CN111954384A - Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof - Google Patents
Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof Download PDFInfo
- Publication number
- CN111954384A CN111954384A CN201910869915.9A CN201910869915A CN111954384A CN 111954384 A CN111954384 A CN 111954384A CN 201910869915 A CN201910869915 A CN 201910869915A CN 111954384 A CN111954384 A CN 111954384A
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- Prior art keywords
- board structure
- circuit board
- insulating substrate
- manufacturing
- layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 51
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000002356 single layer Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a circuit board structure and a manufacturing method thereof, and a display device and a manufacturing method thereof. The insulating substrate has a first surface and a second surface opposite to each other. The connecting pad is located on the first surface of the insulating substrate. The circuit layer is located on the second surface of the insulating substrate. The via hole penetrates through the insulating substrate. The connecting pads are overlapped with the through holes.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a circuit board structure and a method for manufacturing the same, and a display device having the circuit board structure and a method for manufacturing the same.
Background
The circuit board often has a solder mask layer on the side where the electronic components are disposed. The solder mask layer needs to be windowed to be connected with the circuit of the circuit board. However, solder mask windows have size limitations and alignment issues.
Disclosure of Invention
The invention provides a circuit board structure and a manufacturing method thereof, which can have better flatness or higher element configuration number in application.
The manufacturing method of the circuit board structure comprises the following steps. An insulating substrate is provided. The insulating substrate is provided with a first surface and a second surface which are opposite to each other and a plurality of through holes which connect the first surface and the second surface. And forming a conductive material layer on the insulating substrate to cover the first surface and the second surface, wherein the conductive material layer is filled into the through holes to form a plurality of through holes. Removing a portion of the conductive material layer on the first surface to form a plurality of connection pads, wherein the plurality of connection pads are overlapped with the plurality of via holes. And removing part of the conductive material layer on the second surface to form a circuit layer.
The circuit board structure comprises an insulating substrate, a plurality of connecting pads, a circuit layer and a plurality of through holes. The insulating substrate has a first surface and a second surface opposite to each other. The connecting pad is located on the first surface of the insulating substrate. The circuit layer is located on the second surface of the insulating substrate. The via hole penetrates through the insulating substrate. The connecting pads are overlapped with the through holes.
In an embodiment of the invention, on the first surface, there is no circuit between the plurality of connection pads.
In an embodiment of the invention, the first surface has only a plurality of connecting pads.
In an embodiment of the invention, the plurality of via holes and the plurality of connecting pads are arranged in a one-to-one manner.
In an embodiment of the invention, a projection range of the plurality of via holes on the first surface is completely located within a projection range of the plurality of connection pads on the first surface. In an embodiment of the invention, the plurality of via holes are solid through holes.
In an embodiment of the present invention, the aperture of the via hole is smaller than 50 μm.
Based on the above, the circuit board structure and the manufacturing method thereof of the invention can have better flatness or higher element configuration number in application.
The invention provides a display device and a manufacturing method thereof, which have better flatness or higher configuration number of display elements.
The display device of the invention comprises the circuit board structure and the display element. The display element is arranged on the first surface of the insulating base material of the circuit board structure. The display element is electrically connected to the plurality of connecting pads of the circuit board structure. The display elements are Micro light emitting diodes (Micro LEDs) or sub-millimeter light emitting diodes (mini LEDs).
The manufacturing method of the display device comprises the following steps. The circuit board structure is provided. The display element is configured on the first surface of the insulating base material of the circuit board structure, and the display element is electrically connected with the connecting pads of the circuit board structure. The display elements are micro-leds or sub-millimeter leds.
Based on the above, the display device and the manufacturing method thereof of the invention include or use the circuit board structure of the invention, so that the display device has better flatness or higher number of display elements.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1A to fig. 1C are schematic partial cross-sectional views illustrating a method for manufacturing a circuit board structure according to a first embodiment of the invention;
FIG. 1D is a schematic top view of a portion of a circuit board structure according to a first embodiment of the present invention;
FIG. 1E is a schematic partial bottom view of a circuit board structure according to a first embodiment of the invention;
fig. 2 is a schematic, partly cross-sectional view of a circuit board structure according to a second embodiment of the present invention;
fig. 3 is a schematic, partly cross-sectional view of a circuit board structure according to a third embodiment of the present invention;
fig. 4 is a schematic, partly cross-sectional view of a circuit board structure according to a fourth embodiment of the present invention;
fig. 5 is a schematic partial cross-sectional view of a display device according to an embodiment of the invention.
