CN114049843A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN114049843A CN114049843A CN202111360057.9A CN202111360057A CN114049843A CN 114049843 A CN114049843 A CN 114049843A CN 202111360057 A CN202111360057 A CN 202111360057A CN 114049843 A CN114049843 A CN 114049843A
- Authority
- CN
- China
- Prior art keywords
- display
- display panel
- binding portion
- display module
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 239000011241 protective layer Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 description 23
- 239000010408 film Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 moisture Substances 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Abstract
The application provides a display module assembly and display device relates to and shows technical field for realize the narrow frame design of display module assembly. This display module assembly includes: the display panel comprises a display area and a frame area surrounding the display area, wherein a first wiring extending from the display area to the frame area is arranged on the light emitting side of the display panel, a second wiring is arranged on the backlight side of the display panel, a through hole penetrating through the display panel is also arranged in the frame area, and the through hole is electrically connected with the first wiring and the second wiring respectively; the driving chip and the flexible circuit board are positioned on the backlight side, the driving chip is electrically connected with the second wiring, and the driving chip is electrically connected with the main circuit board through the flexible circuit board. For the technical scheme that the driving chip is arranged on the light-emitting side of the frame area of the display panel and the frame area is bent to the backlight side, the display module reduces the occupied space of the frame area and achieves narrow frame design of the display module.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
Along with the continuous maturity and the development of display technology, the consumer requires more and more severer to display module's visual effect, not only requires diversified to display module's appearance design, and the screen to display module moreover accounts for the requirement also more and more high, and comprehensive screen technique is in force. The comprehensive screen technology refers to the design of through super narrow frame, no frame even under the unchangeable condition of fuselage total area for display area maximize improves display module assembly's visual effect. However, the conventional display module has difficulty in realizing a narrow bezel design.
Disclosure of Invention
In view of the foregoing problems, embodiments of the present application provide a display module and a display device, where the display module can implement a narrow frame design.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
a first aspect of the embodiments of the present application provides a display module, including: the display panel comprises a display area and a frame area surrounding the display area, wherein a first wiring extending from the display area to the frame area is arranged on the light emitting side of the display panel, a second wiring is arranged on the backlight side of the display panel, a through hole penetrating through the display panel is also arranged in the frame area, and the through hole is electrically connected with the first wiring and the second wiring respectively; the driving chip and the flexible circuit board are positioned on the backlight side, the driving chip is electrically connected with the second wiring, and the driving chip is electrically connected with the main circuit board through the flexible circuit board.
In one possible implementation manner, the number of the first wires and the number of the second wires are respectively multiple and correspond to one another; the number of the via holes is multiple, and each via hole is connected with one corresponding first routing line and one corresponding second routing line.
In one possible implementation manner, in the frame area, a plurality of first wires are parallel to each other and are arranged at intervals, and the ends of the plurality of first wires are arranged in an aligned manner; the second wires are parallel to each other and arranged at intervals, and the ends of the second wires are aligned; preferably, the via hole penetrates through the first trace and the second trace, and the plurality of via holes are aligned in a direction perpendicular to the first trace.
In a possible implementation manner, the backlight side of the display panel includes a first binding portion, the second trace is electrically connected to the first binding portion, and the flexible circuit board is bound to the chip on film.
In one possible implementation manner, the driving chip is bound and connected with the first binding portion through the chip on film, and the flexible circuit board is bound and connected with the chip on film.
In one possible implementation, the first binding portion is located within the display area; or the first binding part is positioned in the frame area, and preferably, the first binding part is positioned on one side of the frame area, which is far away from the display area.
In a possible implementation manner, the backlight side of the display panel further includes a second binding portion located in the display area, the second routing is further electrically connected with the second binding portion, the driving chip is bound with the first binding portion, and the flexible circuit board is bound with the second binding portion.
In a possible implementation manner, the display device further comprises a supporting pad, the supporting pad is arranged between the display panel and the flexible circuit board and/or the chip on film, and the orthographic projection of the supporting pad on the display panel is not overlapped with the first binding portion or the second binding portion.
In a possible implementation manner, the display panel further includes a first protective layer and a second protective layer, the first protective layer covers the first routing line, and the second protective layer covers the second routing line.
A second aspect of an embodiment of the present application provides a display device, including: the display module is as described above.
