CN202697046U - Tool for copper-covered substrate printing and reflow technology - Google Patents
Tool for copper-covered substrate printing and reflow technology Download PDFInfo
- Publication number
- CN202697046U CN202697046U CN 201220213668 CN201220213668U CN202697046U CN 202697046 U CN202697046 U CN 202697046U CN 201220213668 CN201220213668 CN 201220213668 CN 201220213668 U CN201220213668 U CN 201220213668U CN 202697046 U CN202697046 U CN 202697046U
- Authority
- CN
- China
- Prior art keywords
- hole
- base plate
- tool
- group
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a tool for copper-covered substrate printing and a reflow technology. The tool for the copper-covered substrate printing and the reflow technology comprises a baseplate and a cover plate, wherein the baseplate is used for bearing a copper-covered substrate, the cover plate is matched with the baseplate, the base plate comprises a first set of holes, and the cover plate comprises a second set of holes corresponding to the first set of the holes. By using the tool for the copper-covered substrate printing and the reflow technology, tool switching frequency is effectively reduced in the printing and the reflow technology.
Description
Technical field
The utility model relates to production process of semiconductor, relates in particular to the tool in the production technology.
Background technology
Along with SMT (Surface Mounted Technology) technical development is gradually improved, surface mount elements (SMC:Surface Mounted Component) and mount device (SMD:Surface Mounted Element) and be widely used in the electronic product.Correspondingly, the Reflow Soldering technology that these SMD components is adhered to circuit board is widely used in nearly all electronic product field too.The device interior that carries out Reflow Soldering has heater circuit, this heater circuit can be heated to sufficiently high temperature with air or nitrogen, air after the heating or nitrogen are blown to the wiring board that has posted element subsequently, so that the scolder of elements on either side melts and by the scolder after melting this element and this circuit board are bondd.
In the existing SMT technique, need to finish by complementary tool for printing and the backflow after the substrate mounting of copper-clad base plate.The current technique that adopts in the industry is first copper-clad base plate to be placed on the printing apparatus, through recycling corresponding tool after printing and the paster copper-clad base plate is taken off from printing apparatus, then manually be placed on the reflow soldering tool, lead frame assembled up carried out again reflow soldering simultaneously.
The product that this mode has adopted multiple tool and needed the people to carry out repeatedly has enough to meet the need, this is so that production efficiency is low and have certain quality hidden danger, because the tin cream that has printed is run in artificial repeatedly turnover easily, this is with regard to so that tin cream deficiency, the excessive problem of tin cream may occur after refluxing.
The utility model content
In view of this, the utility model provides a kind of tool for copper-clad base plate printing and reflux technique.Described tool comprise for the base plate of carrying copper-clad base plate, with the suitable cover plate of described base plate, described base plate comprises first group of hole, described cover plate comprises the second group hole corresponding with described first group of hole.
Preferably, the shape in each hole adapts with the shape in described first group of its corresponding hole of Kong Zhongyu in described second group of hole.
Preferably, each hole also comprises the groove that is arranged at least one side of hole main body in described first group of hole.
Preferably, each in described second group of hole is enclosed its corresponding hole of described first group of Kong Zhongyu when described cover plate is fitted to described base plate and is put therein.
Preferably, be provided with respectively magnetic part at the frame of described base plate and the frame place of described cover plate, so that the closely adhesive when combining with described base plate of described cover plate.
The application of tool described in the utility model can effectively reduce the tool conversion times in printing and the reflux technique.
Description of drawings
Fig. 1 is the schematic diagram according to the tool of an embodiment of the present utility model.
Fig. 2 is according to the base plate 10 of described tool of the present utility model and schematic diagram after cover plate 20 combines.
Embodiment
Further set forth the utility model below with reference to accompanying drawing.Need to prove that accompanying drawing only is used for signal, do not limit the size, ratio of the parts of illustrating etc. at this point, and identical label represents same or analogous parts in the accompanying drawings.
Fig. 1 is the schematic diagram according to the tool of an embodiment of the present utility model.As shown in the figure, described tool comprises base plate 10 and the cover plate 20 that is complementary with base plate 10.Base plate 10 is used for carrying copper-clad base plate, for example ceramic copper-clad base plate (DBC).Carry out paster and typography at the copper-clad base plate that carries, on the base plate 10 that subsequently cover plate 20 is added to.According to the utility model, the frame of base plate 10 and cover plate 20 is respectively and adds magnetic design, this so that cover plate 20 can closely combine with base plate 10.Alternatively, can pilot pin be set in the frame portion of base plate 10, and at the frame portion setting of cover plate 20 lock screw corresponding with described pilot pin, so that when described cover plate 20 covers described base plate 10, described pilot pin can combine with described lock screw, thereby guarantees that cover plate and base plate do not misplace.
The shape of base plate 10 and cover plate 20 is complementary.Generally speaking, base plate 10 and cover plate 20 are square, but also do not get rid of circular grade for other shape.Be provided with first group of hole 100 on the base plate 10, correspondingly, cover plate 20 is provided with the second group hole 200 corresponding with first group of hole 100.The quantity in second group of hole 200 is identical with the quantity in first group of hole 100, further, the quantity in two groups of holes can with to be placed on base plate 10 on the quantity of copper-clad base plate identical, and the shape of each adapts with the copper-clad base plate shape that will place in first group of hole 100, just any one hole in first group of hole 100 also comprises the groove that is arranged at least one side of hole main body, in order to increase the heat conduction when making tool described in the utility model pass through reflow ovens after carrying copper-clad base plate, for example two opposite sides in the hole arrange respectively the first groove 101 and the second groove 103.
As mentioned above, the shape of each corresponding aperture in the shape of each in second group of hole 200 and the first group of hole 100 adapts to.The shape in first group of hole 200 is described below in conjunction with any one hole 202 in second group of hole 200 of figure and the hole 102 in first group of hole 100 corresponding with it.Such as has already been described, the shape in the hole 102 in first group of hole 100 and thereon device (such as, copper-clad base plate) shape to be placed adapt, and in this example, it is polygon, and the limit on its first direction 301 and second direction 302 is for the longest.The both sides that simultaneously 102 hole main body 1020 is positioned at first direction 301 and second direction 302 in the hole arrange respectively the first groove 101 and the second groove 103.Second group of hole 200 mesopore 202 be shaped as quadrangle, and when hole 202 fits to base plate 10 at cover plate 20, four limits in hole 202 are just enclosed and are put 102 in first group of hole 100, that is to say, hole 202 be positioned on first direction 301 and the second direction 302 the limit with the corresponding edge of the hole main body in hole 102, and the first groove 101 and the second groove 103 enclose and put therein; And hole 202 be arranged in illustrate third direction 303 and four directions just to enclose the hole 102 of putting first group of hole 100 to two limits of 304 to be positioned at third direction 303 and four directions two corresponding sides to 304.Wherein, hole 102 be positioned at third direction 303 and four directions two limits to 304 be hole 102 in Y-direction at a distance of two limits farthest, and to be positioned at two limits of first direction 301 and second direction 302 are holes 102 in hole 102 at directions X at a distance of farthest two limits.
Fig. 2 is according to the base plate 10 of described tool of the present utility model and schematic diagram after cover plate 20 combines.Be noted that to form the process cardinal principle that base plate 10 shown in Figure 2 combines with cover plate 20 as follows: place copper-clad base plate in each in first group of hole 100 of base plate 10, print, paster technique, then cover plate 20 is attached on the base plate 10.As shown in the figure, each in second group of hole 200 is just enclosed each of putting in first group of hole 100.
In this example, first group of hole 100 and second group of hole 200 of tool are the structure that four lines three is listed as, and therefore, can place three lead frames along the direction of row on cover plate 20.
As described in the background technology part, in the prior art, after in copper-clad base plate being placed into relevant tool, having carried out paster and typography, copper-clad base plate need to be taken out manually being placed into again on the backflow tool in tool, lead frame be assembled up carried out again reflow soldering simultaneously.This with regard to so that in the technique kind of required tool more and need to carry out changing tool in the process in technique, so the higher and required manual operation of production cost is more, causes production efficiency low, there is quality hidden danger in simultaneously repeatedly manual operation.
According to tool described in the utility model, after on the base plate 10 that copper-clad base plate is being placed into tool as shown in Figure 1, carry out paster and typography, then need not mobile copper-clad base plate, but directly cover cover plate 20, simultaneously lead frame is placed on the cover plate 20, thereby carries out reflow soldering.So, reduced the tool conversion, correspondingly reduced the manual operation number of times, avoided the quality hidden danger that may cause.
Although with reference to above-mentioned embodiment the utility model has been carried out detailed elaboration; but those of ordinary skill in the art is to be understood that; can make amendment or the part technical characterictic is equal to replacement embodiment of the present utility model; and under the spirit that does not break away from the technical solution of the utility model, it all should be encompassed in the middle of the technical scheme scope that the utility model asks for protection.
Claims (5)
1. tool that is used for copper-clad base plate printing and reflux technique, it is characterized in that, described tool comprise for the base plate of carrying copper-clad base plate, with the suitable cover plate of described base plate, described base plate comprises first group of hole, described cover plate comprises the second group hole corresponding with described first group of hole.
2. tool according to claim 1 is characterized in that, the shape in each hole adapts with the shape in described first group of its corresponding hole of Kong Zhongyu in described second group of hole.
3. tool according to claim 2 is characterized in that, each hole also comprises the groove that is arranged at least one side of hole main body in described first group of hole.
4. tool according to claim 3 is characterized in that, each in described second group of hole is enclosed its corresponding hole of described first group of Kong Zhongyu when described cover plate is fitted to described base plate and put therein.
5. according to claim 1,2,3, or any one described tool in 4, it is characterized in that, be provided with respectively magnetic part at the frame of described base plate and the frame place of described cover plate, so that the closely adhesive when combining with described base plate of described cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220213668 CN202697046U (en) | 2012-05-14 | 2012-05-14 | Tool for copper-covered substrate printing and reflow technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220213668 CN202697046U (en) | 2012-05-14 | 2012-05-14 | Tool for copper-covered substrate printing and reflow technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697046U true CN202697046U (en) | 2013-01-23 |
Family
ID=47552595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220213668 Expired - Lifetime CN202697046U (en) | 2012-05-14 | 2012-05-14 | Tool for copper-covered substrate printing and reflow technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202697046U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111700A (en) * | 2013-02-21 | 2013-05-22 | 北京工业大学 | Miniature soldering lapped joint and lapping method |
| CN103158336A (en) * | 2013-03-06 | 2013-06-19 | 上海大唐移动通信设备有限公司 | Tool of printing circuit board and printing method of circuit board |
| CN106392940A (en) * | 2016-11-28 | 2017-02-15 | 中国电子科技集团公司第二十四研究所 | Universal fixture compatible with integrated circuit microassembly technology |
| CN106672396A (en) * | 2015-11-11 | 2017-05-17 | 深圳市朗能电池有限公司 | Battery protective plate tray |
| CN108257938A (en) * | 2018-01-31 | 2018-07-06 | 江苏长电科技股份有限公司 | For the jig of lead frame and the engraving method of lead frame |
-
2012
- 2012-05-14 CN CN 201220213668 patent/CN202697046U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103111700A (en) * | 2013-02-21 | 2013-05-22 | 北京工业大学 | Miniature soldering lapped joint and lapping method |
| CN103111700B (en) * | 2013-02-21 | 2015-06-10 | 北京工业大学 | Miniature soldering lapped joint and lapping method |
| CN103158336A (en) * | 2013-03-06 | 2013-06-19 | 上海大唐移动通信设备有限公司 | Tool of printing circuit board and printing method of circuit board |
| CN106672396A (en) * | 2015-11-11 | 2017-05-17 | 深圳市朗能电池有限公司 | Battery protective plate tray |
| CN106672396B (en) * | 2015-11-11 | 2018-08-14 | 深圳市朗能电池有限公司 | Battery protection sheet tray |
| CN106392940A (en) * | 2016-11-28 | 2017-02-15 | 中国电子科技集团公司第二十四研究所 | Universal fixture compatible with integrated circuit microassembly technology |
| CN108257938A (en) * | 2018-01-31 | 2018-07-06 | 江苏长电科技股份有限公司 | For the jig of lead frame and the engraving method of lead frame |
| CN108257938B (en) * | 2018-01-31 | 2020-01-24 | 江苏长电科技股份有限公司 | Jig for lead frame and etching method of lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202697046U (en) | Tool for copper-covered substrate printing and reflow technology | |
| CN104228316B (en) | Machining technology for conducting printing and surface mounting on substrates made of various materials simultaneously and jig structure thereof | |
| CN103313527A (en) | Furnace-through fixture for reflow soldering | |
| CN201601900U (en) | Flexible printed circuit board holding device | |
| CN102123562B (en) | Method for manufacturing metal substrate by adopting reflow soldering | |
| CN100589256C (en) | Method for preparing solar energy cell assembly with printed circuit paster technique | |
| CN204498475U (en) | A kind of PCB universal carrier | |
| CN203984794U (en) | A kind of Flexible Printed Circuit SMT mounts and uses tool | |
| CN201563327U (en) | Portable electronic device | |
| CN201491379U (en) | Printed circuit board comprising LCD bonding pads | |
| CN203951172U (en) | Lithium battery protection board circuit based on NTC paster thermistor element | |
| CN112397669B (en) | Display module, manufacturing method thereof and display device | |
| CN202524656U (en) | Deformation-preventing wave soldering jig | |
| CN204243733U (en) | Based on the lithium battery protection board circuit of NTC paster thermistor element | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| CN103582283A (en) | Flexible printed circuit board and manufacturing method | |
| CN202738275U (en) | Wave soldering jig capable of preventing solder bridge | |
| CN202425217U (en) | Flexible lamp panel furnace-through clamp | |
| CN112788863A (en) | Double-side welding device and process for simultaneously welding Chip elements on two sides of PCB | |
| CN107039384B (en) | Surface-mounted element | |
| CN205830144U (en) | Circuit board cooling structure | |
| CN204771030U (en) | Alarm device during little tin furnace gauge | |
| CN204258277U (en) | Based on the lithium battery protection board circuit of NTC paster thermistor element | |
| CN203057706U (en) | Solder paste coating device for metal substrate | |
| CN217789971U (en) | Circuit board that heat dispersion is good for localization tracking ware |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |