TW202121380A - Tiled display and manufacturing method thereof - Google Patents

Abstract

A tiled display comprising a plurality of display panels and a control device is provided. Each of the display panels includes an upper substrate, a lower substrate, and a light emitting diode. The upper substrate includes an insulating material, a circuit layer, and a conductive via. The insulating material has a first surface and a second surface opposite to each other. The circuit layer is disposed on the first surface. The conductive via penetrates the insulating material and is electrically connected to the circuit layer. The lower substrate has a third surface facing the first surface and a drive device disposed on the third surface. The light emitting diode is disposed on the second surface of the upper substrate. The control device is disposed on the first surface of the upper substrate of at least one of the plurality of display panels. The control device is electrically connected to the drive devices of the lower substrates of each display panel via the circuit layer. A manufacturing method of a tiled display is also provided.

Description

Spliced display and manufacturing method thereof

The present invention relates to a display and a manufacturing method thereof, and particularly relates to a spliced display and a manufacturing method thereof.

With the popularization of display panels, it can be seen in home TVs, e-sports screens, large outdoor billboards, public information screens in stores, and even portable or wearable electronic devices. In recent years, in addition to the continuous increase in the mainstream size of display panels, in response to consumer demand for high-end electronic products, spliced displays composed of multiple display panels have become one of the key projects actively developed by many panel manufacturers.

The invention provides a spliced display and a manufacturing method thereof, which have better quality.

The spliced display of the present invention includes a plurality of display panels and control elements. Each display panel includes an upper substrate, a lower substrate, and a light emitting diode. The upper substrate includes an insulating material, a circuit layer and a via hole. The insulating material has a first surface and a second surface opposite to each other. The circuit layer is located on the first surface. The via hole penetrates the insulating material and is electrically connected to the circuit layer. The lower substrate has a third surface facing the first surface and a driving element located on the third surface. The light emitting diode is arranged on the second surface of the upper substrate. The control element is arranged on the first surface of the upper substrate of at least one of the plurality of display panels. The control element is electrically connected to the driving element of the lower substrate of each display panel via the circuit layer.

The manufacturing method of the spliced display of the present invention includes the following steps. Provide multiple display panels. The manufacturing method of each display panel includes: providing an upper substrate, wherein the upper substrate includes an insulating material having a first surface and a second surface opposite to each other, a circuit layer located on the first surface, and a circuit layer penetrating the insulating material and electrically connected to the circuit layer. Through holes; providing a lower substrate with a third surface and a driving element located on the third surface; arranging the light emitting diode on the second surface of the upper substrate; and making the upper substrate in such a way that the third surface faces the first surface Connect the lower board. The control element is arranged on the first surface of at least one of the upper substrates. The multiple display panels are spliced, wherein after the step of configuring the control element and the step of splicing the multiple display panels, the control element is electrically connected to the driving element of the lower substrate of each of the multiple display panels through the circuit layer.

Based on the above, the driving elements in the multiple display panels in the spliced display of the present invention can be controlled by the control element on at least one of the display panels, and therefore, the signal difference between the display panels can be reduced. In addition, the configuration of the control elements can reduce the thickness of the spliced display. In addition, the light-emitting diodes on one surface of the display panel are electrically connected to the circuits or components on the other surface through the through holes, so that the visibility of the joints of the spliced display can be reduced, so that the spliced display can be The visual experience of seamless splicing can be achieved or approached visually. In this way, the spliced display can have better quality.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

In the drawings, the thickness of each element and the like are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on”, “connected to,” or “overlapped on another element”, it may be directly on the other element. On or connected to another element, or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connections.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and/or parts, these elements, components, regions, and/or Or part should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the "first element", "member", "region", "layer" or "portion" discussed below may be referred to as a second element, member, region, layer or portion without departing from the teachings herein.

The terminology used here is only for the purpose of describing specific embodiments and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one." "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the related listed items. It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "beneath" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "about" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the process in question and the process-related or measurement and measurement-related errors The specific number (ie, the limit of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

The exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the diagram as a result of, for example, manufacturing technology and/or tolerances can be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shape of the area as shown herein, but include, for example, shape deviations caused by manufacturing. For example, regions shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shape of the regions, and are not intended to limit the scope of the claims.

