CN113257143A

CN113257143A - Display panel, display device and manufacturing method of display panel

Info

Publication number: CN113257143A
Application number: CN202110332238.4A
Authority: CN
Inventors: 陈政鸿; 余思慧
Original assignee: HKC Co Ltd; Beihai HKC Optoelectronics Technology Co Ltd
Current assignee: HKC Co Ltd; Beihai HKC Optoelectronics Technology Co Ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-08-13

Abstract

The application discloses display panel, display device and display panel's manufacturing method, display panel includes circuit substrate, initiative drive film and source drive binding portion: the circuit substrate comprises a first mounting surface and a second mounting surface opposite to the first mounting surface; the active driving film is attached to the first mounting surface of the circuit substrate; the source driving binding part is arranged on a second mounting surface of the circuit substrate; the active driving film is provided with an active switch and a light-emitting element, and the light-emitting element is connected with the active switch; display panel still includes grid drive circuit, data line and scanning line, grid drive circuit passes through the scanning line connect in the initiative switch, source drive binding portion passes through electrically conductive via hole with the data line is connected, the data line connect in the initiative switch, this application is favorable to realizing narrow frame or no frame.

Description

Display panel, display device and manufacturing method of display panel

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a display device, and a method for manufacturing the display panel.

Background

A typical display device includes a display panel and a driving circuit, the driving circuit includes a source driving circuit, etc., in order to reduce the frame, the source driving circuit may adopt a flexible COF (Chip on film) package type, but the Chip on film still needs to reserve a binding region and an edge grinding distance at a certain distance in the non-display region of the display panel, which is not favorable for the design of a display product with a narrow frame or without a frame.

Therefore, how to realize a narrower frame or a frameless display device is a technical problem to be solved urgently by those skilled in the art.

Summary of the invention

The present application is directed to a display panel, a display device, and a method for manufacturing the display panel, which are advantageous for designing a narrow frame or even a frame-less frame.

The application discloses display panel includes:

the circuit substrate comprises a first mounting surface and a second mounting surface opposite to the first mounting surface;

the active driving film is attached to the first mounting surface of the circuit substrate; and

a source driving binding part arranged on the second mounting surface of the circuit substrate;

the active driving film is provided with an active switch and a light-emitting element, and the light-emitting element is connected with the active switch;

the display panel further comprises a gate driving circuit, a data line and a scanning line, the gate driving circuit is connected with the active switch through the scanning line, the source electrode driving binding part is connected with the data line through a conductive through hole, and the data line is connected with the active switch.

Optionally, the gate driving circuit, the data line and the scan line are formed on the active driving thin film, and the data line is connected to the source driving binding portion through the conductive via.

Optionally, the data lines and the scanning lines are formed on the active driving thin film, a gate driving binding portion is further disposed on the second mounting surface of the circuit substrate, and the gate driving binding portion is connected to the scanning lines through the conductive vias.

Optionally, the conductive via is formed by a laser drilling process and an in-hole metallization process;

the circuit substrate is at least one of a printed circuit board, a flexible circuit board, a microporous plate and a metal substrate;

the active driving film is fixedly attached to the circuit substrate through glue.

Optionally, the light emitting element includes an LED lamp, and the LED lamp is bonded to the active switch;

the initiative drive film is including macromolecular material layer, PI layer, circuit layer and the water oxygen barrier layer that sets gradually, the initiative switch forms the circuit layer, be formed with the via hole on the water oxygen barrier layer, the LED lamp passes through the via hole with the initiative switch bonding is connected, macromolecular material layer's surface with the circuit base plate passes through the glue laminating fixedly.

Optionally, a metal pad is disposed on one side of the circuit substrate, which is close to the active driving film, the conductive via is correspondingly formed on the metal pad and penetrates through the metal pad to connect the source driving binding portion, and the size of the metal pad is larger than that of the conductive via;

one side, far away from the active driving thin film, of the circuit substrate is further provided with a fan-out wiring, and the fan-out wiring is arranged between the conductive via hole and the source electrode driving binding portion.

