CN105489509A - Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology - Google Patents
Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology Download PDFInfo
- Publication number
- CN105489509A CN105489509A CN201510990642.5A CN201510990642A CN105489509A CN 105489509 A CN105489509 A CN 105489509A CN 201510990642 A CN201510990642 A CN 201510990642A CN 105489509 A CN105489509 A CN 105489509A
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- CN
- China
- Prior art keywords
- steel mesh
- chip
- substrate
- optical glue
- bonding wire
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses an optical sensing chip package method for optimizing a coating process by applying a metal stencil printing technology. The method comprises processes of core feeding, pressure welding, adhesive printing reinforcement, plastic package and the like. The method has the advantages that the cost of a special die is saved on a particular condition, the cost is saved, the requirement of a particular adhesive shape can be achieved, and the height of an adhesive is controllable.
Description
Technical field
The present invention relates to optical sensor chip encapsulation technology field, specifically a kind of optical sensing chip packaging method applying steel mesh printing technology Optimum Points adhesive process.
Background technology
The current optical sensor chip that relates to encapsulates, and mainly contains two kinds of packaging technologies: first, special plastic package die, first carries out transparent plastic packaging by special dies to product photosensitive region, to ensure to reach special photosensitive demand.Another kind, some glue (coating), namely carrying out a glue by the mode of plastic squeeze and gluing by needing the region of transparent enclosure, meeting special photosensitive requirement.But, the packing material that these two kinds of techniques are used all needs light transmission high, there is certain fluidity, this kind of material is essentially epoxy resin plastic packaging material or glue, and its Main Ingredients and Appearance is epoxy resin, other fillers are almost little, so this situation result in this type of glue have high thermal expansion coefficient, and the feature of viscosity lower (glue is not dried front profile and is difficult to control).
Less for product size, need light between different elements not interfere with each other, need again the optical-chip encapsulation field of special light transmission condition, adopt special dies encapsulation, the investment cost of mould is very big, and can only the corresponding a kind of product of one set of die.
Adopt gluing process, due to the restriction of transparent glue own viscosity characteristic, glue profile is difficult to accomplish to require shape (generally having shape requirement: have certain altitude, spreading area out can not be too large, can not disturb between chip and chip), and efficiency is low.
Summary of the invention
For the problem that above-mentioned prior art proposes, the invention provides a kind of optical sensing chip packaging method applying steel mesh printing technology Optimum Points adhesive process, the present invention realizes plastic packaging and gluing process by steel mesh printing, and technological process is simple, easy realization, investment cost is low.
The optical sensing chip packaging method of application steel mesh printing technology Optimum Points adhesive process, carries out in accordance with the following steps:
The first step, prepared substrate;
Second step, upper core and pressure welding, pasting chip on substrate, bonding wire connects chip and substrate;
3rd step, steel mesh printing and rapid curing, be positioned on substrate with the pertusate steel mesh of band, chip and bonding wire combination are positioned at the hollow spaces of steel mesh, place optical glue in steel mesh upper surface one end, the upper surface that steel mesh is close to by scraper slides to the other end, and optical glue falls in the hollow spaces of steel mesh, cover chip and bonding wire combination, the heating platform distribute heat rapid curing optical glue of base plate bottom;
4th step, after optical glue solidification, removes steel mesh;
5th step, is placed on chip, bonding wire, substrate and optical glue in the mould with cavity, injects plastic packaging material in cavity, forms plastic-sealed body parcel chip, bonding wire, substrate and optical glue;
6th step, removes mould, by grinding technics, is removed by unnecessary plastic-sealed body, expose optical glue, the encapsulating structure needed for formation.
Described chip comprises LED element and sensitive chip.
The advantage of this invention:
1, utilize glue rapid curing nature, make steel mesh, brush coating is shaped, and under specified conditions, does not need to make special dies, saves die cost;
2, steel mesh aperture can be made needs shape, and compare mould, cost is lower;
3, compare gluing process, efficiency is higher;
4, solve gluing process, the control of glue formed profile difficulty, light such as easily to disturb at the problem, and utilizing steel mesh to make needs profile, utilizes steel mesh THICKNESS CONTROL glue forming height.
Accompanying drawing explanation
Fig. 1 is upper core and wire bonding schematic diagram;
Fig. 2 is steel mesh printing and rapid curing schematic diagram;
Fig. 3 is for removing steel mesh schematic diagram;
Fig. 4 is mould plastic packaging schematic diagram;
Fig. 5 is for removing mould schematic diagram.
In figure, 1 be chip, 2 be bonding wire, 3 be substrate, 4 be steel mesh, 5 be optical glue, 6 be scraper, 7 be heating platform, 8 be plastic-sealed body, 9 for mould.
Embodiment
The optical sensing chip packaging method of application steel mesh printing technology Optimum Points adhesive process, carries out in accordance with the following steps:
The first step, prepared substrate 3;
Second step, upper core and pressure welding, on the substrate 3 pasting chip 1, bonding wire 2 connects chip 1 and substrate 3, as shown in Figure 1;
3rd step, steel mesh printing and rapid curing, be positioned on substrate 3 with the pertusate steel mesh 4 of band, chip 1 and bonding wire 2 combination are positioned at the hollow spaces of steel mesh 4, and place optical glue 5 in steel mesh 4 upper surface one end, the upper surface that steel mesh 4 is close to by scraper 6 slides to the other end, optical glue 5 falls in the hollow spaces of steel mesh 4, covering chip 1 and bonding wire 2 combine, the heating platform 7 distribute heat rapid curing optical glue 5 bottom substrate 3, as shown in Figure 2;
4th step, after optical glue 5 is solidified, removes steel mesh 4, as shown in Figure 3;
5th step, is placed on chip 1, bonding wire 2, substrate 3 and optical glue 5 in the mould 9 with cavity, injects plastic packaging material in cavity, forms plastic-sealed body 8 and wraps up chip 1, bonding wire 2, substrate 3 and optical glue 5, as shown in Figure 4;
6th step, removes mould 9, by grinding technics, is removed by unnecessary plastic-sealed body 8, expose optical glue 5, the encapsulating structure needed for formation, as shown in Figure 5.
Described chip 1 comprises LED element and sensitive chip.
Claims (2)
1. apply the optical sensing chip packaging method of steel mesh printing technology Optimum Points adhesive process, it is characterized in that, carry out in accordance with the following steps:
The first step, prepared substrate (3);
Second step, upper core and pressure welding, at the upper pasting chip (1) of substrate (3), bonding wire (2) connects chip (1) and substrate (3);
3rd step, steel mesh printing and rapid curing, be positioned on substrate (3) with the pertusate steel mesh of band (4), chip (1) and bonding wire (2) combination are positioned at the hollow spaces of steel mesh (4), optical glue (5) is placed in steel mesh (4) upper surface one end, the upper surface that steel mesh (4) is close to by scraper (6) slides to the other end, optical glue (5) falls in the hollow spaces of steel mesh (4), cover chip (1) and bonding wire (2) combination, heating platform (7) distribute heat rapid curing optical glue (5) of substrate (3) bottom;
4th step, after optical glue (5) solidification, removes steel mesh (4);
5th step, chip (1), bonding wire (2), substrate (3) and optical glue (5) are placed in the mould (9) with cavity, inject plastic packaging material in cavity, form plastic-sealed body (8) parcel chip (1), bonding wire (2), substrate (3) and optical glue (5);
6th step, removes mould (9), by grinding technics, is removed by unnecessary plastic-sealed body (8), exposes optical glue (5), the encapsulating structure needed for formation.
2. the optical sensing chip packaging method of application steel mesh printing technology Optimum Points adhesive process according to claim 1, it is characterized in that, described chip (1) comprises LED element and sensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990642.5A CN105489509A (en) | 2015-12-25 | 2015-12-25 | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990642.5A CN105489509A (en) | 2015-12-25 | 2015-12-25 | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105489509A true CN105489509A (en) | 2016-04-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510990642.5A Pending CN105489509A (en) | 2015-12-25 | 2015-12-25 | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105489509A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784031A (en) * | 2017-01-18 | 2017-05-31 | 华天科技（西安）有限公司 | A kind of packaging part of novel photoelectric sensor |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN110517963A (en) * | 2019-09-05 | 2019-11-29 | 合肥矽迈微电子科技有限公司 | A kind of ring membrane structure Shooting Technique |
| CN112018272A (en) * | 2020-09-10 | 2020-12-01 | 紫旸升光电科技(苏州)有限公司 | Wafer laminating and packaging method of silicon-based OLED |
| CN113193101A (en) * | 2021-04-07 | 2021-07-30 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method of barrier type blue light emitting device display |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201112408Y (en) * | 2007-09-05 | 2008-09-10 | 李克新 | Luminescent diode packaging structure |
| US20100200982A1 (en) * | 2009-02-06 | 2010-08-12 | Noriyuki Kimura | Semiconductor device and manufacturing method thereof |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
-
2015
- 2015-12-25 CN CN201510990642.5A patent/CN105489509A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201112408Y (en) * | 2007-09-05 | 2008-09-10 | 李克新 | Luminescent diode packaging structure |
| US20100200982A1 (en) * | 2009-02-06 | 2010-08-12 | Noriyuki Kimura | Semiconductor device and manufacturing method thereof |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784031A (en) * | 2017-01-18 | 2017-05-31 | 华天科技（西安）有限公司 | A kind of packaging part of novel photoelectric sensor |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN110517963A (en) * | 2019-09-05 | 2019-11-29 | 合肥矽迈微电子科技有限公司 | A kind of ring membrane structure Shooting Technique |
| CN112018272A (en) * | 2020-09-10 | 2020-12-01 | 紫旸升光电科技(苏州)有限公司 | Wafer laminating and packaging method of silicon-based OLED |
| CN113193101A (en) * | 2021-04-07 | 2021-07-30 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method of barrier type blue light emitting device display |
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Application publication date: 20160413 |