CN110580855B - Chip on film, chip on film substrate, manufacturing method thereof and display device - Google Patents
Chip on film, chip on film substrate, manufacturing method thereof and display device Download PDFInfo
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- CN110580855B CN110580855B CN201910876911.3A CN201910876911A CN110580855B CN 110580855 B CN110580855 B CN 110580855B CN 201910876911 A CN201910876911 A CN 201910876911A CN 110580855 B CN110580855 B CN 110580855B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The invention provides a chip on film, a chip on film substrate, a manufacturing method of the chip on film substrate and a display device, and belongs to the technical field of display. The manufacturing method of the chip on film substrate comprises the following steps: providing a rigid carrier plate; forming a flexible substrate on the rigid carrier; forming a routing layer on the flexible substrate by using nano silver; forming a protective layer covering the routing layer; separating the flexible substrate from the rigid carrier. The technical scheme of the invention can utilize the manufacturing equipment of the display substrate to manufacture the chip on film substrate, thereby improving the productivity of the chip on film substrate and reducing the production cost of the chip on film substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a chip on film, a chip on film substrate, a manufacturing method of the chip on film substrate and a display device.
Background
When the display device displays, a Chip On Film (COF) substrate needs to be used to connect a Printed Circuit Board (PCB) and a display panel, so that signals on the PCB can be conducted to the display panel, and the development of display products is restricted by the insufficient productivity of the COF substrate.
Disclosure of Invention
The present invention provides a chip on film, a chip on film substrate, a method for manufacturing the same, and a display device, which can manufacture the chip on film substrate by using a manufacturing apparatus of the display substrate, thereby increasing the productivity of the chip on film substrate and reducing the production cost of the chip on film substrate.
In order to solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, a chip on film substrate is provided, including:
a flexible substrate;
the wiring layer is positioned on the flexible substrate and adopts nano silver;
and the protective layer covers the wiring layer.
Optionally, the method further comprises:
a planar layer located between the flexible substrate and the routing layer.
The embodiment of the invention also provides the chip on film which is obtained by cutting the chip on film substrate.
Optionally, the chip on film substrate further comprises:
an insulating protective film covering the protective layer.
The embodiment of the invention also provides a display device, which comprises a drive circuit of a display substrate and the chip on film bound with the drive circuit, wherein the chip on film adopts the chip on film.
Optionally, the chip on film is bound to the driving circuit through anisotropic conductive adhesive.
The embodiment of the invention also provides a manufacturing method of the chip on film substrate, which comprises the following steps:
providing a rigid carrier plate;
forming a flexible substrate on the rigid carrier;
forming a routing layer on the flexible substrate by using nano silver;
forming a protective layer covering the wiring layer;
separating the flexible substrate from the rigid carrier.
Optionally, before forming a routing layer on the flexible substrate using nano-silver, the method further comprises:
and forming a flat layer on the flexible substrate, wherein the routing layer is positioned on the flat layer.
Optionally, before forming the flexible substrate on the rigid carrier plate, the method further comprises:
forming a bonding adhesive layer on the rigid carrier plate;
forming a flexible substrate on the rigid carrier plate comprises:
forming the flexible substrate on the adhesive layer;
and curing the adhesive layer to fix the flexible substrate on the rigid carrier plate.
Optionally, said separating said flexible substrate from said rigid carrier plate comprises:
heating the bonding adhesive layer to reduce the viscosity of the bonding adhesive layer;
mechanically separating the flexible substrate from the rigid carrier.
The embodiment of the invention has the following beneficial effects:
according to the scheme, when the chip on film substrate is manufactured, the rigid carrier plate is provided, the flexible substrate is formed on the rigid carrier plate, the wiring layer is formed on the flexible substrate by utilizing the nano silver, the protective layer covering the wiring layer is formed, and then the flexible substrate is separated from the rigid carrier plate, so that the film layer of the chip on film substrate can be manufactured by utilizing the manufacturing equipment of the display substrate, the capacity of the chip on film substrate is improved, and the production cost of the chip on film substrate is reduced.
Drawings
FIG. 1-FIG. 5 are schematic views of a process for fabricating a COF substrate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of forming an insulating protective film according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating bonding of the flip chip on film and the driving circuit according to the embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description is made with reference to the accompanying drawings and specific embodiments.
With the development of display technology, the development of display products has been severely restricted by the insufficient productivity of COF substrates.
In order to solve the above problems, embodiments of the present invention provide a flip chip, a flip chip substrate, a method for manufacturing the same, and a display device, which can manufacture the flip chip substrate by using a manufacturing apparatus of the display substrate, thereby increasing the productivity of the flip chip substrate and reducing the production cost of the flip chip substrate.
The embodiment of the invention also provides a manufacturing method of the chip on film substrate, which comprises the following steps:
providing a rigid carrier plate;
forming a flexible substrate on the rigid carrier;
forming a wiring layer on the flexible substrate by using nano silver;
forming a protective layer covering the routing layer;
separating the flexible substrate from the rigid carrier.
In this embodiment, when the substrate with a chip on film is manufactured, a rigid carrier is provided, a flexible substrate is formed on the rigid carrier, a wiring layer is formed on the flexible substrate by using nano-silver, a protective layer covering the wiring layer is formed, and then the flexible substrate is separated from the rigid carrier, so that a film layer of the substrate with a chip on film can be manufactured by using a manufacturing device of the display substrate, and the substrate with a chip on film can be manufactured by using the manufacturing device of the display substrate, thereby improving the productivity of the substrate with a chip on film and reducing the production cost of the substrate with a chip on film.
In the manufacturing process of the traditional COF substrate, thick Cu wiring is manufactured on a flexible substrate, tin plating is carried out after the wiring is manufactured, green oil printing is carried out after the tin plating is manufactured, and finally IC (drive circuit) Bonding is carried out. The processes of manufacturing thick Cu traces, tinning and the like are all performed by special COF substrate production equipment, and the productivity of the COF substrate production equipment is insufficient.
In this embodiment, the routing layer is formed by using nano silver, the nano silver layer can be formed by using a coating process, the nano silver layer is patterned to form the routing layer, the nano silver layer with a larger thickness can be formed by using the coating process, the resistance requirement of the chip on film substrate to routing is met, the manufacturing equipment of the existing display substrate can execute the coating process, so that the routing layer can be manufactured by using the manufacturing equipment of the display substrate, and the productivity of the chip on film substrate can be improved. In addition, compared with thick Cu, the ductility of the nano silver is better, the prepared chip on film substrate can be folded, and when the chip on film substrate is applied to a display device, the frame of the display device can be reduced by folding the chip on film substrate.
In addition, the traditional scheme adopts chemical tinning to protect the surface of the Cu wire, the Cu wire is prevented from being oxidized, the protective layer is adopted to protect the surface of the nano-silver wire in the embodiment, the protective layer cannot influence the conductivity of the nano-silver wire, the nano-silver wire can also be protected, the nano-silver wire is prevented from being corroded or oxidized, the nano-silver wire is not required to be protected through chemical tinning, the protective layer can be prepared by adopting a deposition or coating process, the existing display substrate manufacturing equipment can perform a deposition or coating process, the protective layer for protecting the nano-silver wire can be manufactured by the display substrate manufacturing equipment, and the production capacity of the flip chip substrate can be improved.
Optionally, before forming a routing layer on the flexible substrate using nano-silver, the method further comprises:
and forming a flat layer on the flexible substrate, wherein the routing layer is positioned on the flat layer. The flat layer can be made of organic or inorganic insulating materials, and can improve the water and oxygen isolation capability of the chip on film substrate.
Optionally, before forming the flexible substrate on the rigid carrier plate, the method further comprises:
forming a bonding adhesive layer on the rigid carrier plate;
forming a flexible substrate on the rigid carrier plate comprises:
forming the flexible substrate on the adhesive layer;
and curing the adhesive layer to fix the flexible substrate on the rigid carrier plate.
Wherein, the laminating is glued and can be adopted the control by temperature change to glue, glues the temperature through control by temperature change, can control the viscidity that the control by temperature change was glued.
Optionally, said separating said flexible substrate from said rigid carrier plate comprises:
heating the bonding adhesive layer to reduce the viscosity of the bonding adhesive layer;
mechanically separating the flexible substrate from the rigid carrier.
In one embodiment, as shown in fig. 1-5, the method for manufacturing a chip on film substrate includes the following steps:
the rigid carrier 1 may be a glass substrate or a quartz substrate.
wherein, the bonding glue 2 can adopt temperature control glue, and the viscosity of the bonding glue 2 can be controlled by controlling the temperature of the bonding glue 2.
specifically, the flexible substrate 3 may be directly attached to the rigid carrier 1 through the adhesive 2, or a polyimide solution may be coated on the rigid carrier 1 through a coating process, and the flexible substrate 3 is formed after curing.
the flat layer 4 may be made of an organic insulating material or an inorganic insulating material, and the flat layer 4 can improve the water and oxygen isolation capability of the substrate.
specifically, the nano silver layer 5 can be formed through a coating process, and the coating process can control the thickness of the nano silver layer, so that the thickness of the nano silver layer reaches the micron level, and the requirement of the chip on film substrate on the wiring resistivity is met. Therefore, the routing of the chip on film substrate can be manufactured by using the manufacturing equipment of the display substrate, and the productivity of the chip on film substrate can be improved.
the protective layer 6 can not influence the conductivity of the nano-silver wires, can also protect the nano-silver wires, and prevent the nano-silver wires from being corroded or oxidized, so that the nano-silver wires are not required to be protected by chemical tinning, the protective layer 6 can be prepared by adopting deposition or coating process, the existing preparation equipment of the display substrate can execute deposition or coating process, the protective layer for protecting the nano-silver wires can be prepared by the preparation equipment of the display substrate, and the productivity of the chip on film substrate can be improved.
Specifically, the viscosity of the adhesive 2 can be reduced by controlling the temperature of the adhesive 2, and then the flexible substrate 3 is peeled off from the rigid carrier board 1 by mechanical peeling.
In this embodiment, the process of manufacturing the chip on film substrate does not include tin plating and thick Cu plating, and the manufacturing of the chip on film substrate can be realized by using the manufacturing equipment of the display substrate, so that the productivity of the chip on film substrate can be improved.
An embodiment of the present invention provides a chip on film substrate, including:
a flexible substrate;
a wiring layer positioned on the flexible substrate, wherein the wiring layer adopts nano silver;
and the protective layer covers the routing layer.
In this embodiment, the film layer of the cover crystal film substrate can be manufactured by the manufacturing equipment of the display substrate, so that the cover crystal film substrate can be manufactured by the manufacturing equipment of the display substrate, the productivity of the cover crystal film substrate is improved, and the production cost of the cover crystal film substrate is reduced.
Optionally, the substrate further includes:
a planar layer located between the flexible substrate and the routing layer. The flat layer can be made of organic or inorganic insulating materials, and can improve the water and oxygen isolation capability of the chip on film substrate.
Specifically, the thin film transistor substrate according to the embodiment of the present invention is manufactured by the above method, and as shown in fig. 5, the thin film transistor substrate includes: the display substrate comprises a flexible substrate 3, a flat layer 4 positioned on the flexible substrate 3, a nano silver layer 4 positioned on the flat layer 4 and a protective layer 5, wherein the nano silver layer 4 and the protective layer 5 can be manufactured by using manufacturing equipment of the display substrate.
The embodiment of the invention also provides a chip on film which is obtained by cutting the chip on film substrate.
Optionally, the chip on film further comprises:
and the insulating protective film covers the protective layer, can be coated on the protective layer and the wiring layer by adopting green oil, and can protect the chip on film for a long time.
As shown in fig. 6, after the flexible substrate 3 is peeled off from the rigid carrier 1, the substrate with the chip on film may be cut into strips, and then the insulating protective film 7 is formed on the strip substrate with the chip on film; then, the substrate with the chip on film in strip shape can be cut into small chip on film, as shown in fig. 7, and the Bonding process of COF and IC can be completed by binding the anisotropic conductive adhesive 8 with the driving circuit 9.
The traditional scheme is that chemical tinning is carried out on Cu wiring, a soldering process is adopted for pin Bonding when IC Bonding is carried out, however, the chemical tinning needs special COF substrate production equipment for execution, anisotropic conductive adhesive is adopted for binding the chip on film and the driving circuit in the embodiment, a tinning process is not needed, secondary tin pollution is avoided, a display substrate manufacturing device can be used for executing the Bonding process, the capacity of the chip on film substrate can be improved, and the utilization rate of the display substrate manufacturing device can be improved.
The embodiment of the invention also provides a display device, which comprises a drive circuit of a display substrate and the chip on film bound with the drive circuit, wherein the chip on film adopts the chip on film. The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
Alternatively, as shown in fig. 7, the flip chip is bonded to the driving circuit 9 through the anisotropic conductive adhesive 8. The traditional scheme is that chemical tinning is carried out on Cu wiring, and pin Bonding is carried out by adopting a soldering process when IC Bonding is carried out, but the chemical tinning is carried out by special COF substrate production equipment.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and the like in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.
Claims (4)
1. A method for manufacturing a chip on film substrate is characterized by comprising the following steps:
providing a rigid carrier plate;
forming a flexible substrate on the rigid carrier;
forming a routing layer on the flexible substrate by using nano silver; the nano silver layer is manufactured by adopting a coating process, and the nano silver layer is subjected to composition to form the nano silver wiring, wherein the coating process can enable the thickness of the nano silver layer to reach a micron level;
forming a protective layer covering the routing layer; the protective layer is made by adopting a coating process, and the protective layer is patterned;
separating the flexible substrate from the rigid carrier;
cutting the chip on film substrate into strips;
forming an insulating protective film covering the protective layer;
cutting the strip-shaped chip on film substrate into small chip on film;
the flip chip film is bound with the driving circuit through anisotropic conductive adhesive;
before forming a routing layer using nano-silver on the flexible substrate, the method further comprises:
and forming a flat layer on the flexible substrate, wherein the routing layer is positioned on the flat layer.
2. The method of claim 1, wherein before the forming the flexible substrate on the rigid carrier, the method further comprises:
forming a bonding adhesive layer on the rigid carrier plate;
forming a flexible substrate on the rigid carrier plate comprises:
forming the flexible substrate on the adhesive layer;
and curing the adhesive layer to fix the flexible substrate on the rigid carrier plate.
3. The method as claimed in claim 2, wherein the separating the flexible substrate from the rigid carrier comprises:
heating the bonding adhesive layer to reduce the viscosity of the bonding adhesive layer;
mechanically separating the flexible substrate from the rigid carrier.
4. A display device, comprising a driving circuit of a display substrate and a flip-chip film bound with the driving circuit, wherein the flip-chip film is formed by cutting a flip-chip film substrate manufactured by the method according to any one of claims 1 to 3.
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| CN201910876911.3A CN110580855B (en) | 2019-09-17 | 2019-09-17 | Chip on film, chip on film substrate, manufacturing method thereof and display device |
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| CN110580855B true CN110580855B (en) | 2022-08-30 |
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| CN112071862B (en) | 2020-09-03 | 2024-01-19 | Tcl华星光电技术有限公司 | Light-emitting panel, preparation method thereof and display panel |
| CN114049843A (en) * | 2021-11-17 | 2022-02-15 | 合肥维信诺科技有限公司 | Display module and display device |
| WO2024055205A1 (en) * | 2022-09-14 | 2024-03-21 | 京东方科技集团股份有限公司 | Chip on film, manufacturing method therefor, and display device |
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| CN110093141A (en) * | 2019-05-06 | 2019-08-06 | 深圳市华星光电技术有限公司 | The production method of combined material for flexible base board removing and preparation method thereof, flexible panel |
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| JP2006156943A (en) * | 2004-09-28 | 2006-06-15 | Seiko Epson Corp | Wiring pattern forming method, wiring pattern, and electronic equipment |
| CN104049393A (en) * | 2014-06-12 | 2014-09-17 | 深圳市华星光电技术有限公司 | Chip on film (COF) substrate and manufacturing method thereof and display panel |
| CN108250469B (en) * | 2016-12-29 | 2021-04-30 | 乐凯华光印刷科技有限公司 | Production process of nano silver wire transparent conductive film |
| CN108621513B (en) * | 2017-03-22 | 2019-11-12 | 昆山雅森电子材料科技有限公司 | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material |
| CN107134443B (en) * | 2017-06-23 | 2019-09-03 | 厦门天马微电子有限公司 | The packaging method of flip chip, display device and integrated circuit |
| CN109561577A (en) * | 2017-09-26 | 2019-04-02 | 华为终端（东莞）有限公司 | A kind of flip chip flexible circuit board and terminal device |
| CN209150099U (en) * | 2019-01-09 | 2019-07-23 | 昆山工研院新型平板显示技术中心有限公司 | A kind of display panel and display device |
| CN110190042A (en) * | 2019-06-26 | 2019-08-30 | 云谷（固安）科技有限公司 | Bind structure, binding method, display panel and display device |
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| CN110093141A (en) * | 2019-05-06 | 2019-08-06 | 深圳市华星光电技术有限公司 | The production method of combined material for flexible base board removing and preparation method thereof, flexible panel |
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