CN101977485B - Patching method for circuit board - Google Patents
Patching method for circuit board Download PDFInfo
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- CN101977485B CN101977485B CN201010524669.2A CN201010524669A CN101977485B CN 101977485 B CN101977485 B CN 101977485B CN 201010524669 A CN201010524669 A CN 201010524669A CN 101977485 B CN101977485 B CN 101977485B
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- wiring board
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Abstract
The invention discloses a patching method for a circuit board. The method comprises the following steps of: 1) making a plastic patch template; 2) brushing soldering paste on the circuit board; 3) sticking a corresponding element at a corresponding position; and 4) welding the stuck element by using a reflow welder. In the step of welding the stuck element by using the reflow welder, the circuit board is welded by the reflow welder according to welding temperature and welding time which are set based on a reflow welding characteristic curve, the component of the soldering paste is Sn63/Pb37 and the melting point is 183 DEG C. The patching method for the circuit board has the advantages of effectively ensuring the welding quality of the element, greatly improving the welding efficiency of a patched element, lowering the requirements of the patched element/chip on the professional welding skills of production personnel and greatly lowering the processing cost of the patched element. An operation method is simple and practical and has high application and popularization value.
Description
Technical field
The present invention relates to a kind of pasting method for wiring board.
Background technology
At present, in the production process of standardized product, the in the situation that on some wiring boards, less, the new product test-type of surface mount elements being produced or more suddenly cannot external coordination carries out paster processing in the production cycle, SMD components all adopts manual welding, but there is following drawback in this kind of method: 1, because surface mount elements volume is little, pad is little, pin is many, therefore employee's solder technology and the suitable welding temperature of grasp are had to high requirement, slightly error will cause components and parts performance failure, causes product quality hidden danger; 2, manual welding production efficiency is low, long in time limit, often affects shipping period.Therefore just need to develop a kind of time that does not need to consume specialty welding employee, reach the paster welding method of quick production, assurance welding quality.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of pasting method for wiring board for problems of the prior art, its objective is the quality and the efficiency that improve SMD components welding, reduces the technical need to welding personnel simultaneously.
Technical scheme of the present invention is that this kind comprises for the pasting method of wiring board:
1) make mold paster template;
2) brush is smeared solder(ing) paste in the circuit board;
3) on corresponding position, paste corresponding components and parts;
4) components and parts that paste being crossed to reflow machine welds.
The manufacture method of described mold paster template is:
1) print PCB circuit board drawing 1: 1 ratio, need to be soldering surface mounted;
2) the PCB figure sticker of printing is being schemed on big or small identical plastic film with PCB;
3), by the surface mount elements position of printing on PCB circuit board drawing, with paper knife, on plastic film, inscribe the copper face that covers that needs SMD components;
4) take off the PCB circuit board drawing of printing.
The concrete grammar that described brush is in the circuit board smeared solder(ing) paste is:
1) paster on the hole in plastics paster template and PCB wiring board is covered to copper face position alignment, and fix with clip;
2) with solder(ing) paste, the hole in paster template is covered and scraped and smear evenly;
3) take off paster template, and repair solder(ing) paste on wiring board and have connected place.
The described concrete grammar of pasting corresponding components and parts on corresponding position is:
1) components and parts on wiring board are placed respectively to different magazines by model;
2) according to material list, with tweezers, SMD components is placed into respectively to the circuit board component position of having brushed solder(ing) paste, and under flicking, utilizes the fixing components and parts of viscosity of solder(ing) paste.
It is to utilize reflow soldering characteristic curve to set welding temperature and the time welds wiring board successively by reflow machine that the described components and parts by pasting cross that reflow machine welds.
The composition of described tin cream is Sn63/Pb37, and fusing point is 183 ℃.
Or the composition of described tin cream is Sn62/Pb36/Ag2, fusing point is 179 ℃.
A kind of pasting method for wiring board with above-mentioned special construction has the following advantages:
1, this kind effectively guaranteed the quality of welding component for the pasting method of wiring board, improved greatly the efficiency of surface mount elements welding, reduced surface mount elements, the specialty welding technical ability requirement of chip to Manufacturing Worker simultaneously.
2, this kind significantly reduced SMD components processing cost for the pasting method of wiring board, and method of operation is simple, has good application and popularization value.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described:
Fig. 1 is operating process schematic diagram of the present invention.
Fig. 2 is the structural representation of the PCB template printed of the present invention.
Fig. 3 is welding characteristic curve synoptic diagram in the present invention.
Embodiment
From structure shown in Fig. 1-3 in conjunction with, this kind comprises for the pasting method of wiring board:
1) make mold paster template;
2) brush is smeared solder(ing) paste in the circuit board;
3) on corresponding position, paste corresponding components and parts;
4) components and parts that paste being crossed to reflow machine welds.
Wherein, the manufacture method of mold paster template is:
1) print PCB circuit board drawing 1: 1 ratio, need to be soldering surface mounted;
2) the PCB figure sticker of printing is being schemed on big or small identical plastic film with PCB;
3), by the surface mount elements position of printing on PCB circuit board drawing, with paper knife, on plastic film, inscribe the copper face that covers that needs SMD components;
4) take off the PCB circuit board drawing of printing.
The concrete grammar that brush is smeared solder(ing) paste is in the circuit board:
1) paster on the hole in plastics paster template and PCB wiring board is covered to copper face position alignment, and fix with clip;
2) with solder(ing) paste, the hole in paster template is covered and scraped and smear evenly;
3) take off paster template, and repair solder(ing) paste on wiring board and have connected place.
The concrete grammar of pasting corresponding components and parts on corresponding position is:
1) components and parts on wiring board are placed respectively to different magazines by model;
2) according to material list, with tweezers, SMD components is placed into respectively to the circuit board component position of having brushed solder(ing) paste, and under flicking, utilizes the fixing components and parts of viscosity of solder(ing) paste.
It is that to utilize reflow soldering characteristic curve to set the composition that welding temperature and time welds tin cream used by reflow machine successively by wiring board be Sn63/Pb37 that the components and parts that paste are crossed to reflow machine welds, and fusing point is 183 ℃.
The composition of all tin creams can be also Sn62/Pb36/Ag2, and fusing point is 179 ℃.
This kind effectively guaranteed the quality of welding component for the pasting method of wiring board, improved greatly the efficiency of surface mount elements welding, reduce surface mount elements, the specialty welding technical ability requirement of chip to Manufacturing Worker simultaneously, significantly reduced SMD components processing cost.
Claims (5)
1. for a pasting method for wiring board, it is characterized in that: described pasting method comprises:
1) make mold paster template;
2) brush is smeared solder(ing) paste in the circuit board;
3) on corresponding position, paste corresponding components and parts;
4) components and parts that paste being crossed to reflow machine welds;
And the manufacture method of described mold paster template is:
1) print a PCB circuit board drawing 1:1 ratio, need to be soldering surface mounted;
2) the PCB figure sticker of printing is being schemed on big or small identical plastic film with PCB;
3), by the surface mount elements position of printing on PCB circuit board drawing, with paper knife, on plastic film, inscribe the copper face that covers that needs SMD components;
4) take off the PCB circuit board drawing of printing;
The concrete grammar that described brush is in the circuit board smeared solder(ing) paste is:
1) paster on the hole in plastics paster template and PCB wiring board is covered to copper face position alignment, and fix with clip;
2) with solder(ing) paste, the hole in paster template is covered and scraped and smear evenly;
3) take off paster template, and repair solder(ing) paste on wiring board and have connected place.
2. a kind of pasting method for wiring board according to claim 1, is characterized in that: the described concrete grammar of pasting corresponding components and parts on corresponding position is:
1) components and parts on wiring board are placed respectively to different magazines by model;
2) according to material list, with tweezers, SMD components is placed into respectively to the circuit board component position of having brushed solder(ing) paste, and under flicking, utilizes the fixing components and parts of viscosity of solder(ing) paste.
3. according to a kind of pasting method for wiring board described in claim 1-2 any one claim, it is characterized in that: it is to utilize reflow soldering characteristic curve to set welding temperature and the time welds wiring board successively by reflow machine that the described components and parts by pasting cross that reflow machine welds.
4. a kind of pasting method for wiring board according to claim 3, is characterized in that: the composition of described tin cream is Sn63/Pb37, fusing point is 183 ℃.
5. a kind of pasting method for wiring board according to claim 3, is characterized in that: the composition of described tin cream is Sn62/Pb36/Ag2, fusing point is 179 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010524669.2A CN101977485B (en) | 2010-10-29 | 2010-10-29 | Patching method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010524669.2A CN101977485B (en) | 2010-10-29 | 2010-10-29 | Patching method for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101977485A CN101977485A (en) | 2011-02-16 |
| CN101977485B true CN101977485B (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010524669.2A Active CN101977485B (en) | 2010-10-29 | 2010-10-29 | Patching method for circuit board |
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| Country | Link |
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| CN (1) | CN101977485B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573324A (en) * | 2011-12-15 | 2012-07-11 | 华东光电集成器件研究所 | Assembling method for devices |
| CN104754881B (en) * | 2013-12-31 | 2017-07-14 | 深圳市堃琦鑫华股份有限公司 | A kind of jet flow welding method |
| CN106535498A (en) * | 2016-11-10 | 2017-03-22 | 江苏鸿佳电子科技有限公司 | Circuit board patch welding method for LED lamp |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN101772276A (en) * | 2009-12-31 | 2010-07-07 | 深圳和而泰智能控制股份有限公司 | Method for installing press key in printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101775A (en) * | 1988-10-11 | 1990-04-13 | Yokogawa Electric Corp | Double-faced printed board and its mounting method |
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2010
- 2010-10-29 CN CN201010524669.2A patent/CN101977485B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN101772276A (en) * | 2009-12-31 | 2010-07-07 | 深圳和而泰智能控制股份有限公司 | Method for installing press key in printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN101977485A (en) | 2011-02-16 |
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Address after: 241008 Anhui Province, Wuhu City Jiuhua Jiujiang District Road No. 118 Patentee after: ANHUI ZHONGDIAN XINGFA AND XINLONG TECHNOLOGY CO., LTD. Address before: 241008 Anhui Province, Wuhu City Jiuhua Jiujiang District Road No. 118 Patentee before: Xinlong Electric-Appliance Co., Ltd., Anhui |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110216 Assignee: Anhui Xinlong Automation Co., Ltd. Assignor: ANHUI ZHONGDIAN XINGFA AND XINLONG TECHNOLOGY CO., LTD. Contract record no.: 2017340000019 Denomination of invention: Patching method for circuit board Granted publication date: 20140416 License type: Exclusive License Record date: 20170420 |
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