TWI721525B - Circuit board and stacked structure and method for manufacturing stacked structure - Google Patents

Abstract

A circuit board includes a substrate and a plurality of routing layers. The substrate includes a top surface, a bottom surface that is opposite to the top surface, a lateral surface, and a plurality of recessed surfaces. The lateral surface is connected to the top surface and the bottom surface. The recessed surfaces are recessed from the lateral surface to inside and extend from the top surface to the bottom surface. Each of the routing layers is disposed on a corresponding recessed surface of the recessed surfaces. An interval is between an edge of each of the routing layers and the lateral surface to expose a portion of each of the recessed surfaces adjacent to the lateral surface.

Description

Circuit board and assembly structure and assembly structure Manufacturing method

The invention relates to an assembly structure and a manufacturing method thereof. In particular, it relates to an assembly structure having a circuit board and a manufacturing method of the assembly structure having a circuit board.

With the continuous development of integrated circuit chips and various electronic products to smaller sizes, the electrical connections between different electronic components in electronic products also develop to smaller dimensions. In the new microLED or sub-millimeter light emitting diode (miniLED) technology, the board and contacts are generally made by using die soft die bonding (COF) and flexible printed circuit boards (FPC) . However, the micro-light-emitting diodes or sub-millimeter light-emitting diodes produced by this technology will make it impossible to place the light-emitting diodes at the connection points, and therefore cannot meet the current demand for high screen ratio of displays. In addition, large-scale LED displays need to use splicing for multi-screen arrangement. However, the connection point between the small screen and the small screen in the prior art occupies a large area and cannot achieve a completely seamless visual effect. fruit.

In view of this, there is an urgent need for a better assembly method of fine-pitch components to solve the above-mentioned problems.

One aspect of the present invention is to provide a circuit board. The circuit board includes a substrate and a plurality of perforated wiring portions. The substrate includes a top surface, a bottom surface opposite to the top surface, a side surface, and a plurality of concave surfaces. The sides connect the top and bottom surfaces. The plurality of concave surfaces are recessed from the side surface inward and extend from the top surface to the bottom surface. The plurality of perforated wiring portions are respectively arranged on a corresponding one of the plurality of concave surfaces. There is an interval between an edge and the side surface of each perforated wiring portion, so as to expose a part of each concave surface adjacent to the side surface.

In some embodiments, the plurality of perforated trace portions do not contact the side surface of the substrate.

In some embodiments, the circuit board further includes an upper circuit structure disposed on the substrate and a lower circuit structure disposed below the substrate, and one or more of the plurality of perforated wiring portions are electrically connected Upper line structure and/or lower line structure.

In some embodiments, the circuit board further includes at least one conductive solder, which is filled in one of the plurality of concave surfaces and covers the exposed part of the one of the plurality of concave surfaces.

Another aspect of the present invention is to provide an assembly structure including a first circuit board and a second circuit board. The first circuit board includes a first substrate, a plurality of first through-hole wiring portions, and at least one conductive solder. The second circuit board includes a second substrate and a plurality of second perforated wiring portions. The first substrate includes a first top surface, a first bottom surface opposite to the first top surface, a first side surface, and a plurality of first concave surfaces. The first side surface connects the first top surface and the first bottom surface. The plurality of first concave surfaces are recessed inward from the side surface and extend from the first top surface to the first bottom surface. The plurality of first perforated wiring portions are respectively disposed on a local area of the first top surface and the first bottom surface on a corresponding one of the plurality of first concave surfaces. The at least one conductive solder is filled in one of the first concave surfaces. The second substrate has a plurality of second concave surfaces disposed on a second side surface of the second substrate relative to the plurality of first concave surfaces. The first side surface is in contact with the second side surface. The plurality of second perforated wiring portions are respectively disposed on a local area of the second top surface and the second bottom surface on a corresponding one of the plurality of second concave surfaces. The at least one conductive solder extends from each first through-hole wiring portion to each corresponding second through-hole wiring portion.

In some embodiments, there is a first gap between a first edge of each first perforation trace and the first side surface to expose a part of the first side surface adjacent to each first concave surface, and each second perforation There is a second gap between a second edge and the second side surface of the wiring portion, and each second concave surface is exposed to be adjacent to a part of the second side surface, wherein the at least one conductive solder covers the one of the plurality of first The exposed part of a concave surface extends to the corresponding second perforated wiring portions.

In some embodiments, the first circuit board includes a first upper circuit structure disposed on the first substrate, and a first lower circuit structure under the first substrate, and the second circuit board includes a first lower circuit structure disposed on the first substrate. A second upper circuit structure on the two substrates, and a second lower circuit structure under the second substrate, wherein one or more of the plurality of first perforated wiring portions are electrically connected to a first upper portion The circuit structure and/or the first lower circuit structure, and one or more of the plurality of second perforated wiring portions are electrically connected to the second upper circuit structure and/or the second lower circuit structure.

Another aspect of the present invention is to provide a method of manufacturing an assembly structure. The method includes: (i) providing a first circuit board. The first circuit board includes a first substrate, a plurality of first perforated wiring portions, and at least A conductive solder, the first substrate includes a first top surface, a first bottom surface opposite to the first top surface, a first side surface and a plurality of first concave surfaces, the first side surface connects the first top surface and the first bottom surface, The plurality of first concave surfaces are recessed inward from the first side surface and extend from the first top surface to the first bottom surface, and each first perforated wiring portion is provided on a corresponding one of the plurality of first concave surfaces, the At least one conductive solder is filled in one of the plurality of first concave surfaces; (ii) a second circuit board is provided. The second circuit board includes a second substrate and a plurality of second perforated wiring portions, and the second substrate includes opposite A plurality of second concave surfaces provided on a second side surface of the second substrate on the plurality of first concave surfaces, and each second perforated wiring portion is provided on a corresponding one of the plurality of second concave surfaces; and (iii) ) To join the to One less conductive solder and the corresponding second perforated wiring portions make the at least one conductive solder connect each first perforated wiring portion and each second perforated wiring portion, and the first side surface contacts the second side surface.

In some embodiments, in the step of providing the first circuit board, there is a first gap between a first edge and the first side surface of each first perforated wiring portion, so that each first concave surface is exposed and adjacent to the first A part of the side surface, the at least one conductive solder covers the exposed part of one of the plurality of first concave surfaces, and in the step of providing the second circuit board, a second edge of each second perforated wiring portion There is a second interval between the second side surface and the second side surface to expose a part of each second concave surface adjacent to the second side surface.

In some embodiments, in the step of joining the at least one conductive solder on the plurality of first through-hole wiring portions and the corresponding second through-hole wiring portions, the at least one conductive solder is along each The exposed portion of the second concave surface adjacent to the second side surface and the plurality of second perforated wiring portions flow to join the first circuit board to the second circuit board.

100, 500: circuit board

110, 520: substrate

111, 509, 521: perforation

112, 522: top surface

113, 523: Bottom

114, 524: side

115, 525: concave

120, 530: seed layer

121, 122: Surface

130, 540: patterned photoresist layer

131, 132: area

140, 550: perforated wiring part

141, 551: Edge

142, 552: Interval

150, 560: upper circuit structure

160, 570: lower line structure

170, 580: conductive solder

400, 800: assembly structure

200, 600: the first circuit board

210, 620: first substrate

212, 622: The first top surface

213, 623: The first bottom

214, 624: First side

215, 625: the first concave surface

220, 630: seed layer

240, 650: the first perforation routing part

241, 651: the first edge

242, 652: first interval

250, 660: the first upper circuit structure

260, 670: the first lower line structure

270, 680: conductive solder

300, 700: second circuit board

310, 720: second substrate

314, 724: second side

315, 725: second concave surface

340, 750: the second perforation routing part

341, 751: Second Edge

342, 752: second interval

350, 760: second upper circuit structure

360, 770: second lower line structure

320: Seed Layer

505: Internal circuit structure

506: Carrier Board

507: conductive blind hole

508: circuit layer

510: Dielectric layer

511: Through blind hole

590: Insulation protection layer

590o: opening

593: conductive layer

595: area

B-B, L: line

FIGS. 1A-10A show three-dimensional schematic diagrams of the method of manufacturing a circuit board in different process stages according to an embodiment of the present invention.

FIGS. 1B-10B show schematic cross-sectional views of the method for manufacturing a circuit board according to an embodiment of the present invention, which are respectively cut along the line B-B in FIGS. 1A-10A at different process stages.

FIGS. 1C to 10C show top views of the method of manufacturing a circuit board according to an embodiment of the present invention in different process stages.

FIG. 11A is a top view of a method of manufacturing an assembly structure according to an embodiment of the present invention at a certain stage of the manufacturing process.

FIG. 11B is a schematic cross-sectional view of the method for manufacturing an assembly structure according to an embodiment of the present invention, which is cut along the line B-B in FIG. 11A at a certain process stage.

FIG. 12A is a top view of the method for manufacturing an assembly structure according to an embodiment of the present invention at a certain stage of the manufacturing process.

FIG. 12B is a schematic cross-sectional view of the method for manufacturing an assembly structure according to an embodiment of the present invention, which is cut along the line B-B in FIG. 12A at a certain process stage.