Optionally, the conductive via is formed between two adjacent light emitting elements.

The application discloses display device, including source drive cover brilliant film, and the display panel of this application open arbitrary one:

the source electrode driving chip on film is bound and connected with the source electrode driving binding part.

Optionally, the number of the circuit substrates is at least two, and the number of the active driving films is the same as that of the circuit substrates and is respectively arranged in a one-to-one correspondence manner;

and two adjacent circuit substrates are attached through glue.

The application also discloses a manufacturing method of the display panel, which comprises the following steps:

s1: providing a transition substrate;

s2: performing an active driving thin film process on the transition substrate to form a scan line, a data line and an active switch;

s3: removing the transition substrate to obtain an active driving film;

s4: the active driving film is aligned, attached and fixed with a circuit substrate, and a source electrode driving binding part used for binding and connecting with a source electrode driving chip on film is arranged on one surface of the circuit substrate away from the active driving film;

s5: and performing a laser drilling process and an in-hole metallization process on the active driving film and the circuit substrate to form a conductive via hole so that the conductive via hole conducts the active switch and the source electrode driving binding part.

For the display panel with the frame reserved, the display device breaks through the inherent thinking that the drive array of the display panel is necessarily integrated with the substrate, the display device comprises the active drive film and the circuit substrate which are designed independently, the source drive binding part is arranged on the back of the circuit substrate and used for binding the source drive flip chip, and then the circuit substrate forms the conductive through hole to connect the active drive film and the source drive binding part, so that the display panel does not need to reserve a binding area and an edging distance of a certain space on the side edge, the display panel can have a narrower frame, and even can realize no frame; and because the circuit substrate can be selected from a material which is more convenient to punch than a glass substrate, the yield of the conductive through holes is also improved, and the yield of the display panel is further improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

FIG. 1 is a schematic diagram of an exemplary display panel;

FIG. 2 is a schematic diagram of an exemplary light emitting device bonded to a driving backplane containing an active device;

FIG. 3 is a schematic diagram of an exemplary tiled display arrangement;

FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present application;

FIG. 5 is a schematic sectional view A-A' of the drawing of FIG. 4;

FIG. 6 is a schematic diagram of a display panel according to another embodiment of the present application;

FIG. 7 is a schematic sectional view taken along line B-B' of FIG. 6;

FIG. 8 is a schematic diagram of a display panel according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of a display device according to an embodiment of the present application;

FIG. 10 is a schematic view of a tiled display apparatus according to an embodiment of the present application;

FIG. 11 is a schematic view of another tiled display apparatus according to an embodiment of the present application;

FIG. 12 is a flowchart illustrating a method of fabricating a display panel according to an embodiment of the present disclosure;

fig. 13 is a schematic diagram illustrating a variation of a film layer in a method for manufacturing a display panel according to an embodiment of the present disclosure.

Wherein, 1, a display panel; 10. a source driver circuit; 20. a gate drive circuit; 30. scanning a line; 40. a data line; 50. an active switch; 60. a light emitting element; 70. a glass substrate; 80. a binding region; 90. driving a chip on film by a source electrode; 100. actively driving the thin film; 101. a polymer material layer; 102. a PI layer; 103. a circuit layer; 104. a water oxygen barrier layer; 110. a circuit substrate; 111. a source drive binding section; 112. a conductive via; 113. a gate drive binding part; 120. driving the gate by a chip on film; 114. fan-out routing; 200. a display device; 1121. a first conductive via; 1122. a second conductive via.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Fig. 1 is a schematic diagram of an exemplary display panel, fig. 2 is a schematic diagram of an exemplary light emitting device bonded to a driving backplane including an active device, and fig. 3 is a schematic diagram of an exemplary tiled display device.

