CN112397669B - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN112397669B CN112397669B CN202011351799.0A CN202011351799A CN112397669B CN 112397669 B CN112397669 B CN 112397669B CN 202011351799 A CN202011351799 A CN 202011351799A CN 112397669 B CN112397669 B CN 112397669B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention discloses a display module, a manufacturing method thereof and a display device, and belongs to the technical field of display, wherein the display module comprises a substrate, a circuit layer and a packaging composite layer, the packaging composite layer comprises an insulating film and hot melt adhesive, and the insulating film is positioned on one side of the hot melt adhesive far away from the substrate; the hot melt adhesive comprises a first surface far away from one side of the substrate and a second surface close to one side of the substrate, the first surface is fixedly attached to the insulating film, the second surface is of a concave-convex structure, the shape of the second surface is matched with the shape of the surface, far away from one side of the substrate, of the circuit layer, and the hot melt adhesive covers elements of the circuit layer. The manufacturing method of the display module is used for manufacturing the display module. The display device comprises a display panel and the display module which are electrically connected. The invention is beneficial to increasing the attaching area of the circuit layer and the packaging composite layer, and under the design structure of the hot melt adhesive, the insulating film of the packaging composite layer is not easy to fall off, thereby being beneficial to improving the product yield and the display reliability.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device.
Background
In recent years, with the technical development of personal smart terminal devices and wearable devices, demands for flat panel displays are increasingly diversified. Such as organic light emitting diode displays, electrophoretic displays, liquid crystal displays, etc. As a new generation of display technology, an OLED (Organic Light-Emitting Diode) display panel has advantages of low power consumption, high color gamut, high brightness, high resolution, wide viewing angle, high response speed, and the like, and is thus favored by the market. In the prior art, the production yield is often affected due to the limitation of the process or the production materials in the production process of the display screen, so that the reliability of the product cannot meet the process requirement.
Therefore, a stable and reliable display module, a manufacturing method thereof and a display device are provided to improve the product yield and the display quality, which are technical problems to be solved by those skilled in the art.
Disclosure of Invention
In view of this, the present invention provides a display module, a manufacturing method thereof, and a display device, so as to solve the problem of low yield of the process and affecting the reliability of the product in the prior art.
The invention discloses a display module, comprising: a substrate; the circuit layer is positioned on one side of the substrate and at least comprises two elements with different heights; the packaging composite layer is positioned on one side of the circuit layer far away from the substrate; the packaging composite layer comprises an insulating film and hot melt adhesive, and the insulating film is positioned at one side of the hot melt adhesive far away from the substrate; the hot melt adhesive comprises a first surface far away from one side of the substrate and a second surface close to one side of the substrate, the first surface is fixedly attached to the insulating film, the second surface is of a concave-convex structure, the shape of the second surface is matched with the shape of the surface, far away from one side of the substrate, of the circuit layer, and the hot melt adhesive covers elements of the circuit layer.
Based on the same inventive concept, the invention also discloses a manufacturing method of the display module, which is used for manufacturing the display module, and comprises the following steps: providing a substrate, manufacturing a circuit layer on one side of the substrate, wherein the circuit layer at least comprises two elements with different heights; providing a mold, wherein the mold comprises a third surface, and the shape of the third surface is the same as the shape of the surface of the circuit layer, which is far away from the substrate; providing an insulating film, and attaching an original hot melt adhesive on one side of the insulating film, which is close to a substrate, wherein the original hot melt adhesive is of a plate-shaped structure; covering the third surface of the die with the insulating film attached with the original hot melt adhesive, and heating and pressing the insulating film attached with the original hot melt adhesive to melt the original hot melt adhesive to the third surface of the die; cooling and shaping the insulating film attached with the original hot melt adhesive, and then taking down to obtain a packaging composite layer, wherein the packaging composite layer comprises the insulating film and the shaped hot melt adhesive, and the shape of one side surface of the hot melt adhesive is the same as the shape of the surface of the circuit layer, which is far away from the substrate; the packaging composite layer and the circuit layer are mutually embedded and fixed.
Based on the same inventive concept, the invention also discloses a display device, which comprises a display panel and the display module which are electrically connected.
Compared with the prior art, the display module, the manufacturing method and the display device provided by the invention have the advantages that at least the following beneficial effects are realized:
the display module provided by the invention comprises a packaging composite layer, wherein the hot melt adhesive of the packaging composite layer comprises a first surface far away from one side of the substrate and a second surface close to one side of the substrate, the first surface is adhered and fixed with the insulating film, the second surface of the hot melt adhesive is of a concave-convex structure, the concave-convex structure can be formed by prefabricating and shaping a die, and the shape of the second surface is matched with the shape of the surface of the circuit layer far away from one side of the substrate, so that the hot melt adhesive covers all elements of the circuit layer. The hot melt adhesive comprises the second surface of the concave-convex structure matched with the surface of the circuit layer far away from the substrate, and the packaging composite layer formed by bonding the insulating film and the hot melt adhesive can be prefabricated and shaped according to the surface shape of the circuit layer, so that the circuit layer and the packaging composite layer can be directly attached in the process of manufacturing, other positioning designs are not needed, and the time is saved. The clearance of component can be filled to the unsmooth form structure's of hot melt adhesive second surface, is favorable to increasing the attached area of circuit layer and encapsulation composite layer, under this kind of design structure of hot melt adhesive, can make the insulating film of encapsulation composite layer be difficult for droing, is favorable to improving the product yield, promotes the demonstration reliability.
Of course, it is not necessary for any one product to practice the invention to achieve all of the technical effects described above at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic plan view of a display module according to an embodiment of the present invention;
FIG. 2 is a schematic view of the cross-sectional structure in the direction A-A' of FIG. 1;
FIG. 3 is a schematic view of the encapsulation composite of FIG. 2;
FIG. 4 is a schematic view of another cross-sectional structure in the direction A-A' of FIG. 1;
FIG. 5 is a schematic diagram of the structure of the substrate, the circuit layer, and the fluorinated liquid layer in FIG. 4;
FIG. 6 is a schematic view of the cross-sectional structure in the direction B-B' in FIG. 1;
FIG. 7 is a schematic view of another cross-sectional structure in the direction B-B' in FIG. 1;
FIG. 8 is a flow chart of a method for manufacturing a display module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a circuit layer fabricated on a substrate;
FIG. 10 is a schematic view of the structure of the provided mold;
FIG. 11 is a schematic view of the structure of the insulating film after the original hot melt adhesive is attached to the side of the insulating film close to the substrate;
fig. 12 is a schematic view of the structure in which the insulating film to which the original hot melt adhesive is attached has not yet been covered onto the third surface of the mold;
fig. 13 is a schematic view of a structure in which an insulating film to which an original hot melt adhesive is attached is heated and pressed to fill up a third surface of a mold;
FIG. 14 is a schematic structural view of the resulting encapsulated composite layer;
fig. 15 is a schematic structural diagram of a display module manufactured by the manufacturing method of the present embodiment;
FIG. 16 is a flowchart of another method for manufacturing a display module according to an embodiment of the present invention;
FIG. 17 is a schematic diagram of a structure in which a fluorinated liquid layer is applied after a circuit layer is formed on one side of a substrate;
FIG. 18 is a flowchart of another method for manufacturing a display module according to an embodiment of the present invention;
FIG. 19 is a schematic view of the structure of the vent hole after the encapsulation composite layer is fabricated;
fig. 20 is a schematic plan view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the related art, each sub-pixel in the display panel needs to be connected to a driving circuit to enable the sub-pixel to realize a display function. The driving circuit is generally integrated on an IC (Integrated Circuit, driving chip, integrated circuit) or an FPC (Flexible Printed Circuit, flexible circuit board), a PCB (Printed Circuit Board ), and is directly and electrically bonded to the display panel, so as to provide driving electric signals for each sub-pixel of the display panel. Since a large number of electronic components are required to be integrated on the driving chip or the flexible wiring board. When packaging driver chip or flexible line way board, the insulating film is pasted on the device surface, plays the effect of insulation protection, because the size of the volume of the electronic components of type, model is different, highly probably different, makes the device surface unsmooth easily, and the insulating film pastes the resistance, pastes infirm easily, and then drops at follow-up manufacturing procedure in-process, influences product yield and reliability.
Based on the above problems, the application provides a display module, a manufacturing method thereof and a display device, wherein an insulating film on a driving chip or a flexible circuit board is not easy to fall off, the product yield is improved, and the display reliability is improved. The display module set, the manufacturing method thereof and the specific embodiments of the display device are described in detail below.
Referring to fig. 1-3, fig. 1 is a schematic plan view of a display module according to an embodiment of the present invention, fig. 2 is a schematic sectional view of A-A' in fig. 1, fig. 3 is a schematic structural view of a packaging composite layer in fig. 2, and a display module 000 according to the embodiment includes:
a substrate 10;
a circuit layer 20, the circuit layer 20 being located on one side of the substrate 10, the circuit layer 20 comprising at least two elements 201 of different heights; it will be appreciated that the height of the element 201 refers to its height in a direction Z perpendicular to the plane of the substrate 10;
the packaging composite layer 30, the packaging composite layer 30 is located at one side of the circuit layer 20 away from the substrate 10;
the packaging composite layer 30 comprises an insulating film 301 and a hot melt adhesive 302, wherein the insulating film 301 is positioned on one side of the hot melt adhesive 302 away from the substrate;
the hot melt adhesive 302 includes a first surface 302A on a side far from the substrate 10 and a second surface 302B on a side close to the substrate 10, the first surface 302A is adhered and fixed to the insulating film 301, the second surface 302B has a concave-convex structure, the shape of the second surface 302B is matched with the shape of the surface (the surface formed by each element 201 and the gap can be understood) of the circuit layer 20 on a side far from the substrate 10, and the hot melt adhesive 302 covers the element 201 of the circuit layer 20.
Specifically, the display module 000 provided in this embodiment includes a substrate 10, where the substrate 10 may be used as a carrier for carrying other components, the substrate 10 may be a metal-based heat dissipation plate (such as an aluminum substrate, a copper substrate, or an iron substrate), is a unique metal-based copper-clad plate, has good thermal conductivity, electrical insulation performance, and mechanical processability, and may be a substrate made of a flexible substrate such as Polyimide (PI), which has many advantages not possessed by a rigid printed circuit board, for example, it may be freely bent, rolled, folded, and widely applied to fields or products such as aerospace, military, mobile communication, laptop, computer peripherals, PDA, and digital cameras, and may be selectively set according to actual needs when being implemented. The circuit layer 20 on one side of the substrate 10 is used for integrally arranging a plurality of components 201, and optionally, a leadless or short-lead surface-mounted component (SMC or SMD, SMC refers to a surface-mounted component, mainly refers to a passive component such as a resistor or an inductor, and does not need to be polarized, and SMD refers to a surface-mounted component, mainly refers to an active component such as a capacitor, and needs to be polarized, and is mounted on the surface of the substrate 10 by a surface mounting technology, and is welded and assembled by a reflow soldering or dip soldering method to form the circuit layer 20. Since each element 201 may comprise different model types, the size and the height thereof may be different, that is, the circuit layer 20 may comprise at least two elements 201 with different heights, where the height of the element 201 refers to the height thereof in the direction Z perpendicular to the plane of the substrate 10, and the surface of the circuit layer 20 on the side away from the substrate 10 is likely to be an uneven surface. The circuit layer 20 is equipped with encapsulation composite layer 30 far away from the one side of base plate 10, and encapsulation composite layer 30 includes insulating film 301 and hot melt adhesive 302, and hot melt adhesive 302 plays the adhesive effect for with insulating film 301 and circuit layer 20 better fixed laminating, insulating film 301 plays the effect of encapsulation insulation protection circuit layer 20 on the component 201. The hot melt adhesive 302 provided in this embodiment includes a first surface 302A far from the substrate 10 and a second surface 302B near to the substrate 10, where the first surface 302A is adhered and fixed to the insulating film 301, and optionally, the first surface 302A may have a planar structure matching with the surface of the insulating film 301, so as to be better adhered to the insulating film 301; the second surface 302B of the hot melt adhesive 302 is a concave-convex structure, which may be formed by prefabricating and shaping a mold, and the shape of the second surface 302B matches with the shape of the surface of the circuit layer 20 on the side away from the substrate 10 (which may be understood as a concave-convex surface formed by the respective elements 201 and the voids), so that the hot melt adhesive 302 covers the respective elements 201 of the circuit layer 20. The hot melt adhesive 302 provided in this embodiment includes the second surface 302B of the concave-convex structure matched with the surface of the circuit layer 20 far away from the substrate 10, and the packaging composite layer 30 formed by bonding the insulating film 301 and the hot melt adhesive 302 can be preformed and shaped according to the surface shape of the circuit layer 20, so that the circuit layer 20 and the packaging composite layer 30 can be directly attached in the process, other positioning designs are not needed, time is saved, the time is short, the gaps of the elements 201 can be filled with the second surface 302B of the concave-convex structure of the hot melt adhesive 302, the adhesion area of the circuit layer 20 and the packaging composite layer 30 is increased, and under the design structure of the hot melt adhesive 302, the insulating film 301 of the packaging composite layer 30 is not easy to fall off, the product yield is improved, and the display reliability is improved.
It should be noted that, the display module 000 of this embodiment may be any one of an IC (Integrated Circuit, a driving chip, an integrated circuit) integrated with a driving circuit, an FPC (Flexible Printed Circuit, a flexible circuit board), a PCB (Printed Circuit Board, a printed circuit board) and the like, and is used for directly binding and electrically connecting with a display panel, and providing driving electric signals for each sub-pixel of the display panel, so as to realize a display function. The structure of the display module 000 is only exemplified in this embodiment, and in the specific implementation, the structure of the display module 000 is not limited to this, but may include other structures capable of integrating a driving circuit, and the structures of the IC (Integrated Circuit, driving chip, integrated circuit), FPC (Flexible Printed Circuit, flexible circuit board), PCB (Printed Circuit Board ) in the related art may be referred to for understanding, which will not be described in detail in this embodiment.
In some alternative embodiments, please refer to fig. 1, fig. 4, fig. 5, fig. 4 is a schematic cross-sectional view of fig. 1 in the direction A-A', fig. 5 is a schematic view of fig. 4 illustrating a structure of a substrate, a circuit layer, and a fluorinated liquid layer, the display module 000 in this embodiment includes a substrate 10, a circuit layer 20, a packaging composite layer 30, and a fluorinated liquid layer 40, wherein the fluorinated liquid layer 40 is coated on a surface of the circuit layer 20 away from the substrate 10.