13 to 23 are cross-sectional schematic diagrams of a method for manufacturing a circuit board according to another embodiment of the present invention in different process stages.

FIG. 24A is a top view of a method of manufacturing a circuit board in a certain process stage according to another embodiment of the present invention.

FIG. 24B is a schematic cross-sectional view of a method for manufacturing a circuit board according to another embodiment of the present invention, which is cut along the line B-B in FIG. 24A at a certain process stage.

FIG. 25A is a top view of a method for manufacturing an assembly structure according to another embodiment of the present invention at a certain stage of the manufacturing process.

FIG. 25B is a schematic cross-sectional view of a method for manufacturing an assembly structure according to another embodiment of the present invention, which is cut along the line B-B in FIG. 25A at different process stages.

FIG. 26A is a top view of a method of manufacturing an assembly structure according to another embodiment of the present invention at a certain stage of the manufacturing process.

FIG. 26B is a schematic cross-sectional view of a method for manufacturing an assembly structure according to another embodiment of the present invention, which is cut along the line B-B in FIG. 26A at a certain process stage.

In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description for the implementation aspects and specific embodiments of the present invention; this is not the only way to implement or use the specific embodiments of the present invention. The embodiments disclosed below can be combined or substituted with each other under beneficial circumstances, and other embodiments can also be added to an embodiment without further description or description.

In the following description, many specific details will be described in detail so that the reader can fully understand the following embodiments. However, the embodiments of the present invention may be practiced without these specific details. In other cases, in order to simplify the drawings, well-known structures and devices are only schematically shown in the drawings.

Spatial relative terms are used in this article, such as "below", "below", "above", "above", etc. This is to facilitate the description of the relative relationship between one element or feature and another element or feature, such as Shown in the figure. The true meaning of these relative terms in space includes other directions. For example, when the icon is turned upside down by 180 degrees, the relationship between one element and another element may change from "below" and "below" to "above" and "above". In addition, in this article The relative narrative in the space used should be interpreted in the same way.

One aspect of the present invention is to provide a manufacturing method of the circuit board 100. FIGS. 1A to 10A show three-dimensional schematic diagrams of a method for manufacturing a circuit board in different process stages according to an embodiment of the present invention. FIGS. 1B-10B show schematic cross-sectional views of the method for manufacturing a circuit board according to an embodiment of the present invention, which are respectively cut along the line B-B in FIGS. 1A-10A at different process stages. FIGS. 1C to 10C show top views of the method of manufacturing a circuit board according to an embodiment of the present invention in different process stages. First, as shown in FIGS. 1A to 1C, a substrate 110 is provided. In an embodiment, the substrate 110 may be, for example, a glass substrate, a ceramic substrate, a silicon substrate, or a polymer glass fiber composite substrate.

As shown in FIGS. 2A to 2C, a plurality of through holes 111 are formed in the substrate 110. Then, as shown in FIGS. 3A to 3C, a seed layer 120 is formed on the surface of the substrate 110 and in the through hole 111. The method for forming the seed layer 120 includes, but is not limited to, a physical method, such as sputtering titanium copper, or a chemical method, such as electroplating palladium copper.

Then, as shown in FIGS. 4A to 4C, a patterned photoresist layer 130 is formed on the opposite surfaces 121 and 122 of the seed layer 120, wherein the patterned photoresist layer 130 exposes the opposite surfaces 121 and 122 of the seed layer 120. 122 area 131 and area 132. The area 131 exists on the perforation 111 and a part of the seed layer 120 surrounding the perforation 111, and the area 132 exists on a part of the seed layer 120. It should be noted that the patterned photoresist layer 130 covers part of the perforation 111 in this article, which will be beneficial for the following The formation of the perforated wiring portion 140 with a special shape in one step enables the present invention to have special technical effects, which will be described in more detail below.

As shown in FIGS. 5A to 5C, a plurality of perforated wiring portions 140, an upper circuit structure 150 and a lower circuit structure 160 are formed on the exposed seed layer 120. Specifically, each perforation wiring portion 140 is formed on the surface of each perforation 111 covered by the seed layer 120, and extends to the surface of the area 131 exposed by the seed layer 120 outside the perforation 111, and the upper circuit structure 150 And the lower circuit structure 160 is formed on the exposed area 132 of the seed layer 120. In some embodiments, the formation method of the perforated wiring portion 140, the upper circuit structure 150 and the lower circuit structure 160 may be, for example, an electroplating process. In an embodiment, the perforated wiring portion 140 may be, for example, copper, silver, gold, or other highly conductive materials.

As shown in FIGS. 6A to 6C, the patterned photoresist layer 130 is removed. Then, as shown in FIGS. 7A to 7C, the seed layer 120 that is not covered by the perforated wiring portion 140, the upper circuit structure 150 and the lower circuit structure 160 is removed to form a patterned seed layer 120.

Furthermore, as shown in FIGS. 8A to 8C, at least one conductive solder 170 is filled in the remaining space of one of the through holes 111. In one embodiment, the conductive solder 170 may be lead-free solder, tin beryllium (SnBe), tin silver copper (SnAgCu), tin lead (SnPb), or tin antimony (SnSb), for example.

As shown in Figures 9A-9C, cut along the line L to get To multiple circuit boards 100. In other words, after performing the steps depicted in FIGS. 1A to 9C above, a plurality of circuit boards 100 are formed. In short, as shown in FIGS. 10A to 10C, the circuit board 100 includes a substrate 110, a plurality of perforated wiring portions 140, an upper circuit structure 150, a lower circuit structure 160, and at least one conductive solder 170. In various embodiments, the substrate 110 includes a top surface 112, a bottom surface 113 opposite to the top surface 112, a side surface 114, and a plurality of concave surfaces 115. The side surface 114 connects the top surface 112 and the bottom surface 113. The concave surface 115 is recessed inward from the side surface 114 and extends from the top surface 112 to the bottom surface 113.

In some embodiments, the perforated wiring portions 140 are each disposed on a corresponding one of the concave surface 115, wherein there is a gap 142 between the edge 141 of each perforated wiring portion 140 and the side surface 114, so as to expose the concave surface 115 adjacent to the side surface 114. Part. In other words, the perforated wiring portion 140 does not contact the side surface 114 of the substrate 110. The upper circuit structure 150 is disposed on the substrate 110, the lower circuit structure 160 is disposed under the substrate 110, and one or more of the perforated wiring portions 140 are electrically connected to the upper circuit structure 150 and/or the lower circuit structure 160. In one embodiment, at least one conductive solder 170 is filled in one of the concave surfaces 115 and covers the exposed part of one of the concave surfaces 115.

Another aspect of the present invention is to provide a manufacturing method of the assembly structure 400. FIG. 11A and FIG. 12A are top views of a method of manufacturing an assembly structure according to an embodiment of the present invention at a certain process stage. Figures 11B and 12B illustrate the method of manufacturing an assembly structure according to an embodiment of the present invention in a certain process stage, respectively A schematic cross-sectional view taken along the line B-B in FIGS. 11A and 12A. First, as shown in FIG. 11A and FIG. 11B, a first circuit board 200 is provided.

In various embodiments, the first circuit board 200 includes a first substrate 210, a plurality of first perforated wiring portions 240 and at least one conductive solder 270. In some embodiments, the first substrate 210 includes a first top surface 212, a first bottom surface 213 opposite to the first top surface 212, a first side surface 214, and a plurality of first concave surfaces 215. The first side surface 214 connects the first top surface 212 and the first bottom surface 213. The first concave surface 215 is recessed inward from the first side surface 214 and extends from the first top surface 212 to the first bottom surface 213.

In some embodiments, each first perforated wiring portion 240 is disposed on a corresponding one of the first concave surface 215, and there is a first edge 241 and the first side surface 214 between the first edge 241 of each first perforated wiring portion 240 and the first side surface 214. The space 242 exposes a portion of the first concave surface 215 adjacent to the first side surface 214.

In one embodiment, at least one conductive solder 270 is filled in one of the first concave surfaces 215 and covers the exposed part of one of the first concave surfaces 215. The manufacturing method and material of the first circuit board 200 are as described above, and will not be repeated here.

Next, the second circuit board 300 is provided. In various embodiments, the second circuit board 300 includes a second substrate 310 and a plurality of second perforated wiring portions 340. In some embodiments, the second substrate 310 includes a second substrate 310 disposed on the second substrate 310 relative to the first concave surface 215. The multiple second concave surfaces 315 of the side surface 314, each of the second perforated wiring portions 340 is disposed on a corresponding one of the second concave surfaces 315. The manufacturing method and material of the second circuit board 300 are as described above, and will not be repeated here.

Then, as shown in FIGS. 12A and 12B, the at least one conductive solder 270 on the first through-hole wiring portion 240 and the corresponding second through-hole wiring portions 340 are joined, so that at least one conductive solder 270 is connected to each of the first through-hole wiring portions 340. A perforated wiring portion 240 and each second perforated wiring portion 340, and the first side surface 214 contacts the second side surface 314 to form the assembly structure 400. In detail, at least one conductive solder 270 melts after being heated, and flows along each second concave surface 315 adjacent to the exposed part of the second side surface 314 and the second perforated wiring portion 340 to join the first circuit board 200 To the second circuit board 300, the connection between the first circuit board 200 and the second circuit board 300 is formed.

In summary, the perforated wiring portion of the embodiment of the present invention is formed by using a patterned photoresist layer. Specifically, due to the gap between the edge of the perforated trace and the side surface of the substrate, when the first circuit board and the second circuit board are joined, there is no gap between the first concave surface that is not filled with conductive solder and the corresponding second concave surface. Will touch and conduct electricity. In other words, the conductive solder can be selectively filled to make one or more of the contacts of the circuit board appear in a conductive state or a non-conductive state.

In addition, when the upper circuit structure and/or the lower circuit structure are formed on both sides of the substrate, the upper circuit structure and/or the lower circuit structure can be electrically connected to the perforated wiring portion on the substrate. Therefore, the present invention The assembly structure of the Ming embodiment can be designed and applied to a multi-layer or complex structure circuit board.

Another aspect of the present invention is to provide an assembly structure 400, as shown in FIGS. 12A and 12B. The assembly structure 400 includes a first circuit board 200 and a second circuit board 300. In various embodiments, the first circuit board 200 includes a first substrate 210, a plurality of first perforated wiring portions 240, a first upper circuit structure 250 disposed on the first substrate 210, and The lower first lower circuit structure 260 and at least one conductive solder 270. In some embodiments, the first substrate 210 includes a first top surface 212, a first bottom surface 213 opposite to the first top surface 212, a first side surface 214, and a plurality of first concave surfaces 215. The first side surface 214 connects the first top surface 212 and the first bottom surface 213, and the first concave surface 215 is recessed inward from the side surface and extends from the first top surface 212 to the first bottom surface 213.

In some embodiments, the second circuit board 300 includes a second substrate 310, a plurality of second perforated wiring portions 340, a second upper circuit structure 350 disposed on the second substrate 310, and a second substrate 310 underneath. The second lower wiring structure 360. The second substrate 310 has a plurality of second concave surfaces 315 disposed on the second side surface 314 of the second substrate 310 relative to the first concave surface 215, wherein the first side surface 214 is in contact with the second side surface 314.

In some embodiments, the first perforated wiring portions 240 are each disposed on a corresponding one of the first concave surface 215, and there is a first gap 242 between the first edge 241 and the first side surface 214, so as to expose Each first concave surface 215 abuts a part of the first side surface 214. Similarly, the second perforated wiring portions 340 are each disposed on a corresponding one of the second concave surface 315, and there is a second interval 342 between the second edge 341 and the second side surface 314, so as to expose the second concave surface 315 to be adjacent to each other. Part of the second side 314. In other embodiments, one or more of the first perforated wiring portions 240 are electrically connected to a first upper circuit structure 250 and/or a first lower circuit structure 260. Similarly, one or more of the second perforated wiring portions 340 are electrically connected to the second upper circuit structure 350 and/or the second lower circuit structure 360.

In one embodiment, at least one conductive solder 270 is filled in one of the first concave surfaces 215 and covers the exposed part of the one of the first concave surfaces 215, and extends from each first perforated wiring portion 240 to a corresponding one The second perforated wiring portion 340.

13 to 23 are schematic cross-sectional views of a method of manufacturing a circuit board in different process stages according to another embodiment of the present invention. The method of manufacturing the circuit board 500 of this embodiment is similar to the method of manufacturing the circuit board 100 described above. Please refer to Figures 13-16 and Figures 1A~1C at the same time. The difference between this embodiment and the steps shown in Figures 1A~1C is that the step of providing the substrate 520 includes: drilling holes along the line L to drill holes on the carrier plate A plurality of through holes 509 are formed in 506, and then a dielectric layer 510 is formed to cover the surface of the internal circuit structure 505 and fill each through hole 509 to form a substrate 520. In detail, as shown in FIG. 13, first, an internal circuit structure 505 is provided.

For example, the internal circuit structure 505 includes a carrier board 506, a plurality of conductive blind vias 507, and a circuit layer 508. The conductive blind holes 507 are located in the supporting board 506, and the circuit layer 508 is located on opposite sides of the supporting board 506 and can extend to the conductive blind holes 507. The method for forming the circuit layer 508 can be, for example, as follows: first, a photoresist layer (not shown), such as a dry film, is formed on the carrier plate 506, and then the photoresist layer is patterned to expose a part of the circuit layer 508 through a lithography process, and then The electroplating process and the removal process of the photoresist layer are performed to form the circuit layer 508. The material of the circuit layer 508 can be, for example, copper, silver, gold, or other highly conductive materials.

Next, as shown in FIGS. 14 and 15, drill holes along the line L to form a plurality of perforations 509 in the carrier plate 506. As shown in FIG. 16, a dielectric layer 510 is formed to cover the surface of each internal circuit structure 505 and fill each through hole 509 to form a substrate 520. In short, the substrate 520 includes an internal circuit structure 505 and a dielectric layer 510. The internal circuit structure 505 includes a carrier plate 506, a plurality of conductive blind holes 507, a circuit layer 508, and a plurality of through holes 509. The dielectric layer 510 may be, for example, photosensitive dielectric material (PID), polyimide (PI), build-up material (ABF), resin, or polymer glass fiber composite material.

Please refer to Figure 17 and Figures 2A to 2C at the same time. The difference between the steps shown in this embodiment and Figures 2A to 2C is that the step of forming a plurality of through holes 521 in the substrate 520 includes: leaving a portion of the through holes when forming the through holes 521 The electrical layer 510 is formed on the wall of the hole to form a plurality of blind vias 511 in the dielectric layer 510 to expose a part of the circuit layer 508. The method of forming the blind via 511 includes, but is not limited to, laser burning the dielectric layer 510 Laser ablation, or the material of the dielectric layer 510 is a photosensitive dielectric material to be exposed and developed to form via blind holes 511.

Next, please refer to Figures 18-21 and Figures 3A-7C at the same time. This embodiment is similar to the steps shown in Figures 3A-7C. The difference from the step shown in FIG. 7C is that the patterned seed layer 530 of this embodiment is not only provided on the dielectric layer 510 of the substrate 520, but also provided on the inner surface of the via 511, and the through hole 521 On the surface of the dielectric layer of the hole wall and the partially exposed dielectric layer 510, the upper circuit structure 560 and the lower circuit structure 570 are formed on the seed layer 530 and fill the remaining space of the via hole 511.

Please refer to Fig. 22 and Figs. 8A to 8C at the same time. The step difference between this embodiment and Figs. 8A to 8C is that the step of filling at least one conductive solder 580 in the remaining space of one of the through holes 521 includes: forming insulation The protective layer 590 is on the exposed dielectric layer 510 and on the upper circuit structure 560 and the lower circuit structure 570, wherein the insulating protective layer 590 has a plurality of openings 590o, so that part of the surface of the upper circuit structure 560 and the lower circuit structure 570 is exposed to the openings In 590o, then, a conductive layer 593 is formed on the exposed surface of each opening 590o. In an embodiment, the material of the conductive layer 593 may be gold, for example.

FIG. 24A is a top view of a method of manufacturing a circuit board in a certain process stage according to another embodiment of the present invention. Fig. 24B illustrates a method for manufacturing a circuit board according to another embodiment of the present invention, cutting along the line B-B in Fig. 24A at a certain process stage Schematic diagram of the cross section. Please refer to Figures 23~24B and Figures 9A~10C at the same time. After cutting along the line L, multiple circuit boards 500 as shown in Figures 24A and 24B can be obtained. This embodiment is similar to Figures 9A~10C. The difference between the steps shown in the figure is that there is a region 595 (for example, a micro-light emitting diode micro-LED) formed on the insulating protective layer 590 and the conductive layer 593 of each circuit board 500 where components can be arranged. This embodiment can be applied to a display panel arranged in a matrix with micro LEDs. In short, as shown in FIGS. 24A and 24B, the circuit board 500 includes a substrate 520, a perforated wiring portion 550, and an upper circuit structure 560 disposed on the substrate 520 and a lower circuit structure disposed below the substrate 520 570 and at least one conductive solder 580. In various embodiments, the substrate 520 includes a top surface 522, a bottom surface 523 opposite to the top surface 522, a side surface 524, and a plurality of concave surfaces 525. The side surface 524 connects the top surface 522 and the bottom surface 523. The concave surface 525 is recessed inward from the side surface 524 and extends from the top surface 522 to the bottom surface 523.

In some embodiments, the perforated wiring portions 550 are each disposed on a corresponding one of the concave surface 525, and there is a gap 552 between the edge 551 of each perforated wiring portion 550 and the side surface 524, so as to expose the concave surface 525 adjacent to the side surface 524. Part. In other words, the perforated wiring portion 550 does not contact the side surface 524 of the substrate 520. In other embodiments, one or more of the perforated wiring portions 550 are electrically connected to the upper circuit structure 560 and/or the lower circuit structure 570. In one embodiment, at least one conductive solder 580 is filled in one of the concave surfaces 525 and covers the exposed part of the one of the concave surfaces 525.