1A to 1E are schematic partial cross-sectional views of a spliced display according to the first embodiment of the present invention. FIG. 1F is a partial flowchart of a partial manufacturing method of a spliced display according to the first embodiment of the present invention.

1A and 1F, in step S11, the upper substrate 110 is provided. The upper substrate 110 includes an insulating material 111, a first circuit layer 121 and via holes 123. The insulating material 111 has a first surface 111a and a second surface 111b opposite to each other. The first circuit layer 121 is located on the first surface 111a. The via 123 penetrates the insulating material 111 and is electrically connected to the first circuit layer 121.

The material of the insulating material 111 can be glass, quartz, organic polymers (e.g. epoxy resin (Epoxy), polyimide, etc.), other suitable insulating materials or a combination of the above (e.g. epoxy resin) Glass fiber), but the present invention is not limited to this.

In one embodiment, a through hole (through hole) penetrating the insulating material 111 may be formed by etching, drilling, punching, or other suitable methods. After the aforementioned through holes are formed, sputtering, evaporation, electroplating, and/or other suitable plating methods may be used to fill the aforementioned through holes with conductive materials to form the through holes 123.

In an embodiment, the first circuit layer 121 may be formed on the first surface 111a by plating and photolithography. In an embodiment, the first circuit layer 121 and the via 123 can be formed in the same or similar manner.

In this embodiment, the upper substrate 110 may further include a second circuit layer 122 on the second surface 111b. The formation method of the second circuit layer 122 can be the same or similar to that of the first circuit layer 121, so it will not be repeated. The via 123 may electrically connect the corresponding line in the first line layer 121 and the corresponding line in the second line layer 122 with each other.

In an embodiment, the insulating material 111 and the first circuit layer 121 and the second circuit layer 122 located on opposite sides thereof may be referred to as a double sided wiring board. For example, the upper substrate 110 may be a circuit board formed by a copper clad laminate (CCL) or other suitable printed circuit boards, but the present invention is not limited thereto. For another example, the upper substrate 110 may be a hard circuit board (commonly known as a hard board); or, the upper substrate 110 may be a flexible circuit board (commonly known as a flexible printed circuit (FPC)) .

In this embodiment, the upper substrate 110 may further include a light shielding structure 141. The light-shielding structure 141 is located on the second surface 111b, and the light-shielding structure 141 may have a pixel opening 141a. The pattern or number of the pixel openings 141a can be adjusted according to design requirements, which is not limited in the present invention. For example, the light-shielding structure 141 can absorb light (for example, use a light-absorbing resin as a material) or reflect light (for example, use a reflective layer on the surface or use a light-reflecting material), which is not limited in the present invention.

1B and 1F, in step S20, the light emitting diode 160 provided in step S13 is disposed on the second surface 111b of the upper substrate 110. For example, the second circuit layer 122 may have a connection pad 122a, and the light emitting diode 160 is configured to correspond to the connection pad 122a. In an embodiment, the light emitting diode 160 may be electrically connected to the corresponding connection pad 122a through the conductive connection member 191 through flip chip bonding. The conductive connecting member 191 is, for example, solder, but the present invention is not limited thereto.

In this embodiment, the light emitting diode 160 may be disposed in the corresponding pixel opening 141a. In an embodiment, the light shielding structure 141 can reduce the problem of light leakage or light mixing between adjacent light emitting diodes 160.

In this embodiment, the type or color of the light-emitting diode 160 is not limited. For example, the light-emitting diode 160 can be a sub-millimeter light-emitting diode (Mini LED) or a micro-light-emitting diode (Micro LED), and different light-emitting diodes 160 can emit red, green, or blue, for example, respectively. Light.

In this embodiment, the circuit layout of the first circuit layer 121, the circuit layout of the second circuit layer 122, the configuration of the light-emitting diode 160, and/or the configuration of the via 123 can be based on the design Be adjusted as required. For example, on a cross-section (such as the cross-section shown in Figure 1A, or the cross-section shown in other similar drawings later), unconnected lines may (but not limited to) pass through other cross-sections or other The circuits or components in the area are not shown but are electrically connected.

Take FIG. 1G as an example, where FIG. 1B may be a schematic cross-sectional view similar to the AA' cross-section in FIG. 1G, and for clarity and ease of description, the illustrated part of the film layer or member is omitted in FIG. 1G. In an embodiment, the through holes 123a and the through holes 123b may be electrically connected to different electrodes in the light emitting diode 160.

Take FIG. 1H as an example, where FIG. 1B may be a schematic cross-sectional view similar to the BB' cross-section in FIG. 1H, and for clarity and ease of description, the illustrated part of the film layer or component is omitted in FIG. 1H. In an embodiment, the through holes 123a and the through holes 123c may be electrically connected to different electrodes in the light emitting diode 160. Different light-emitting diodes 160 can be electrically connected to the vias 123c via corresponding lines 122d in the second circuit layer 122. The via 123c may be electrically connected to a common power source, for example, but the invention is not limited thereto.

It is worth noting that FIGS. 1G and 1H are only exemplarily shown or illustrated, and the present invention does not limit the structure in FIG. 1B whose top view needs to be at least one of the top schematic diagrams of FIGS. 1G and 1H. However, the top view of the structure in FIG. 1B may still be at least one of the top schematic views of FIG. 1G and FIG. 1H.

Referring to FIG. 1C and FIG. 1F, in step S12, a lower substrate 130 is provided. The lower substrate 130 has a third surface 131 a and a fourth surface 131 b opposite to each other, and the third surface 131 a of the lower substrate 130 may have a driving element 170.

The base substrate of the lower substrate 130 may be glass, quartz, organic polymer, or opaque/reflective material (for example, conductive material, metal, wafer, ceramic, or other applicable materials), or It is other applicable materials. If conductive materials or metals are used, an insulating layer can be covered on the substrate to avoid short circuit problems.

In this embodiment, the driving element 170 may include a chiplet, but the present invention is not limited thereto. The aforementioned small chip may be an integrated circuit (IC) that integrates multiple or multiple modules. In an embodiment, the driving element 170 may include a thin film transistor formed by a common semiconductor process. The type of the driving element 170 can be selected according to the application requirements, and is not limited in the present invention. In an embodiment, the lower substrate 130 may be referred to as an array substrate, but the present invention is not limited thereto.

In this embodiment, the lower substrate 130 may further include a third circuit layer 134, and the driving element 170 may be electrically connected to a corresponding circuit in the third circuit layer 134. In addition, the circuit layout of the third circuit layer 134 can be adjusted according to design requirements. For example, on a cross-section (such as the cross-section shown in Figure 1C, or the cross-section shown in other similar drawings later), unconnected lines may (but not limited to) pass through other cross-sections or other The circuits or components in the area are not shown but are electrically connected.

1C to 1D and 1F, in step S20, the third surface 131a of the lower substrate 130 faces the first surface 111a of the upper substrate 110, so that the upper substrate 110 and the lower substrate 130 are connected to each other. After the upper substrate 110 and the lower substrate 130 are connected to each other, the driving element 170 on the lower substrate 130 can be electrically connected to the corresponding via 123 in the upper substrate 110. For example, the driving element 170 on the lower substrate 130 may be electrically connected to the corresponding via hole 123 via the corresponding circuit 134 a in the third circuit layer 134 and the corresponding circuit 121 a in the first circuit layer 121.

In an embodiment, before connecting the upper substrate 110 and the lower substrate 130 to each other, a conductive connection member 192 may be formed on the corresponding circuit 121b in the first circuit layer 121 first. In this way, after the upper substrate 110 and the lower substrate 130 are connected to each other, the conductive connection member 192 can be used to make the corresponding circuit 134b in the third circuit layer 134 and the corresponding circuit 121b in the first circuit layer 121 be electrically connected to each other. Sexual connection.

In an embodiment, before connecting the upper substrate 110 and the lower substrate 130 to each other, a conductive connection member 192 may be formed on the corresponding circuit 134 b in the third circuit layer 134 first. In this way, after the upper substrate 110 and the lower substrate 130 are connected to each other, the conductive connection member 192 can be used to make the corresponding circuit 134b in the third circuit layer 134 and the corresponding circuit 121b in the first circuit layer 121 be electrically connected to each other. Sexual connection.

In an embodiment, the conductive connecting member 192 may be a conductive pillar, a conductive paste, a solder (such as a solder ball), or a combination of the above, but the present invention is not limited thereto.

In this embodiment, there may be an adhesive layer 194 between the upper substrate 110 and the lower substrate 130, but the present invention is not limited thereto.

After the above steps, the fabrication of one or more display panels 100 in this embodiment can be roughly completed. That is, the display panel 100 may include an upper substrate 110, a lower substrate 130, and a light emitting diode 160. The upper substrate 110 includes an insulating material 111. The insulating material 111 has a first surface 111a and a second surface 111b opposite to each other. The first circuit layer 121 is located on the first surface 111a. The via 123 penetrates the insulating material 111 and is electrically connected to the first circuit layer 121. The third surface 131a of the lower substrate 130 faces the first surface 111a of the upper substrate 110, and the third surface 131a of the lower substrate 130 has a driving element 170 thereon. The light emitting diode 160 is disposed on the second surface 111b of the upper substrate 110. The driving element 170 on the lower substrate 130 may be electrically connected to the corresponding through hole 123 in the upper substrate 110 to be electrically connected to the corresponding light emitting diode 160.

In addition, this embodiment does not limit that the display panels 100 manufactured through the above steps need to be completely the same. For example, the size of the upper substrate 110, the size of the lower substrate 130, the number or configuration of the light-emitting diodes 160, and/or the configuration of other corresponding electronic components (such as the control component 180 mentioned later) and No or the configuration method can be adjusted according to the design requirements.

Please continue to refer to FIGS. 1C to 1D and 1F. In step S20, the control element 180 to be provided in step S14 is disposed on the first surface 111a of at least one of the upper substrate 110. For example, flip-chip bonding may be used to enable the control element 180 to be electrically connected to the corresponding circuit 121 b in the first circuit layer 121. The control element 180 is, for example, a Display Driver IC (DDI) or other suitable chips, but the invention is not limited thereto.

In this embodiment, the control element 180 can be electrically connected to one or more driving elements 170 via the corresponding circuit 121 b in the first circuit layer 121, the conductive connector 191 and the corresponding circuit 134 b in the third circuit layer 134.

In an embodiment, the display panel 100 having the control element 180 disposed thereon may be referred to as the first display panel 101. The upper substrate 110 of the first display panel 101 has a protruding area R1 that does not overlap the lower substrate 130, the control element 180 is disposed in the protruding area R1, the protruding area R1 has a first width W1, the control element 180 has a second width W2, and the A width W1 is greater than the second width W2. That is, the projection of the control element 180 on the first surface 111a does not overlap with the projection of the lower substrate 130 on the first surface 111a.

The steps of configuring the control element 180 can be adjusted according to design requirements. In an embodiment, before connecting the upper substrate 110 and the lower substrate 130 to each other, the control element 180 may be disposed on the first surface 111 a of at least one of the upper substrate 110. In another embodiment, after connecting the upper substrate 110 and the lower substrate 130 to each other, the control element 180 may be disposed on the first surface 111 a of at least one of the upper substrate 110.

In one embodiment, the first width W1 is greater than or equal to the second width W2 plus about 200 microns (micrometer; μm). In this way, in the step of arranging the control element 180 on the first surface 111 a of the upper substrate 110, a better process window can be obtained.

1D to FIG. 1E and FIG. 1F, in step S30, a plurality of display panels 100 may be spliced to form a spliced display 10. In addition, the control element 180 may be electrically connected to the corresponding driving element 170 of the lower substrate 130 of the display panel 100 via the first circuit layer 121. For example, the control element 180 can be electrically connected to the display panel 101 via the corresponding circuit 121b in the first circuit layer 121 of the display panel 101, the conductive connector 192a, and the corresponding circuit 134b in the third circuit layer 134 of the display panel 101 One or more of the driving element 170, and the control element 180 can pass through the corresponding line 121b in the first circuit layer 121 of the display panel 101, the conductive connector 192b, and the corresponding line in the third circuit layer 134 of the display panel 102 134b is electrically connected to one or more driving elements 170 in the display panel 102. Wherein, the conductive connector 192a located between the upper substrate 110 of the display panel 101 and the lower substrate 130 of the display panel 102 may be arranged on the upper substrate 110 of the display panel 101 or on the lower substrate 130 of the display panel 102. This invention is not limited.

In this embodiment, since the driving elements 170 in the multiple display panels 100 (such as the display panel 101 and the display panel 102) in the spliced display 10 can be controlled by the control element 180, the gap between the display panels 100 can be reduced. The inter-chip signal difference is easy. In addition, the control element 180 is arranged in the protruding area R1 (marked in FIG. 1D) of the display panel 101, so that the thickness of the spliced display 10 can be reduced. In addition, the light emitting diode 160 disposed on the second surface 111b is connected to the circuit (such as the circuit 121a; shown in FIG. 1D) or the element (such as the driving element 170) on the first surface 111a through the via 123 It is electrically connected, and the visibility of the joints of the spliced display 10 can be reduced, so that the spliced display 10 can achieve or approach a seamless splicing visual experience. In this way, the spliced display 10 can have better quality.

FIG. 2 is a schematic partial cross-sectional view of a spliced display according to a second embodiment of the present invention. The manufacturing method of the spliced display 20 of this embodiment is similar to the manufacturing method of the spliced display 10 of the first embodiment. Similar components are denoted by the same reference numerals and have similar functions, materials or formation methods, and descriptions are omitted.

In this embodiment, the projection of a part of the light-emitting diode 161 (that is, at least one of the light-emitting diodes 160) on the first surface 111a or the second surface 111b in the display panel 101 may overlap the control element 180 Projection on the first surface 111a or the second surface 111b.

3A to 3B are schematic partial cross-sectional views of a spliced display according to a third embodiment of the present invention. The manufacturing method of the spliced display 30 of this embodiment is similar to the manufacturing method of the spliced display 10 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and the description is omitted.

Referring to FIG. 3A, an upper substrate 310 is provided. The upper substrate 310 includes an insulating material 311, a first circuit layer 121 and via holes 123. The insulating material 311 has a first surface 111a and a second surface 311b opposite to each other. The first circuit layer 121 is located on the first surface 111a. The second circuit layer 122 is located on the second surface 311b. The via hole 123 penetrates the insulating material 311 and is electrically connected to the first circuit layer 121. The material of the insulating material 311 of this embodiment may be the same or similar to the material of the insulating material 111 of the previous embodiment, so it will not be repeated here.

In this embodiment, the second surface 311 b of the insulating material 311 may have a plurality of recesses 314. In other words, the second surface 311b of the insulating material 311 may not be a flat surface.

In one embodiment, the recesses 314 can be formed by etching, grinding, embossing or other suitable methods, and the appearance, position, and number of the recesses 314 can be adjusted according to design requirements, which are not limited in the present invention. .

Please continue to refer to FIG. 3A, the light emitting diode 160 can be disposed in the recess 314, and the light emitting diode 160 can be electrically connected to the corresponding connection pad 122a. In one embodiment, by disposing the light emitting diode 160 in the recess 314, the problem of light leakage or light mixing between adjacent light emitting diodes 160 can be reduced.

After that, the spliced display 30 as shown in FIG. 3B can be constructed by the same or similar steps or methods as shown or described in FIG. 1B to FIG. 1E.

The display panel 300 in the spliced display 30 is similar to the display panel 100 in the spliced display 10 in the foregoing embodiment, one of the differences is that the insulating material 311 has a recess 314.

4A to 4B are schematic partial cross-sectional views of a spliced display according to a fourth embodiment of the present invention. The manufacturing method of the spliced display 40 of this embodiment is similar to the manufacturing method of the spliced display 30 of the third embodiment. Similar components are denoted by the same reference numerals and have similar functions, materials or formation methods, and descriptions are omitted.

4A, the upper substrate 410 of the display panel 400 includes an insulating material 411, a first circuit layer 121, and via holes 123. The insulating material 411 has a first surface 411a and a second surface 311b opposite to each other. The first circuit layer 121 is located on the first surface 411a. The via 123 penetrates the insulating material 411 and is electrically connected to the first circuit layer 121. The material of the insulating material 411 of this embodiment can be the same or similar to the material of the insulating material 311 of the foregoing embodiment, so it will not be repeated here.

In this embodiment, the first surface 411 a of the insulating material 411 of the upper substrate 410 may have an outer convex structure 415. In other words, the first surface 411a of the insulating material 411 may not be a flat surface. The projection of the convex structure 415 on the third surface 131a does not overlap with the projection of the driving element 170 on the third surface 131a.

After that, the spliced display 40 as shown in FIG. 4B can be constructed by the same or similar steps or methods as shown or described in FIG. 1D to FIG. 1E.

The display panel 400 in the spliced display 40 is similar to the display panel 300 in the spliced display 30 in the foregoing embodiment, one of the differences is that the insulating material 411 has a convex structure 415.

5A to 5B are schematic partial cross-sectional views of a spliced display according to a fifth embodiment of the present invention. The manufacturing method of the spliced display 50 of this embodiment is similar to the manufacturing method of the spliced display 40 of the fourth embodiment. Similar components are denoted by the same reference numerals and have similar functions, materials or formation methods, and descriptions are omitted.

Referring to FIG. 5A, part of the first circuit layer 121 may be further located on the convex structure 415. The control element 180 can be electrically connected to one or more driving elements 170 via the line 521c covering the convex structure 415 in the first line layer 121 and the corresponding line 134b in the third line layer 134.

After that, through the same or similar steps or methods as shown or described in FIGS. 1D to 1E, the spliced display 50 as shown in FIG. 5A can be constructed. The control element 180 can be electrically connected to one or more of the display panel 401 via the circuit 521c covering the convex structure 415 in the first circuit layer 121 of the display panel 401 and the corresponding circuit 134b in the third circuit layer 134 of the display panel 401. The driving element 170 and the control element 180 can be electrically connected to the display via the line 521c covering the convex structure 415 in the first line layer 121 of the display panel 401 and the corresponding line 134b in the third line layer 134 of the display panel 402 One or more driving elements 170 in the panel 402.

6A to 6B are schematic partial cross-sectional views of a spliced display according to a sixth embodiment of the present invention. The manufacturing method of the spliced display 60 of this embodiment is similar to the manufacturing method of the spliced display 10 of the first embodiment or the spliced display 40 of the fourth embodiment, and similar components are denoted by the same reference numerals and have similar functions and materials. Or the method of formation, and the description is omitted.

6A, the upper substrate 610 of the display panel 600 includes an insulating material 611, a first circuit layer 121, and via holes 123. The insulating material 611 has a first surface 611a and a second surface 311b opposite to each other. The first circuit layer 121 is located on the first surface 611a. The via 123 penetrates the insulating material 611 and is electrically connected to the first circuit layer 121. The material of the insulating material 611 of this embodiment can be the same or similar to the material of the insulating material 611 of the previous embodiment, so it will not be repeated here.

In this embodiment, the first surface 611 a of the insulating material 611 of the upper substrate 610 may have a convex structure 615, and the via hole 123 may penetrate the convex structure 615. The projection of the convex structure 615 on the third surface 131a does not overlap with the projection of the driving element 170 on the third surface 131a.

After that, the same or similar steps or methods as shown or described in FIGS. 1D to 1E can be used to form the spliced display 60 as shown in FIG. 6B.

FIG. 7 is a schematic partial cross-sectional view of a spliced display according to a seventh embodiment of the present invention. The manufacturing method of the spliced display 70 of this embodiment is similar to the manufacturing method of the spliced display 10 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and the description is omitted.