The embodiment illustrates that the surface of the circuit layer 20 of the display module 000, which is far away from the substrate 10, may be further coated with a fluorinated liquid layer 40, the fluorinated liquid of the fluorinated liquid layer 40 is a cleaning agent for precision instruments, and is applied to precisely clean the components 201 on the circuit layer 20 to remove impurities such as grease, wax, rosin soldering flux, fingerprint sweat, particles, etc., while the fluorinated liquid layer 40 may be used as a protective coating of the circuit layer 20, and a thin transparent film is left on the surface of the circuit layer 20 coated with the fluorinated liquid layer 40, so as to play a role in moisture resistance and anti-sticking. The surface dyne value (the dyne value is measured as the humidity of the surface and is also understood to be the side angle of the droplet on the surface of the fluorinated liquid layer 40, and the droplet of the fluorinated liquid layer 40 forms a small droplet on the surface, so that the dyne value on the surface of the fluorinated liquid layer 40 is low) is low, and the lower the dyne value is, the lower the energy on the surface of the fluorinated liquid layer 40 is, so that the less the surface of the fluorinated liquid layer 40 is likely to adhere to the hot melt adhesive 302, and the insulating film 301 is likely to fall off. Therefore, when the surface of the circuit layer 20 far away from the substrate 10 in the display module 000 is coated with the fluorinated liquid layer 40, the second surface 302B of the hot melt adhesive 302 needs to be designed into a concave-convex structure matching with the surface of the circuit layer 20 far away from the substrate 10, and in the process, the circuit layer 20 including the fluorinated liquid layer 40 and the packaging composite layer 30 can be directly attached without any other positioning design, so that the time is saved, the gap between the elements 201 can be filled with the second surface 302B of the concave-convex structure of the hot melt adhesive 302, the attaching area of the circuit layer 20 and the packaging composite layer 30 can be increased, the attaching effect of the insulating film 301 can be prevented from being affected due to the low dyne value of the fluorinated liquid layer 40, the insulating film 301 of the packaging composite layer 30 can be further prevented from falling off under the design structure of the hot melt adhesive 302, the product yield is improved, and the display reliability is further improved.
In some alternative embodiments, referring to fig. 1 and 6 in combination, fig. 6 is a schematic cross-sectional structure of the direction B-B' in fig. 1, in which the hot melt adhesive 302 includes a first area M and a second area N disposed around the first area M, and the first area M overlaps the element 201 of the circuit layer 20 in a direction Z perpendicular to the plane of the substrate 10;
in the second region N, the second surface 302B of the hot melt adhesive 302 is adhered and fixed to the substrate 10.
The present embodiment explains that in order to attach and fix the encapsulation composite 30 to the substrate 10 including the circuit layer 20, the hot melt adhesive 302 may be provided with a first region M overlapping with a region where the element 201 of the circuit layer 20 is located in a direction Z perpendicular to a plane where the substrate 10 is located and a second region N around the first region M, in which the second surface 302B of the hot melt adhesive 302 is attached and fixed to the substrate 10, so that the hot melt adhesive 302 having the second surface 302B of the concave-convex structure can be filled in the gap of the element 201, the effect of attaching the substrate 10, the circuit layer 20, and the insulating film 301 is ensured, and the phenomenon of yield reduction caused by the falling off of the insulating film 301 is avoided.
In some alternative embodiments, referring to fig. 1 and 7 in combination, fig. 7 is a schematic cross-sectional view of fig. 1 along the direction B-B', in which at least one vent 303 is formed on the second surface 302B of the hot melt adhesive 302 in the second region N of the hot melt adhesive 302. Alternatively, the vent 303 may be recessed from the second surface 302B toward the direction approaching the first surface 302A at the edge of the hot melt adhesive 302.
The embodiment further explains that at least one vent 303 is formed on the second surface 302B of the hot melt adhesive 302 within the range of the second area N of the hot melt adhesive 302, and after the circuit layer 20 is packaged by the packaging composite layer 30, the situation that the electrical connection is unstable may occur during the detection performance, so in order to facilitate the disassembly during reworking and repair, the embodiment is arranged within the range of the second area N of the hot melt adhesive 302, at least one vent 303 is formed on the second surface 302B of the hot melt adhesive 302, and auxiliary raw materials with freezing function such as liquid nitrogen may be introduced into the bonding surface of the hot melt adhesive 302 and the circuit layer 20 through the vent 303 (the low temperature characteristic of the liquid nitrogen is utilized, and the effect of freezing and disassembling the separating device is provided), so that the auxiliary raw materials enter the hot melt adhesive 302, and the disassembly of the packaging composite layer 30 is faster and more convenient on the premise that the element 201 of the circuit layer 20 is not damaged as much as possible.
It should be noted that, fig. 7 of the present embodiment illustrates only an exemplary structure of one vent 303, and in the implementation, the number of vent 303 may be set according to the actual requirement, and the present embodiment is not limited specifically, according to the size of the entire display module 000 and the requirement of improving the disassembling speed.
In some alternative embodiments, please refer to fig. 1-7 and fig. 8, fig. 8 is a flowchart of a manufacturing method of a display module 000 according to an embodiment of the present invention, where the manufacturing method is used to manufacture the display module 000 in the above embodiment, and the manufacturing method includes:
s01: providing a substrate 10, manufacturing a circuit layer 20 on one side of the substrate 10, wherein the circuit layer 20 comprises at least two components 201 with different heights, the heights of the components 201 refer to the heights of the components in a direction Z perpendicular to a plane of the substrate 10, as shown in fig. 9, and fig. 9 is a schematic structural diagram of the circuit layer 20 manufactured on the substrate 10;
s02: providing a mold 50, wherein the mold 50 comprises a third surface 50A, the shape of the third surface 50A is the same as the shape of the surface of the circuit layer 20 on the side far away from the substrate 10, as shown in fig. 10, and fig. 10 is a schematic structural diagram of the provided mold 50;
s03: providing an insulating film 301, attaching an original hot melt adhesive 302' to one side of the insulating film 301 close to the substrate 10, wherein the original hot melt adhesive 302' has a plate-shaped structure, as shown in fig. 11, and fig. 11 is a schematic diagram of the structure after attaching the original hot melt adhesive 302' to one side of the insulating film 301 close to the substrate 10;
s04: covering the third surface 50A of the mold 50 with the insulating film 301 attached with the original hot-melt adhesive 302', heating and pressing the insulating film 301 attached with the original hot-melt adhesive 302', melting the original hot-melt adhesive 302' to the third surface 50A of the mold 50, as shown in fig. 12 and 13, fig. 12 is a schematic structural view of the insulating film 301 attached with the original hot-melt adhesive 302' not yet covering the third surface 50A of the mold 50, and fig. 13 is a schematic structural view of the third surface 50A of the mold 50 filled with the insulating film 301 attached with the original hot-melt adhesive 302' after heating and pressing;
s05: the insulating film 301 to which the original hot melt adhesive 302' is attached is removed after cooling and shaping, so as to obtain a packaging composite layer 30, wherein the packaging composite layer 30 comprises the insulating film 301 and the shaped hot melt adhesive 302, the surface of one side of the hot melt adhesive 302 is the same as the surface of the circuit layer 20, which is far away from the substrate, as shown in fig. 14, and fig. 14 is a schematic structural diagram of the obtained packaging composite layer 30;
s06: as shown in fig. 15, fig. 15 is a schematic structural diagram of a display module 000 manufactured by the manufacturing method of the present embodiment.
Specifically, the manufacturing method of the display module 000 provided in this embodiment is used to manufacture the display module 000 in the above embodiment. The substrate 10 may be provided first, the substrate 10 may be a carrier for carrying other components, the substrate 10 may be a metal-based heat dissipation plate (such as an aluminum substrate, a copper substrate, and an iron substrate), is a unique metal-based copper-clad plate, has good thermal conductivity, electrical insulation performance, and machining performance, and may be a substrate made of a flexible substrate such as Polyimide (PI), which has many advantages not possessed by a rigid printed circuit board, for example, it may be freely bent, rolled, folded, and widely applied to fields or products such as aerospace, military, mobile communication, portable computers, computer peripherals, PDAs, digital cameras, etc., and may be selectively set according to practical requirements in specific implementation, and the embodiment is not specifically limited. The circuit layer 20 is manufactured on one side of the substrate 10, the circuit layer 20 comprises at least two components 201 with different heights, the circuit layer 20 is used for integrally arranging a plurality of components 201, alternatively, no-pin or short-lead surface-mounted components (SMC or SMD, SMC refers to surface-mounted components mainly refers to passive components such as resistors and inductors and sheet-shaped components without polarity), SMD refers to surface-mounted components mainly refers to active components such as capacitors and sheet-shaped components with positive and negative poles are arranged on the surface of the substrate 10, and the circuit layer 20 is formed by welding and assembling through reflow soldering or dip soldering and the like. Since each element 201 may include different model types, the volume and the height thereof may be different, that is, the circuit layer 20 may include at least two elements 201 having different heights, and the surface of the circuit layer 20 on the side away from the substrate 10 may be a surface having a high probability of being uneven. Then, the packaging composite layer 30 on the side of the circuit layer 20 far away from the substrate 10 is manufactured by providing a die 50, wherein the die 50 comprises a third surface 50A, and the shape of the third surface 50A is the same as the shape of the surface of the circuit layer 20 on the side far away from the substrate 10; then providing an insulating film 301, and attaching an original hot melt adhesive 302 'on one side of the insulating film 301 close to the substrate 10, wherein the original hot melt adhesive 302' is of a plate-shaped structure; covering the third surface 50A of the mold 50 with the insulating film 301 attached with the original hot melt adhesive 302', and heating and pressing the insulating film 301 attached with the original hot melt adhesive 302', so that the original hot melt adhesive 302' is melted until the third surface 50A of the mold 50 is filled; and cooling and shaping the insulating film 301 to which the original hot melt adhesive 302' is attached, and then removing the insulating film to obtain the packaging composite layer 30, wherein the packaging composite layer 30 comprises the insulating film 301 and the shaped hot melt adhesive 302, and the shape of one side surface of the hot melt adhesive 302 is the same as the shape of the surface of the circuit layer 20, which is far away from the substrate. The hot melt adhesive 302 has an adhesive function for better fixing and attaching the insulating film 301 to the circuit layer 20, and the insulating film 301 has a function of encapsulating the element 201 on the insulating protection circuit layer 20. The display module 000 manufactured by the manufacturing method provided in this embodiment, the hot melt adhesive 302 includes a first surface 302A far from the substrate 10 and a second surface 302B near to the substrate 10, where the first surface 302A is adhered and fixed to the insulating film 301, and optionally, the first surface 302A may have a planar structure matching with the surface of the insulating film 301, so as to be better adhered to the insulating film 301; the second surface 302B of the hot melt adhesive 302 is in a concave-convex structure, and the concave-convex structure can be formed by prefabricating and shaping the mold 50, and the shape of the second surface 302B is matched with the shape of the surface (which can be understood as the concave-convex surface formed by each element 201 and the gap) of the circuit layer 20 on the side far away from the substrate 10, so that the hot melt adhesive 302 covers each element 201 of the circuit layer 20. The hot melt adhesive 302 of the display module 000 manufactured in this embodiment includes a second surface 302B of a concave-convex structure matched with the surface of the circuit layer 20, which is far away from the substrate 10, and the packaging composite layer 30 formed by bonding the insulating film 301 and the hot melt adhesive 302 can be prefabricated and shaped according to the surface shape of the circuit layer 20, so that the circuit layer 20 and the packaging composite layer 30 can be directly attached in the process of manufacturing, and no other positioning design is needed, thereby saving time and being fast. The second surface 302B of the concave-convex structure of the hot melt adhesive 302 can be filled with the gap of the element 201, which is favorable for increasing the attaching area of the circuit layer 20 and the packaging composite layer 30, and under the design structure of the hot melt adhesive 302, the insulating film 301 of the packaging composite layer 30 is not easy to fall off, which is favorable for improving the product yield and the display reliability.
It should be noted that, in the cross-sectional view of the display module 000 manufactured in this embodiment, only the structure of the display module 000 is schematically illustrated, and in specific implementation, the structure of the display module 000 is not limited to this, and may include other structures capable of integrating a driving circuit, and the structures of the IC (Integrated Circuit, the driving chip, the integrated circuit), the FPC (Flexible Printed Circuit, the flexible circuit board) and the PCB (Printed Circuit Board, the printed circuit board) in the related art may be referred to for understanding, which is not described in detail in this embodiment.
In some alternative embodiments, please refer to fig. 16 and 17 in combination, fig. 16 is a flow chart of another manufacturing method of a display module according to an embodiment of the present invention, and fig. 17 is a schematic structural diagram of a fluorinated liquid layer 40 coated after a circuit layer 20 is manufactured on one side of a substrate 10, where in the manufacturing method of a display module according to the embodiment, after the circuit layer 20 is manufactured on one side of the substrate 10, the manufacturing method further includes: s07, coating the circuit layer 20 with the fluorinated liquid layer 40 on a side away from the substrate 10.
The manufacturing method of the display module 000 provided in this embodiment further includes coating the surface of the circuit layer 20 in the display module 000, which is far away from the substrate 10, with a fluorinated liquid layer 40, wherein the fluorinated liquid layer 40 is a cleaning agent for precision instruments, and is applied to precisely clean the components 201 on the circuit layer 20 to remove impurities such as grease, wax, rosin flux, fingerprint sweat, particles, etc., while the fluorinated liquid layer 40 can be used for a protective coating of the circuit layer 20, and a thin transparent film is left on the surface of the circuit layer 20 coated with the fluorinated liquid layer 40, so as to play a role in moisture prevention and adhesion prevention. The surface dyne value (the dyne value is measured as the humidity of the surface and is also understood to be the side angle of the droplet on the surface of the fluorinated liquid layer 40, and the droplet of the fluorinated liquid layer 40 forms a small droplet on the surface, so that the dyne value on the surface of the fluorinated liquid layer 40 is low) is low, and the lower the dyne value is, the lower the energy on the surface of the fluorinated liquid layer 40 is, so that the less the surface of the fluorinated liquid layer 40 is likely to adhere to the hot melt adhesive 302, and the insulating film 301 is likely to fall off. Therefore, when the surface of the circuit layer 20 far away from the substrate 10 in the display module 000 is coated with the fluorinated liquid layer 40, the second surface 302B of the hot melt adhesive 302 needs to be designed into a concave-convex structure matching with the surface of the circuit layer 20 far away from the substrate 10, and in the process, the circuit layer 20 including the fluorinated liquid layer 40 and the packaging composite layer 30 can be directly attached without any other positioning design, so that the time is saved, the gap between the elements 201 can be filled with the second surface 302B of the concave-convex structure of the hot melt adhesive 302, the attaching area of the circuit layer 20 and the packaging composite layer 30 can be increased, the attaching effect of the insulating film 301 can be prevented from being affected due to the low dyne value of the fluorinated liquid layer 40, the insulating film 301 of the packaging composite layer 30 can be further prevented from falling off under the design structure of the hot melt adhesive 302, the product yield is improved, and the display reliability is further improved.
In some alternative embodiments, please refer to fig. 18 and 19 in combination, fig. 18 is a flow chart of another manufacturing method of a display module provided in an embodiment of the present invention, and fig. 19 is a schematic structural diagram of a vent 303 manufactured after manufacturing a packaging composite layer 30, where in the manufacturing method of a display module provided in the embodiment, after manufacturing the packaging composite layer 30, the method further includes: s08, manufacturing a vent 303 on the surface of the hot melt adhesive 302, which is close to one side of the substrate 10. Alternatively, the vent 303 may be recessed from the second surface 302B toward the direction approaching the first surface 302A at the edge of the hot melt adhesive 302.
In this embodiment, the manufacturing method of the display module 000 is further explained, after the manufacturing of the packaging composite layer 30, further includes manufacturing the vent 303 on the surface of the hot melt adhesive 302 near the substrate 10, and since the situation that the electrical connection is unstable may occur during the inspection performance after the packaging of the circuit layer 20 by using the packaging composite layer 30 is completed, in order to facilitate the disassembly during the reworking inspection repair, the vent 303 may be manufactured on the surface of the hot melt adhesive 302 near the substrate 10 after the manufacturing of the packaging composite layer 30, and auxiliary materials such as liquid nitrogen having a freezing effect (by using the low temperature characteristic of the liquid nitrogen, having the effect of freezing and disassembling the separation device) may be introduced into the hot melt adhesive 302 through the vent 303, so that the disassembly of the packaging composite layer 30 may be faster and more convenient without damaging the element 201 of the circuit layer 20 as much as possible.
Alternatively, as shown in fig. 19, the hot melt adhesive 302 may include a first region M overlapping the element 201 of the circuit layer 20 in a direction Z perpendicular to the plane of the substrate 10, and a second region N disposed around the first region M; in the second region N, the hot melt adhesive 302 is adhered and fixed to the substrate 10; the vent 303 is located in the second region N. It should be understood that fig. 19 of the present embodiment illustrates only an exemplary structure of one vent 303, and in the implementation, the number of vent 303 may be set according to the actual requirement, and the present embodiment is not limited specifically, according to the size of the entire display module 000 and the requirement of improving the disassembling speed.
In some alternative embodiments, please refer to fig. 20, fig. 20 is a schematic plan view of a display device 111 according to an embodiment of the present invention, where the display device 111 according to the present embodiment includes a display panel 222 electrically connected to the display module 000 according to the above embodiment of the present invention. The embodiment of fig. 20 is only an example of a mobile phone, and the display device 111 is described, and it is to be understood that the display device 111 provided in the embodiment of the present invention may be other display devices 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, which is not particularly limited in the present invention. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the display module 000 provided in the embodiment of the present invention, and the specific description of the display module 000 in the above embodiments may be referred to specifically, and this embodiment is not repeated here.
According to the display module, the manufacturing method thereof and the display device provided by the invention, the following beneficial effects are at least realized:
the display module provided by the invention comprises a packaging composite layer, wherein the hot melt adhesive of the packaging composite layer comprises a first surface far away from one side of the substrate and a second surface close to one side of the substrate, the first surface is adhered and fixed with the insulating film, the second surface of the hot melt adhesive is of a concave-convex structure, the concave-convex structure can be formed by prefabricating and shaping a die, and the shape of the second surface is matched with the shape of the surface of the circuit layer far away from one side of the substrate, so that the hot melt adhesive covers all elements of the circuit layer. The hot melt adhesive comprises the second surface of the concave-convex structure matched with the surface of the circuit layer far away from the substrate, and the packaging composite layer formed by bonding the insulating film and the hot melt adhesive can be prefabricated and shaped according to the surface shape of the circuit layer, so that the circuit layer and the packaging composite layer can be directly attached in the process of manufacturing, other positioning designs are not needed, and the time is saved. The clearance of component can be filled to the unsmooth form structure's of hot melt adhesive second surface, is favorable to increasing the attached area of circuit layer and encapsulation composite layer, under this kind of design structure of hot melt adhesive, can make the insulating film of encapsulation composite layer be difficult for droing, is favorable to improving the product yield, promotes the demonstration reliability.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A display module, comprising:
a substrate;
the circuit layer is positioned on one side of the substrate and at least comprises two elements with different heights;
the packaging composite layer is positioned on one side of the circuit layer away from the substrate;
the packaging composite layer comprises an insulating film and hot melt adhesive, and the insulating film is positioned on one side of the hot melt adhesive away from the substrate;
the hot melt adhesive comprises a first surface far away from one side of the substrate and a second surface close to one side of the substrate, the first surface is adhered and fixed with the insulating film, the second surface is of a concave-convex structure, the shape of the second surface is matched with the shape of the surface of the circuit layer far away from one side of the substrate, and the hot melt adhesive covers the element of the circuit layer; at least one vent hole is formed in the second surface of the hot melt adhesive, and the vent hole is formed in the edge of the hot melt adhesive in a recessed manner from the second surface to the direction close to the first surface;
the circuit layer is coated on the surface of the circuit layer, which is far away from the substrate.
2. The display module of claim 1, wherein the hot melt adhesive includes a first region and a second region disposed around the first region, the first region overlapping the element of the circuit layer in a direction perpendicular to a plane in which the substrate lies;
and in the second area, the second surface of the hot melt adhesive is adhered and fixed with the substrate.
3. The display module of claim 1, wherein the first surface of the hot melt adhesive is a planar structure.
4. A method for manufacturing a display module, wherein the manufacturing method is used for manufacturing the display module according to any one of claims 1 to 3, and the manufacturing method comprises:
providing a substrate, and manufacturing a circuit layer on one side of the substrate, wherein the circuit layer at least comprises two elements with different heights;
providing a mold, wherein the mold comprises a third surface, and the shape of the third surface is the same as the shape of the surface of the circuit layer on the side far away from the substrate;
providing an insulating film, and attaching an original hot melt adhesive to one side of the insulating film, which is close to the substrate, wherein the original hot melt adhesive is of a plate-shaped structure;
covering the third surface of the die with the insulating film attached with the original hot melt adhesive, and heating and pressing the insulating film attached with the original hot melt adhesive to melt the original hot melt adhesive until the third surface of the die is filled;
cooling and shaping the insulating film attached with the original hot melt adhesive, and then taking down to obtain a packaging composite layer, wherein the packaging composite layer comprises the insulating film and the shaped hot melt adhesive, and the shape of the surface of one side of the hot melt adhesive is the same as the shape of the surface of one side of the circuit layer, which is far away from the substrate;
and embedding and fixing the packaging composite layer and the circuit layer.
