CN104254197B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
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- CN104254197B CN104254197B CN201310270638.2A CN201310270638A CN104254197B CN 104254197 B CN104254197 B CN 104254197B CN 201310270638 A CN201310270638 A CN 201310270638A CN 104254197 B CN104254197 B CN 104254197B
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- dielectric layer
- conductive circuit
- conductive
- blind hole
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 60
- 238000010168 coupling process Methods 0.000 claims abstract description 53
- 230000008878 coupling Effects 0.000 claims abstract description 52
- 238000005859 coupling reaction Methods 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 193
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000011889 copper foil Substances 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 18
- 239000011241 protective layer Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 238000003825 pressing Methods 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Abstract
A kind of circuit board, including the first dielectric layer, the first conductive circuit layer, metal coupling and the second dielectric layer, first dielectric layer and the second dielectric layer are connected with each other, first dielectric layer has the first surface away from the second dielectric layer, first conductive circuit layer is formed between the first dielectric layer and the second dielectric layer, the metal coupling is extended by the first conductive circuit layer integrally connected, and protrudes from the first surface of the first dielectric layer.The present invention also provides a kind of preparation method of the circuit board.
Description
Technical field
The present invention relates to circuit board making field, more particularly to a kind of circuit board and its making side with metal coupling
Method.
Background technology
When circuit board and other electronic components are assembled, it usually needs in the external conducting wire side of circuit board
Make metal coupling.The metal coupling is corresponding with the electric contact mat of electronic component, by circuit board by way of welding
Assembled with electronic component, in the prior art, the preparation method of described metal coupling includes step：First outside being covered in
First is formed in the welding resisting layer on layer conducting wire surface to be open so that the electric contact mat in conductive circuit layer exposes.Then, exist
It is formed with the surface formation photoresist graph layer of welding resisting layer, the photoresist graph layer corresponding with the first opening
Second opening.In order that the first opening can be completely revealed by obtaining the second opening, the size of the second opening needs to be more than first
The size of opening.Finally, the method similar using conducting wire is made, the filling conductive gold in the first opening and the second opening
Category.Remove after photoresist graph layer, described filling metal protrudes from welding resisting layer, form metal coupling.
Then, adopt with the aforedescribed process must secondary contraposition, the gap of metal coupling is difficult to reduce, therefore it is intensive to be unfavorable for arrangement
Metal coupling making.Further, since the electric contact mat of conducting wire is successively formed respectively with metal coupling, it is not one
It is body formed.So, after packaging is accomplished, stress is easily concentrated at structure interface, will cause electric contact mat and metal coupling
The phenomenon being separated from each other.
The content of the invention
Therefore, it is necessary to provide making and its method for a kind of circuit board, the metal with dense distribution can be obtained convex
The circuit board of block.
A kind of circuit board, including the first dielectric layer, the first conductive circuit layer, metal coupling and the second dielectric layer, described
One dielectric layer and the second dielectric layer are connected with each other, and first dielectric layer has the first surface away from the second dielectric layer, described
First conductive circuit layer is formed between the first dielectric layer and the second dielectric layer, and the metal coupling is by the first conductive circuit layer one
Body connection is extended, and protrudes from the first surface of the first dielectric layer.
A kind of preparation method of circuit board, including step：Support plate is provided；The first dielectric is pressed on the surface of the support plate
Layer, obtains multilager base plate；The first blind hole is formed in the multilager base plate, first blind hole runs through first dielectric layer simultaneously
Extend in the support plate；Metal coupling is formed in first blind hole, and first is formed on the surface of the first dielectric layer and is led
Electric line layer, the metal coupling is integrally formed with the first conductive circuit layer；The pressing the in the first conductive circuit layer side
Two dielectric layers；And support plate is removed, obtain circuit board.
A kind of preparation method of circuit board, including step：Support plate and the first copper foil are provided, first copper foil is formed at load
One surface of plate, the support plate is used to support first copper foil；The first dielectric layer is pressed on the surface of first copper foil,
Obtain multilager base plate；Form the first blind hole in the multilager base plate, first blind hole is through first dielectric layer and the
One copper foil is simultaneously extended in the support plate；Metal coupling is formed in first blind hole, and in the surface shape of the first dielectric layer
Into the first conductive circuit layer, the metal coupling is integrally formed with the first conductive circuit layer；In first conductive circuit layer one
The second dielectric layer is closed in side pressure；And support plate and the first copper foil are removed, obtain circuit board.
Compared with prior art, circuit board that the technical program is provided and preparation method thereof, the metal coupling passes through electricity
The mode of plating makes simultaneously with the first conductive circuit layer.So in identical board area, more metals can be set
Projection, so that the circuit distribution of circuit board is more intensive.Also, due to metal coupling and the first conductive circuit layer one
Shaping so that metal coupling is completely embedded with the first conductive circuit layer, it is to avoid in encapsulation process due to stress caused by
Metal coupling is separated with the first conductive circuit layer.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of the first copper foil that the technical program embodiment is provided and support plate.
Fig. 2 is the diagrammatic cross-section of Fig. 1 the first copper foil surface pressing dielectric layer formation multilager base plate.
Fig. 3 is to form the diagrammatic cross-section after the first blind hole in Fig. 2 multilager base plate.
Fig. 4 is metal coupling to be formed in Fig. 3 the first blind hole and in the first dielectric layer surface the first conductive circuit layer of formation
Diagrammatic cross-section afterwards.
Fig. 5 is the diagrammatic cross-section after pressing the second dielectric layer in Fig. 4 the first conductive circuit layer side.
Fig. 6 is the diagrammatic cross-section that the first blind hole is formed in Fig. 5 the second dielectric layer.
Fig. 7 is the diagrammatic cross-section after Fig. 6 the second dielectric layer surface the second conductive circuit layer of formation.
Fig. 8 is the diagrammatic cross-section after Fig. 7 the second conducting wire layer surface formation welding resisting layer.
Fig. 9 is that Fig. 8 removes the diagrammatic cross-section after support plate and the first copper foil.
Figure 10 is the diagrammatic cross-section for the circuit board that the technical program makes.
Main element symbol description
| Circuit board | 100 |
| Support plate | 110 |
| First copper foil | 120 |
| First dielectric layer | 130 |
| Multilager base plate | 140 |
| First blind hole | 141 |
| Metal coupling | 142 |
| First conductive circuit layer | 150 |
| Second dielectric layer | 160 |
| Second blind hole | 162 |
| Conductive blind hole | 161 |
| Second conductive circuit layer | 170 |
| Electric contact mat | 171 |
| Welding resisting layer | 180 |
| Opening | 181 |
| Protective layer | 190 |
| First surface | 101 |
| Second surface | 102 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
The circuit board manufacturing method that the technical program is provided comprises the following steps：
The first step, referring to Fig. 1, providing the copper foil 120 of support plate 110 and first.
The support plate 110 is used to support first copper foil 120.First copper foil 120 is thin copper foil, first bronze medal
The thickness of paper tinsel 120 is 2 microns to 5 microns.The support plate 110 is to use the metal material system different from the material of the first copper foil 120
Into or be made of nonmetallic materials.There is metal support plate 110 enough mechanical strengths to support the first copper foil 120.
Second step, also referring to Fig. 2, the first dielectric layer 130, the support plate are pressed on the surface of the first copper foil 120
110th, the first copper foil 120 and the first dielectric layer 130 collectively form multilager base plate 140.
First dielectric layer 130 can be by forming in the surface semi-solid preparation film of the first copper foil 120.
3rd step, referring to Fig. 3, forming multiple first blind holes 141 in the multilager base plate 140.
In the present embodiment, the support plate 110, which is adopted, to be formed from aluminium.First blind hole 141 can use the side of laser ablation
Formula is formed.First blind hole 141 is extended to inside support plate 110 from the side of the first dielectric layer 130 of the multilager base plate 140.
I.e. described first blind hole 141 runs through the first dielectric layer 130, the first copper foil 120 and partial support plate 110.In the present embodiment, due to
Multiple first blind holes 141 are formed by the way of laser ablation, the opening in the side of the first dielectric layer 130 of the first blind hole 141
The cross-sectional area at mouth end is more than the cross-sectional area for the bottom being located inside support plate 110.The shape of the longitudinal section of first blind hole 141
Shape is trapezoidal.
4th step, referring to Fig. 4, metal coupling 142 is formed in first blind hole 141, and simultaneously in the first dielectric
The surface of layer 130 forms the first conductive circuit layer 150, the metal coupling 142 and the first conductive circuit layer being connected electrically
150 are integrally formed.
