TWI704854B - Circuit board structure and manufacturing method thereof, display device having circuit board structure and manufacturing method thereof - Google Patents

Abstract

A circuit board structure including an insulating substrate, a plurality of connection pads, a circuit layer, and a plurality of conductive holes is provided. The insulating substrate has a first surface and a second surface opposite to each other. The connection pads are disposed on the first surface of the insulating substrate. The circuit layer is disposed on the second surface of the insulating substrate. The conductive holes penetrate through the insulating substrate. The connection pads overlap the conductive holes.

Description

Circuit board structure and manufacturing method thereof, display device with circuit board structure and manufacturing method thereof

The invention relates to an electronic component and a manufacturing method thereof, and more particularly to a circuit board structure and a manufacturing method thereof, a display device with a circuit board structure and a manufacturing method thereof.

The circuit board often has a solder mask on the side where the electronic components are arranged. The solder mask needs to be opened to connect with the circuit board. However, the solder mask window has size limitations and alignment problems.

The present invention provides a circuit board structure and a manufacturing method thereof, which can have better flatness or a higher number of components in application.

The manufacturing method of the circuit board structure of the present invention includes the following steps. Provide insulating base material. The insulating substrate has a first surface and a second surface opposite to each other, and a plurality of through holes connecting the first surface and the second surface. A conductive material layer is formed on the insulating substrate to cover the first surface and the second surface, and the conductive material layer is filled into the through holes to form a plurality of through holes. Part of the conductive material layer on the first surface is removed to form a plurality of connection pads, wherein the plurality of connection pads overlap the plurality of via holes. Part of the conductive material layer on the second surface is removed to form a circuit layer.

The circuit board structure of the present invention includes an insulating substrate, a plurality of connecting pads, a circuit layer and a plurality of via holes. The insulating substrate has a first surface and a second surface opposite to each other. The connection pad is located on the first surface of the insulating substrate. The circuit layer is located on the second surface of the insulating substrate. The via hole penetrates the insulating substrate. A plurality of connection pads overlap a plurality of via holes.

In an embodiment of the present invention, on the first surface, there is no circuit between the plurality of connection pads.

In an embodiment of the present invention, there are only a plurality of connection pads on the first surface.

In an embodiment of the present invention, the plurality of vias and the plurality of connection pads are arranged in a one-to-one manner.

In an embodiment of the present invention, the projection range of the plurality of via holes on the first surface is completely within the projection range of the plurality of connection pads on the first surface.

In an embodiment of the present invention, the plurality of through holes are solid through holes.

In an embodiment of the present invention, the diameter of the via hole is less than 50 microns.

Based on the above, the circuit board structure and the manufacturing method thereof of the present invention can have better flatness or a higher number of components in application.

The present invention provides a display device and a manufacturing method thereof, which have better flatness or a higher number of display elements.

The display device of the present invention includes the aforementioned circuit board structure and display elements. The display element is arranged on the first surface of the insulating substrate of the circuit board structure. The display element is electrically connected to a plurality of connection pads of the circuit board structure. The display element is a micro light emitting diode (Micro LED) or a sub-millimeter light emitting diode (mini LED).

The manufacturing method of the display device of the present invention includes the following steps. Provide the aforementioned circuit board structure. The display element is arranged on the first surface of the insulating substrate of the circuit board structure, and the display element is electrically connected to the plurality of connection pads of the circuit board structure. The display element is a micro light emitting diode or a sub-millimeter light emitting diode.

Based on the above, the display device and the manufacturing method thereof of the present invention include or use the circuit board structure of the present invention, and therefore have better flatness or a higher number of display elements.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

The foregoing and other technical content, features and effects of the present invention will be clearly presented in the detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: "up", "down", "front", "rear", "left", "right", etc., are just directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present invention. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

1A to 1C are schematic partial cross-sectional views of a part of a manufacturing method of a circuit board structure according to a first embodiment of the present invention. FIG. 1D is a schematic partial top view of a circuit board structure according to the first embodiment of the present invention. FIG. 1E is a schematic partial bottom view of a circuit board structure according to the first embodiment of the present invention.

1A, an insulating substrate 110 is provided. In this embodiment, the insulating substrate 110 may be a hard substrate or a flexible substrate, which is not limited in the present invention. For example, the material of the aforementioned hard substrate includes polymer glass fiber composite materials, glass, ceramics or other hard materials, and the material of the aforementioned flexible substrate is, for example, polyimide (PI) or Other flexible materials. The insulating substrate 110 may be a single-layer board or a composite board, which is not limited in the present invention.

The insulating substrate 110 has a first surface 111, a second surface 112 and a plurality of through holes 113. The second surface 112 is opposite to the first surface 111. The through hole 113 connects the first surface 111 and the second surface 112. The through hole 113 can be formed by mechanical drilling, laser drilling, etching or other suitable methods, and is not limited in the present invention.

It is worth noting that in FIG. 1A, only one of the through holes 113 is exemplarily shown, but the number of the through holes 113 is not limited in the present invention.

In this embodiment, the aperture 113a of the through hole 113 may be less than 50 microns (micrometer; μm), but the present invention is not limited thereto.

1B, a conductive material layer 120 is formed on the insulating substrate 110. The conductive material layer 120 can be a single-layer structure or a multi-layer structure, which is not limited in the present invention. For example, a seed layer can be formed by sputtering. Then, an electroplating layer can be formed on the aforementioned seed layer by electroplating. However, the present invention does not limit the material or formation method of the conductive material layer 120.

The conductive material layer 120 includes a first conductive portion 121, a second conductive portion 122 and a third conductive portion 123. The first conductive portion 121 covers the first surface 111 of the insulating substrate 110. The second conductive portion 122 covers the second surface 112 of the insulating substrate 110. The third conductive portion 123 is filled in the through hole 113 of the insulating substrate 110.

In this embodiment, the third conductive portion 123 can be completely filled in the through hole 113 of the insulating substrate 110. In other words, the through hole 113 may be completely filled by the third conductive portion 123 without voids, but the present invention is not limited thereto.

Referring to FIGS. 1B to 1C, a portion of the first conductive portion 121 on the first surface 111 is removed to form a plurality of connection pads 141. In addition, part of the second conductive portion 122 on the second surface 112 is removed to form at least the circuit layer 152. It should be noted that the present invention does not limit the formation sequence of the connection pad 141 and the circuit layer 152. In addition, the third conductive portion 123 filled in the through hole 113 may constitute the through hole 163.

The connection pad 141 and/or the circuit layer 152 can be formed by, for example, etching, laser peeling or other suitable methods, which are not limited in the present invention. The formation method of the connection pad 141 and the circuit layer 152 can be the same or different, which is not limited in the present invention. In addition, the layout of the circuit layer 152 can be adjusted according to design requirements, which is not limited in the present invention.

After the above-mentioned manufacturing process, the fabrication of the circuit board structure 100 of this embodiment can be substantially completed.

1C to 1E, the circuit board structure 100 includes an insulating substrate 110, a plurality of connection pads 141, a circuit layer 152, and a plurality of via holes 163. The insulating substrate 110 has a first surface 111 and a second surface 112 opposite to each other. The connection pad 141 is located on the first surface 111 of the insulating substrate 110. The circuit layer 152 is located on the second surface 112 of the insulating substrate 110. The via hole 163 penetrates the insulating substrate 110. The connection pad 141 overlaps the via hole 163.

In this embodiment, on the first surface 111, there are no lines between the plurality of connection pads 141 (they are not shown because they are not). Therefore, if other elements (such as the display element 580 in the subsequent embodiment) need to be arranged on the first surface 111, the formation of a solder resist layer on the first surface 111 may be omitted. In this way, the problem of size limitation and alignment of the solder mask window of the solder mask can be reduced.

In this embodiment, there are only a plurality of connection pads 141 on the first surface 111. In this way, the number of connection pads 141 per unit area on the first surface 111 can be increased; or, the distribution density of the connection pads 141 can be increased.

In this embodiment, the number of the vias 163 is multiple, the number of the connection pads 141 is multiple, and the vias 163 and the connection pads 141 can be arranged in a one-to-one manner. In other words, the number of vias 163 may be the same as the number of connection pads 141.

In this embodiment, the projection range of the via 163 on the first surface 111 is completely within the projection range of the connection pad 141 on the first surface 111.