According to the display module and the display device provided by the embodiment of the application, the display module is provided with the through holes through the frame area of the display panel, the electric signals of the first wiring positioned on the light-emitting side are transmitted to the second wiring on the backlight side, the driving chip is arranged on the backlight side, and compared with the technical scheme that the driving chip is arranged on the light-emitting side of the frame area of the display panel and the frame area is bent to the backlight side, the occupied space of the frame area is reduced, and the narrow-frame design of the display module is realized. In addition, the frame area of the display panel is not required to be bent, so that the problem of circuit breakage can be avoided, and the service life of the display module is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic top view of a display module according to the related art;
FIG. 2 is a schematic side view of the display module shown in FIG. 1;
FIG. 3 is a schematic diagram illustrating a top view structure of a display module according to an embodiment of the present disclosure;
FIG. 4 is a partial enlarged view of a region C in FIG. 3;
FIG. 5 is a schematic cross-sectional view taken along the direction D-D in FIG. 3;
FIG. 6 is an enlarged partial schematic view of a region C in FIG. 3;
FIG. 7 is a schematic diagram of a backlight side of the display panel shown in FIG. 6;
FIG. 8 is a schematic cross-sectional view of a display module according to another embodiment of the present disclosure along the direction D-D;
FIG. 9 is a schematic diagram of a backlight side of the display panel shown in FIG. 8;
FIG. 10 is a schematic cross-sectional view of a display module according to another embodiment of the present disclosure along the direction D-D;
FIG. 11 is a schematic diagram of a backlight side of the display panel of FIG. 10;
FIG. 12 is a schematic cross-sectional view of a display module according to another embodiment of the present disclosure along the direction D-D;
FIG. 13 is a schematic diagram of a backlight side of the display panel of FIG. 12;
fig. 14 to 18 are schematic views illustrating a method for manufacturing a display module according to an embodiment of the present application.
Description of reference numerals:
1. a display panel; AA. A display area; NA, frame area; 1a, a light emergent side; 1b, backlight side; 11. a first wire; 12. a second routing; 13. a via hole; b1, a first binding section; b2, a second binding section; 14. a first protective layer; 15. a second protective layer;
2. a driving chip; F. a chip on film; 3. a flexible circuit board; 4. a support pad.
Detailed Description
As described in the background art, with the development of the full-screen technology, a plurality of packaging technologies may be used for a driving chip for driving the light emitting elements in the display area to display, so as to save the wiring space of the display panel and improve the screen occupation ratio. As shown in fig. 1 and 2, a display panel 1 of a display module in the related art includes a display area AA and a frame area NA located below the display area AA, the frame area NA is provided with a driving chip 2 and a trace (not shown in the figure), and an end of the trace is a bonding portion BA. The portion of the frame area NA including the binding portion BA is bent to the backlight side of the display panel 1 for electrical connection with the flexible circuit board 3, and the electrical signal of the driving chip 2 is transmitted to the main circuit board (not shown in the figure) through the flexible circuit board 3. The side of being shaded of the bending part of display panel 1 has flexible design, improves the pliability of bending part, and the light-emitting side of the bending part of display panel 1 has protective insulation layer P for prevent to walk the line and be corroded by dust, moisture etc. improve display panel 1's life.
As can be seen from fig. 2, in order to realize the bending, the occupied space of the total frame length L formed after the whole frame area NA of the display panel 1 is bent is large, which results in a large overall size of the display module, and the screen duty ratio of the display module is low, which cannot meet the increasingly stringent visual effect requirement of the consumer on the display device.
To solve the above technical problem, an embodiment of the present application provides a display module, in this display module, through setting up the via hole in the frame district of display panel, will be located the electric signal transmission of light-emitting side to the side of being shaded to set up driver chip in the side of being shaded, reduced the occupation space in frame district, realized display module's narrow frame design.
In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 3 is a schematic top view of a display module according to an embodiment of the present application, fig. 4 is a schematic partially enlarged view of a region C in fig. 3, and fig. 5 is a schematic cross-sectional view taken along a direction D-D in fig. 3.
As shown in fig. 3 to 5, the display module provided in the embodiment of the present application includes: display panel 1, driver chip 2 and flexible circuit board 3.
The display panel 1 comprises a display area AA and a frame area NA surrounding the display area AA, a first wiring 11 extending from the display area AA to the frame area NA is arranged on a light emitting side 1a of the display panel 1, a second wiring 12 is arranged on a backlight side 1b of the display panel 1, a through hole 13 penetrating through the display panel 1 is arranged on the frame area NA, and the through hole 13 is electrically connected with the first wiring 11 and the second wiring 12 respectively.
The Display panel 1 may be an Organic Light-Emitting Diode (OLED) Display panel, a Liquid Crystal Display (LCD), an LED Display panel, a Micro-LED Display panel, or the like. The display panel may have a circular structure, or may have a rectangular or other shape. The embodiment of the present invention is described by taking an OLED display panel with a rectangular display panel as an example.
Herein, the "light exit side" refers to a side of the display panel 1 where the light exit direction is located, and the "backlight side" refers to a side of the display panel 1 opposite to the light exit direction.
The bezel area NA of the display panel 1 may be located at either side of the display area AA or the entire outer peripheral side. The embodiment of the present application is described by taking the frame area NA shown in fig. 3 below the display area AA as an example.
