CN104703399A - Circuit board and production method thereof - Google Patents
Circuit board and production method thereof Download PDFInfo
- Publication number
- CN104703399A CN104703399A CN201310649295.0A CN201310649295A CN104703399A CN 104703399 A CN104703399 A CN 104703399A CN 201310649295 A CN201310649295 A CN 201310649295A CN 104703399 A CN104703399 A CN 104703399A
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- Prior art keywords
- copper foil
- circuit pattern
- photoresist
- conductive
- conductive circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a production method of a circuit board. The production method includes providing a bearing plate with an insulation substrate and two first copper foils, to be specific, the first copper foils are formed on two opposite sides of the insulation substrate; forming a first conducting circuit pattern on the each first copper foil; compressing a dielectric layer onto the each first conducting circuit pattern and forming a second copper foil on the each dielectric layer; forming blind holes facing the dielectric layers from the second copper foil so as to expose the first conducting circuit patterns; filling the blind holes by electroplating; removing the insulation substrate; changing the second copper foil into second conducting circuit patterns respectively and changing the first copper foil into conducting bosses. The invention further relates to the circuit board made in the way.
Description
Technical field
The present invention relates to a kind of circuit board and preparation method thereof.
Background technology
Now the general mode of plating that adopts makes multiple conductive projection on circuit boards, but due to the problem of electroplating evenness, causes the height of the plurality of conductive projection variant.Therefore, when the electronic component such as welding chip on the board, some the pin meeting in multiple pins of this chip and cause rosin joint between corresponding conductive projection, affects the normal work of this chip.The general electroplating device making conductive projection adopting electroplating evenness higher, makes production cost higher now.
Summary of the invention
In view of this, be necessary to provide a kind of circuit board and preparation method thereof, make the high uniformity of the conductive projection on this circuit board.
A manufacture method for circuit board, it comprises step:
There is provided a loading plate, this loading plate comprises an insulated substrate and two the first Copper Foils, and these two first Copper Foils are respectively formed at opposing two surfaces of this insulated substrate;
This first Copper Foil each all forms first conductive circuit pattern;
At side pressing one dielectric layer of this first conductive circuit pattern each, and form second Copper Foil on this dielectric layer each;
At least one blind hole is offered towards the direction of this dielectric layer, with this first conductive circuit pattern of exposed portion from this second Copper Foil each;
This at least one blind hole is filled up, with conducting this first conductive circuit pattern each and this corresponding second Copper Foil, to obtain two circuit substrates by the mode of plating;
This insulated substrate is removed, is separated from each other to make these two circuit substrates; And
This first Copper Foil is become multiple conductive projection, and this second Copper Foil is become multiple second conductive circuit pattern.
A manufacture method for circuit board, it comprises step:
There is provided a loading plate, this loading plate comprises an insulated substrate and two the first Copper Foils, and these two first Copper Foils are respectively formed at opposing two surfaces of this insulated substrate;
This first Copper Foil each forms first conductive circuit pattern;
At side pressing one dielectric layer of this first conductive circuit pattern each, and form second Copper Foil on this dielectric layer each;
At least one blind hole is offered towards the direction of this dielectric layer, with this first conductive circuit pattern of exposed portion from this second Copper Foil each;
This at least one blind hole is filled up, with conducting this first conductive circuit pattern each and this corresponding second Copper Foil, to obtain two circuit substrates by the mode of plating;
This second Copper Foil is become the second conductive circuit pattern;
This insulated substrate is removed, to make these two circuit substrates be separated from each other, these two circuit substrates is all formed with this second conductive circuit pattern; And
This first Copper Foil is become multiple conductive projection.