In this embodiment, the plurality of through holes 163 are solid through holes. Therefore, if other components (such as the display component 580 in the subsequent embodiment) need to be arranged on the first surface 111, the conductive adhesive material (such as the conductive paste 590 in the subsequent embodiment) can be reduced from flowing into the through hole 113. In this way, the possibility of uneven surface can be reduced, and the overall flatness can be improved.

In this embodiment, the aperture 163a of the via hole 163 may be less than 50 microns.

2 is a schematic partial cross-sectional view of a circuit board structure according to a second embodiment of the present invention. The manufacturing method of the circuit board structure 200 of this embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment. Similar components are denoted by the same reference numerals and have similar functions, materials or formation methods, and descriptions are omitted. .

The circuit board structure 200 of this embodiment is similar to the circuit board structure 100 of the first embodiment, except that the circuit board structure 100 may further include an insulating layer 270. The insulating layer 270 is located on the second surface 112 of the insulating substrate 110, and the insulating layer 270 covers at least a part of the circuit layer 152.

In this embodiment, the insulating layer 270 may be a single-layer structure or a multilayer structure, which is not limited in the present invention.

In this embodiment, the insulating layer 270 can be a cover layer or a solder mask, which is not limited in the present invention.

In this embodiment, the insulating layer 270 may have an insulating opening 271, so that the circuit layer 152 can penetrate the insulating opening 271 of the insulating layer 270 to be electrically connected to other conductive elements (not shown).

3 is a schematic partial cross-sectional view of a circuit board structure according to a third embodiment of the present invention. The manufacturing method of the circuit board structure 300 of this embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and descriptions are omitted .

The circuit board structure 300 of this embodiment is similar to the circuit board structure 100 of the first embodiment, except that the via 363 has a core conductive layer 364. In other words, the via hole 363 may include the third conductive part 123 and the core conductive layer 364. The via hole 363 can be formed by multiple plating.

In addition, in the process of forming the via 363, if the third conductive portion 123 is not completely filled in the via 113 of the insulating substrate 110, the core conductive layer 364 can make the via 363 a solid via.

4 is a schematic partial cross-sectional view of a circuit board structure according to a fourth embodiment of the present invention. The manufacturing method of the circuit board structure 400 of this embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and descriptions are omitted. .

The circuit board structure 400 of this embodiment is similar to the circuit board structure 100 of the first embodiment, except that the via 463 has a core insulating layer 465. In other words, the via hole 463 may include the third conductive part 123 and the core insulating layer 465. The material of the core insulating layer 465 may include resin, ink or other suitable curable materials, which is not limited in the present invention.

In addition, in the process of forming the via hole 463, if the third conductive portion 123 is not completely filled in the via hole 113 of the insulating substrate 110, the core insulating layer 465 can make the via hole 463 a solid via.

In summary, the circuit board structure and manufacturing method of the present invention can have better flatness or a higher number of components in application.

5 is a schematic partial cross-sectional view of a display device according to an embodiment of the invention.

Referring to FIG. 5, the manufacturing method of the display device 500 may be as follows.

Provide circuit board structure. In this embodiment, the circuit board structure used is the circuit board structure 100 of the first embodiment as an example, but in other embodiments not shown, a circuit board structure similar to the circuit board structure 100 can be used ( For example: the same or similar circuit board structure 200, circuit board structure 300, circuit board structure 400). In other words, in the following description, the circuit board structure uses the circuit board structure 100 used as an example as a label and description, and its similar components are denoted by the same reference numerals and have similar functions, materials or formation methods. And omit the description.

5, the display element 580 is arranged on the first surface 111 of the insulating substrate 110 of the circuit board structure 100, and the display element 580 is electrically connected to the plurality of connection pads 141 of the circuit board structure 100.

In this embodiment, the display element 580 can be electrically connected to the connection pad 141 by flip chip bonding. For example, the display element 580 and the connection pad 141 can be electrically connected by a conductive paste 590 (such as solder paste).

In this embodiment, the through hole 163 is a solid through hole. Therefore, when the display element 580 is arranged on the first surface 111, the flow of the conductive paste 590 into the through hole 113 can be reduced. In this way, the possibility of unevenness on the surface can be reduced, and the overall flatness of the display element 580 can be improved.

In this embodiment, since there is no circuit between the plurality of connection pads 141 on the first surface 111 of the insulating substrate 110 of the circuit board structure 100 (they are not shown). Therefore, when the display element 580 is arranged on the first surface 111, the formation of a solder mask on the first surface 111 can be omitted. In this way, the size limitation and alignment problems of the solder mask window of the solder mask can be reduced, and the size limitation and alignment problems of the display element 580 can also be reduced. In other words, the display element 580 can be a micro light emitting diode (Micro LED) or a sub-millimeter light emitting diode (mini LED), which can improve the resolution and display quality of the display device 500.

In this embodiment, since in the circuit board structure 100, the first surface 111 of the insulating substrate 110 of the circuit board structure 100 only has the connection pad 141. In this way, by increasing the number per unit area or the distribution density of the connection pads 141, the number per unit area or the distribution density of the display device 500 can be further increased, and the resolution and display quality of the display element 580 can be improved.

In summary, the display device and the manufacturing method thereof of the present invention include or use the circuit board structure of the present invention, and therefore have better flatness or a higher number of display elements.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100, 200, 300, 400: circuit board structure

110: Insulating substrate

111: first surface

112: second surface

113: Through hole

113a: Aperture

120: conductive material layer

121: The first conductive part

122: second conductive part

123: third conductive part

141: connection pad

152: circuit layer

163, 363, 463: vias

163a: Aperture

364: core conductive layer

465: core insulation layer

270: Insulation layer

271: Insulated opening

500: display device

580: display element

590: conductive paste

1A to 1C are schematic partial cross-sectional views of a part of a manufacturing method of a circuit board structure according to a first embodiment of the present invention. FIG. 1D is a schematic partial top view of a circuit board structure according to the first embodiment of the present invention. FIG. 1E is a schematic partial bottom view of a circuit board structure according to the first embodiment of the present invention. 2 is a schematic partial cross-sectional view of a circuit board structure according to a second embodiment of the present invention. 3 is a schematic partial cross-sectional view of a circuit board structure according to a third embodiment of the present invention. 4 is a schematic partial cross-sectional view of a circuit board structure according to a fourth embodiment of the present invention. 5 is a schematic partial cross-sectional view of a display device according to an embodiment of the invention.

100: circuit board structure

110: Insulating substrate

111: first surface

141: connection pad

163: Via

163a: Aperture

Claims (8)

A method for manufacturing a circuit board structure includes: providing an insulating substrate having a first surface and a second surface opposite to each other, and a plurality of through holes connecting the first surface and the second surface; Forming a conductive material layer on the insulating substrate to cover the first surface and the second surface, and the conductive material layer is filled into the plurality of through holes to form a plurality of via holes; Remove part of the conductive material layer on the first surface to form a plurality of connection pads, wherein the plurality of connection pads overlap the plurality of vias; and remove part of the conductive material on the second surface The conductive material layer to form a circuit layer. A circuit board structure, comprising: an insulating substrate having a first surface and a second surface opposite to each other; a plurality of connecting pads located on the first surface of the insulating substrate, wherein on the first surface , There is no circuit between the plurality of connection pads, and only the plurality of connection pads are provided on the first surface; a circuit layer is located on the second surface of the insulating substrate; and a plurality of conduction A hole penetrates the insulating substrate, and the plurality of connection pads overlap the plurality of via holes. The circuit board structure according to the second item of the scope of patent application, wherein the plurality of via holes and the plurality of connection pads are arranged in a one-to-one manner. The circuit board structure according to item 2 of the scope of patent application, wherein the projection range of the plurality of via holes on the first surface is completely within the projection range of the plurality of connection pads on the first surface . According to the circuit board structure described in item 2 of the scope of patent application, the plurality of vias are solid vias. According to the circuit board structure described in item 2 of the scope of patent application, the apertures of the plurality of via holes are less than 50 microns. A display device, comprising: the circuit board structure according to the second item of the scope of patent application; and a display element arranged on the first surface of the insulating substrate of the circuit board structure, and the display element The plurality of connection pads electrically connected to the circuit board structure, wherein the display element is a micro light emitting diode (Micro LED) or a sub-millimeter light emitting diode (mini LED). A method for manufacturing a display device includes: providing the circuit board structure as described in item 2 of the scope of patent application; and arranging a display element on the first surface of the insulating substrate of the circuit board structure, and using The display element is electrically connected to the plurality of connection pads of the circuit board structure, wherein the display element is a micro light emitting diode or a sub-millimeter light emitting diode.

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