5. The method of manufacturing a display module according to claim 4, further comprising, after the circuit layer is manufactured on the substrate side: and coating a fluoride liquid layer on one side of the circuit layer away from the substrate.
6. The method of manufacturing a display module according to claim 4, further comprising, after the manufacturing of the encapsulation composite layer: and manufacturing vent holes on the surface of one side of the hot melt adhesive close to the substrate.
7. The method according to claim 6, wherein the hot melt adhesive includes a first region and a second region disposed around the first region, the first region overlapping the element of the circuit layer in a direction perpendicular to a plane in which the substrate is disposed; in the second area, the hot melt adhesive is adhered and fixed with the substrate;
the vent is located within the second region.
8. A display device comprising an electrically connected display panel and a display module according to any one of claims 1-3.
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1868062A (en) * | 2003-09-09 | 2006-11-22 | 三洋电机株式会社 | Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same |
| TW201445697A (en) * | 2013-05-31 | 2014-12-01 | Advanced Semiconductor Eng | Stacked multi-package module and manufacation method thereof |
| CN106833166A (en) * | 2017-03-21 | 2017-06-13 | 深圳市阿拉町科技发展有限公司 | A kind of waterproof fluorination liquid and its preparation method and application |
| CN107565046A (en) * | 2017-08-17 | 2018-01-09 | 上海天马有机发光显示技术有限公司 | Organic electroluminescence display panel and its manufacture method and display device |
| CN107921464A (en) * | 2015-05-01 | 2018-04-17 | E·帕克 | Apparatus and method for display screen that recycle curved surface and flexible |
| CN108281458A (en) * | 2017-01-03 | 2018-07-13 | 昆山工研院新型平板显示技术中心有限公司 | Flexible OLED display and preparation method thereof |
| CN108713356A (en) * | 2016-04-08 | 2018-10-26 | 三星电子株式会社 | EMI shielding constructions and its manufacturing method |
| CN208521099U (en) * | 2018-08-02 | 2019-02-19 | 信利半导体有限公司 | A kind of display screen and terminal |
| CN109541834A (en) * | 2018-12-29 | 2019-03-29 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110121771A (en) * | 2017-09-04 | 2019-08-13 | 首尔半导体株式会社 | The manufacturing method of display device and the display device |
| CN210298180U (en) * | 2019-05-20 | 2020-04-10 | Oppo广东移动通信有限公司 | Electronic circuit board and electronic equipment |
| CN210429781U (en) * | 2019-10-24 | 2020-04-28 | 广东气派科技有限公司 | Stacking and packaging structure of small-size special-shaped element |
| CN111524941A (en) * | 2020-04-26 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN111834543A (en) * | 2020-06-28 | 2020-10-27 | 昆山国显光电有限公司 | Flexible display panel and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2011058978A1 (en) * | 2009-11-10 | 2013-04-04 | 株式会社フジクラ | Wiring board manufacturing method |
-
2020
- 2020-11-26 CN CN202011351799.0A patent/CN112397669B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1868062A (en) * | 2003-09-09 | 2006-11-22 | 三洋电机株式会社 | Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same |
| TW201445697A (en) * | 2013-05-31 | 2014-12-01 | Advanced Semiconductor Eng | Stacked multi-package module and manufacation method thereof |
| CN107921464A (en) * | 2015-05-01 | 2018-04-17 | E·帕克 | Apparatus and method for display screen that recycle curved surface and flexible |
| CN108713356A (en) * | 2016-04-08 | 2018-10-26 | 三星电子株式会社 | EMI shielding constructions and its manufacturing method |
| CN108281458A (en) * | 2017-01-03 | 2018-07-13 | 昆山工研院新型平板显示技术中心有限公司 | Flexible OLED display and preparation method thereof |
| CN106833166A (en) * | 2017-03-21 | 2017-06-13 | 深圳市阿拉町科技发展有限公司 | A kind of waterproof fluorination liquid and its preparation method and application |
| CN107565046A (en) * | 2017-08-17 | 2018-01-09 | 上海天马有机发光显示技术有限公司 | Organic electroluminescence display panel and its manufacture method and display device |
| CN110121771A (en) * | 2017-09-04 | 2019-08-13 | 首尔半导体株式会社 | The manufacturing method of display device and the display device |
| CN208521099U (en) * | 2018-08-02 | 2019-02-19 | 信利半导体有限公司 | A kind of display screen and terminal |
| CN109541834A (en) * | 2018-12-29 | 2019-03-29 | 厦门天马微电子有限公司 | Display panel and display device |
| CN210298180U (en) * | 2019-05-20 | 2020-04-10 | Oppo广东移动通信有限公司 | Electronic circuit board and electronic equipment |
| CN210429781U (en) * | 2019-10-24 | 2020-04-28 | 广东气派科技有限公司 | Stacking and packaging structure of small-size special-shaped element |
| CN111524941A (en) * | 2020-04-26 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN111834543A (en) * | 2020-06-28 | 2020-10-27 | 昆山国显光电有限公司 | Flexible display panel and display device |
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| Publication number | Publication date |
|---|---|
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