A kind of circuit board, it comprises a dielectric layer, the first conductive circuit pattern, second conductive circuit pattern and a multiple conductive projection, and this dielectric layer comprises first surface and the second surface of opposing setting; Multiple through hole running through this first surface and this second surface is offered in this dielectric layer; This first conductive circuit pattern is formed on the first surface, and this second conductive circuit pattern is embedded in this second surface; Filled conductive material in this through hole, thus this first conductive circuit pattern is electrically connected with this second conductive circuit pattern; The plurality of conductive projection is formed in this first conductive circuit pattern.The height of the plurality of conductive projection is consistent, and the area of the upper surface of the plurality of conductive projection is less than the area of lower surface.
Compared with prior art, circuit board of the present invention and preparation method thereof, the height of the plurality of conductive projection can be controlled by the thickness of the first Copper Foil (i.e. native copper) on loading plate, makes the height of the plurality of conductive projection and uniformity ratio be easier to control.
Accompanying drawing explanation
Fig. 1-12 is schematic diagrames of the manufacture method of the circuit board of first embodiment of the invention.
Figure 13-15 is partial schematic diagram of the manufacture method of the circuit board of second embodiment of the invention.
Figure 16-21 is partial schematic diagram of the manufacture method of the circuit board of third embodiment of the invention.
Figure 22 is the structural representation of the circuit board of four embodiment of the invention.
Main element symbol description
| Loading plate | 10 |
| Insulated substrate | 101、301 |
| First Copper Foil | 11、211、311 |
| Second Copper Foil | 13、213、313 |
| First conductive circuit pattern | 110、420 |
| First photoresist figure | 111 |
| Second photoresist figure | 135 |
| Dielectric layer | 112、410 |
| Blind hole | 113 |
| Circuit substrate | 15、35 |
| Second conductive circuit pattern | 130、230、330、430 |
| Conductive projection | 114、214、314、440 |
| 3rd photoresist figure | 115 |
| 4th photoresist oxidant layer | 215 |
| 4th photoresist figure | 231 |
| First welding resisting layer | 151、450 |
| Second welding resisting layer | 152、460 |
| Opening | 153 |
| Circuit board | 17、400 |
| 5th photoresist figure | 216 |
| 6th photoresist oxidant layer | 232 |
| 6th photoresist figure | 331 |
| 7th photoresist figure | 316 |
| 9th photoresist oxidant layer | 336 |
| First surface | 411 |
| Second surface | 412 |
| Through hole | 413 |
| Upper surface | 441 |
| Lower surface | 442 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The manufacture method of a kind of circuit board that first embodiment of the invention provides comprises the steps:
The first step, refers to Fig. 1, provides a loading plate 10, and this loading plate 10 comprises an insulated substrate 101 and two the first Copper Foils 11.These two the first Copper Foils 11 are respectively formed on opposing two surfaces of this insulated substrate 101.
Second step, as Figure 2-3, this first Copper Foil 11 each all forms first conductive circuit pattern 110.
This second step specifically can be adopted with the following method:
First, form the first photoresist oxidant layer respectively on the surface of these two the first Copper Foils 11, and adopt the mode of exposure and development, remove obtain the first photoresist figure 111 by with for forming part corresponding to the first conductive circuit pattern 110.
Secondly, the first conductive circuit pattern 110 is formed at the first Copper Foil 11 electroplating surface exposed from the space of the first photoresist figure 111.
Finally, the mode adopting chemical medicinal liquid to sting erosion removes the first photoresist figure 111, and that is, this first conductive circuit pattern 110 is obtained by the mode of plating.
3rd step, as shown in Figure 4, at the equal pressing in the side of this first conductive circuit pattern 110 each dielectric layer 112, and forms second Copper Foil 13 on this dielectric layer 112.This dielectric layer 112 covers this first conductive circuit pattern 110.
In this step, the mode of hot pressing is adopted to be pressed in this first conductive circuit pattern 110 by this dielectric layer 112.The material of this dielectric layer 112 can be all polyimides (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephthalate, or PEN (Polyethylene naphthalate PET), PEN), PP (Prepreg) or ABF (Ajinomoto Build-up film) etc., be preferably PP or ABF.
