CN204441272U - A kind of chip of preset glued membrane - Google Patents
A kind of chip of preset glued membrane Download PDFInfo
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- CN204441272U CN204441272U CN201420871900.9U CN201420871900U CN204441272U CN 204441272 U CN204441272 U CN 204441272U CN 201420871900 U CN201420871900 U CN 201420871900U CN 204441272 U CN204441272 U CN 204441272U
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- chip
- glued membrane
- adhesive film
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Abstract
The utility model discloses a kind of chip of preset glued membrane, preset adhesive film on the circuit layer reverse side of this chip, the circuit layer reverse side corresponding matching of this adhesive film and chip and fitting tightly.The back side of the chip that the utility model provides is prefixed glued membrane, is arranged on by chip on carrier band and is heating and curing, then through techniques such as wire bonds, encapsulation, tests, and the package module that forming property is stable.This chip is adopted to carry out the encapsulation of module, the operation of equipment point glue can be saved, substantially increase production efficiency, avoid the fraction defective because a glue processing procedure produces simultaneously, effectively reduce product cost, whole production process can adopt existing equipment and produce in enormous quantities.
Description
Technical field
The utility model relates to a kind of integrated circuit (IC) chip and integrated antenna package technology, particularly a kind of smart card integrated circuit (IC) chip.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.For the new opplication demand constantly occurred, require that integrated antenna package enterprise can design novel packing forms to coordinate new demand.
At present, in field of semiconductor package, the mode of die bond mostly adopts the mode of silver slurry point glue die bond; Particularly in smart card module encapsulation field, chip is installed on carrier band by traditional smart card module mode of silver slurry die bond that all adopts without exception, by heating by the solidification of silver slurry, then carries out the operations such as follow-up wire bonds, encapsulation, test.Adopt the technique of silver slurry point glue, there is complex production process, material cost is high, spillage of material is large, the shortcomings such as production efficiency is low.
For this reason, develop new production technology and new technology, that this area needs the problem that will solve badly, also occurred in industry adopting the technique of encapsulation to carry out the production that alternative traditional wire bonds technique realizes smart card module, but this mode has its limitation, the versatility of such as carrier band is not strong, the belt for smart card that often kind of necessary Aided design of chip is special, pad on carrier band and the necessary one_to_one corresponding of chip, change chip must change carrier band simultaneously, this mode is for small batch, and the production of polytypic is very unfavorable.
Utility model content
The problem such as high and production efficiency is low for existing smart card module complex production process, production cost, the purpose of this utility model is the chip providing a kind of preset glued membrane.This intelligent card chip, can be advantageously used in smart card and field of semiconductor package, effectively can simplify production procedure, enhance productivity, and more reduces the production cost of product.
In order to achieve the above object, the utility model adopts following technical scheme:
A chip for preset glued membrane, comprises chip circuit layer, it is characterized in that, described chip also comprises adhesive film, and described adhesive film is preset in the reverse side of the circuit layer of chip, the circuit layer reverse side corresponding matching of this adhesive film and chip and fitting tightly.
Further, described adhesive film has the characteristic varying with temperature and produce state and viscosity change, and under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the low temperature melt temperature of glued membrane is between 50-100 DEG C.
Further, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
Further, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can again melt when secondary low-temperature heat.
Further, described adhesive film reaches final solidification after 100-200 DEG C of quick high-temp heating, and after final solidification, heating can not be melted again, has the characteristic that can not recall.
Further, described adhesive film thickness is evenly 5 ~ 30um.
The chip of the preset glued membrane that the utility model provides, it can save the technique of the silver slurry point glue in die bond process in actual application, the processing procedure be heating and curing more can be eliminated under partial picture, greatly save the production time, improve production efficiency, also reduce due to a glue debugging and the raw material loss of waste simultaneously, and thoroughly solve the fraction defective problem in a glue process, for the batch production of product provides technical guarantee.
Moreover the scheme that provides of the utility model can adapt to the encapsulation requirement of semiconductor, integrated circuit fields, is more suitable for the innovation and application in smart card module field, greatly will promote the development of global smart card module Packaging Industry, there is good application prospect.
Accompanying drawing explanation
The utility model is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is the schematic diagram that in the utility model, the wafer circuit back side attaches die bond film;
Fig. 2 is that in the utility model, wafer circuit face attaches die bond film and is coated with the schematic diagram of glued membrane;
Fig. 3 is through being prefixed the schematic diagram of wafer after cutting action of glued membrane in the utility model;
Fig. 4 is one single chip in the utility model after preset glued membrane and glued membrane schematic diagram.
Embodiment
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
See Fig. 4, it is depicted as the one single chip after preset glued membrane and glued membrane schematic diagram that the utility model provides.
As seen from the figure, whole chip is made up of chip circuit layer 32 and the preset and adhesive film 4 covering chip circuit layer 32 reverse side.This adhesive film 4 thickness is even, and its size, shape are all corresponding with chip circuit layer 32 aspect, and fit tightly in chip circuit layer 32.
When specific implementation, the glued membrane forming adhesive film 4 has the characteristic varying with temperature and produce state and viscosity change, and under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the low temperature melt temperature of glued membrane is between 50-100 DEG C.
Further, the glued membrane forming adhesive film 4 solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
As an alternative, form the glued membrane of adhesive film 4, also can adopt and solidify at normal temperatures after a low-temperature heat is melted, the glued membrane that can again melt when secondary low-temperature heat.
As an alternative, form the glued membrane of adhesive film 4, also can adopt and reach final solidification after 100-200 DEG C of quick high-temp heating, after final solidification, heating can not be melted again, has the glued membrane of the characteristic that can not recall.
The thickness of the adhesive film 4 utilizing above-mentioned glued membrane to form is even, and thickness is 5 ~ 30um.
Scheme of the present utility model is further illustrated below by way of an instantiation:
See Fig. 1, it is depicted as the wafer circuit back side in this example and attaches the schematic diagram of die bond film.
Generally, without the wafer 3 of cutting processing, its circuit face mark 31 is upwards placed, and wafer attachment is got up by the film colloid 21 on die bond film by the circuit reverse side of wafer and die bond film 2, plays the effect of fixing wafer.Metal supporting frames 1 is for being reliably fixed up smooth for die bond film.
Before carrying out coating process, need wafer 3 to turn over turnback, namely make circuit labels face (i.e. front) place downwards, make the circuit face of wafer and die bond film adhered.Turn over mold process should adopt first paste new film after carry out except the mode of old film, film should attach reliably smooth,
See Fig. 2, attach die bond film for wafer circuit face in this example and be coated with the schematic diagram of glued membrane, after turning over mold technique through wafer, die bond film 2 is effectively fixed up by metal supporting frames 1, together with the circuit face of wafer 3 is attached to the film colloid 21 of die bond film; Further, the circuit reverse side of wafer 3 exposes.
For the circuit reverse side of the wafer 3 exposed, by automatic double surface gluer, colloid is coated on the circuit reverse side surface of wafer 3, after solidification, forms adhesive film 4.
After glued membrane parches completely, again wafer is turned over mould, the film colloid 21 of the adhesive film 4 and die bond film 2 that are prefixed the wafer of glued membrane is fit together, (see Fig. 3) to be cut.
See Fig. 3, in this example through being prefixed the schematic diagram of wafer after cutting action of glued membrane.Being coated with and turning over the wafer of mould by wafer cutting equipment well cutting on request by completing glued membrane, forming many independently chip 32 uses to be packaged.Detailed process is as follows:
Complete the wafer of glued membrane coating and solidification, by metal supporting frames 1, die bond film 2 is effectively fixed up, through turning over mould, make the circuit face mark 31 of wafer 3 upwards, adhesive film 4 forms corresponding cutting groove 33, makes between chip 32 separate together with being attached to the film colloid 21 of die bond film 2 downwards between chip 32, glued membrane 4 bottom chip 32 is also independent by cutting groove 33, and the severity control of this cutting groove is being greater than the degree of depth bottom glued membrane.
See Fig. 4, be the one single chip in this example after preset glued membrane and glued membrane schematic diagram, chip is removed rear adhesive film 4 and chip 32 is attached together.
When utilizing the above-mentioned chip being prefixed glued membrane to carry out the production of smart card module, chip is arranged on carrier band and is heating and curing, then through techniques such as wire bonds, encapsulation, tests, the package module that forming property is stable.This chip is adopted to carry out the encapsulation of module, not only can save the operation of equipment point glue, substantially increase production efficiency, avoid the fraction defective because a glue processing procedure produces simultaneously, effectively reduce product cost, whole production process can adopt existing equipment and produce in enormous quantities.
More than show and describe general principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a chip for preset glued membrane, comprises chip circuit layer, it is characterized in that, described chip also comprises adhesive film, and described adhesive film is preset in the reverse side of the circuit layer of chip, the circuit layer reverse side corresponding matching of this adhesive film and chip and fitting tightly.
2. the chip of a kind of preset glued membrane according to claim 1, it is characterized in that, described adhesive film has the characteristic varying with temperature and produce state and viscosity change, under normal temperature, glued membrane is solid-state, after heating, glued membrane melts, and producing cohesive force, the low temperature melt temperature of glued membrane is between 50-100 DEG C.
3. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
4. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can again melt when secondary low-temperature heat.
5. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film reaches final solidification after 100-200 DEG C of quick high-temp heating, and after final solidification, heating can not be melted again, has the characteristic that can not recall.
6. the chip of a kind of preset glued membrane according to any one of claim 1-5, is characterized in that, described adhesive film thickness is evenly 5 ~ 30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420871900.9U CN204441272U (en) | 2014-12-30 | 2014-12-30 | A kind of chip of preset glued membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420871900.9U CN204441272U (en) | 2014-12-30 | 2014-12-30 | A kind of chip of preset glued membrane |
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| Publication Number | Publication Date |
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| CN204441272U true CN204441272U (en) | 2015-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420871900.9U Active CN204441272U (en) | 2014-12-30 | 2014-12-30 | A kind of chip of preset glued membrane |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
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2014
- 2014-12-30 CN CN201420871900.9U patent/CN204441272U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |