CN109548313A - A kind of FPC component paster technique - Google Patents
A kind of FPC component paster technique Download PDFInfo
- Publication number
- CN109548313A CN109548313A CN201811448229.6A CN201811448229A CN109548313A CN 109548313 A CN109548313 A CN 109548313A CN 201811448229 A CN201811448229 A CN 201811448229A CN 109548313 A CN109548313 A CN 109548313A
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- China
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- fpc
- component
- fpc plate
- glue
- steel mesh
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of FPC component paster techniques, the paster technique includes the following steps: that S1.FPC plate is fixed, and -- S2 glue prints -- S3 paste solder printing -- S4 attachment -- S5 solidification -- S6 middle inspection -- S7 reflow soldering -- S8 testing product, complete processing procedure, the present invention passes through double steel mesh designs in processing procedure, successively glue and tin cream are bitten in FPC plate predeterminated position, simultaneously, tin cream steel mesh version is designed using empty avoiding, keep dispensing position and tin cream steel mesh non-interference, reinforce component patch thrust, the production quality of circuit board is ensured, solve presently, there are LED or capacitive plates thrust technical problem not up to standard, suitable for large-scale efficiently production.
Description
Technical field
The invention belongs to SMT(surface mounting technologies) technical field, it is related to a kind of FPC component paster technique.
Background technique
As electronic product develops to short and small, frivolous direction, just require that electronic component is integrated, microminiature accordingly
Change.Traditional through hole mount technology (THT) has been unable to meet requirement, mounting technology of new generation, i.e. surface mounting technology (SMT)
Just come into being.For broadest scope, SMT be include element pasted on surface (SMC:Surface Mount
Component), surface mount device (SMD:Surface Mount Device), surface mount printed circuit board (SMB:
Surface Mount Printed Circuit Board), commonly load in mixture printed circuit board (PCB:Printed Circuit
Board), dispensing, apply the technology contents such as cream, surface-mounting equipment, component clamping and placing system, welding and on-line testing a whole set of
The general designation of complete process technical process.Surface mount process mainly includes three basic links: applying solder paste, patch and weldering
Connect, below our emphasis the first two basic links.When being produced in enormous quantities, we generally use full-automatic printer progress
(i.e. the applying solder paste) of printing.During present FPC patch, need to assess the weld strength that component is welded on FPC,
In a standard be exactly thrust that LED forward direction is subject to；The numerical value is different using specification and field of employment according to LED, it is required that not
With when LED is greater than LED weld strength by downward requirement thrust, pad may fall off, and cause the dead lamp phenomenon of LED,
With the high speed development of electronics manufacturing, surface mounting technology and industry are similarly grown rapidly, and electronic product is pursued small-sized
Change, weld that the technical requirements connect are more and more tighter, the problem, which has become, at present influences the bottleneck that mobile phone selects lamp using backlight, part
LED is because optical property meets the requirements, but welding performance is unable to reach ideal index.
Summary of the invention
The main purpose of the present invention is to provide a kind of FPC component paster techniques, can effectively solve in background technique
The problem of.
To achieve the above object, the technical scheme adopted by the invention is as follows: a kind of FPC component paster technique, feature exist
In, comprising the following steps:
FPC back is fixed on localization tool by S1, fixation, and optical camera carries out circuit and position detection to FPC plate, is
The welding of component 30 is prepared；
S2, glue printing, optical camera to FPC plate 10 detect it is errorless after, the first steel mesh version is affixed on the front of FPC plate 10, is passed through
Carry out steel mesh printing of the dispensing position to FPC plate；
Second steel mesh version, is placed in the one side for printing glue by S3, paste solder printing, and the second steel mesh version is set in corresponding dispensing position position
There are mesh and avoiding hollow groove, tin cream is bitten to the fixation position of FPC plate by the second steel mesh version；
FPC plate after completion paste solder printing step is sent into chip mounter by S4, attachment, and chip mounter accurately installs component
To the fixed position of FPC plate；
S5, solidification will complete mounted FPC plate and be sent into curing oven, and curing oven melts Heraeus, will assembling component and
FPC plate bonds together；
S6, middle inspection, check whether the polarity of the component fixed shifts phenomenon whether there is or not reversed, attachment, and whether there is or not short
Road and whether lack component；
Circuit board after completion step S5 is sent in reflow soldering and carries out reflow soldering by S7, reflow soldering, and soldering paste melts, and makes
Surface-assembled component is together with FPC plate strong bond；
S8, detection carry out the detection of welding quality and assembling quality using detecting instrument to assembled FPC plate.
Further technical solution is that the specific color of the glue is selected according to FPC plate welding surface surface color, described
Glue color and the FPC plate face of weld color are inconsistent.
Further technical solution is that the avoiding hollow groove and the horizontal distance of the dispensing position need to meet:
0.15mm<A<0.3mm
Further technical solution is that the avoiding hollow groove and the vertical range of the dispensing position need to meet:
0.03mm<B<0.05mm
Further technical solution is that dispensing position two sides respectively correspond the mesh.
Further technical solution is that the dispensing position is located at the lower section of the component, and the component passes through tin cream
Welding and glue are fixed on the FPC plate.
Compared with prior art, the invention has the following beneficial effects: successively printed glue and tin cream by two steel meshes
Brush can be isolated in FPC plate surface, tin cream steel mesh version using empty avoiding design in dispensing position, reinforce component patch thrust, thus
The production quality for having ensured circuit board, solve the problems, such as presently, there are LED or capacitive plates thrust it is not up to standard, can be suitable for
Large-scale production.
Detailed description of the invention
Fig. 1 is FPC component structure schematic diagram during the present invention is implemented.
Fig. 2 is FPC component partial sectional view during the present invention is implemented；
Wherein: 10, FPC plate；20 tin creams, 30 components, 40 dispensing positions, 50 second steel mesh versions, 51, mesh；52, avoiding hollow groove.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is a part of the embodiment in the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
As Fig. 1-2 shows.
FPC back is fixed on localization tool by S1, fixation, and optical camera carries out circuit to FPC plate and position is examined
It surveys, prepares for the welding of component 30.
S2, glue printing, optical camera to FPC plate 10 detect it is errorless after, the first steel mesh version (not shown) is affixed on FPC plate
10 fronts, pass through the carry out steel mesh printing of 40 pairs of dispensing position FPC plate 10.
Second steel mesh version 50 is placed in above the first steel mesh version by S3, paste solder printing, and the second steel mesh version is in corresponding dispensing position 40
Position is equipped with mesh 51 and avoiding hollow groove 52, and tin cream 20 can be bitten to the predeterminated position of FPC plate 10.
S4, attachment will complete the FPC plate 10 after 20 print steps of tin cream and be sent into chip mounter, and chip mounter is by component 30
Accurately it is installed to the fixed position of FPC plate 10.
S5, solidification will complete mounted FPC plate 10 and be sent into curing oven, and curing oven melts Heraeus, will assemble first device
Part 30 and FPC plate 10 bonds together.
S6, middle inspection, check whether the polarity of the component 30 fixed shifts phenomenon whether there is or not reversed, attachment,
Whether there is short circuit and whether lacks component.
FPC plate 10 after completion step S5 is sent in reflow soldering and carries out reflow soldering by S7, reflow soldering, and soldering paste melts
Change, makes surface-assembled component 30 together with 10 strong bond of FPC plate.
S8, detection carry out the detection of welding quality and assembling quality using detecting instrument to assembled FPC plate 10.
Wherein, in step 2 glue specific color according to FPC welding surface surface color select, the glue color need with
FPC face of weld color is variant, so that we visually inspect with the presence or absence of leakage brush coating water phenomenon, dispensing position 40 is located at component
30 lower section, hole for injecting glue is corresponding with dispensing position 40 in the first steel mesh version.
It in step 3, needs to meet with the horizontal distance of dispensing position 40: 0.15mm < A < 0.3mm；Avoiding hollow groove 52 and dispensing position 40
Vertical range need to meet: 0.03mm < B < 0.05mm；Because step 2 republishes tin cream through having printed one layer of glue on FPC plate 10
When, need empty avoiding to design in the place for having glue；Dispensing position 40 is located at the lower section of component 30, and component 30 is welded by tin cream
It is fixed on FPC plate 10 with glue, wherein 40 two sides of dispensing position are corresponding.
With above-mentioned FPC preliminary processes processing procedure, we carry out repetition test, in several indexs with previous FPC patch system
Journey compares, as shown in the table:
Embodiment two.
It is as shown in Figs. 1-2:
FPC back is fixed on localization tool by S1, fixation, and optical camera carries out circuit and position detection to FPC plate, is
The welding of component 30 is prepared.
S2, dispensing, optical camera to FPC plate 10 detect it is errorless after, dispenser is in the 10 predeterminated position dispensing of FPC plate.
Second steel mesh version is placed in the one side for printing glue by S3, paste solder printing, and the second steel mesh version is in corresponding dispensing position 40
Position is equipped with and avoiding hollow groove 52, and tin cream can be bitten to the predeterminated position of FPC plate 10.
FPC after completion 20 print steps of tin cream is sent into chip mounter by S4, attachment, and chip mounter is accurate by component 30
The fixation position for being installed to FPC plate 10.
S5, solidification will complete mounted circuit board and be sent into curing oven, and curing oven melts Heraeus, will assemble first device
Part 30 and FPC plate 10 bonds together.
S6, middle inspection, check whether the polarity of the component 30 fixed shifts phenomenon whether there is or not reversed, attachment,
Whether there is short circuit and whether lacks component 30.
FPC plate 10 after completion step S5 is sent in reflow soldering and carries out reflow soldering by S7, reflow soldering, and soldering paste melts
Change, makes surface-assembled component 30 together with 10 strong bond of FPC plate.
S8, detection carry out the detection of welding quality and assembling quality using detecting instrument to assembled FPC.
Wherein, in step 2 glue specific color according to FPC welding surface surface color select, the glue color need with
FPC face of weld color is variant, so that we visually inspect with the presence or absence of leakage brush coating water phenomenon, dispensing position 40 is located at component
Glue is injected by dispensing position 40 in 30 lower section.
In step 3, horizontal distance of the avoiding hollow groove 52 apart from printing glue needs to meet: 0.15mm < A < 0.3mm；Avoiding hollow groove 52
Vertical range apart from dispensing position 40 needs to meet: 0.03mm < B < 0.05mm；Because step 2 passes through the corresponding position dispensing on FPC plate 10
When, need empty avoiding to design in the place for having glue, component 30 is fixed on FPC plate 10 by tin cream welding and glue, wherein
Dispensing position two sides correspond to the second steel mesh version.
With above-mentioned FPC preliminary processes processing procedure, we carry out repetition test, in several indexs with previous FPC patch system
Journey compares, as shown in the table:
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.For institute
For the those of ordinary skill in category field, other various forms of variations or change can also be made on the basis of the above description
It is dynamic.There is no necessity and possibility to exhaust all the enbodiments.And obvious variation extended from this or change
It moves still within the protection scope of the invention.
Claims (6)
1. a kind of FPC component paster technique, which comprises the following steps:
FPC back is fixed on localization tool by S1, fixation, and optical camera carries out circuit and position detection to FPC plate, is
The welding of component is prepared；
First steel mesh version after optical camera is errorless to the detection of FPC plate, is affixed on 10 front of FPC plate, passed through a little by S2, glue printing
Carry out steel mesh printing of the glue position to FPC plate；
Second steel mesh version, is placed in the one side for printing glue by S3, paste solder printing, and the second steel mesh version is set in corresponding dispensing position position
There are mesh and avoiding hollow groove, tin cream is bitten to the fixation position of FPC plate by the second steel mesh version；
FPC plate after completion paste solder printing step is sent into chip mounter by S4, attachment, and chip mounter accurately installs component
To the fixed position of FPC plate；
S5, solidification will complete mounted FPC plate and be sent into curing oven, and curing oven melts Heraeus, will assembling component and
FPC plate bonds together；
S6, middle inspection, check whether the polarity of the component fixed shifts phenomenon whether there is or not reversed, attachment, and whether there is or not short
Road and whether lack component；
Circuit board after completion step S5 is sent in reflow soldering and carries out reflow soldering by S7, reflow soldering, and soldering paste melts, and makes
Surface-assembled component is together with FPC plate strong bond；
S8, detection carry out the detection of welding quality and assembling quality using detecting instrument to assembled FPC plate.
2. a kind of FPC component paster technique according to claim 1, which is characterized in that the specific color of the glue
It is selected according to FPC plate welding surface surface color, the glue color and the FPC plate face of weld color are inconsistent.
3. a kind of FPC component paster technique according to claim 1, which is characterized in that described in the avoiding hollow groove distance
The horizontal distance of dispensing position needs to meet:
0.15mm<A<0.3mm。
4. a kind of FPC component paster technique according to claim 1, which is characterized in that described in the avoiding hollow groove distance
The vertical range of dispensing position needs to meet:
0.03mm<B<0.05mm。
5. a kind of FPC component paster technique according to claim 1, dispensing position two sides respectively correspond the net
Hole.
6. a kind of FPC component paster technique according to claim 1, which is characterized in that the dispensing position is located at described
The lower section of component, the component are fixed on the FPC plate by tin cream welding and glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811448229.6A CN109548313A (en) | 2018-11-30 | 2018-11-30 | A kind of FPC component paster technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811448229.6A CN109548313A (en) | 2018-11-30 | 2018-11-30 | A kind of FPC component paster technique |
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| Publication Number | Publication Date |
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| CN109548313A true CN109548313A (en) | 2019-03-29 |
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| CN201811448229.6A Pending CN109548313A (en) | 2018-11-30 | 2018-11-30 | A kind of FPC component paster technique |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110099521A (en) * | 2019-06-05 | 2019-08-06 | 深圳市南极光电子科技股份有限公司 | A kind of welding method and PCB lamp bar of FPC and PCB lamp bar |
| CN112413424A (en) * | 2020-12-08 | 2021-02-26 | 湖北谱辰光电有限公司 | Production method of LED lamp strip |
| CN112770533A (en) * | 2020-12-31 | 2021-05-07 | 海纳川海拉电子(江苏)有限公司 | High-precision LED position precision assembling method based on dispensing technology |
| CN113141730A (en) * | 2021-04-14 | 2021-07-20 | 深圳市鸿岸电子科技有限公司 | LED (light emitting diode) surface mounting method of FPC (Flexible printed Circuit) |
| CN113471088A (en) * | 2021-06-29 | 2021-10-01 | 华天科技(南京)有限公司 | Optimized POP repackaging method adopting MUF process |
| CN114423179A (en) * | 2022-02-15 | 2022-04-29 | 惠州市则成技术有限公司 | Welding manufacturing process based on FPC board and components |
| CN115249445A (en) * | 2022-08-16 | 2022-10-28 | 广州市建研零碳新材料科技有限公司 | Manufacturing method of ultrathin glass-based display module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489509A (en) * | 2015-12-25 | 2016-04-13 | 华天科技（西安）有限公司 | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology |
| CN105538888A (en) * | 2016-02-20 | 2016-05-04 | 李旭 | Three-in-one intelligent SMT (surface-mount technology) printing press |
| CN107995797A (en) * | 2017-10-31 | 2018-05-04 | 马瑞利汽车零部件(芜湖)有限公司 | High-accuracy PCB paster technique |
| CN107993984A (en) * | 2017-12-28 | 2018-05-04 | 南京皓赛米电力科技有限公司 | A kind of base plate for packaging and manufacturing process for improving power semiconductor reliability |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
-
2018
- 2018-11-30 CN CN201811448229.6A patent/CN109548313A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489509A (en) * | 2015-12-25 | 2016-04-13 | 华天科技（西安）有限公司 | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology |
| CN105538888A (en) * | 2016-02-20 | 2016-05-04 | 李旭 | Three-in-one intelligent SMT (surface-mount technology) printing press |
| CN107995797A (en) * | 2017-10-31 | 2018-05-04 | 马瑞利汽车零部件(芜湖)有限公司 | High-accuracy PCB paster technique |
| CN107993984A (en) * | 2017-12-28 | 2018-05-04 | 南京皓赛米电力科技有限公司 | A kind of base plate for packaging and manufacturing process for improving power semiconductor reliability |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110099521A (en) * | 2019-06-05 | 2019-08-06 | 深圳市南极光电子科技股份有限公司 | A kind of welding method and PCB lamp bar of FPC and PCB lamp bar |
| CN110099521B (en) * | 2019-06-05 | 2021-11-09 | 深圳市南极光电子科技股份有限公司 | Welding method for FPC (flexible printed circuit) and PCB (printed circuit board) lamp strip and PCB lamp strip |
| CN112413424A (en) * | 2020-12-08 | 2021-02-26 | 湖北谱辰光电有限公司 | Production method of LED lamp strip |
| CN112770533A (en) * | 2020-12-31 | 2021-05-07 | 海纳川海拉电子(江苏)有限公司 | High-precision LED position precision assembling method based on dispensing technology |
| CN113141730A (en) * | 2021-04-14 | 2021-07-20 | 深圳市鸿岸电子科技有限公司 | LED (light emitting diode) surface mounting method of FPC (Flexible printed Circuit) |
| CN113471088A (en) * | 2021-06-29 | 2021-10-01 | 华天科技(南京)有限公司 | Optimized POP repackaging method adopting MUF process |
| CN114423179A (en) * | 2022-02-15 | 2022-04-29 | 惠州市则成技术有限公司 | Welding manufacturing process based on FPC board and components |
| CN114423179B (en) * | 2022-02-15 | 2024-02-27 | 惠州市则成技术有限公司 | Welding manufacturing process based on FPC board and components |
| CN115249445A (en) * | 2022-08-16 | 2022-10-28 | 广州市建研零碳新材料科技有限公司 | Manufacturing method of ultrathin glass-based display module |
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Application publication date: 20190329 |