4th step, as shown in Figure 5, at least one blind hole 113 is offered in the direction from this second Copper Foil 13 each towards this dielectric layer 112, with this first conductive circuit pattern 110 of exposed portion.In this step, this at least one blind hole 113 adopts the mode of laser ablation to be formed.
5th step, as shown in Figure 6, is filled up this at least one blind hole 113 by the mode of plating, with this first conductive circuit pattern 110 of conducting and this second Copper Foil 13, to obtain two circuit substrates 15.
6th step, as Figure 7-8, removes this insulated substrate 101, to obtain the circuit substrate 15 be separated from each other.
7th step, as shown in figs. 9-10, becomes this second Copper Foil 13 into the second conductive circuit pattern 130, this first Copper Foil 11 is become multiple conductive projection 114 simultaneously.
7th step specifically can be adopted with the following method:
First, the second photoresist oxidant layer is formed respectively on the surface of the first Copper Foil 11 and the second Copper Foil 13, and adopt the mode of exposure and development, remove obtain the second photoresist figure 135 by with for forming part corresponding to the second conductive circuit pattern 130, remove obtain the 3rd photoresist figure 115 by forming part corresponding to multiple conductive projection 114 with wish.
Secondly, lead to overetched mode at the second Copper Foil 13 exposed from the space of the second photoresist figure 135 to remove, so that this second Copper Foil 13 is become this second conductive circuit pattern 130, the first Copper Foil 11 exposed in space from the 3rd photoresist figure 115 leads to overetched mode to be removed, so that this first Copper Foil 11 is become multiple conductive projection 114.
Finally, the mode adopting chemical medicinal liquid to sting erosion removes the second photoresist figure 135 and the 3rd photoresist figure 115.
8th step, as shown in figure 11, this first conductive circuit pattern 110 forms the first welding resisting layer 151, this second conductive circuit pattern 130 is formed the second welding resisting layer 152, thus prevents this circuit board 17 warpage, and circuit can also be prevented to be oxidized.Wherein, this this first conductive circuit pattern 110 of the first welding resisting layer 151 cover part, and the region at this conductive projection 114 place is only done organic guarantor and is welded film (Organic Solderability Preservatives, OSP) surface treatment.Due to scolding tin welding wafer in the final meeting of the plurality of conductive projection 114, and bottom of wafer filler (Underfill) can carry out protection against oxidation to it, therefore the plurality of conductive projection 114 need not form welding resisting layer, only OSP surface treatment need be used to do temporary protection; This this second conductive circuit pattern 130 of the second welding resisting layer 152 cover part, and this second welding resisting layer 152 has multiple opening 153, this second conductive circuit pattern 130 of part is exposed from the plurality of opening 153, and is called as weld pad from the second conductive circuit pattern 130 that the plurality of opening 153 exposes.
The first step of the manufacture method of a kind of circuit board that second embodiment of the invention provides is identical to the 6th step, the 8th step with the first step of the manufacture method of the circuit board of first embodiment of the invention respectively to the 6th step, the 8th step.7th step of the manufacture method of the circuit board that second embodiment of the invention provides is different from the step of the first execution mode the 7th step.
7th step: the second Copper Foil 213 is become the second conductive circuit pattern 230, then becomes the first Copper Foil 211 into multiple conductive projection 214.
This step specifically can be adopted with the following method:
First, as illustrated by figs. 12-13, first form the 3rd photoresist oxidant layer on the surface of the second Copper Foil 213, then adopt the mode of exposure and development, remove obtain the 4th photoresist figure 231 by with for forming part corresponding to the second conductive circuit pattern 230; Form the 4th photoresist oxidant layer the 215, four photoresist oxidant layer 215 simultaneously on the surface of this first Copper Foil 211 and cover this first Copper Foil 211, to prevent the uniformity destroying this first Copper Foil 211 surface in the process etched this second Copper Foil 213.