As shown in fig. 1 and 2, with the progress and development of technology, displays using light emitting diodes as light emitting sources have been developed to the stage of Mini-LED displays (Mini light emitting diodes) and Micro-LED displays (Micro light emitting diodes), both of them cannot use the conventional Passive Matrix (Passive Matrix) driving method, and thus, the display panel 1 shown in fig. 1 needs to use an Active Matrix (Active Matrix) instead, but if the driving method of the Active Matrix is used, the display array related elements such as the active switches 50 of the pixels, the scan lines 30 and the data lines 40 need to be fabricated on the glass substrate by a physical deposition or chemical deposition process, the led 60 is then bonded to the active switch 50, and space is required for the source driver circuit 10 and the gate driver circuit 20 to be arranged in order to drive the active switch and the led.

As shown in fig. 3, taking the source driving circuit 10 as an example of using the source driving flip chip film 90 in conjunction with fig. 1 and fig. 2, the fabrication of the display array related elements such as the active switch 50 generally requires a relatively high temperature process, and therefore, the display panel 1 is usually fabricated on a high temperature resistant glass substrate 70, and in order to be bonded and connected to the source driving flip chip film 90, a certain space needs to be reserved as a bonding region 80 and an edging distance, which is not favorable for a narrow frame or a frameless frame design.

When the display panel 1 is a spliced screen, the problem is particularly outstanding, and the bound area which needs to be reserved is large, so that the distance b between the display areas of the two screens is much larger than the distance between the light-emitting diodes in the display areas, and therefore, black stripes can appear between the spliced screens, and the display effect is seriously influenced.

In order to solve the above-mentioned technical problems, the inventors have made improvements.

The present application is described in detail below with reference to the figures and alternative embodiments.

Fig. 4 is a schematic diagram of a display panel according to an embodiment of the present application, and fig. 5 is a schematic diagram of a cross section a-a' of fig. 4, as shown in fig. 4 and fig. 5, and as can be seen from fig. 1 to fig. 3, the present application discloses a display panel 1, including:

a circuit board 110 including a first mounting surface and a second mounting surface opposite to the first mounting surface;

an active driving film 100 attached to a first mounting surface of the circuit substrate 110; and

a source drive binding portion 111 provided on a second mounting surface of the circuit board 110;

wherein, an active switch 50 and a light emitting element 60 are arranged on the active driving film 100, and the light emitting element 60 is connected with the active switch 50;

the display panel 1 further includes a gate driving circuit 20, a data line 40 and a scan line 30, the gate driving circuit 20 is connected to the active switch 50 through the scan line 30, the source driving binding portion 111 is connected to the data line 40 through a conductive via 112, and the data line 40 is connected to the active switch 50.

The source driver binding portion 111 is used for binding the source driver flip chip 90.

For a display panel with a frame needing to be reserved, the display panel breaks through the inherent thinking that a drive array of the display panel is bound in a non-display area and is integrated with a substrate, and particularly, the display device is directed at a display device with a non-flexible display requirement, wherein the display device comprises an active drive film and a circuit substrate which are designed independently, a source drive binding part is arranged on the back of the circuit substrate and used for binding the source drive flip chip film, and a conductive through hole is formed on the circuit substrate and used for connecting the active drive film and the source drive binding part; and because the circuit substrate can be selected from a material which is more convenient to punch than a glass substrate, the yield of the conductive through holes is also improved, and the yield of the display panel is further improved.

In this application, both the active driving film 100 and the circuit substrate 110 may be provided with a circuit, and optionally, the gate driving circuit 20, the data line 40 and the scan line 30 may be formed on the active driving film 100, or may be formed or disposed on the circuit substrate 110, as follows, two preferred embodiments thereof are described as follows:

in an alternative embodiment, the gate driving circuit 20, the data line 40 and the scan line 30 are all formed on the active driving film 100, and the data line 40 is connected to the source driving binding portion 111 through the conductive via 112. The conductive through holes are correspondingly formed on the data lines, so that the binding area is saved, narrower frames or even no frames are facilitated, the stability of the circuit can be guaranteed, and the possibility of wire breakage is reduced.

Fig. 6 is a schematic view of a display panel according to another embodiment of the present application, fig. 7 is a schematic cross-sectional view of B-B' in fig. 6, and referring to fig. 6 and 7, as can be seen from fig. 4 and 5, in an alternative embodiment, the data lines 40 and the scan lines 30 are both formed on the active driving film 100, the second mounting surface of the circuit substrate 110 is further provided with gate driving binding portions 113, and the gate driving binding portions 113 are connected to the scan lines 30 through the conductive vias 112. That is, the display panel does not adopt the Gate Driver on Array (GOA) technology, but when the Gate driving flip-chip film 120 is adopted, the Gate driving flip-chip film 120 may be disposed and connected to the Gate driving binding portion 113, and then the Gate driving binding portion 113 is connected to the scan line 30 through the conductive via 112; of course, it is also possible to form the gate driving circuit on the circuit substrate and connect the gate driving circuit to the scan line through the conductive via by using a method similar to the COA technique.

The circuit substrate 110 of the present application generally does not use a glass substrate (unless a glass substrate convenient for punching is produced), but uses other materials more convenient for punching, and may use at least one of a printed circuit board, a flexible circuit board, a micro-porous plate, and a metal substrate;

since the active driving thin film 100 is not directly formed on the circuit substrate 110, the active driving thin film 100 and the circuit substrate 110 need to be assembled together, the assembling mode is selected according to specific situations, the active driving thin film 100 and the circuit substrate 110 can be directly attached and fixed by glue, and the type of the glue can refer to the glue used between the multilayer boards of the printed circuit board.

In addition, the light emitting element 60 of the present application may be an LED lamp, or may be other suitable light emitting sources, taking the LED lamp as an example, and the LED lamp is connected to the active switch 50 in a bonding manner; of course, if an OLED (organic light-Emitting semiconductor) is used as the light-Emitting element 60, the layers of the OLED are formed together when the active switch 50 is formed.

Fig. 8 is a schematic diagram of the layers of a display panel according to an embodiment of the disclosure, referring to fig. 6, and referring to fig. 4 to 7:

regarding the active driving thin film 100, in this embodiment, optionally, the active driving thin film 100 includes a polymer material layer 101, a PI layer (Polyimide) 102, a circuit layer 103, and a water-oxygen blocking layer 104, which are sequentially disposed, the active switch 50 is formed on the circuit layer 103, and an outer surface of the polymer material layer 101 is attached and fixed to the circuit substrate 110 by glue. The scanning lines 30 and the data lines 40 are also formed on the circuit layer 103, when the gate driving circuit 20 adopts the GOA technology, the gate driving circuit 20 is also formed on the circuit layer 103, and when the gate driving circuit 20 adopts the gate driving thin film 120, the gate driving thin film 120 is connected to the scanning lines 30 of the circuit layer 103 through the gate driving binding portions 113 and the conductive vias 112 in sequence. In addition, the existence of the water oxygen barrier layer 104 can improve the water oxygen resistance and reduce the deterioration condition of the wiring and the element, and the water oxygen barrier layer 104 can be provided with only one layer or a plurality of layers; when the multiple water oxygen barrier layers 104 are arranged, multiple layers can be covered on the circuit layer 103, and water oxygen barrier layers can be formed above and below the circuit layer 103; each abrasion of the circuit layer can be formed by adopting a physical vapor deposition and chemical vapor deposition mode, and can also be formed by adopting other modes; the existence of the polymer material layer is beneficial to peeling the active driving film from the transition substrate, and the peeling mode can adopt LLO (Laser Lift Off) and MLO (Mechanical Lift Off);

when the active driving film 100 is attached to the circuit substrate 110 by glue, an alignment mark (not shown) may be additionally added to ensure alignment accuracy; wherein the thickness of the PI layer is 50-100 mil.

Regarding the design of the conductive via, firstly, the film layer of the active driving thin film of the present application may be selected according to actual needs, and as follows, for one example, the conductive via 112 includes a first conductive via 1121 formed on the active driving thin film 100 and a second conductive via 1122 formed on the circuit substrate 110, the first conductive via 1121 and the second conductive via 1122 are correspondingly disposed, the circuit on the active driving thin film 100 is correspondingly conducted with the circuit on the circuit substrate 110, and the conductive via 112 is formed through a laser drilling process and an in-hole metallization process.

Next, the conductive via 112 is formed on the data line 40, and is located between two adjacent light emitting elements 60 (when the gate driving circuit adopts a gate-driven flip-chip film, a conductive via is also formed on the scan line), preferably, between the first and second outermost light emitting elements 60 arranged along the data line 40, or may be formed on the outer side of the outermost light emitting element 60, so as to achieve the effect of narrowing the frame.

In addition, the conductive via 112 may also be formed between the two light emitting elements 60 arranged at the middle along the data line 40, so that a half of the transmission path is reduced compared to the case of transmitting the data signal from one end of the data line 40 to the other end, and when the data signal transmitted from the source-driving flip chip 90 through the conductive via 112 is transmitted to the data line 40, the data signal acquired by each active switch 50 connected to the data line 40 is more uniform, which is beneficial to improving the display uniformity and thus improving the display effect.

In addition, since the conductive via 112 is formed on the trace, which may cause the trace to be broken, the corresponding conductive via may be widened appropriately, for example, by 1.5 times to reduce the broken trace corresponding to the trace on which the conductive via 112 is formed; for example, when the conductive via 112 is formed on the data line 40 or the scan line 30, the data line 40 or the scan line 30 is wider corresponding to the conductive via 112.

Similarly, in order to reduce the wire breakage of the conductive via 112 and improve the yield of the conductive via 112, a metal pad 115 is disposed on one side of the circuit substrate 110 close to the active driving film 100, the conductive via 112 is correspondingly formed on the metal pad 115 and penetrates through the metal pad 115 to connect the source driving binding portion 111, and the size of the metal pad 115 is larger than that of the conductive via 112;

regarding the design of the source driver binding portion 111, in order to facilitate the binding connection with the source driver flip-chip film 90, a fan-out trace 114 is further disposed on a surface of the circuit substrate 110 away from the active driver film 100, and the fan-out trace 114 is disposed between the conductive via 112 and the source driver binding portion 111. The existence of the metal gasket is beneficial to punching and reducing broken lines; the fan-out routing connects each conductive via hole with the source drive binding part, and the source drive binding part is arranged corresponding to the source drive chip on film, so that the current source drive chip on film can be directly adopted without redesign.

Fig. 9 is a schematic diagram of a display device according to an embodiment of the present application, and referring to fig. 9 and fig. 4 to 8, the present application discloses a display device 200 including a source driving flip-chip film 90 and a display panel 1 according to any one of the disclosure:

the source driving flip chip 90 is bound and connected to the source driving binding portion 111.

Similarly, when the gate driving circuit 20 adopts the gate driving flip-chip film 120, the gate driving flip-chip film 120 is bound and connected to the gate driving binding part 113.

The source driving flip chip film 90 may be attached to the second mounting surface of the circuit substrate 110, or may be mounted at another place, and the source driving flip chip film 90 is connected to the source driving binding portion 111, and similarly, the same applies to the gate driving flip chip film 120.

In addition, the display device 200 may further include a control board (not shown) connected to the source driving bonding portion 111 through the source driving flip-chip film 90, and the control board may be a separate board or may be integrated on the circuit substrate 110.

Fig. 10 is a schematic view of a tiled display device according to an embodiment of the present disclosure, fig. 11 is a schematic view of another tiled display device according to an embodiment of the present disclosure, and as can be seen from fig. 10 and fig. 11, at least two circuit substrates 110 are disposed, and the number of the active driving films 100 is the same as that of the circuit substrates 110, and the active driving films are disposed in a one-to-one correspondence;

and the two adjacent circuit substrates 110 are jointed by glue to obtain a spliced circuit substrate. Because the active driving film does not need a binding region and an edging distance in the display panel, the length of the frame can be greatly reduced, and a narrower frame or even no frame can be realized; optionally, a distance b between the light emitting elements closest to two adjacent active driving films 100 is equal to a distance a between two adjacent light emitting elements in the two active driving films 100.

In addition, each active driving film 100 may be separately connected with one source driving flip-chip film 90 as shown in fig. 10, and then the source driving flip-chip film is bonded and fixed on the second mounting surface of the circuit substrate 110, or one source driving flip-chip film 90 may be used to share one source driving chip as shown in fig. 11, and then the source driving flip-chip film is respectively bonded to two source driving bonding portions through two flip-chip films.

Fig. 12 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present application, and as shown in fig. 12, the present application further discloses a manufacturing method of a display panel, including the steps of:

s1: providing a transition substrate;

s3: removing the transition substrate to obtain an active driving film;

After the display panel is formed, if the display device is assembled, the source driver flip-chip film is bound and connected to the source driver binding portion.

When the gate driving circuit adopts the GOA technology, the gate driving circuit is synchronously formed in step S2; when the gate driving circuit adopts the gate driving flip chip, the second mounting surface of the circuit substrate is further formed with a gate driving binding portion, and the gate driving flip chip is bound and connected to the gate driving binding portion in step S5.

Fig. 13 is a schematic diagram of a variation of layers in a manufacturing process of a display device according to an embodiment of the present application, and referring to fig. 13, it can be known from fig. 12 that:

the steps in the schematic diagram of the variation of the film layer substantially correspond to those in fig. 12, and the first difference is that in step S2, the method is subdivided into steps S21 and S22, wherein in step S21, the polymer material layer and the PI layer are sequentially formed, then in step S22, the circuit layer is formed, the circuit layer includes the scan lines, the data lines, the active switches, and other elements, and the water-oxygen barrier layer is formed above the circuit layer; the second difference is that after the step S5, there is a step S6 of bonding the source driver flip-chip on film to the source driver bonding portion of the circuit substrate.

If the gate driving circuit adopts the GOA technology, the formed circuit layer further includes the gate driving circuit in step S, and if the gate driving circuit adopts the gate driving flip chip, the scanning lines of the active driving thin film and the gate driving binding portion are further connected through the conductive vias and the gate driving flip chip is bound and connected to the gate driving binding portion in steps S5 and S6.

It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.

The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.

Claims

1. A display panel, comprising:

2. The display panel according to claim 1, wherein the gate driving circuit, the data line and the scan line are formed on the active driving film, and the data line is connected to the source driving bonding portion through the conductive via.

3. The display panel according to claim 1, wherein the data lines and the scan lines are formed on the active driving film, and the second mounting surface of the circuit substrate is further provided with gate driving bonding portions connected to the scan lines through the conductive vias.

4. The display panel of any one of claims 1-3, wherein the conductive via is formed by a laser drilling process and an in-hole metallization process;

5. The display panel of claim 4, wherein the light emitting elements comprise LED lamps, the LED lamps are bonded to the active switches;

the initiative drive film is including the macromolecular material layer, PI layer, circuit layer and the water oxygen barrier layer that set gradually, the initiative switch forms the circuit layer, the macromolecular material layer the surface with the circuit base plate passes through the glue laminating fixedly.

6. The display panel according to claim 1, wherein a metal pad is disposed on a side of the circuit substrate adjacent to the active driving film, the conductive via is correspondingly formed on the metal pad and penetrates through the metal pad to connect the source driving bonding portion, and a size of the metal pad is larger than a size of the conductive via;

7. The display panel according to claim 1, wherein the conductive via is formed on the data line between two adjacent light emitting elements.

8. A display device comprising a source drive flip-chip film, and the display panel according to any one of claims 1 to 7:

9. The display device according to claim 8, wherein the display device is a tiled display device, the circuit substrates are provided with at least two, the number of the active driving thin films is the same as that of the circuit substrates, and the active driving thin films are respectively provided in a one-to-one correspondence;

and the adjacent two circuit substrates are jointed through glue to obtain the spliced circuit substrate.

10. A method of manufacturing a display panel for manufacturing a display panel according to any one of claims 1 to 7, comprising the steps of:

s1: providing a transition substrate;

s3: removing the transition substrate to obtain an active driving film;