In this embodiment, the spliced display 70 may further include an insulating layer 795. The insulating layer 795 may be located between the control element 180 and the lower substrate 130 of the display panel 101, and/or the insulating layer 795 may be located between the control element 180 and the lower substrate 130 of the display panel 101. The insulating layer 795 may include an inorganic or organic insulating material layer, a hard coat layer, a water vapor barrier layer with a low water vapor transmission rate (WVTR), and a low oxygen transmission rate (Oxygen Transmission Rate; OTR) oxygen barrier layer or a combination or combination of one or more of the foregoing film layers.

FIG. 8 is a schematic partial cross-sectional view of a spliced display according to an eighth embodiment of the present invention. The manufacturing method of the spliced display 80 of this embodiment is similar to the manufacturing method of the spliced display 70 of the seventh embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and the description is omitted.

In this embodiment, the spliced display 80 may further include an insulating layer 795. The insulating layer 795 may be further located on the fourth surface 131 b of the lower substrate 130.

It should be noted that the present invention does not limit the combination of the display panels in the spliced display. In other words, the combination of the display panels in the spliced display is not limited to those in FIG. 1E, FIG. 2, FIG. 3B, FIG. 4B, FIG. 5B, or FIG. 6B. For example, in an embodiment not shown, the display panel 101 (shown in FIG. 1E or 2), the display panel 301 (shown in FIG. 3B), and the display panel 401 (shown in FIG. 4B) ), one of the display panel 501 (shown in Figure 5B) or the display panel 601 (shown in Figure 6B) and the display panel 102 (shown in Figure 1E or Figure 2), the display panel 302 (shown in Figure 6B) 3B) One of the display panel 402 (shown in FIG. 4B), the display panel 502 (shown in FIG. 5B), or the display panel 602 (shown in FIG. 6B) is spliced to form a spliced display.

To sum up, the driving elements in the multiple display panels in the spliced display of the present invention can be controlled by the control element on at least one of the display panels. Therefore, the signal difference between the display panels can be reduced. . In addition, the configuration of the control elements can reduce the thickness of the spliced display. In addition, the light-emitting diodes on one surface of the display panel are electrically connected to the circuits or components on the other surface through the through holes, so that the visibility of the joints of the spliced display can be reduced, so that the spliced display can be The visual experience of seamless splicing can be achieved or approached visually. In this way, the spliced display can have better quality.

10, 20, 30, 40, 50, 60, 70, 80: spliced display 100, 101, 102, 300, 301, 302, 400, 401, 402, 500, 501, 502, 600, 601, 602: display panel 110, 310, 410, 610: upper substrate 111, 311, 411, 611: insulating material 111a, 411a, 611a: first surface 111b, 311b: second surface 314: Depression 415, 615: convex structure 121: first circuit layer 121a, 121b, 521c: line 122: second circuit layer 122a: connection pad 122d: line 123, 123a, 123b, 123c: via holes 130: lower substrate 131a: third surface 131b: Fourth surface 134: third circuit layer 134a, 134b: line 141: Shading structure 141a: Pixel opening 160, 161: light-emitting diodes 170: drive components 180: control element 191, 192, 192a, 192b: conductive connectors 193: Shading structure 194: Adhesive Layer R1: prominent area W1: first width W2: second width 795: Insulation layer S11, S12, S13, S14, S20, S30: steps

1A to 1E are schematic partial cross-sectional views of a spliced display according to the first embodiment of the present invention. FIG. 1F is a partial flowchart of a partial manufacturing method of a spliced display according to the first embodiment of the present invention. FIG. 1G is a schematic partial top view of one of the display panels of a spliced display according to an embodiment of the present invention. FIG. 1H is a schematic partial top view of another display panel of a spliced display according to an embodiment of the present invention. FIG. 2 is a schematic partial cross-sectional view of a spliced display according to a second embodiment of the present invention. 3A to 3B are schematic partial cross-sectional views of a spliced display according to a third embodiment of the present invention. 4A to 4B are schematic partial cross-sectional views of a spliced display according to a fourth embodiment of the present invention. 5A to 5B are schematic partial cross-sectional views of a spliced display according to a fifth embodiment of the present invention. 6A to 6B are schematic partial cross-sectional views of a spliced display according to a sixth embodiment of the present invention. FIG. 7 is a schematic partial cross-sectional view of a spliced display according to a seventh embodiment of the present invention. FIG. 8 is a schematic partial cross-sectional view of a spliced display according to an eighth embodiment of the present invention.

10: Spliced display

100, 101, 102: display panel

111: Insulating material

111a: first surface

111b: second surface

121: first circuit layer

121b: line

122: second circuit layer

122a: connection pad

123: Via

134: third circuit layer

134a, 134b: line

160: LED

170: drive components

180: control element

192, 192a, 192b: conductive connectors

Claims (14)

A spliced display, including: A plurality of display panels, wherein each of the display panels includes: The upper base plate includes: The insulating material has a first surface and a second surface opposite to each other; A circuit layer located on the first surface; and A via hole penetrates the insulating material and is electrically connected to the circuit layer; A lower substrate having a third surface facing the first surface and a driving element located on the third surface; and A light emitting diode, which is disposed on the second surface of the upper substrate; and The control element is arranged on the first surface of the upper substrate of at least one of the plurality of display panels, and the control element is electrically connected to all of the plurality of display panels via the circuit layer. The driving element of the lower substrate is described. The spliced display according to the first item of the scope of patent application, wherein the plurality of display panels includes a first display panel, and the upper substrate of the first display panel has a protruding area that does not overlap the lower substrate, so The control element is disposed in the protruding area, the protruding area has a first width, the control element has a second width, and the first width is greater than the second width. The spliced display as described in item 2 of the scope of patent application, wherein the first width is greater than or equal to the second width plus 200 microns. According to the spliced display described in the first item of the scope of patent application, the upper substrate of at least one of the plurality of display panels further includes: The light-shielding structure is arranged on the second surface and has a pixel opening, and the light-emitting diode is arranged in the pixel opening. According to the spliced display described in the first item of the scope of patent application, the insulating material of at least one of the plurality of display panels has a recess, and the light-emitting diode is disposed in the recess. According to the spliced display described in the first item of the scope of patent application, the upper substrate of at least one of the plurality of display panels further includes: The convex structure is located on the first surface, and the projection of the convex structure on the third surface does not overlap with the projection of the driving element on the third surface. As for the spliced display described in item 6 of the scope of patent application, part of the circuit layer is further located on the convex structure. According to the spliced display described in item 7 of the scope of patent application, the via hole further penetrates the convex structure. The spliced display described in item 1 of the scope of patent application further includes: The insulating layer is located between the control element and the lower substrate of the plurality of display panels. In the spliced display according to item 9 of the scope of patent application, the lower substrate further has a fourth surface opposite to the third surface, and the insulating layer is further located on the fourth surface of the lower substrate. A manufacturing method of spliced display, including: A plurality of display panels are provided, wherein the manufacturing method of each of the display panels includes: Provide upper base plate, including: The insulating material has a first surface and a second surface opposite to each other; A circuit layer located on the first surface; and A via hole penetrates the insulating material and is electrically connected to the circuit layer; Providing a lower substrate having a third surface and a driving element located on the third surface; Disposing a light emitting diode on the second surface of the upper substrate; and Connecting the upper substrate to the lower substrate in a manner that the third surface faces the first surface; Disposing a control element on the first surface of at least one of the upper substrates; and Splicing the plurality of display panels, wherein after the step of configuring the control element and the step of splicing the plurality of display panels, the control element is electrically connected to each of the plurality of display panels via the circuit layer The driving element of the lower substrate. The method for manufacturing a spliced display according to the 11th item of the scope of patent application, wherein the step of arranging the control element is before the step of connecting the upper substrate to the lower substrate. The method for manufacturing the spliced display described in item 11 of the scope of patent application, wherein the step of arranging the control element is after the step of connecting the upper substrate to the lower substrate. The method for manufacturing a spliced display according to the 11th item of the scope of patent application, wherein the upper substrate of at least one of the plurality of display panels further comprises: The light-shielding structure is arranged on the second surface and has a pixel opening, and the light-emitting diode is arranged in the pixel opening.

Images