FIG. 25A and FIG. 26A are top views of a method of manufacturing an assembly structure according to another embodiment of the present invention at a certain process stage. FIGS. 25B and 26B are schematic cross-sectional views of the method for manufacturing an assembly structure according to another embodiment of the present invention, which are respectively cut along the line B-B in FIGS. 25A and 25A at different process stages. First, as shown in FIGS. 25A and 25B, a first circuit board 600 is provided. In short, the first circuit board 600 includes a first substrate 620, a plurality of first perforated wiring portions 650, a first upper circuit structure 660, a first lower circuit structure 670, and at least one conductive solder 680, wherein the first substrate 620 includes a first top surface 622, a first bottom surface 623, a first side surface 624, and a plurality of first concave surfaces 625. In various embodiments, there is a first gap 652 between the first edge 651 of each first perforated wiring portion 650 and the first side surface 624 to expose a portion of each first concave surface 625 adjacent to the first side surface 624.

For the manufacturing method and specific implementation of the first circuit board 600, please refer to the manufacturing method and implementation of the circuit board 500 in Figures 13-24B. For simplicity, it will not be repeated here. For example, the first substrate 620, the first top surface 622, the first bottom surface 623, the first side surface 624, the first concave surface 625, the first perforated wiring portion 650, the first edge 651, the first space 652, the first The upper circuit structure 660, the first lower circuit structure 670, and the at least one conductive solder 680 can refer to the substrate 520, the top surface 522, the bottom surface 523, the side surface 524, the concave surface 525, the perforated wiring portion 550, the edge 551, and the edge 551 of the circuit board 500, respectively. Interval 552, upper line structure 560, lower line structure 570, and At least one conductive solder 580.

Next, a second circuit board 700 is provided. In short, the second circuit board includes a second substrate 720, a plurality of second perforated wiring portions 750, a second upper circuit structure 760, and a second lower circuit structure 770, wherein the second substrate 720 includes a concave surface opposite to the first A plurality of second concave surfaces 725 provided on the second side surface 724 of the second substrate 720. In various embodiments, there is a second gap 752 between the second edge 751 of each second perforated wiring portion 750 and the second side surface 724 to expose a portion of each second concave surface 725 adjacent to the second side surface 724.

For the manufacturing method and specific implementation of the second circuit board 700, please refer to the manufacturing method and implementation of the circuit board 500 in Figures 13-24B. For the sake of simplicity, it will not be repeated here. For example, the second substrate 720, the second side surface 724, the second concave surface 725, the second perforated wiring portion 750, the second edge 751, the second spacer 752, the second upper circuit structure 760, and the second lower circuit structure 770 Reference may be made to the substrate 520, the side surface 524, the concave surface 525, the perforated wiring portion 550, the edge 551, the space 552, the upper circuit structure 560, and the lower circuit structure 570 of the circuit board 500, respectively.

Then, as shown in FIGS. 26A and 26B, at least one conductive solder 680 on the first through-hole wiring portion 650 and the corresponding second through-hole wiring portions are joined, so that at least one conductive solder 680 is connected to each first through hole. The perforated wiring portion 650 and each of the second perforated wiring portions 750, and the first side surface 624 contacts the second side surface 724 to form the assembly structure 800. The manufacturing method of the assembly structure 800 of this embodiment is similar to the 11A~ The manufacturing method of the assembly structure 400 in FIG. 12B is the same, so it will not be repeated here.

After the steps in Figures 25A to 26B are completed, an assembly structure 800 according to another embodiment of the present invention is formed. The specific implementation of the assembling structure 800 in this embodiment can refer to the implementation of the assembling structure 400 in FIG. 12A and FIG. 12B, which will not be repeated here.

From the above detailed description of the specific embodiments of the present invention, it is obvious that the circuit board of the present invention is formed with perforated traces on the concave surface of the side surface of the substrate, and the concave surface is filled with conductive solder, so that the concave surface filled with the conductive solder becomes The joint is joined with the concave surface of another circuit board. When it is applied to the display panel of a liquid crystal screen, the screen-to-body ratio can be increased. In addition, by using the present invention as a small-sized panel and other panels arranged in matrix and spliced horizontally, a large-scale LED display panel can be formed, thereby greatly reducing the area occupied by the connection points between the joints and achieving seamless vision. effect.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the definition of the attached patent application scope.

100‧‧‧Circuit board

112‧‧‧Top surface

114‧‧‧ side

115‧‧‧Concave

140‧‧‧Perforated wiring part

141‧‧‧Edge

142‧‧‧Interval

150‧‧‧Superior circuit structure

160‧‧‧Lower line structure

170‧‧‧Conductive solder

Line B-B‧‧‧

Claims (10)

A circuit board includes: a substrate, including a top surface, a bottom surface opposite to the top surface, a side surface, and a plurality of concave surfaces, the side surface connects the top surface and the bottom surface, and the concave surfaces are recessed inward from the side surface. Extending from the top surface to the bottom surface; and a plurality of perforated wiring portions are each disposed on a corresponding one of the concave surfaces, wherein there is a gap between an edge of each perforated wiring portion and the side surface to expose Each of the concave surfaces adjoins a part of the side surface. The circuit board according to claim 1, wherein the perforated wiring portions do not contact the side surface of the substrate. The circuit board according to claim 1, wherein the circuit board further includes an upper circuit structure disposed on the substrate and a lower circuit structure disposed below the substrate, one of the perforated wiring portions or A plurality of electrical connections are made to the upper circuit structure and/or the lower circuit structure. The circuit board according to claim 1, wherein the circuit board further comprises at least one conductive solder filled in one of the concave surfaces and covering the exposed part of the one of the concave surfaces. An assembly structure includes: a first circuit board, including: a first substrate, including a first top surface, a first bottom surface opposite to the first top surface, a first side surface, and a plurality of first concave surfaces, The first side surface connects the first top surface and the first bottom surface, the first concave surfaces are recessed inward from the side surface and extend from the first top surface to the first bottom surface; a plurality of first perforated wiring portions, Each is disposed on a corresponding one of the first concave surfaces; and at least one conductive solder is filled in one of the first concave surfaces; and a second circuit board, including: a second substrate having an opposite to the first concave surface A concave surface is provided on a plurality of second concave surfaces of a second side surface of the second substrate, wherein the first side surface is in contact with the second side surface; and a plurality of second perforated wiring portions are respectively provided on the second concave surfaces On the corresponding one of, the at least one conductive solder extends from each of the first through-hole wiring portions to the corresponding second through-hole wiring portions. The assembly structure according to claim 5, wherein there is a first gap between a first edge of each of the first perforated wiring portions and the first side surface, so as to expose the first concave surface adjacent to the first side surface. Part, and there is a second gap between a second edge of each second perforated wiring portion and the second side surface to expose Each of the second concave surfaces is adjacent to a part of the second side surface, wherein the at least one conductive solder covers the exposed part of the one of the first concave surfaces and extends to the corresponding second perforated wiring portions. The assembly structure according to claim 5, wherein the first circuit board includes a first upper circuit structure disposed on the first substrate, and a first lower circuit structure under the first substrate, the The second circuit board includes a second upper circuit structure disposed on the second substrate, and a second lower circuit structure under the second substrate, wherein one or more of the first perforated wiring portions Are electrically connected to the first upper circuit structure and/or the first lower circuit structure, and one or more of the second perforated wiring portions are electrically connected to the second upper circuit structure and/or the first lower circuit structure 2. Lower line structure. A manufacturing method of an assembly structure includes the following steps: providing a first circuit board, the first circuit board including a first substrate, a plurality of first perforated wiring portions and at least one conductive solder, the first substrate including a first substrate A top surface, a first bottom surface opposite to the first top surface, a first side surface, and a plurality of first concave surfaces, the first side surface connects the first top surface and the first bottom surface, the first concave surfaces are formed by The first side surface is recessed inward and extends from the first top surface to the first bottom surface, and each of the first perforated wiring portions is disposed on the first On a corresponding one of a concave surface, the at least one conductive solder is filled in one of the first concave surfaces; a second circuit board is provided, and the second circuit board includes a second substrate and a plurality of second perforated wiring portions, The second substrate includes a plurality of second concave surfaces disposed on a second side surface of the second substrate relative to the first concave surfaces, and each of the second perforated wiring portions is disposed on a corresponding one of the second concave surfaces And joining the at least one conductive solder on the first through-hole wiring portions and the corresponding second through-hole wiring portions, so that the at least one conductive solder connects each of the first through-hole wiring portions and the first Two perforated wiring parts, and the first side surface contacts the second side surface. The manufacturing method of the assembly structure according to claim 8, wherein in the step of providing the first circuit board, there is a first gap between a first edge of each of the first perforated wiring portions and the first side surface , Each exposed first concave surface is adjacent to a part of the first side surface, the at least one conductive solder covers the exposed part of one of the first concave surfaces, and in the step of providing the second circuit board, each There is a second interval between a second edge of the second perforated wiring portion and the second side surface, so as to expose a part of each of the second concave surfaces adjacent to the second side surface. The manufacturing method of the assembly structure according to claim 9, wherein in the step of joining the at least one conductive solder on the first through-hole wiring portions and the corresponding second through-hole wiring portions, The at least one conductive solder flows along the exposed portion of each second concave surface adjacent to the second side surface and the second perforated wiring portions to join the first circuit board to the second circuit board.

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