The conductive circuit layer 150 of metal coupling 142 and first can be made using semi-additive process.It is specifically as follows：It is first
First pass through the modes such as chemical plating and form plating seed layer in the inwall of the first blind hole 141 and the surface of the first dielectric layer 130.So
Afterwards, photoresist graph layer is formed on the surface of the plating seed layer so that each first blind hole 141 is exposed, and
And the surface of the plating seed layer positioned at the first dielectric layer 130 forms photic with the shape complementation of the first conductive circuit layer 150
Resist figure.Then, by way of plating, each first blind hole 141 is completely filled to form metal coupling 142, and
The first conductive circuit layer 150 is formed in the space of photoresist figure.Finally, photoresist figure is removed and using erosion
Carve the plating seed layer for removing and being covered by photoresist figure.
Because first conductive circuit layer 150 and metal coupling 142 are formed simultaneously, so metal coupling 142 connects with it
The first conductive circuit layer 150 connect is integrally formed.
5th step, referring to Fig. 5, pressing the second dielectric layer 160 in the side of the first conductive circuit layer 150.
This step can use and form the second dielectric layer 160 with second step identical mode.
6th step, refers to Fig. 6 and Fig. 7, and the second conductive circuit layer 170 is formed on the surface of second dielectric layer 160.
In this step, conductive blind hole 161 also is formed with the second dielectric layer 160 in the lump, to cause the first conducting wire
The conductive circuit layer 170 of layer 150 and second is in electrical communication with one another.This step can specifically be adopted and completed with the following method：
First, multiple second blind holes 162 are formed in the second dielectric layer 160.
Second blind hole 162 can be formed by the way of laser ablation.
Then, it is blind second according to above-mentioned with making the identical method of 142 and first conductive circuit layer of metal coupling 150
Filling conducting metal formation conductive blind hole 161 in hole 162, and form the second conductive circuit layer on the surface of the second dielectric layer 160
170, first conductive circuit layer 150 is mutually conducted with the second conductive circuit layer 170 by conductive blind hole 161.
7th step, referring to Fig. 8, forming welding resisting layer 180 on the surface of the second conductive circuit layer 170.
This step can form welding resisting layer 180 by the way of printing liquid anti-solder ink.Formed in the welding resisting layer 180
There is the conducting wire in multiple openings 181, the second conductive circuit layer of part 170 to expose from opening 181, form electric contact mat
171。
8th step, also referring to Fig. 9, removes the copper foil 120 of support plate 110 and first.
In the present embodiment, support plate 110, which is adopted, to be formed from aluminium, and this step can be removed support plate 110 by the way of chemical etching
Remove.
When support plate 110 is made of nonmetallic materials such as resin etc., the side with being dissolved using chemical solvent can be used
Formula is removed.
After support plate 110 is removed, the first copper foil 120 can be removed by the way of etching.Due to the first copper foil 120
Thickness is smaller, so as to be removed the first copper foil 120 using shorter etching period, and metal coupling 142 only remove it is less
Part.
After support plate 110 is removed, metal coupling 142 is partially protrude through the first dielectric layer 130.
9th step, referring to Fig. 10, forming protective layer on the surface of metal coupling 142 and the surface of electric contact mat 171
190, obtain circuit board 100.
The protective layer 190 can weld film for organic guarantor（OSP）, or nickel-gold layer or NiPdAu layer.
It is understood that can also only provide support plate 110 in this step without providing the first copper foil 120.Because the
One copper foil 120 only plays the more preferable electric action more arrived in follow-up electroplating process, if being not provided with the first copper foil 120, shape
Into metal seed layer can play electric action.When the surface of support plate 110 in the first step does not form the first copper foil 120,
First dielectric layer 130 can be formed directly into the surface of support plate 110.Then, the first blind hole 141 of formation runs through the first dielectric layer
130 and extend in support plate 110.Also, in eight steps, removed without by the first copper foil 120.
Referring to Fig. 10, the technical program also provides a kind of circuit board 100, the circuit board 100 includes the first dielectric layer
130th, metal coupling 142, the second dielectric layer 160 and the first conductive circuit layer 150.
The dielectric layer 160 of first dielectric layer 130 and second is connected with each other.First conductive circuit layer 150 is located at the
Between one dielectric layer 130 and the second dielectric layer 160.First dielectric layer 130 has the first table away from the second dielectric layer 160
Face 101, second dielectric layer 160 has the second surface 102 away from the first dielectric layer 130.Metal coupling 142 is led with first
Electric line layer 150 is electrically connected to each other and is integrally formed, and the metal coupling 142 is through first dielectric layer 130 and protrudes from
The first surface 101.
The circuit board can also include the second conductive circuit layer 170 and conductive blind hole 161.Second conductive circuit layer
170 are formed at the second surface 102, and the conductive blind hole 161 is formed in the second dielectric layer 160, the first conductive circuit layer
150 and second conductive circuit layer 170 mutually conducted by the conductive blind hole 161.
The circuit board 100 can further include welding resisting layer 180, and the welding resisting layer 180 is formed at the second conductor wire
The surface of road floor 170 and second surface 102.Opening 181 is formed with the welding resisting layer 180.The second conductive circuit layer of part 170
Conducting wire is exposed from the opening 181, forms electric contact mat 171.
The circuit board 100 can also include protective layer 190, and the protective layer 190 is formed at electric contact mat 171 and gold
Belong to the surface of projection 142.
When being packaged with other electronic components, the metal coupling 142 can be used for passing through weldering with other electronic components
Ball is welded.
Circuit board that the technical program is provided and preparation method thereof, the metal coupling is led by way of plating with first
Electric line layer makes simultaneously.So in identical board area, more metal couplings can be set, so that circuit
It is more intensive that the circuit of plate is distributed.Also, because metal coupling is integrally formed with the first conductive circuit layer, so that metal
Projection is completely embedded with the first conductive circuit layer.After the completion of avoiding encapsulation, because stress easily concentrates on metal coupling and first
The intersection of conducting wire, caused by the phenomenon that is separated with the first conductive circuit layer of metal coupling.
It is understood that the circuit board manufacturing method of the technical program can apply to high-density interconnected circuit board
（HDI）Making.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (6)
1. a kind of circuit board, including the first dielectric layer, the first conductive circuit layer, metal coupling and the second dielectric layer, described first
Dielectric layer and the second dielectric layer are connected with each other, and first dielectric layer has a first surface away from the second dielectric layer, and described the
One conductive circuit layer is formed between the first dielectric layer and the second dielectric layer, and the metal coupling is by the first conductive circuit layer one
Connection is extended, and penetrates first dielectric layer, and protrudes from the first surface of the first dielectric layer, and the metal coupling is protruded
Matcoveredn is formed in the surface of first dielectric layer, and the opposite end of the protective layer is contacted with the first surface, institute
Stating circuit board also includes the second conductive circuit layer, and second dielectric layer has the second surface away from first dielectric layer,
Second conductive circuit layer is formed at the second surface, and second conductive circuit layer and second surface are formed with anti-welding
There is opening, the conductive circuit layer of part second is exposed to form electric contact mat from the opening, the electricity in layer, the welding resisting layer
The surface of property engagement pad is also formed with protective layer.
2. circuit board as claimed in claim 1, it is characterised in that also including conductive blind hole, the conductive blind hole is formed at
In two dielectric layers, first conductive circuit layer is mutually conducted with the second conductive circuit layer by the conductive blind hole.
3. a kind of circuit board manufacturing method, including step：
Support plate is provided；
The first dielectric layer is pressed on the surface of the support plate, multilager base plate is obtained；
The first blind hole is formed using being laser-ablated in the multilager base plate, first blind hole runs through first dielectric layer simultaneously
Extend in the support plate；
Metal coupling is formed in first blind hole, and the first conductive circuit layer is formed on the surface of the first dielectric layer, it is described
Metal coupling is integrally formed with the first conductive circuit layer；
The second dielectric layer is pressed in the first conductive circuit layer side；
The second conductive circuit layer is formed on surface of second dielectric layer away from the first dielectric layer；
Formed on the surface of second conductive circuit layer in welding resisting layer, the welding resisting layer and be formed with multiple openings, part second
Conductive circuit layer is exposed to form electric contact mat from the opening；
Support plate is removed, exposes the part that the metal coupling protrudes from first dielectric layer；And
The surface of the part of first dielectric layer and the table of the electric contact mat are protruded from the metal coupling exposed
Face forms protective layer, obtains circuit board.
4. circuit board manufacturing method as claimed in claim 3, it is characterised in that when forming second conductive circuit layer,
Conductive blind hole is also formed in the second dielectric layer, first conductive circuit layer is blind by the conduction with the second conductive circuit layer
Hole is in electrical communication with one another.
5. a kind of circuit board manufacturing method, including step：
Support plate and the first copper foil are provided, first copper foil is formed at a surface of support plate, and the support plate is used to support described
First copper foil；
The first dielectric layer is pressed on the surface of first copper foil, multilager base plate is obtained；
Form the first blind hole using being laser-ablated in the multilager base plate, first blind hole through first dielectric layer and
First copper foil is simultaneously extended in the support plate；
Metal coupling is formed in first blind hole, and the first conductive circuit layer is formed on the surface of the first dielectric layer, it is described
Metal coupling is integrally formed with the first conductive circuit layer；
The second dielectric layer is pressed in the first conductive circuit layer side；
The second conductive circuit layer is formed on surface of second dielectric layer away from the first dielectric layer；
Formed on the surface of second conductive circuit layer in welding resisting layer, the welding resisting layer and be formed with multiple openings, part second
Conductive circuit layer is exposed to form electric contact mat from the opening；
Support plate and the first copper foil are removed, exposes the part that the metal coupling protrudes from first dielectric layer；And
The surface of the part of first dielectric layer and the table of the electric contact mat are protruded from the metal coupling exposed
Face forms protective layer, obtains circuit board.
6. circuit board manufacturing method as claimed in claim 5, it is characterised in that in the second dielectric layer away from the first dielectric layer
Surface is formed after the second conductive circuit layer, is additionally included in the second dielectric layer and is formed conductive blind hole, first conducting wire
Layer is mutually conducted with the second conductive circuit layer by the conductive blind hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310270638.2A CN104254197B (en) | 2013-06-27 | 2013-06-27 | Circuit board and preparation method thereof |
| TW102124005A TWI594675B (en) | 2013-06-27 | 2013-07-04 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310270638.2A CN104254197B (en) | 2013-06-27 | 2013-06-27 | Circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104254197A CN104254197A (en) | 2014-12-31 |
| CN104254197B true CN104254197B (en) | 2017-10-27 |
Family
ID=52188612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310270638.2A Active CN104254197B (en) | 2013-06-27 | 2013-06-27 | Circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104254197B (en) |
| TW (1) | TWI594675B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1791311A (en) * | 2004-12-01 | 2006-06-21 | 新光电气工业株式会社 | Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure |
| TW200708219A (en) * | 2005-08-09 | 2007-02-16 | Phoenix Prec Technology Corp | Circuit board structure and fabricating method thereof |
| TW201044940A (en) * | 2009-06-11 | 2010-12-16 | Phoenix Prec Technology Corp | Method for fabricating packaging substrate and base therefor |
| CN102867806A (en) * | 2011-07-08 | 2013-01-09 | 欣兴电子股份有限公司 | Package substrate and method for manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI475935B (en) * | 2011-07-08 | 2015-03-01 | Unimicron Technology Corp | Coreless package substrate and fabrication method thereof |
-
2013
- 2013-06-27 CN CN201310270638.2A patent/CN104254197B/en active Active
- 2013-07-04 TW TW102124005A patent/TWI594675B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1791311A (en) * | 2004-12-01 | 2006-06-21 | 新光电气工业株式会社 | Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure |
| TW200708219A (en) * | 2005-08-09 | 2007-02-16 | Phoenix Prec Technology Corp | Circuit board structure and fabricating method thereof |
| TW201044940A (en) * | 2009-06-11 | 2010-12-16 | Phoenix Prec Technology Corp | Method for fabricating packaging substrate and base therefor |
| CN102867806A (en) * | 2011-07-08 | 2013-01-09 | 欣兴电子股份有限公司 | Package substrate and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201507562A (en) | 2015-02-16 |
| CN104254197A (en) | 2014-12-31 |
| TWI594675B (en) | 2017-08-01 |
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Effective date of registration: 20161220 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Applicant after: Qi Ding Technology Qinhuangdao Co.,Ltd. Applicant after: Zhen Ding Technology Co.,Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Applicant before: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co.,Ltd. Applicant before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20231012 Address after: 066004 No. 18-2, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: No.18, Tengfei Road, Qinhuangdao Economic and Technological Development Zone, Hebei Province 066004 Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |