is characterized in that, in the chip bearing region that described glued membrane is preset at belt for smart card or be preset at the circuit layer reverse side of chip.
3. the smart card module of the preset glued membrane technique encapsulation of employing according to claim 1, it is characterized in that, described glued membrane has the characteristic varying with temperature and produce state and viscosity change, under normal temperature, glued membrane is solid-state, after heating, glued membrane melts, and producing stronger cohesive force, the melt temperature of glued membrane is between 50-100 DEG C.
4. the smart card module of the preset glued membrane technique encapsulation of employing according to claim 1, it is characterized in that, in solid-state under described glued membrane normal temperature, after 50-100 DEG C of low-temperature heat, glued membrane possesses stronger viscosity, the requirement that this state can provide the chip seat of honour fixing, after reach final solidification through 100-200 DEG C of quick baking, Baking out can not melt again, has the characteristic that can not recall.
5. the smart card module of the preset glued membrane technique encapsulation of employing according to claim 1, it is characterized in that, the normal temperature cure after a heating and melting of described glued membrane, no longer melts when post bake.
6. the smart card module of the preset glued membrane technique encapsulation of employing according to claim 1, it is characterized in that, described glued membrane can repeatedly melt after heating for multiple times.
7. the smart card module of the preset glued membrane technique encapsulation of employing according to any one of claim 1 to 6, it is characterized in that, described film thickness is 5 ~ 30um.
8. adopt the method for packing of the smart card module of preset glued membrane technique encapsulation, it is characterized in that, described method for packing comprises the steps:
(1) the chip seat of honour: the chip bearing region by seat apparatus on full-automatic chip, chip being installed to carrier band, and from carrier band bottom-heated, heating-up temperature is 50-100 DEG C, the glued membrane between chip and carrier band is melted, bonding chip and carrier band, and be cured;
(2) wire bonds: pad corresponding on the function pads on chip and carrier band is coupled together by full-automatic lead welding equipment by semi-finished product step (1) completed, and makes the function pads on chip extend on carrier band;
(3) encapsulate: encapsulated moulding is carried out to the semi-finished product obtained by step (2);
(4) test: carry out electric performance test by automation chip testing devices to module to the semi-finished product obtained by step (3), marked by defective item, qualified product are put in storage, complete the production process of module.
9. the method for packing of the smart card module of the preset glued membrane technique encapsulation of employing according to claim 8, it is characterized in that, when melting the solidification of shape glued membrane in described step (1), after leaving heating region after by carrier band stepping, by natural cooling, colloid solidification makes chip and carrier band be bonded together securely; Or reach final solidification through 100-200 DEG C of quick baking.
10. the method for packing of the smart card module of the preset glued membrane technique encapsulation of employing according to claim 8, it is characterized in that, when encapsulating in described step (3), by the epoxide-resin glue point glue of ultraviolet curing, lead-in wire and chip package are got up, and adopts Ultraviolet radiation that colloid is solidified; Or adopt molded packages technique, solid molded feed liquid is sealed lead-in wire and chip in die material, after the demoulding, namely forms reliably packaging body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855172.7A CN104617052A (en) | 2014-12-30 | 2014-12-30 | Smart card module packaged through adhesive film pre-arranging technology and packaging method |
| PCT/CN2015/094436 WO2016107298A1 (en) | 2014-12-30 | 2015-11-12 | Molding packaged mini mobile phone intelligent card, and packing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855172.7A CN104617052A (en) | 2014-12-30 | 2014-12-30 | Smart card module packaged through adhesive film pre-arranging technology and packaging method |
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| Publication Number | Publication Date |
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| CN104617052A true CN104617052A (en) | 2015-05-13 |
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| CN201410855172.7A Pending CN104617052A (en) | 2014-12-30 | 2014-12-30 | Smart card module packaged through adhesive film pre-arranging technology and packaging method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106471524A (en) * | 2015-06-18 | 2017-03-01 | 株式会社村田制作所 | Carrier band and its manufacture method of manufacture method and RFID label tag |
| CN106682721A (en) * | 2016-12-08 | 2017-05-17 | 杭州电子科技大学 | Tool with RFID label and label packaging method thereof |
| CN109816079A (en) * | 2017-11-21 | 2019-05-28 | 北京握奇智能科技有限公司 | A kind of radio frequency payment mould group and preparation method thereof |
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| CN101409275A (en) * | 2007-11-28 | 2009-04-15 | 上海长丰智能卡有限公司 | Double-interface smart card module and loading belt |
| CN103887271A (en) * | 2012-12-19 | 2014-06-25 | 上海长丰智能卡有限公司 | Mini molding packaged mobile phone card and packaging method |
| CN204441277U (en) * | 2014-12-30 | 2015-07-01 | 上海仪电智能电子有限公司 | A kind of smart card module adopting preset glued membrane technique to encapsulate |
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