CN107666770A - Has circuit board of weld pad and preparation method thereof - Google Patents
Has circuit board of weld pad and preparation method thereof Download PDFInfo
- Publication number
- CN107666770A CN107666770A CN201610617488.1A CN201610617488A CN107666770A CN 107666770 A CN107666770 A CN 107666770A CN 201610617488 A CN201610617488 A CN 201610617488A CN 107666770 A CN107666770 A CN 107666770A
- Authority
- CN
- China
- Prior art keywords
- layer
- weld pad
- conductive
- circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of circuit board for having weld pad, including：At least three conductive circuit layer, the circuit board include first surface, formed with the first conductive circuit layer and multiple weld pads on the first surface；The plurality of weld pad is in the weld pad matrix of matrix form arrangement form one, the weld pad matrix includes multiple outer layer weld pads positioned at outermost and multiple center weld pads by outer layer weld pad encirclement, the outer layer weld pad is electrically connected with first conductive circuit layer respectively, and the center weld pad is each independently formed on the first surface.
Description
Technical field
The present invention relates to a kind of circuit board for having weld pad and preparation method thereof.
Background technology
Consumption electronic products are increasingly towards compact and intelligent development, the flexible circuit version as significant components
(FPC) largely used wherein, this requires that FPC realizes high frequency, high speed, slim, circuit densification, and BGA Package
(Ball Grid Array, BGA) is to realize flexible circuit board high frequency, high speed, slim, circuit densification a important step.
Current BGA conductive pads, the weld pad line inside its array need to connect up between weld pad, and weld pad spacing increases therewith, limitation
The high-density trend of weld pad.
The content of the invention
In view of this, it is necessary to which a kind of circuit board that can solve the problem that above-mentioned technical problem and preparation method thereof is provided.
A kind of circuit board for having weld pad, including：
At least three conductive circuit layer, the circuit board include first surface, formed with the first conducting wire on the first surface
Layer and multiple weld pads；Wherein
Multiple weld pads are in the weld pad matrix of matrix form arrangement form one, and the weld pad matrix is included positioned at the multiple of outermost
Outer layer weld pad and the multiple center weld pads surrounded by the outer layer weld pad, the outer layer weld pad are electrical with first conductive circuit layer respectively
Connection, the center weld pad are each independently formed on the first surface.
The formation direction of those the first conductive holes can be with identical or opposite with the formation direction of those the second conductive holes.
Any conductive hole is not connected with those outer layer weld pads, and those first conductive holes are different from those second conductive holes
When be connected to any center weld pad.
A kind of preparation method of the circuit board for the circuit board for having weld pad, its step are as follows：
One first circuit substrate is provided, first circuit substrate includes the first base material layer and opposite positioned at the first base material layer
First copper foil and the second copper foil on two surfaces；
Second copper foil is made to form the second conductive circuit layer；
One second circuit substrate is provided, the second circuit substrate includes the 3rd copper foil and the second substrate layer, by this second
Circuit substrate presses together to form a multi-layer sheet with first circuit substrate, and second conductive circuit layer is located at first base
Between material layer and second substrate layer；
Form multiple first conductive holes and multiple second conductive holes on the multi-layer sheet, first conductive hole through this first
Copper foil and the first base material layer and second conductive circuit layer is electrically connected to, second conductive hole is through the multi-layer sheet and electrical
Connect first copper foil, second conductive circuit layer and the 3rd copper foil；
First copper foil is made to form the first conductive circuit layer and multiple weld pads, the 3rd copper foil is made to form the 3rd
Conductive circuit layer, the plurality of weld pad are in the weld pad matrix of matrix form arrangement form one, and the weld pad matrix is included positioned at outermost
Multiple outer layer weld pads and by the outer layer weld pad surround multiple center weld pads, the outer layer weld pad respectively with first conductive circuit layer
It is electrically connected with, the center weld pad is each independently formed on the first base material layer.
Compared with prior art, circuit board provided by the invention, the weld pad connection first of its weld pad matrix outermost are conductive
Line layer, center weld pad are conducted to second, third conductive circuit layer by conductive hole, make to pass through without weld pad lead between weld pad,
So as to improve the weld pad density of circuit board surface to greatest extent.
Brief description of the drawings
Fig. 1 is the sectional view for the first circuit substrate that first embodiment of the invention provides.
Fig. 2 is the section view that the first copper foil for including the first circuit substrate shown in Fig. 1 forms the second conductive circuit layer
Figure.
