CN106535498A - Circuit board patch welding method for LED lamp - Google Patents
Circuit board patch welding method for LED lamp Download PDFInfo
- Publication number
- CN106535498A CN106535498A CN201610989456.4A CN201610989456A CN106535498A CN 106535498 A CN106535498 A CN 106535498A CN 201610989456 A CN201610989456 A CN 201610989456A CN 106535498 A CN106535498 A CN 106535498A
- Authority
- CN
- China
- Prior art keywords
- paster
- wiring board
- welding method
- welding
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board patch welding method for an LED lamp. The method comprise steps of a, circuit board fixing; b, soldering paste brushing; c, component pasting; and d, component welding. The method is advantaged in that labor cost is saved, the mounting process is simple and direct, quality of welding components is guaranteed, patch welding efficiency is greatly improved, and improvement of efficiency and precision of patches is facilitated.
Description
Technical field
A kind of the present invention relates to technical field of LED, more particularly to wiring board paster welding method for LED.
Background technology
At present, in the production process of standardized product, especially on the wiring board of ED lamps, surface mount elements are less, new product
Test-type produces or more suddenly cannot be in the case that external coordination carries out paster processing in the production cycle, and SMD components all adopt craft
Welding, but there is following drawback in this kind of method：1st, as surface mount elements small volume, pad are little, pin is more, therefore to employee's
The suitable welding temperature of solder technology and grasp suffers from high requirement, and slightly error may result in components and parts performance failure, make
Into product quality hidden danger；2nd, manual welding low production efficiency, long in time limit, Jing often affects shipping period.Therefore it is accomplished by exploitation one
The time that need not consume specialty welding employee is planted, quick production, the paster welding method of guarantee welding quality is reached.
The content of the invention
The invention mainly solves the technical problem of providing a kind of wiring board paster welding method for LED, save
Labour cost, attachment process are simple, direct, it is ensured that the quality of welding component, greatly improve the efficiency of paster welding,
It is favorably improved paster efficiency and precision.
For solving above-mentioned technical problem, one aspect of the present invention is：There is provided a kind of line for LED
Road plate paster welding method, comprises the following steps：
A, fixing circuit board, the wiring board for treating paster is fixed on work platformses；
B, brush smear solder(ing) paste, using paster template, paster template are placed the upper surface of assist side, with solder(ing) paste by paster mould
Hole on plate covers and scrapes smears uniform, paster template of then tearing；
C, stickup components and parts, using mechanical hand, draw components and parts according to the information of positioner by the feeding head on mechanical hand and glue
It is attached on the corresponding position of wiring board；
The components and parts for pasting are crossed reflow machine and are welded by d, welding component, and the temperature of welding is 150-250 degree, often
The weld interval of individual components and parts is the 2-3 seconds.
In a preferred embodiment of the present invention, described paster template is relative with the position for needing paster on wiring board
Should.
In a preferred embodiment of the present invention, the quantity of described feeding head is 3-13.
In a preferred embodiment of the present invention, described feeding head adopts vacuum slot formula feeding head.
In a preferred embodiment of the present invention, the fusing point of described tin cream is 150-200 degree.
The invention has the beneficial effects as follows：The wiring board paster welding method for LED of the present invention, saving are worked into
This, attachment process is simple, direct, it is ensured that the quality of welding component, greatly improves the efficiency of paster welding, contributes to
Improve paster efficiency and precision.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to making needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, can be obtaining other according to these accompanying drawings
Accompanying drawing, wherein：
Fig. 1 is flow chart of the present invention for a preferred embodiment of the wiring board paster welding method of LED.
Specific embodiment
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention, rather than the embodiment of whole.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
As shown in figure 1, the embodiment of the present invention includes：
A kind of wiring board paster welding method for LED, comprises the following steps：
A, fixing circuit board, the wiring board for treating paster is fixed on work platformses；
B, brush smear solder(ing) paste, using paster template, paster template are placed the upper surface of assist side, with solder(ing) paste by paster mould
Hole on plate covers and scrapes smears uniform, paster template of then tearing；
C, stickup components and parts, using mechanical hand, draw components and parts according to the information of positioner by the feeding head on mechanical hand and glue
It is attached on the corresponding position of wiring board；
The components and parts for pasting are crossed reflow machine and are welded by d, welding component, and the temperature of welding is 150-250 degree, often
The weld interval of individual components and parts is the 2-3 seconds.
In above-mentioned, described paster template is corresponding with the position for needing paster on wiring board.It is in the present embodiment, described
The size of wiring board is 5cm*6cm.
Further, the quantity of described feeding head is 3-13.Wherein, described feeding head is taken using vacuum slot formula
Stub bar, is difficult to drop during absorption.
In the present embodiment, the fusing point of described tin cream is 150-200 degree.
In sum, the wiring board paster welding method for LED of the invention, saves labour cost, mounts process
Simply, directly, it is ensured that the quality of welding component, the efficiency of paster welding is greatly improved, paster effect is favorably improved
Rate and precision.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (5)
1. a kind of wiring board paster welding method for LED, it is characterised in that comprise the following steps：
A, fixing circuit board, the wiring board for treating paster is fixed on work platformses；
B, brush smear solder(ing) paste, using paster template, paster template are placed the upper surface of assist side, with solder(ing) paste by paster mould
Hole on plate covers and scrapes smears uniform, paster template of then tearing；
C, stickup components and parts, using mechanical hand, draw components and parts according to the information of positioner by the feeding head on mechanical hand and glue
It is attached on the corresponding position of wiring board；
The components and parts for pasting are crossed reflow machine and are welded by d, welding component, and the temperature of welding is 150-250 degree, often
The weld interval of individual components and parts is the 2-3 seconds.
2. the wiring board paster welding method for LED according to claim 1, it is characterised in that described paster
Template is corresponding with the position for needing paster on wiring board.
3. the wiring board paster welding method for LED according to claim 1, it is characterised in that described feeding
The quantity of head is 3-13.
4. the wiring board paster welding method for LED according to claim 1, it is characterised in that described feeding
Head adopts vacuum slot formula feeding head.
5. the wiring board paster welding method for LED according to claim 1, it is characterised in that described tin cream
Fusing point be 150-200 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610989456.4A CN106535498A (en) | 2016-11-10 | 2016-11-10 | Circuit board patch welding method for LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610989456.4A CN106535498A (en) | 2016-11-10 | 2016-11-10 | Circuit board patch welding method for LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535498A true CN106535498A (en) | 2017-03-22 |
Family
ID=58350768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610989456.4A Pending CN106535498A (en) | 2016-11-10 | 2016-11-10 | Circuit board patch welding method for LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535498A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683513A (en) * | 2020-06-24 | 2020-09-18 | 安徽富信半导体科技有限公司 | High-temperature chip mounting equipment for processing electronic components and working method thereof |
| CN113518512A (en) * | 2021-03-23 | 2021-10-19 | 沙桂林 | Electronic device welding method and circuit board welding equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101977485A (en) * | 2010-10-29 | 2011-02-16 | 安徽鑫龙电器股份有限公司 | Patching method for circuit board |
| KR20110020663A (en) * | 2009-08-24 | 2011-03-03 | 삼성전기주식회사 | Mounting module of electronic components |
| CN102097543A (en) * | 2010-10-30 | 2011-06-15 | 木林森股份有限公司 | Digital tube manufacturing method |
| CN202160346U (en) * | 2011-06-17 | 2012-03-07 | 王协峰 | Full-automatic high-speed LED plug-in chip mounter |
| US20130168722A1 (en) * | 2011-12-29 | 2013-07-04 | Hon Hai Precision Industry Co., Ltd. | Surface-mounting light emitting diode device and method for manufacturing the same |
-
2016
- 2016-11-10 CN CN201610989456.4A patent/CN106535498A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110020663A (en) * | 2009-08-24 | 2011-03-03 | 삼성전기주식회사 | Mounting module of electronic components |
| CN101977485A (en) * | 2010-10-29 | 2011-02-16 | 安徽鑫龙电器股份有限公司 | Patching method for circuit board |
| CN102097543A (en) * | 2010-10-30 | 2011-06-15 | 木林森股份有限公司 | Digital tube manufacturing method |
| CN202160346U (en) * | 2011-06-17 | 2012-03-07 | 王协峰 | Full-automatic high-speed LED plug-in chip mounter |
| US20130168722A1 (en) * | 2011-12-29 | 2013-07-04 | Hon Hai Precision Industry Co., Ltd. | Surface-mounting light emitting diode device and method for manufacturing the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111683513A (en) * | 2020-06-24 | 2020-09-18 | 安徽富信半导体科技有限公司 | High-temperature chip mounting equipment for processing electronic components and working method thereof |
| CN113518512A (en) * | 2021-03-23 | 2021-10-19 | 沙桂林 | Electronic device welding method and circuit board welding equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |
|
| RJ01 | Rejection of invention patent application after publication |