Secondly, lead to overetched mode at this second Copper Foil 213 exposed from the space of the 4th photoresist figure 231 and remove, so that this second Copper Foil 213 is become this second conductive circuit pattern 230; Then the mode adopting chemical medicinal liquid to sting erosion removes the 4th photoresist figure 231 and the 4th photoresist oxidant layer 215.
Then, as shown in figs. 14-15, form formation the 5th photoresist oxidant layer on the surface of this first Copper Foil 211, then adopt the mode of exposure and development, remove obtain the 5th photoresist figure 216 by with for forming part corresponding to the plurality of conductive projection 214; Form the 6th photoresist oxidant layer 232 on the surface of this second conductive circuit pattern 230 simultaneously, 6th photoresist oxidant layer 232 covers this second conductive circuit pattern 230, to prevent from destroying this second conductive circuit pattern 230 in the process etched this first Copper Foil 211.
Finally, lead to overetched mode at this first Copper Foil 211 exposed from the space of the 5th photoresist figure 216 and remove, so that this first Copper Foil 211 is become the plurality of conductive projection 214; Then the mode adopting chemical medicinal liquid to sting erosion removes the 5th photoresist figure 216 and the 6th photoresist oxidant layer 232.
The first step of the manufacture method of a kind of circuit board that third embodiment of the invention provides is identical to the 5th step with the first step of the manufacture method of the circuit board of first embodiment of the invention to the 5th step.The manufacture method of the circuit board that third embodiment of the invention provides also comprises the steps:
6th step: these two the second Copper Foils 313 are become two the second conductive circuit pattern 330 respectively.
This step specifically can be adopted with the following method:
First, as shown in figure 16, form the 7th photoresist oxidant layer respectively on the surface of these two the second Copper Foils 313, and adopt the mode of exposure and development, remove obtain the 6th photoresist figure 331 by with for forming part corresponding to the second conductive circuit pattern 330.
Secondly, as shown in figure 17, lead to overetched mode at the second Copper Foil 313 exposed from the space of the 6th photoresist figure 331 and remove, so that this second Copper Foil 313 is become this second conductive circuit pattern 330.
Finally, the mode adopting chemical medicinal liquid to sting erosion removes this two the 6th photoresist figures 331.
7th step: as depicted in figs. 18-19, removes insulated substrate 301, to obtain the circuit substrate 35 be separated from each other, this circuit substrate 35 each is formed with this second conductive circuit pattern 330.
8th step: the first Copper Foil 311 is become multiple conductive projection 314.
This step specifically can be adopted with the following method:
First, as shown in figure 20, form the 8th photoresist oxidant layer on the surface of this first Copper Foil 311, and adopt the mode of exposure and development, remove obtain the 7th photoresist figure 316 by with for forming part corresponding to the plurality of conductive projection 314; In this second conductive circuit pattern 330, electroplate formation the 9th photoresist oxidant layer 336 simultaneously, 9th photoresist oxidant layer 336 covers this second conductive circuit pattern 330, to prevent from destroying this second conductive circuit pattern 330 in the process etched this first Copper Foil 311.
Then, as shown in figure 21, the first Copper Foil 311 exposed in the space from the 7th photoresist figure 316 leads to overetched mode to be removed, so that this first Copper Foil 311 is become multiple conductive projection 314.
Finally, the mode adopting chemical medicinal liquid to sting erosion removes the 7th photoresist figure 316 and the 9th photoresist oxidant layer 336.
9th step is identical with the 8th step of the manufacture method of the circuit board of the first execution mode.
Be appreciated that when the thickness of this first conductive projection is identical with the thickness of this first outer-layer circuit layer, use the method for the first execution mode to make this conductive projection and this first outer-layer circuit layer simultaneously.When the thickness of this first conductive projection is different from the thickness of this first outer-layer circuit layer, method or the 3rd execution mode method of the second execution mode can be adopted, first make this first outer-layer circuit layer, then this first conductive projection is made, or first make this first conductive projection, then make this first outer-layer circuit layer.
As shown in figure 22, the technical program provides a kind of circuit board 400 adopting said method to make, and it comprises a dielectric layer 410, first conductive circuit pattern 420, second conductive circuit pattern 430, multiple conductive projection 440, first welding resisting layer 450 and second welding resisting layer 460.This dielectric layer 410 comprises first surface 411 and the second surface 412 of opposing setting.Multiple through hole 413 running through this first surface 411 and this second surface 412 is offered in this dielectric layer 410.This first conductive circuit pattern 420 is embedded in this first surface 411, and this second conductive circuit pattern 430 is formed on this second surface 412.Filled conductive material in this through hole 413, thus this first conductive circuit pattern 420 is electrically connected with this second conductive circuit pattern 430.The plurality of conductive projection 440 is formed in this first conductive circuit pattern 420, and is obtained by the logical overetched mode of the first Copper Foil (i.e. native copper) on this loading plate 10.The height of the plurality of conductive projection 440 is consistent.This conductive projection 440 each comprises the upper surface 441 and lower surface 442 that are oppositely arranged.This upper surface 441 is away from this first conductive circuit pattern 420, and this lower surface 442 is near this first conductive circuit pattern 420.The area of this upper surface 441 is less than the area of this lower surface 442.This this first conductive circuit pattern 420 of the first welding resisting layer 450 cover part.OSP surface treatment is carried out on the surface of the plurality of conductive projection 114.This this second conductive circuit pattern 430 of the second welding resisting layer 460 cover part.This first conductive circuit pattern 420 is obtained by the mode of plating, and this second conductive circuit pattern 430 is led to overetched mode and obtained.
Compared with prior art, circuit board of the present invention and preparation method thereof, the height of the plurality of conductive projection can be controlled by the thickness of the first Copper Foil (i.e. native copper) on loading plate, makes the height of the plurality of conductive projection and uniformity ratio be easier to control.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a manufacture method for circuit board, it comprises step:
There is provided a loading plate, this loading plate comprises an insulated substrate and two the first Copper Foils, and these two first Copper Foils are respectively formed at opposing two surfaces of this insulated substrate;
This first Copper Foil each all forms first conductive circuit pattern;
At side pressing one dielectric layer of this first conductive circuit pattern each, and form second Copper Foil on this dielectric layer each;
At least one blind hole is offered towards the direction of this dielectric layer, with this first conductive circuit pattern of exposed portion from this second Copper Foil each;
This at least one blind hole is filled up, with conducting this first conductive circuit pattern each and this corresponding second Copper Foil, to obtain two circuit substrates by the mode of plating;
This insulated substrate is removed, is separated from each other to make these two circuit substrates; And
This first Copper Foil is become multiple conductive projection, and this second Copper Foil is become multiple second conductive circuit pattern.
2. the manufacture method of circuit board as claimed in claim 1, is characterized in that, this first conductive circuit pattern of part forms the first welding resisting layer, and the region at described multiple conductive projection place is only carried out organic guarantor and welded film process; This second conductive circuit pattern of part forms the second welding resisting layer, to obtain two circuit boards.
3. the manufacture method of circuit board as claimed in claim 1, is characterized in that, this first Copper Foil is formed in the step of first conductive circuit pattern and also comprises step:
Form the first photoresist oxidant layer on the surface of the first Copper Foil respectively, and adopt the mode of exposure and development, remove obtain the first photoresist figure by with for forming part corresponding to the first conductive circuit pattern;
The first copper foil surface plating formation first conductive circuit pattern exposed from the space of the first photoresist figure; And
The mode adopting chemical medicinal liquid to sting erosion removes the first photoresist figure.
4. the manufacture method of circuit board as claimed in claim 1, is characterized in that, this first Copper Foil is being become multiple conductive projection, and is become by this second Copper Foil in the step of multiple second conductive circuit pattern and also comprise step:
The second photoresist oxidant layer is formed respectively on the surface of the first Copper Foil and the second Copper Foil, and adopt the mode of exposure and development, remove obtain the second photoresist figure by with for forming part corresponding to this second conductive circuit pattern, remove obtain the 3rd photoresist figure by forming part corresponding to the plurality of conductive projection with wish;
Lead to overetched mode at the second copper foil surface exposed from the space of the second photoresist figure to remove, so that this second Copper Foil is become this second conductive circuit pattern; The first Copper Foil exposed in space from the 3rd photoresist figure is removed, so that this first Copper Foil is become the plurality of conductive projection; And
The mode adopting chemical medicinal liquid to sting erosion removes this second photoresist figure and the 3rd photoresist figure.
5. the manufacture method of circuit board as claimed in claim 1, is characterized in that, this first Copper Foil is being become multiple conductive projection, become in the step of the second conductive circuit pattern by this second Copper Foil and also comprise step:
First form the 3rd photoresist oxidant layer on the surface of the second Copper Foil, then adopt the mode of exposure and development, remove obtain the 4th photoresist figure by with for forming part corresponding to the second conductive circuit pattern; Form the 4th photoresist oxidant layer on the surface of this first Copper Foil, the 4th photoresist oxidant layer covers this first Copper Foil simultaneously;
Lead to overetched mode at this second Copper Foil exposed from the space of the 4th photoresist figure to remove, so that this second Copper Foil is become this second conductive circuit pattern; Then the mode adopting chemical medicinal liquid to sting erosion removes the 4th photoresist figure and the 4th photoresist oxidant layer;
Form formation the 5th photoresist oxidant layer on the surface of this first Copper Foil, then adopt the mode of exposure and development, remove obtain the 5th photoresist figure by with for forming part corresponding to the plurality of conductive projection; In this second conductive circuit pattern, electroplate formation the 6th photoresist oxidant layer, the 6th photoresist oxidant layer covers this second conductive circuit pattern simultaneously;
Remove at this first Copper Foil exposed from the space of the 5th photoresist figure, so that this first Copper Foil is become multiple conductive projection; Then the mode adopting chemical medicinal liquid to sting erosion removes the 5th photoresist figure and the 6th photoresist oxidant layer.
6. a manufacture method for circuit board, it comprises step:
There is provided a loading plate, this loading plate comprises an insulated substrate and two the first Copper Foils, and these two first Copper Foils are respectively formed at opposing two surfaces of this insulated substrate;
This first Copper Foil each forms first conductive circuit pattern;
At side pressing one dielectric layer of this first conductive circuit pattern each, and form second Copper Foil on this dielectric layer each;
At least one blind hole is offered towards the direction of this dielectric layer, with this first conductive circuit pattern of exposed portion from this second Copper Foil each;
This at least one blind hole is filled up, with conducting this first conductive circuit pattern each and this corresponding second Copper Foil, to obtain two circuit substrates by the mode of plating;
This second Copper Foil is become the second conductive circuit pattern;
This insulated substrate is removed, to make these two circuit substrates be separated from each other, these two circuit substrates is all formed with this second conductive circuit pattern; And
This first Copper Foil is become multiple conductive projection.
7. the manufacture method of circuit board as claimed in claim 6, is characterized in that, become respectively in the step of two the second conductive circuit pattern also comprise step at these two second Copper Foils:
Form the 7th photoresist oxidant layer on the surface of these two the second Copper Foils respectively, and adopt the mode of exposure and development, remove obtain the 6th photoresist figure by with for forming part corresponding to the second conductive circuit pattern;
Lead to overetched mode at the second Copper Foil exposed from the space of the 6th photoresist figure to remove, so that this second Copper Foil is become this second conductive circuit pattern; And
The mode adopting chemical medicinal liquid to sting erosion removes this two the 6th photoresist figures.
8. the manufacture method of circuit board as claimed in claim 6, is characterized in that, become in the step of multiple conductive projection by this first Copper Foil and also comprise the steps:
Form the 8th photoresist oxidant layer on the surface of this first Copper Foil, and adopt the mode of exposure and development, remove obtain the 7th photoresist figure by with for forming part corresponding to the plurality of conductive projection; In this second conductive circuit pattern, electroplate formation the 9th photoresist oxidant layer, the 9th photoresist oxidant layer covers this second conductive circuit pattern simultaneously;
The first Copper Foil exposed in space from the 7th photoresist figure is removed, so that this first Copper Foil is become multiple conductive projection; And
The mode adopting chemical medicinal liquid to sting erosion removes the 7th photoresist figure and the 9th photoresist oxidant layer.
9. a circuit board, it comprises a dielectric layer, the first conductive circuit pattern, second conductive circuit pattern and a multiple conductive projection, and this dielectric layer comprises first surface and the second surface of opposing setting; Multiple through hole running through this first surface and this second surface is offered in this dielectric layer; This first conductive circuit pattern is formed on the first surface, and this second conductive circuit pattern is embedded in this second surface; Filled conductive material in this through hole, thus this first conductive circuit pattern is electrically connected with this second conductive circuit pattern; The plurality of conductive projection is formed in this first conductive circuit pattern, and the height of the plurality of conductive projection is consistent, and the area of the upper surface of the plurality of conductive projection is less than the area of lower surface.
10. circuit board as claimed in claim 9, it is characterized in that, the plurality of conductive projection leads to overetched mode and is formed in this first conductive circuit pattern; This first conductive circuit pattern is obtained by the mode of plating, and this second conductive circuit pattern is led to overetched mode and obtained.
Priority Applications (1)
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| CN201310649295.0A CN104703399A (en) | 2013-12-06 | 2013-12-06 | Circuit board and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310649295.0A CN104703399A (en) | 2013-12-06 | 2013-12-06 | Circuit board and production method thereof |
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| CN104703399A true CN104703399A (en) | 2015-06-10 |
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| CN106507582A (en) * | 2015-09-07 | 2017-03-15 | 深南电路股份有限公司 | A kind of base plate for packaging of routing finger embedment resin and its processing method |
| CN107403734A (en) * | 2016-08-29 | 2017-11-28 | 上海兆芯集成电路有限公司 | Electronic structure manufacturing process |
| CN107403770A (en) * | 2016-08-29 | 2017-11-28 | 上海兆芯集成电路有限公司 | Electronic structure and electronic structure array |
| CN112420522A (en) * | 2019-08-23 | 2021-02-26 | 欣兴电子股份有限公司 | Packaging structure and preparation method thereof |
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| CN106507582A (en) * | 2015-09-07 | 2017-03-15 | 深南电路股份有限公司 | A kind of base plate for packaging of routing finger embedment resin and its processing method |
| CN107403734A (en) * | 2016-08-29 | 2017-11-28 | 上海兆芯集成电路有限公司 | Electronic structure manufacturing process |
| CN107403770A (en) * | 2016-08-29 | 2017-11-28 | 上海兆芯集成电路有限公司 | Electronic structure and electronic structure array |
| CN107403770B (en) * | 2016-08-29 | 2020-06-02 | 上海兆芯集成电路有限公司 | Electronic structure and electronic structure array |
| CN107403734B (en) * | 2016-08-29 | 2020-06-02 | 上海兆芯集成电路有限公司 | Electronic structure manufacturing process |
| CN112420522A (en) * | 2019-08-23 | 2021-02-26 | 欣兴电子股份有限公司 | Packaging structure and preparation method thereof |
| CN112420522B (en) * | 2019-08-23 | 2024-03-15 | 欣兴电子股份有限公司 | Packaging structure and preparation method thereof |
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