Fig. 3 is to provide second circuit substrate, and second circuit substrate and the first circuit substrate are carried out into pressing and form multilayer
The sectional view of plate.
Fig. 4 is the sectional view that the first blind hole and the second blind hole are formed in multi-layer sheet.
Fig. 5 is that the first blind hole and the second blind hole are formed into the first conductive hole to being electroplated in the first blind hole and the second blind hole
With the sectional view of the second conductive hole.
Fig. 6 is the profile for etching away plating in the layers of copper of multilayer plate surface.
Fig. 7 is that the copper foil layer on multiple-plate opposite two surfaces is formed into the first conductive circuit layer and the 3rd conductor wire respectively
The sectional view of road floor.
Fig. 8 is the top view of pad arrays.
Main element symbol description
| Has the circuit board of high density weld pad | 100 |
| First circuit substrate | 10 |
| First copper foil | 11 |
| Second copper foil | 13 |
| The first base material layer | 12 |
| Multi-layer sheet | 30 |
| Weld pad | 111 |
| Weld pad matrix | 112 |
| First blind hole | 301 |
| Second blind hole | 302 |
| First conductive hole | 304 |
| Copper plate | 306 |
| Second conductive hole | 305 |
| Second circuit substrate | 20 |
| Adhesive-layer | 23 |
| Second substrate layer | 22 |
| 3rd copper foil | 21 |
| Outer layer weld pad | 114 |
| Center weld pad | 116 |
| Second conductive circuit layer | 130 |
| First conductive circuit layer | 110 |
| 3rd conductive circuit layer | 210 |
| First surface | 101 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Below in conjunction with drawings and Examples, to circuit board of tool high density weld pad provided by the invention and preparation method thereof
It is described in further detail.
Fig. 1-8 are referred to, for a kind of making side for the circuit board 100 for having high density weld pad provided in an embodiment of the present invention
Method, it includes step：
The first step, it refer to Fig. 1, there is provided first circuit substrate 10.
First circuit substrate 10 include the first base material layer 12 and positioned at 12 opposite two surface of the first base material layer the
One copper foil 11 and the second copper foil 13.
The first base material layer 12 can be hard resin layer, such as epoxy resin, glass-fiber-fabric, can also flexible resin layer,
As polyimides (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephtalate,
PET), polytetrafluoroethylene (PTFE) (Teflon), polyamide (Polyamide), polymethyl methacrylate
(Polymethylmethacrylate), makrolon (Polycarbonate) or polyimides-polyethylene-terephthaldehyde's ester
Copolymer (Polyamide polyethylene-terephthalate copolymer) etc..
The copper foil 13 of first copper foil 11 and second can be rolled copper foil, or electrolytic copper foil.
Second step, referring to Fig. 2, patterning second copper foil 13, the second copper foil 13 is made to form the second conductor wire
Road floor 130.Second conductive circuit layer 130 is to make to be formed by way of exposing, develop, etch.
3rd step, referring to Fig. 3, provide a second circuit substrate 20, by the second circuit substrate 20 be pressed together on this
The surface of second conductive circuit layer 130, second conductive circuit layer are located between the first base material layer and second substrate layer,
So as to form a multi-layer sheet 30.
The second circuit substrate 20 includes the 3rd copper foil 21 stacked gradually, the second substrate layer 22 and adhesive-layer 23, should
3rd copper foil 21 is located at opposite two surfaces of second substrate layer 22 with the adhesive-layer 23 respectively.The adhesive-layer 23 can be half
Cured sheets.
The second circuit substrate 20 is pressed on to the surface of second conductive circuit layer 130, the adhesive-layer 23 fill up this
Gap between two conductive circuit layers 130.
4th step, referring to Fig. 4, it is blind by way of laser pit or machine drilling to form first in the multi-layer sheet 30
The blind hole 302 of hole 301 and second, the laser can be Nd:YAG laser, or CO2 laser, mechanical drilling process refer to
By the way of using mechanical drill point, rotation so that form hole on circuit boards at a high speed.In the present embodiment, it is for circuit board
Balance and stability, using laser pit technique.First blind hole 301 can be opened in circuit simultaneously with second blind hole 302
The same surface of plate, two opposite surfaces of circuit board can also be opened in, in the present embodiment, first blind hole 301 with this
Two blind holes 302 are opened in two opposite surfaces of the multi-layer sheet 30, first blind hole 301 through first copper foil 11 and this first
Substrate layer 12, and part second conductive circuit layer 130 is manifested, second blind hole 302 runs through the 3rd copper foil 21, and this second
Substrate layer 22, second conductive circuit layer 130 and the first base material layer 12, and manifest part first copper foil 11.
5th step, refers to Fig. 5-6, and conductive material is filled in the blind hole 302 of the first blind hole 301 and second, to be formed
First conductive hole 304 and the second conductive hole 305, the conductive material can be conducting metals, and such as copper, silver, tin, the conductive material is filled out
The method filled can be plating or printing, in the present embodiment, the first conductive hole 304 and the be formed using the method for electro-coppering
Two conductive holes 305.
Specifically, full copper is please plated in the first blind hole 301 and the second blind hole 302 by electric plating method referring initially to Fig. 5,
Simultaneously one layer of copper plate 306 is formed on the surface of first copper foil 11 and the paper tinsel of the 3rd bronze medal 21.
Referring to Fig. 6, to reduce circuit plate thickness, removed using the method for grinding or etching or part removes first bronze medal
Paper tinsel 11 and the copper plate 306 on the surface of the 3rd copper foil 21.
6th step, referring to Fig. 7, patterning first copper foil 11 and the 3rd copper foil 21, first copper foil 11 is made
Make to form the first conductive circuit layer 110 and multiple weld pads 111, multiple weld pads 11 form weld pad matrix 112, by the 3rd copper foil 21
Make and form the 3rd conductive circuit layer 210.
Also referring to Fig. 8, wherein, the weld pad matrix 112 include positioned at outermost a plurality of outer layer weld pads 114 and
The multiple center weld pads 116 surrounded by the outer layer weld pad 114, the outer layer weld pad 114 electrically connect with first conductive circuit layer 110
Connect, the center weld pad 116 and outer layer weld pad 114 it is relatively independent be formed at the surface of the first base material layer 12.
The outer layer weld pad 114 is not electrically connected with first conductive hole 304 and second conductive hole 305, the center weld pad
116 by the conductive hole 305 of the first conductive hole 304 or second respectively with the conducting wire of the second conductive circuit layer 130 or the 3rd
Layer 210 connects, and the center weld pad 116 is electrically connected to the second conductive circuit layer 130 or the 3rd conductive circuit layer 210.
In the present embodiment, only illustrating pad arrays 112 includes 3 lap welding pads, and illustrates the number of outer layer weld pad 114
For 16, the number of center weld pad 116 is 9.In other embodiments, the number of turns for the weld pad that the pad arrays 112 include
And the number of the weld pad included per lap welding pad designs according to being actually needed.7th step, formed on the surface of the plurality of weld pad 111
Coat of metal (not shown), the material of the coat of metal can be nickel, gold or ni au alloy.
8th step, after forming coat of metal on the surface of the plurality of weld pad 111, it is additionally included in whole circuit board surface and removes
Position beyond the plurality of weld pad 111 forms welding resisting layer.
Referring to Fig. 7 and Fig. 8, second embodiment of the invention also provides a kind of circuit board 100 for having weld pad, the circuit
Plate 100 includes：At least there are 3 conductive circuit layers, weld pad, multiple first conductive holes 304 and multiple second conductive holes 305.
The circuit board 100 includes first surface 101, and 3 conductive circuit layers are the first conductive circuit layer stacked gradually
110th, the second conductive circuit layer 130 and the 3rd conductive circuit layer 21.First conductive circuit layer 110 and multiple weld pads 111 are formed
In the first surface 101.Multiple weld pads 111 are in the weld pad matrix 112 of matrix form arrangement form one, and the weld pad matrix 112 wraps
Include the multiple center weld pads 116 for being located at multiple outer layer weld pads 114 of outermost and being surrounded by the outer layer weld pad 114, outer layer weldering
Pad 114 is connected with first conductive circuit layer 110 respectively, and the center weld pad 116 is each independently formed in the first surface 101
On.
The first base material layer 12 is provided between first conductive circuit layer 110 and second conductive circuit layer 130, second leads
The second substrate layer 22 and adhesive-layer 23 are provided between the conductive circuit layer 210 of electric line layer 130 and the 3rd.In other embodiment party
In formula, the adhesive-layer 23 can omit.
The formation direction of first conductive hole 304 and the formation of second conductive hole 305 are in opposite direction.First conductive hole
304 are electrically connected with the conductive circuit layer 130 of the first conductive circuit layer 110 and second, and second conductive hole 305 is electrically connected with this extremely
Few 3 conductive circuit layers and the part center weld pad.
First conductive hole 304 and second conductive hole 305 are not electrically connected with the outer layer weld pad 114, and this
One conductive hole 304 is connected to the center weld pad 306 when different from second conductive hole 305.
Outermost layer conductive circuit layer of the present invention using the first conductive circuit layer 110 as circuit board 100, only pad arrays
Outermost weld pad (outer layer weld pad 114) in 112 is connected with first conductive circuit layer 110, by outermost weld pad (outer layer weld pad
114) the center weld pad 116 surrounded is electrically connected to second using the first conductive hole 304 and second conductive hole 305 as weld pad lead
The conductive circuit layer 210 of conductive circuit layer 130 or the 3rd.
It that is to say and center weld pad 116 is oriented to the second conducting wire using the conductive hole 305 of the first conductive hole 304 or second
Layer 130 or the 3rd conductive circuit layer 210, in weld pad matrix 112, outer layer only nearest apart from first conductive circuit layer 110
The lead of weld pad 114 can occupy the area on the surface of the first conductive circuit layer 110, and the lead of center weld pad 116 has been oriented to first and led
The second conductive circuit layer 130 or the 3rd conductive circuit layer 210 beyond electric line layer 110, so as to reduce in the weld pad matrix
Weld pad lead is set in 112, that is, on the circuit board of same area, more conductive pads can be set, it is achieved thereby that weldering
The high density of pad, namely realize the high integration of circuit board, Xiao Charges electronic products are met towards compact and intelligent
Change the direction of development.
It is appreciated that in other embodiments, more than three conductive circuit layer can also be included.It is by weld pad square in a word
The weld pad in addition to outmost turns weld pad in the multi-turn weld pad that battle array 112 includes is individually directed positioned at the first conductor wire by conductive hole
Remaining conductive circuit layer under road floor 110.
For circuit board 100, after first conductive circuit layer 110 and the 3rd conductive circuit layer 210 is formed, also wrap
Include and the surface of weld pad, the first conductive circuit layer 110 and the 3rd conductive circuit layer 210 is post-processed, for example the table of weld pad
Face forms coat of metal, and on whole circuit board surface except weld pad surface topography is into welding resisting layer (not shown), should with protection
First conductive circuit layer 130 and the 3rd conductive circuit layer 210.
It is understood that above example is only used for illustrating the present invention, limitation of the invention is not used as.For this
For the those of ordinary skill in field, other various corresponding changes and deformation that technique according to the invention design is made, all
Fall within the protection domain of the claims in the present invention.
Claims (10)
1. a kind of circuit board for having weld pad, including：
At least three conductive circuit layer, the circuit board include first surface, on the first surface formed with the first conductive circuit layer and
Multiple weld pads；Wherein
Multiple weld pads are in the weld pad matrix of matrix form arrangement form one, and the weld pad matrix includes multiple outer layers positioned at outermost
Weld pad and the multiple center weld pads surrounded by the outer layer weld pad, the outer layer weld pad electrically connect with first conductive circuit layer respectively
Connect, the center weld pad is each independently formed on the first surface.
2. the circuit board of tool weld pad as claimed in claim 1, it is characterised in that the circuit board further comprises the first base material
Layer, the second substrate layer, multiple first conductive holes and multiple second conductive holes, first conductive circuit layer are formed in the first base material
On the first surface of layer, formed with least three conducting wire on the surface opposite with the first surface of the first base material layer
The second conductive circuit layer in layer, second substrate layer are formed in the surface of second conductive circuit layer, at least three conducting wire
The 3rd conductive circuit layer in layer is formed in the surface of second substrate layer away from second conductive circuit layer, first conductive hole
First conductive circuit layer and second conductive circuit layer are electrically connected with, second conductive hole is electrically connected with least three conduction
Line layer and the part center weld pad.
3. the circuit board of tool weld pad as claimed in claim 2, wherein, the formation direction of first conductive hole and second conduction
The formation in hole is in opposite direction.
4. the circuit board of tool weld pad as claimed in claim 3, wherein, first conductive hole and second conductive hole not with this
Outer layer weld pad is electrically connected with, and first conductive hole during the second conductive hole difference with being connected to the center weld pad.
5. a kind of preparation method of the circuit board for the circuit board for having weld pad, its step are as follows：
One first circuit substrate is provided, first circuit substrate includes the first base material layer and opposite two positioned at the first base material layer
First copper foil and the second copper foil on surface；
Second copper foil is made to form the second conductive circuit layer；
A second circuit substrate is provided, the second circuit substrate includes the 3rd copper foil and the second substrate layer, by the second circuit
Substrate presses together to form a multi-layer sheet with first circuit substrate, and second conductive circuit layer is located at the first base material layer
Between second substrate layer；
Multiple first conductive holes and multiple second conductive holes are formed on the multi-layer sheet, first conductive hole runs through first copper foil
With the first base material layer and being electrically connected to second conductive circuit layer, second conductive hole is through the multi-layer sheet and is electrically connected with
First copper foil, second conductive circuit layer and the 3rd copper foil；
First copper foil is made to form the first conductive circuit layer and multiple weld pads, the 3rd copper foil is made to form the 3rd conduction
Line layer, the plurality of weld pad are in the weld pad matrix of matrix form arrangement form one, and the weld pad matrix is included positioned at the multiple of outermost
Outer layer weld pad and the multiple center weld pads surrounded by the outer layer weld pad, the outer layer weld pad are electrical with first conductive circuit layer respectively
Connection, the center weld pad are each independently formed on the first base material layer.
6. the preparation method of the circuit board of tool weld pad as claimed in claim 5, it is characterised in that first conductive hole is formed at
First copper foil surface, it is electrically connected with through the first base material layer and with second conductive circuit layer, second conductive hole is formed
In the 3rd copper foil surface, through the multi-layer sheet, it is electrically connected with second conductive circuit layer and first copper foil.
7. as claimed in claim 5 tool weld pad circuit board preparation method, it is characterised in that the first conductive hole and this second
Conductive hole is not connected with the outer layer weld pad, and first conductive hole is connected to the different centers from second conductive hole and welded
Pad.
8. the preparation method of the circuit board of tool weld pad as claimed in claim 6, is characterised by, forms first conductive hole and be somebody's turn to do
The method of second conductive hole is：Multiple blind holes are formed by laser pit technique or depthkeeping mechanical drilling process, and passed through
The method of plating or printing conductive paste fills conductive material in the blind hole and forms first conductive hole and second conductive hole.
9. the preparation method of the circuit board of tool weld pad as claimed in claim 5, it is characterised in that forming the plurality of weld pad
Afterwards, the step of the plurality of weld pad surface forms coat of metal is additionally included in, the material of the coat of metal can be nickel, Jin Huo
Ni au alloy.
10. the preparation method of the circuit board of tool weld pad as claimed in claim 9, it is characterised in that on the plurality of weld pad surface
After forming coat of metal, the step that position of the whole circuit board surface in addition to the plurality of weld pad forms welding resisting layer is additionally included in
Suddenly.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610617488.1A CN107666770A (en) | 2016-07-29 | 2016-07-29 | Has circuit board of weld pad and preparation method thereof |
| TW105135798A TW201806455A (en) | 2016-07-29 | 2016-11-03 | Circuit board with pads and method same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610617488.1A CN107666770A (en) | 2016-07-29 | 2016-07-29 | Has circuit board of weld pad and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107666770A true CN107666770A (en) | 2018-02-06 |
Family
ID=61121921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610617488.1A Pending CN107666770A (en) | 2016-07-29 | 2016-07-29 | Has circuit board of weld pad and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107666770A (en) |
| TW (1) | TW201806455A (en) |
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| CN111954384A (en) * | 2019-05-17 | 2020-11-17 | 同泰电子科技股份有限公司 | Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof |
| CN112423463A (en) * | 2019-08-23 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN114501840A (en) * | 2020-10-26 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board assembly and circuit board assembly |
| CN114554729A (en) * | 2020-11-27 | 2022-05-27 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board |
| CN114765923A (en) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | Three-layer circuit board of 5G base station isolator and preparation method thereof |
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| CN110856375B (en) * | 2018-08-21 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | Hot-pressing tin-melting welding circuit board and manufacturing method thereof |
| CN109862693B (en) * | 2019-02-01 | 2022-01-07 | 奥士康精密电路（惠州）有限公司 | Annular welding disk and control method thereof |
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| CN111954384A (en) * | 2019-05-17 | 2020-11-17 | 同泰电子科技股份有限公司 | Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof |
| CN112423463A (en) * | 2019-08-23 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN114501840A (en) * | 2020-10-26 | 2022-05-13 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board assembly and circuit board assembly |
| CN114554729A (en) * | 2020-11-27 | 2022-05-27 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board |
| CN114765923A (en) * | 2021-05-20 | 2022-07-19 | 上海贺鸿电子科技股份有限公司 | Three-layer circuit board of 5G base station isolator and preparation method thereof |
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