Description of the reference numerals
100. 200, 300, 400: circuit board structure
110: insulating base material
111: first surface
112: second surface
113: through hole
113 a: pore diameter
120: layer of conductive material
121: first conductive part
122: second conductive part
123: third conductive part
141: connecting pad
152: line layer
163. 363, 463: conducting hole
163 a: pore diameter
364: core conductive layer
465: core insulating layer
270: insulating layer
271: insulated opening
500: display device
580: display element
590: conductive paste
Detailed Description
The foregoing and other technical and scientific aspects, features and utilities of the present invention will be apparent from the following detailed description of various embodiments, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: "upper", "lower", "front", "rear", "left", "right", etc., are simply directions with reference to the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.
Fig. 1A to fig. 1C are schematic partial cross-sectional views illustrating a method for manufacturing a circuit board structure according to a first embodiment of the invention. Fig. 1D is a schematic top view of a portion of a circuit board structure according to a first embodiment of the invention. Fig. 1E is a partial schematic bottom view of a circuit board structure according to a first embodiment of the invention.
Referring to fig. 1A, an insulating substrate 110 is provided. In the embodiment, the insulating substrate 110 may be a hard substrate or a flexible substrate, and the invention is not limited thereto. For example, the material of the hard substrate includes polymer glass fiber composite, glass, ceramic or other hard materials, and the material of the flexible substrate is Polyimide (PI) or other flexible materials. The insulating substrate 110 may be a single-layer board or a composite board, but the invention is not limited thereto.
The insulating substrate 110 has a first surface 111, a second surface 112, and a plurality of vias 113. The second surface 112 is opposite to the first surface 111. The via 113 connects the first surface 111 and the second surface 112. The through hole 113 may be formed by, for example, mechanical drilling, laser drilling, etching or other suitable methods, which are not limited in the present invention.
It is noted that, in fig. 1A, only one of the through holes 113 is exemplarily shown, but the number of the through holes 113 is not limited by the present invention.
In the present embodiment, the aperture 113a of the through-hole 113 may be less than 50 micrometers (μm), but the present invention is not limited thereto.
Referring to fig. 1B, a conductive material layer 120 is formed on the insulating substrate 110. The conductive material layer 120 may have a single-layer structure or a multi-layer structure, and the invention is not limited thereto. For example, the seed layer may be formed by sputtering. Then, a plating layer may be formed on the seed layer by electroplating (electroplating). However, the material or forming manner of the conductive material layer 120 is not limited in the present invention.
The conductive material layer 120 includes a first conductive portion 121, a second conductive portion 122, and a third conductive portion 123. The first conductive portion 121 covers the first surface 111 of the insulating substrate 110. The second conductive portion 122 covers the second surface 112 of the insulating substrate 110. The third conductive portion 123 is filled in the via hole 113 of the insulating substrate 110.
In this embodiment, the third conductive portion 123 may completely fill the via hole 113 of the insulating substrate 110. In other words, the via hole 113 may be completely filled with the third conductive portion 123 without having a void therein, but the present invention is not limited thereto.
Referring to fig. 1B to fig. 1C, a portion of the first conductive portion 121 on the first surface 111 is removed to form a plurality of connection pads 141. And, a portion of the second conductive portion 122 on the second surface 112 is removed to form at least the circuit layer 152. It should be noted that the order of forming the connecting pads 141 and the circuit layer 152 is not limited in the present invention. In addition, the third conductive part 123 filled in the through hole 113 may constitute the via hole 163.
The connecting pads 141 and/or the circuit layer 152 may be formed by etching, laser stripping (laser stripping), or other suitable methods, for example, but the invention is not limited thereto. The bonding pads 141 and the circuit layer 152 may be formed in the same manner or different manners, and the invention is not limited thereto. In addition, the routing (layout) of the circuit layer 152 can be adjusted according to the design requirement, and the invention is not limited thereto.
The manufacturing of the circuit board structure 100 of the present embodiment can be substantially completed through the above processes.
Referring to fig. 1C to fig. 1E, the circuit board structure 100 includes an insulating substrate 110, a plurality of connecting pads 141, a circuit layer 152, and a plurality of vias 163. The insulating substrate 110 has a first surface 111 and a second surface 112 opposite to each other. The connecting pad 141 is disposed on the first surface 111 of the insulating substrate 110. The circuit layer 152 is disposed on the second surface 112 of the insulating substrate 110. The via 163 penetrates the insulating substrate 110. The connection pad 141 overlaps the via hole 163.
In the present embodiment, no circuit (not shown) is disposed between the connecting pads 141 on the first surface 111. Therefore, if it is necessary to dispose other elements (such as the display element 580 of the following embodiment) on the first surface 111, the formation of the solder mask layer on the first surface 111 can be omitted. Therefore, the problems of size limitation and alignment of the solder mask window of the solder mask layer can be reduced.
In the present embodiment, the first surface 111 has only a plurality of connection pads 141 thereon. Thus, the number of the connecting pads 141 on the first surface 111 per unit area can be increased; alternatively, the distribution density of the bonding pads 141 can be increased.
In the present embodiment, the number of the vias 163 is plural, the number of the connection pads 141 is plural, and the vias 163 and the connection pads 141 may be configured in a one-to-one manner. In other words, the number of the via holes 163 may be the same as the number of the connection pads 141.
In the present embodiment, the projection range of the via 163 on the first surface 111 is completely located within the projection range of the connecting pad 141 on the first surface 111.
In the present embodiment, the plurality of via holes 163 are solid through holes. Therefore, if it is desired to dispose other elements (e.g., the display element 580 of the subsequent embodiment) on the first surface 111, the flow of the conductive adhesive material (e.g., the conductive paste 590 of the subsequent embodiment) into the through hole 113 can be reduced. Therefore, the possibility of surface unevenness can be reduced, and the overall flatness can be improved.
In the present embodiment, the aperture 163a of the via 163 may be smaller than 50 μm.
Fig. 2 is a schematic partial cross-sectional view of a circuit board structure according to a second embodiment of the invention. The manufacturing method of the circuit board structure 200 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment, and similar components are denoted by the same reference numerals and have similar functions, materials or forming manners, and descriptions thereof are omitted.
The circuit board structure 200 of the present embodiment is similar to the circuit board structure 100 of the first embodiment, and the difference is: the wiring board structure 100 may further include an insulating layer 270. The insulating layer 270 is disposed on the second surface 112 of the insulating substrate 110, and the insulating layer 270 covers at least a portion of the circuit layer 152.
In the embodiment, the insulating layer 270 may have a single-layer structure or a multi-layer structure, and the invention is not limited thereto.
In the embodiment, the insulating layer 270 may be a cover layer (or a solder mask), which is not limited in the invention.
In the present embodiment, the insulating layer 270 may have an insulating opening 271, so that the circuit layer 152 can be electrically connected to other conductive elements (not shown) through the insulating opening 271 of the insulating layer 270.
Fig. 3 is a schematic partial cross-sectional view of a circuit board structure according to a third embodiment of the invention. The manufacturing method of the circuit board structure 300 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or forming manners, and descriptions thereof are omitted.
The circuit board structure 300 of the present embodiment is similar to the circuit board structure 100 of the first embodiment, and the differences are: the via 363 has a core conductive layer 364. In other words, the via 363 may include the third conductive portion 123 and the core conductive layer 364. The via hole 363 may be formed by multiple plating.
In addition, in the process of forming the via hole 363, if the third conductive portion 123 is not completely filled in the through hole 113 of the insulating substrate 110, the via hole 363 can be a solid through hole through the core conductive layer 364.
Fig. 4 is a schematic partial cross-sectional view of a circuit board structure according to a fourth embodiment of the invention. The manufacturing method of the circuit board structure 400 of the present embodiment is similar to the manufacturing method of the circuit board structure 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or forming manners, and descriptions thereof are omitted.
The circuit board structure 400 of the present embodiment is similar to the circuit board structure 100 of the first embodiment, and the differences are: the via 463 has a core insulating layer 465. In other words, the via hole 463 may include the third conductive portion 123 and the core insulating layer 465. The material of the core insulating layer 465 may include resin, ink, or other suitable curable material, and the invention is not limited thereto.
In addition, in the process of forming the via hole 463, if the third conductive portion 123 is not completely filled in the through hole 113 of the insulating substrate 110, the via hole 463 may be a solid through hole by the core insulating layer 465.
In summary, the circuit board structure and the manufacturing method thereof of the present invention can have better flatness or higher number of elements in application.
Fig. 5 is a schematic partial cross-sectional view of a display device according to an embodiment of the invention.
Referring to fig. 5, a method for manufacturing the display device 500 may be as follows.
A circuit board structure is provided. In the present embodiment, the circuit board structure used is the circuit board structure 100 of the first embodiment, but in other embodiments not shown, a circuit board structure similar to the circuit board structure 100 (e.g., a circuit board structure identical or similar to the circuit board structures 200, 300, 400) may be used. In other words, in the following description, the circuit board structure is shown and described by using the exemplary circuit board structure 100, and similar components are denoted by the same reference numerals, and have similar functions, materials or forming manners, and descriptions thereof are omitted.
Referring to fig. 5, the display device 580 is disposed on the first surface 111 of the insulating substrate 110 of the circuit board structure 100, and the display device 580 is electrically connected to the plurality of connection pads 141 of the circuit board structure 100.
In the present embodiment, the display device 580 may be electrically connected to the connection pad 141 by flip chip bonding (flip chip bonding). For example, the display device 580 and the connecting pad 141 may be electrically connected by a conductive paste 590 (e.g., solder paste).
In the present embodiment, the via 163 is a solid through hole. Therefore, when the display element 580 is disposed on the first surface 111, the flow of the conductive paste 590 into the through hole 113 can be reduced. Thus, the possibility of surface irregularities can be reduced, and the flatness of the entire display device 580 can be improved.
In the embodiment, since there is no circuit (not shown) between the connection pads 141 on the first surface 111 of the insulating substrate 110 of the circuit board structure 100. Therefore, when the display element 580 is disposed on the first surface 111, the formation of the solder mask layer on the first surface 111 can be omitted. Thus, the size limitation and the alignment of the solder mask window of the solder mask layer can be reduced, and the size limitation and the alignment of the display device 580 can also be reduced. In other words, the display element 580 may be a Micro light emitting diode (Micro LED) or a sub-millimeter light emitting diode (mini LED), so that the resolution and the display quality of the display device 500 can be improved.
In the present embodiment, in the circuit board structure 100, the first surface 111 of the insulating substrate 110 of the circuit board structure 100 only has the connection pads 141. In this way, the number of unit areas or the distribution density of the connecting pads 141 can be increased, so that the number of unit areas or the distribution density of the display device 500 can be further increased, and the resolution and the display quality of the display element 580 can be improved.
In summary, the display device and the manufacturing method thereof of the present invention include or use the circuit board structure of the present invention, so that the display device has better flatness or higher number of display elements.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A manufacturing method of a circuit board structure comprises the following steps:
providing an insulating substrate, wherein the insulating substrate is provided with a first surface and a second surface which are opposite to each other and a plurality of through holes which connect the first surface and the second surface;
forming a conductive material layer on the insulating substrate to cover the first surface and the second surface, wherein the conductive material layer is filled into the through holes to form a plurality of through holes;
removing a part of the conductive material layer on the first surface to form a plurality of connecting pads, wherein the plurality of connecting pads are overlapped with the plurality of via holes; and
and removing part of the conductive material layer on the second surface to form a circuit layer.
2. A circuit board structure comprising:
an insulating substrate having a first surface and a second surface opposite to each other;
a plurality of connection pads on the first surface of the insulating substrate;
a wiring layer on the second surface of the insulating substrate; and
and the connecting pads are overlapped with the through holes.
3. The circuit board structure of claim 2, wherein no circuitry is disposed between the pads on the first surface.
4. The circuit board structure of claim 3, wherein only the plurality of connecting pads are disposed on the first surface.
5. The wiring board structure according to claim 2, wherein the plurality of via holes and the plurality of connection pads are arranged in a one-to-one manner.
6. The circuit board structure according to claim 2, wherein the projection range of the plurality of via holes on the first surface is completely located within the projection range of the plurality of connection pads on the first surface.
7. The wiring board structure of claim 2, wherein the plurality of vias are solid through holes.
8. The wiring board structure of claim 2, wherein the plurality of vias have a pore size of less than 50 microns.
9. A display device, comprising:
the wiring board structure of claim 2; and
and the display element is arranged on the first surface of the insulating base material of the circuit board structure and is electrically connected with the connecting pads of the circuit board structure, wherein the display element is a micro light-emitting diode or a sub-millimeter light-emitting diode.
10. A method for manufacturing a display device includes:
providing a wiring board structure according to claim 2; and
and arranging a display element on the first surface of the insulating base material of the circuit board structure, and electrically connecting the display element to the connecting pads of the circuit board structure, wherein the display element is a micro light-emitting diode or a sub-millimeter light-emitting diode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108117029 | 2019-05-17 | ||
| TW108117029A TWI704854B (en) | 2019-05-17 | 2019-05-17 | Circuit board structure and manufacturing method thereof, display device having circuit board structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111954384A true CN111954384A (en) | 2020-11-17 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910869915.9A Pending CN111954384A (en) | 2019-05-17 | 2019-09-16 | Circuit board structure and manufacturing method thereof, display device and manufacturing method thereof |
| CN201921535705.8U Active CN210725527U (en) | 2019-05-17 | 2019-09-16 | Circuit board structure and display device with same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921535705.8U Active CN210725527U (en) | 2019-05-17 | 2019-09-16 | Circuit board structure and display device with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN111954384A (en) |
| TW (1) | TWI704854B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI704854B (en) * | 2019-05-17 | 2020-09-11 | 同泰電子科技股份有限公司 | Circuit board structure and manufacturing method thereof, display device having circuit board structure and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284640A1 (en) * | 2005-06-20 | 2006-12-21 | Shing-Ru Wang | Structure of circuit board and method for fabricating the same |
| CN103906371A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN104394646A (en) * | 2014-11-28 | 2015-03-04 | 京东方科技集团股份有限公司 | Printed circuit board, ball grid array package and wiring method of printed circuit board |
| TW201720249A (en) * | 2015-10-16 | 2017-06-01 | 鵬鼎科技股份有限公司 | Circuit board and method for manufacturing same |
| CN107666770A (en) * | 2016-07-29 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Has circuit board of weld pad and preparation method thereof |
| CN210725527U (en) * | 2019-05-17 | 2020-06-09 | 同泰电子科技股份有限公司 | Circuit board structure and display device with same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM583665U (en) * | 2019-05-17 | 2019-09-11 | 同泰電子科技股份有限公司 | Circuit board structure and display device having circuit board structure |
-
2019
- 2019-05-17 TW TW108117029A patent/TWI704854B/en active
- 2019-09-16 CN CN201910869915.9A patent/CN111954384A/en active Pending
- 2019-09-16 CN CN201921535705.8U patent/CN210725527U/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284640A1 (en) * | 2005-06-20 | 2006-12-21 | Shing-Ru Wang | Structure of circuit board and method for fabricating the same |
| CN103906371A (en) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Circuit board having embedded components and manufacturing method thereof |
| CN104394646A (en) * | 2014-11-28 | 2015-03-04 | 京东方科技集团股份有限公司 | Printed circuit board, ball grid array package and wiring method of printed circuit board |
| TW201720249A (en) * | 2015-10-16 | 2017-06-01 | 鵬鼎科技股份有限公司 | Circuit board and method for manufacturing same |
| CN107666770A (en) * | 2016-07-29 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Has circuit board of weld pad and preparation method thereof |
| CN210725527U (en) * | 2019-05-17 | 2020-06-09 | 同泰电子科技股份有限公司 | Circuit board structure and display device with same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI704854B (en) | 2020-09-11 |
| CN210725527U (en) | 2020-06-09 |
| TW202044954A (en) | 2020-12-01 |
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