The display panel 1 includes a substrate, an array substrate, and a plurality of light emitting cells on the array substrate, a display area AA of the array substrate is provided with a plurality of pixel circuits including Thin Film Transistors (TFTs), signal lines including data lines extending in a first direction, gate lines extending in a second direction, and the like, and the first direction crosses the second direction, and the light emitting cells are disposed in an area defined by the crossing of the gate lines and the data lines. The gate electrode of each TFT is connected to the gate line, the source electrode thereof is connected to the data line, and the drain electrode thereof is electrically connected to the anode or cathode of its corresponding light emitting cell. During display, the TFT supplies a signal input from the data line to a light emitting cell corresponding to the TFT under the control of the gate line.
It should be noted that the light-emitting side 1a of the display panel 1 is provided with a first trace 11 extending from the display area AA to the frame area NA, that is, the first trace 11 extending from the display area AA to the frame area NA is laid on the plane where the light-emitting side 1a of the array substrate is located, and the backlight side 1b of the display panel 1 is provided with a second trace 12, that is, the second trace 12 is laid on the plane where the backlight side 1b of the array substrate is located.
The driving chip 2 and the Flexible Circuit board 3 are located on the backlight side 1b of the display panel 1, the driving chip 2 is electrically connected to the second trace 12, and the driving chip 2 is electrically connected to a main Circuit board (not shown in the figure) through the Flexible Printed Circuit (FPC) 3. The flexible circuit board 3 is provided with elements such as capacitors, resistors, connectors, and the like. In some embodiments, the flexible Circuit Board 3 may be replaced by a rigid Printed Circuit Board (PCB).
The driving chip 2 provides a clock signal, a data signal, etc. to the display area AA through the second trace 12, the via hole 13, and the first trace 11 to drive the light emitting unit of the display area AA to display. Then, the signal wire and the power wire are led out through the flexible circuit board 3 to communicate with the main circuit board.
In this embodiment of the application, because the frame area NA of the display panel 1 is provided with the via hole 13, the first wire 11 of the light-emitting side 1a and the second wire 12 of the backlight side 1b can be conducted, so that the driving chip 2 can be arranged on the backlight side 1b, and the occupied space of the light-emitting side 1a of the frame area NA is reduced. In addition, because the frame area NA of the display panel 1 does not need to be bent to the backlight side 1b from the light emitting side 1a, the length of the frame area NA in the direction away from the display area AA can be reduced, and the area of the frame area NA is reduced, so that the frame area NA can be designed to be narrow, and the narrow frame design of the display module is facilitated.
The embodiment of the application provides a display module assembly, frame district NA through at display panel 1 sets up via hole 13, the first electric signal transmission of walking line 11 that will be located light-emitting side 1a walks line 12 to the second of being shaded side 1b, and set up driver chip 2 in being shaded side 1b, set up driver chip 2 in the light-emitting side of frame district NA for, and bend some frame district NA to the technical scheme of being shaded side, the occupation space of frame district NA has been reduced, the narrow frame design of display module assembly has been realized. In addition, the frame area AA of the display panel 1 does not need to be bent, so that the problem of circuit fracture can be avoided, and the service life of the display panel 1 is prolonged.
The specific structure of the display module according to the embodiment of the present application is described in further detail below with reference to the accompanying drawings.
In some embodiments, as shown in fig. 4 and 5, the number of the first traces 11 and the number of the second traces 12 are respectively multiple and correspond to one another. The number of the vias 13 is multiple, and each via 13 connects a corresponding one of the first traces 11 and one of the second traces 12. Optionally, the first trace 11 and the second trace 12 are made of a conductive material, and the inner peripheral side of the via 13 is coated with a conductive material, which may be, for example, but not limited to, copper, so that the first trace 11, the via 13, and the second trace 12 are electrically connected.
Fig. 6 is another partial enlarged structural diagram of a region C in fig. 3, and fig. 7 is a structural diagram of a backlight side of the display panel in fig. 6.
As shown in fig. 6 and 7, in some embodiments, in the border area NA, the plurality of first traces 11 are parallel to each other and are spaced apart from each other, and ends of the plurality of first traces 11 are aligned with each other. The second wires 12 are parallel to each other and spaced apart from each other, and the ends of the second wires 12 are aligned. This can reduce the layout space of the first trace 11 and the second trace 12 in the border area NA. When the display panel 1 is rectangular, the first wires 11 or the second wires 12 may be parallel to each other along the length direction of the display panel 1, or may be parallel to each other along the width direction of the display panel 1. When the display panel 1 is circular, the first routing lines 11 or the second routing lines 12 may be parallel to each other along the circumferential direction of the display panel 1.
Optionally, the via 13 penetrates through the first trace 11 and the second trace 12, and the vias 13 are aligned in a direction perpendicular to the first trace 11. Since the second trace 12 can be electrically connected to the driving chip 2 or the flexible circuit board 3, the alignment direction of the plurality of vias 13 is determined according to the arrangement direction of the first trace 11 or the second trace 12, and will not be described again.
In some embodiments, as shown in fig. 7, the backlight side 1B of the display panel 1 includes a first binding portion B1, the second trace 12 is electrically connected with the first binding portion B1, and the driving chip 2 is electrically connected with the first binding portion B1.
Alternatively, the driver chip 2 is bound and connected to the first binding portion B1. The first binding portions B1 are similar in shape to the driver chip 2, for example, each having a rectangular shape. The first binding part B1 may include a plurality of pads for binding connection with the driving chip 2. In the binding connection, an adhesive is applied between the driver chip 2 and the first binding portion B1, and then pressure and heat are applied to form a stable and reliable mechanical electrical connection. Optionally, the Anisotropic Conductive adhesive is an Anisotropic Conductive Film (ACF), and the ACF has a good conduction effect in the thickness direction.
In some embodiments, as shown in fig. 5 and 7, the first binding portion B1 is located within the display area AA. I.e., the driving chip 2 is disposed in the display area AA of the backlight side 1b to reduce the width of the frame area NA. The second trace 12 extends between the bezel area NA and the display area AA.
Further, the backlight side 1B of the display panel 1 further includes a second binding portion B2 located in the display area AA, the second trace 12 is further electrically connected with a second binding portion B2, and the flexible circuit board 3 is bound and connected with a second binding portion B2. The second binding portions B2 are similar in shape to the binding portions of the flexible circuit board 3, for example, each rectangular. The second binding portion B2 may include a plurality of pads for binding connection with the flexible circuit board 3. At the time of bonding connection, an ACF adhesive is applied between the bonding portion of the flexible circuit board 3 and the second bonding portion B2, and then pressure and heat are applied to form a stable and reliable mechanical electrical connection.
It should be noted that the relative positions of the first binding portion B1 and the second binding portion B2 on the backlight side 1B and the connection manner between the first binding portion B1 and the second routing trace 12 are not limited to the examples in the drawings, and are determined according to the specific wiring space of the array substrate, and are not described again.
In some embodiments, the display panel 1 further includes a first protective layer 14 and a second protective layer 15, the first protective layer 14 covers the first trace 11, and the second protective layer 15 covers the second trace 12. The first protective layer 14 and the second protective layer 15 can be an insulating glue layer, such as silicon, to prevent the first trace 11 and the second trace 12 from being scratched or from being corroded by dust, moisture, and other impurities to affect the electrical performance.
In some embodiments, the display module further includes a support pad 4, the support pad 4 is disposed between the display panel 1 and the flexible circuit board 3 for supporting the flexible circuit board 3, and an orthographic projection of the support pad 6 on the display panel 1 does not overlap with the first binding portion B1 or the second binding portion B2.
Optionally, the material of the supporting pad 4 is Polyethylene terephthalate (PET or PETP). PET or PETP plastic has excellent wear resistance, dimensional stability, and electrical insulation, and can prevent the flexible circuit board 3 from being scratched by friction with the backlight side 1b of the display panel 1. In addition, the orthographic projection of the support pad 4 on the display panel 1 does not overlap the first binding portion B1 or the second binding portion B2 to avoid the binding position of the driving chip 2 or the flexible circuit board 3.
Fig. 8 is a schematic cross-sectional structure view of a display module according to another embodiment of the present application along a direction D-D, and fig. 9 is a schematic structural view of a backlight side of the display panel in fig. 8.
As shown in fig. 8 and 9, the embodiment of the present application further provides a display module having a structure similar to that of the display module shown in fig. 3 to 7, except that the first binding portion B1 is located in the border area NA. Alternatively, the first binding portion B1 is located on the side of the bezel area NA away from the display area AA.
Specifically, the second trace 12 extends between the frame area NA and the display area AA, the first binding portion B1 is located on a side of the plurality of via holes 13 away from the display area AA, the second trace 12 is electrically connected to the first binding portion B1, and the driving chip 2 is disposed on a side of the frame area NA away from the display area AA, so as to save an occupied space of the display area AA.
Meanwhile, the second trace 12 is also electrically connected to the second binding portion B2 of the display area AA, and the flexible circuit board 3 is bound to the second binding portion B2, so that the driving chip 2 is electrically connected to the main circuit board through the flexible circuit board 3.
It should be noted that the relative positions of the first binding portion B1 and the second binding portion B2 on the backlight side 1B and the connection manner between the first binding portion B1 and the second routing trace 12 are not limited to the examples in the drawings, and are determined according to the specific wiring space of the array substrate, and are not described again.
Fig. 10 is a schematic cross-sectional view of a display module according to another embodiment of the present application along a direction D-D, and fig. 11 is a schematic structural view of a backlight side of the display panel in fig. 10.
As shown in fig. 10 and 11, the embodiment of the present application further provides a display module having a structure similar to that of the display module shown in fig. 3 to 7, except that the driving chip 2 is bonded to the first bonding portion B1 through the chip on film F, and the flexible circuit board 3 is bonded to the chip on film F.
Specifically, the first binding portion B1 is located in the display area AA, and the driving Chip 2 is bound and connected to the first binding portion B1 by a (Chip On Flex or Chip On Film, COF for short) packaging technology, that is, the driving Chip 27 is attached to the backlight side 1B of the display panel 1 with the flip-Chip Film F as a carrier. The chip on film comprises a polyimide layer and a copper foil layer arranged on the polyimide layer.
Meanwhile, one end of the flexible circuit board 3 is bound and connected with the chip on film F, and the other end is electrically connected with the main circuit board, so that the driving chip 2 is electrically connected with the main circuit board through the flexible circuit board 3. Because the flexible circuit board 3 is bound and connected with the chip on film F, the second binding part B2 is not required to be arranged on the backlight side 1B of the display panel 1, which is beneficial to saving the wiring space of the array substrate and further reducing the overall size of the display module.
Further, the display module assembly still includes supporting pad 4, and supporting pad 4 sets up between display panel 1 and cover brilliant film F and flexible circuit board 3 for support cover brilliant film F and flexible circuit board 3, and the orthographic projection of supporting pad 4 on display panel 1 and first binding portion B1 or second binding portion B2 are not overlapped, in order to avoid the position of binding of driver chip 2 or flexible circuit board 3.
It should be noted that the relative position of the first binding portion B1 on the backlight side 1B and the connection manner between the first binding portion B1 and the second trace 12 are not limited to the examples in the drawings, and are determined according to the specific wiring space of the array substrate, and are not described again.
Fig. 12 is a schematic cross-sectional view of a display module according to another embodiment of the present application along a direction D-D, and fig. 13 is a schematic structural view of a backlight side of the display panel in fig. 12.
As shown in fig. 12 and 13, the present embodiment further provides a display module having a structure similar to that of the display module shown in fig. 10 and 11, except that the first binding portion B1 is located in the frame area NA, and optionally, the first binding portion B1 is located on a side of the frame area NA away from the display area AA.
Specifically, the second trace 12 extends between the frame area NA and the display area AA, the first binding portion B1 is located on a side of the via holes 13 away from the display area AA, the second trace 12 is electrically connected to the first binding portion B1, and the chip on film F of the driver chip 2 is bound to the first binding portion B1, so as to save the occupied space of the display area AA. Meanwhile, one end of the flexible circuit board 3 is bound and connected with the chip on film F, and the other end is electrically connected with the main circuit board, so that the driving chip 2 is electrically connected with the main circuit board through the flexible circuit board 3.
Similarly, since the flexible circuit board 3 is bound and connected with the chip on film F, the second binding portion B2 does not need to be arranged on the backlight side 1B of the display panel 1, which is beneficial to saving the wiring space of the array substrate and further reducing the overall size of the display module.
It should be noted that the relative position of the first binding portion B1 on the backlight side 1B and the connection manner between the first binding portion B1 and the second trace 12 are not limited to the examples in the drawings, and are determined according to the specific wiring space of the array substrate, and are not described again.
Fig. 14 to 18 are schematic views illustrating a method for manufacturing a display module according to an embodiment of the present application.
As shown in fig. 14 to 18, an embodiment of the present application provides a method for manufacturing a display module, where the display module includes a display panel 1, a driving chip 2 and a flexible circuit board 3, the display panel 1 includes a display area AA and a frame area NA surrounding the display area AA, a first trace 11 extending from the display area AA to the frame area NA is disposed on a light emitting side 1a of the display panel 1, and a second trace 12 is disposed on a backlight side 1b of the display panel 1.
For convenience of description, in the embodiment of the present application, the display module shown in fig. 5 is taken as an example, and the method for manufacturing the display module includes steps S1 to S5.
Step S1: a via hole 13 penetrating through the display panel 1 is disposed in the frame area NA of the display panel 1, and the via hole 13 is electrically connected to the first trace 11 and the second trace 12, respectively.
As shown in fig. 14, the light emitting side 1a of the display panel 1 is provided with a first trace 11 extending from the display area AA to the frame area NA, the backlight side 1b is provided with a second trace 12, the frame area NA is provided with a via hole 13, and the first trace 11 and the second trace 12 are electrically connected and conducted by the via hole 13. The number of the first traces 11 and the second traces 12 may be multiple and correspond to one another. The number of the vias 13 is multiple, and each via 13 connects a corresponding one of the first traces 11 and one of the second traces 12. Optionally, the first trace 11 and the second trace 12 are made of a conductive material, and the inner peripheral side of the via 13 is coated with a conductive material, which may be, for example, but not limited to, copper, so that the first trace 11, the via 13, and the second trace 12 are electrically connected.
Step S2: the light emitting side 1a of the display panel 1 is coated with a first protective layer 14 covering the first wire 11.
As shown in fig. 15, the first protective layer 14 covers the first trace 11. The first protective layer 14 may be an insulating glue layer, such as silicon, to prevent the first trace 11 from being scratched or from being corroded by dust, moisture, and other impurities to affect the electrical performance.
Step S3: the driving chip 2 is bonded to the backlight side 1b of the display panel 1, and the driving chip 2 is electrically connected to the second wire 12.
As shown in fig. 16, the driving chip 2 is disposed on the backlight side 1b of the display panel 1 and electrically connected to the second traces 12, so that the occupied space of the light-emitting side 1a of the frame area NA can be reduced.
Step S4: the second protective layer 15 covering the second routing lines 12 is coated on the backlight side 1b of the display panel 1.
As shown in fig. 17, the second protective layer 15 covers the second trace 12, and the second protective layer 15 may be an insulating glue layer, such as silicon, to prevent the second trace 12 from being scratched or from being corroded by impurities such as dust and moisture to affect the electrical performance.
Step S5: the flexible circuit board 3 is bonded to the backlight side 1b of the display panel 1 so that the driving chip 2 is electrically connected to the main circuit board through the flexible circuit board 3.
As shown in fig. 18, the flexible circuit board 3 is bound to the backlight side 1b of the display panel 1 so that the driving chip 2 is electrically connected to the main circuit board through the flexible circuit board 3. Meanwhile, the supporting pad 4 is disposed on the backlight side 1b of the display panel 1 for supporting the flexible circuit board 3, and the bonding position of the driving chip 2 or the flexible circuit board 3 avoids the supporting pad 6. Optionally, the material of the supporting pad 4 is Polyethylene terephthalate (PET or PETP). PET or PETP plastic has excellent wear resistance, dimensional stability, and electrical insulation, and can prevent the flexible circuit board 3 from being scratched by friction with the backlight side 1b of the display panel 1.
In addition, the embodiment of the application also provides a display device which comprises any one of the display modules. This display module assembly sets up via hole 13 through frame district NA at display panel 1, will be located the first electric signal transmission of walking line 11 of light-emitting side 1a and walk the line to the second of being shaded side 1b, and set up driver chip 2 in being shaded side 1b, for set up driver chip 2 in frame district NA light-emitting side 1a of display panel 1, bend the frame district to the technical scheme of being shaded side 1b again, the occupation space in frame district has been reduced, display module assembly's narrow frame design has been realized. In addition, the frame area NA of the display panel 1 does not need to be bent, so that the problem of circuit breakage can be avoided, and the service life of the display panel is prolonged.
Because the display module realizes the narrow frame design, the increasingly strict visual effect requirement of consumers on the display device can be met. The display device may include, but is not limited to, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a digital camera, a vehicle-mounted display screen, a navigator, a wearable display device, and the like.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
It should be readily understood that "on … …", "above … …" and "above … …" in this application should be interpreted in its broadest sense such that "on … …" means not only "directly on something", but also includes the meaning of "on something" with intervening features or layers therebetween, and "above … …" or "above … …" includes not only the meaning of "above something" or "above" but also includes the meaning of "above something" or "above" without intervening features or layers therebetween (i.e., directly on something).
Furthermore, spatially relative terms, such as "below," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or feature's illustrated relationship to another element or feature. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly as well.
The term "substrate" as used herein refers to a material on which a subsequent layer of material is added. The substrate itself may be patterned. The material added atop the substrate may be patterned or may remain unpatterned. In addition, the substrate may comprise a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).
The term "layer" as used herein may refer to a portion of material that includes a region having a thickness. A layer may extend over the entire underlying or overlying structure or may have a smaller extent than the underlying or overlying structure. Furthermore, a layer may be a region of a continuous structure, homogeneous or heterogeneous, having a thickness less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layers may extend laterally, vertically, and/or along a tapered surface. The substrate may be a layer, may include one or more layers therein, and/or may have one or more layers located thereon, above and/or below. The layer may comprise a plurality of layers. For example, the interconnect layer may include one or more conductors and contact layers (within which contacts, interconnect lines, and/or vias are formed) and one or more dielectric layers.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A display module, comprising:
the display panel comprises a display area and a frame area surrounding the display area, wherein a first wiring extending from the display area to the frame area is arranged on the light emitting side of the display panel, a second wiring is arranged on the backlight side of the display panel, a through hole penetrating through the display panel is arranged in the frame area, and the through hole is electrically connected with the first wiring and the second wiring respectively;
and the driving chip and the flexible circuit board are positioned on the backlight side, the driving chip is electrically connected with the second wiring, and the driving chip is electrically connected with the main circuit board through the flexible circuit board.
2. The display module according to claim 1, wherein the number of the first wires and the second wires is multiple and corresponding to each other;
the number of the via holes is multiple, and each via hole is connected with one corresponding first routing line and one corresponding second routing line.
3. The display module according to claim 2, wherein in the border area, the first traces are parallel to each other and spaced apart from each other, and ends of the first traces are aligned with each other; the second wires are parallel to each other and are arranged at intervals, and the ends of the second wires are aligned; preferably, the via hole penetrates through the first trace and the second trace, and the via holes are aligned in a direction perpendicular to the first trace.
4. The display module according to claim 1, wherein the backlight side of the display panel has a first binding portion, the second trace is electrically connected to the first binding portion, and the driving chip is electrically connected to the first binding portion.
5. The display module assembly according to claim 4, wherein the driving chip is bonded to the first bonding portion through a chip on film, and the flexible circuit board is bonded to the chip on film.
6. The display module assembly of claim 4, wherein the first binding portion is located in the display area; or, the first binding portion is located in the frame area, and preferably, the first binding portion is located on a side of the frame area away from the display area.
7. The display module assembly according to claim 5, wherein the backlight side of the display panel further has a second binding portion located in the display area, the second trace is further electrically connected to the second binding portion, the driver chip is bound to the first binding portion, and the flexible circuit board is bound to the second binding portion.
8. The display module assembly of claim 7, further comprising a support pad disposed between the display panel and the flexible circuit board and/or the flip-chip film, wherein an orthogonal projection of the support pad on the display panel does not overlap with the first binding portion or the second binding portion.
9. The display module of claim 1, wherein the display panel further comprises a first protective layer and a second protective layer, the first protective layer covers the first trace, and the second protective layer covers the second trace.
10. A display device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111360057.9A CN114049843A (en) | 2021-11-17 | 2021-11-17 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111360057.9A CN114049843A (en) | 2021-11-17 | 2021-11-17 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114049843A true CN114049843A (en) | 2022-02-15 |
Family
ID=80209633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111360057.9A Pending CN114049843A (en) | 2021-11-17 | 2021-11-17 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114049843A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114399960A (en) * | 2022-02-28 | 2022-04-26 | 京东方科技集团股份有限公司 | Curved surface display module assembly and display device |
| CN114967250A (en) * | 2022-06-22 | 2022-08-30 | 南昌勤胜电子科技有限公司 | Liquid crystal display module and preparation method thereof |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207250028U (en) * | 2017-09-15 | 2018-04-17 | 维沃移动通信有限公司 | A kind of display module, display screen and mobile terminal |
| CN108153070A (en) * | 2017-12-29 | 2018-06-12 | 惠州市华星光电技术有限公司 | A kind of liquid crystal display panel and preparation method thereof, display device |
| CN108205973A (en) * | 2016-12-19 | 2018-06-26 | 上海和辉光电有限公司 | A kind of flexible display screen and preparation method thereof |
| CN108281387A (en) * | 2018-01-23 | 2018-07-13 | 武汉华星光电半导体显示技术有限公司 | The production method and flexible display apparatus of flexible display apparatus |
| CN109427243A (en) * | 2017-08-22 | 2019-03-05 | 上海和辉光电有限公司 | A kind of display panel, device and production method |
| CN109616480A (en) * | 2018-12-27 | 2019-04-12 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| CN109671352A (en) * | 2018-12-15 | 2019-04-23 | 惠州Tcl移动通信有限公司 | Display component and preparation method thereof |
| CN109872637A (en) * | 2019-04-02 | 2019-06-11 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110148608A (en) * | 2019-06-29 | 2019-08-20 | 上海天马微电子有限公司 | A kind of display panel and display device |
| CN110580855A (en) * | 2019-09-17 | 2019-12-17 | 合肥鑫晟光电科技有限公司 | Chip on film, chip on film substrate, manufacturing method thereof and display device |
| CN110649039A (en) * | 2019-09-16 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | Flexible display device and preparation method |
| CN211061817U (en) * | 2020-01-19 | 2020-07-21 | 北京京东方光电科技有限公司 | Liquid crystal display module and display device |
| CN111538178A (en) * | 2020-03-31 | 2020-08-14 | 上海天马微电子有限公司 | Display panel mother board, display module, preparation method of display module and display device |
| WO2021003849A1 (en) * | 2019-07-05 | 2021-01-14 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor |
| CN112382650A (en) * | 2020-11-26 | 2021-02-19 | 昆山国显光电有限公司 | Display panel assembly and display device |
| CN112599537A (en) * | 2020-12-11 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display substrate and preparation method thereof |
| CN112652245A (en) * | 2020-12-22 | 2021-04-13 | 昆山国显光电有限公司 | Display panel and display device |
| WO2021138920A1 (en) * | 2020-01-10 | 2021-07-15 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN113257143A (en) * | 2021-03-29 | 2021-08-13 | 北海惠科光电技术有限公司 | Display panel, display device and manufacturing method of display panel |
| CN113257173A (en) * | 2021-03-29 | 2021-08-13 | 北海惠科光电技术有限公司 | Active light-emitting device, display panel and splicing display device |
-
2021
- 2021-11-17 CN CN202111360057.9A patent/CN114049843A/en active Pending
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108205973A (en) * | 2016-12-19 | 2018-06-26 | 上海和辉光电有限公司 | A kind of flexible display screen and preparation method thereof |
| CN109427243A (en) * | 2017-08-22 | 2019-03-05 | 上海和辉光电有限公司 | A kind of display panel, device and production method |
| CN207250028U (en) * | 2017-09-15 | 2018-04-17 | 维沃移动通信有限公司 | A kind of display module, display screen and mobile terminal |
| CN108153070A (en) * | 2017-12-29 | 2018-06-12 | 惠州市华星光电技术有限公司 | A kind of liquid crystal display panel and preparation method thereof, display device |
| CN108281387A (en) * | 2018-01-23 | 2018-07-13 | 武汉华星光电半导体显示技术有限公司 | The production method and flexible display apparatus of flexible display apparatus |
| CN109671352A (en) * | 2018-12-15 | 2019-04-23 | 惠州Tcl移动通信有限公司 | Display component and preparation method thereof |
| CN109616480A (en) * | 2018-12-27 | 2019-04-12 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| CN109872637A (en) * | 2019-04-02 | 2019-06-11 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110148608A (en) * | 2019-06-29 | 2019-08-20 | 上海天马微电子有限公司 | A kind of display panel and display device |
| WO2021003849A1 (en) * | 2019-07-05 | 2021-01-14 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor |
| CN110649039A (en) * | 2019-09-16 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | Flexible display device and preparation method |
| CN110580855A (en) * | 2019-09-17 | 2019-12-17 | 合肥鑫晟光电科技有限公司 | Chip on film, chip on film substrate, manufacturing method thereof and display device |
| WO2021138920A1 (en) * | 2020-01-10 | 2021-07-15 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN211061817U (en) * | 2020-01-19 | 2020-07-21 | 北京京东方光电科技有限公司 | Liquid crystal display module and display device |
| CN111538178A (en) * | 2020-03-31 | 2020-08-14 | 上海天马微电子有限公司 | Display panel mother board, display module, preparation method of display module and display device |
| CN112382650A (en) * | 2020-11-26 | 2021-02-19 | 昆山国显光电有限公司 | Display panel assembly and display device |
| CN112599537A (en) * | 2020-12-11 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display substrate and preparation method thereof |
| CN112652245A (en) * | 2020-12-22 | 2021-04-13 | 昆山国显光电有限公司 | Display panel and display device |
| CN113257143A (en) * | 2021-03-29 | 2021-08-13 | 北海惠科光电技术有限公司 | Display panel, display device and manufacturing method of display panel |
| CN113257173A (en) * | 2021-03-29 | 2021-08-13 | 北海惠科光电技术有限公司 | Active light-emitting device, display panel and splicing display device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114399960A (en) * | 2022-02-28 | 2022-04-26 | 京东方科技集团股份有限公司 | Curved surface display module assembly and display device |
| CN114399960B (en) * | 2022-02-28 | 2023-12-26 | 京东方科技集团股份有限公司 | Curved surface display module assembly and display device |
| CN114967250A (en) * | 2022-06-22 | 2022-08-30 | 南昌勤胜电子科技有限公司 | Liquid crystal display module and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11048132B2 (en) | Display panel and display apparatus | |
| US10620490B2 (en) | Displays with minimized border regions having an apertured TFT or other layer for signal conductors | |
| CN109560063B (en) | Electronic panel, display device, and method for manufacturing display device | |
| CN109377890B (en) | Flexible display device | |
| US9113545B2 (en) | Tape wiring substrate and chip-on-film package including the same | |
| US11051405B2 (en) | Flexible display | |
| US20070222777A1 (en) | Electrooptic device, wiring board, method for manufacturing electrooptic device, and electronic device | |
| US9305990B2 (en) | Chip-on-film package and device assembly including the same | |
| KR102300254B1 (en) | Display device | |
| CN100464236C (en) | Structure of semiconductor chip and display device using the same | |
| CN114049843A (en) | Display module and display device | |
| US7095476B2 (en) | Liquid crystal module | |
| US20190067844A1 (en) | Connector, display device including the same, and method of manufacturing the display device | |
| CN110277365B (en) | Electronic device and splicing electronic system | |
| CN111430421A (en) | Display device and method for manufacturing the same | |
| KR20140059548A (en) | Connection structure of circuit board | |
| CN111458941A (en) | Display module, manufacturing method thereof and display device | |
| US20220269123A1 (en) | Chip on film and display device | |
| CN110941122A (en) | Display panel and display device thereof | |
| CN111951682B (en) | Display panel and display device | |
| KR102396021B1 (en) | Chip on printed circuit unit and display apparatus comprising the same | |
| CN113571534A (en) | Display panel, driving panel and manufacturing method thereof | |
| US11538892B2 (en) | Display panel having circuits on opposing sides of insulating substrate connected by tapered through hole and pad, manufacturing method thereof, and display device | |
| WO2020156595A9 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| KR20210025167A (en) | Display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |