CN111458941A - Display module, manufacturing method thereof and display device - Google Patents
Display module, manufacturing method thereof and display device Download PDFInfo
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- CN111458941A CN111458941A CN202010344004.7A CN202010344004A CN111458941A CN 111458941 A CN111458941 A CN 111458941A CN 202010344004 A CN202010344004 A CN 202010344004A CN 111458941 A CN111458941 A CN 111458941A
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- flexible substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
Abstract
The application discloses display module assembly, manufacturing method and display device thereof relates to the technical field of display, and comprises the following steps: a display panel and a driving chip; the display panel comprises a display area and a non-display area surrounding the display area; the non-display area comprises a binding area; the non-display area comprises a plurality of first signal lines; the bonding region includes a plurality of first conductive pads; the first signal line is electrically connected with the first conductive pad; the flexible substrate is bound in the binding region and comprises a first surface, a plurality of second conductive gaskets are arranged on the first surface, and the second conductive gaskets are bound with the first conductive gaskets; the driving chip is located on the first surface of the flexible substrate, and the second conductive gasket is electrically connected with the driving chip. This application sets up driver chip on flexible substrate, realizes driver chip and display panel's electricity through flexible substrate and is connected, can effectively reduce display panel's frame width.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module, a manufacturing method thereof and a display device.
Background
Along with the development and popularization of mobile phone intellectualization, the requirements of users on intelligent equipment are higher and higher, and the trend of intelligent equipment towards large-screen, ultrathin and ultra-narrow frames is more and more obvious.
In order to effectively reduce the bezel width, the bezel is generally reduced by folding back the flexible panel, but this method is generally applied to an organic light emitting display panel. Because the liquid crystal panel needs to use the upper and lower glass substrates, the glass substrates cannot be bent, so the liquid crystal panel package generally adopts cof (chip On flix) and cog (chip On glass) processes for packaging, and the effect of reducing the frame width is obviously lower than that of the flexible organic light-emitting display panel. In addition, in the COF, the FPC to which the IC is attached to the bonding region by attaching the IC on the FPC (Flexible Printed Circuit), and since the process precision of the FPC is much lower than that of the display panel, the attachment cost of the IC on the FPC is high. COG attaches IC on little glass earlier, then links to each other with the little glass that attaches IC with display panel through FPC, because FPC's precision is low, to the display panel of high resolution, FPC need set up a large amount of channels, can show increase FPC's area to can cause the cost to rise.
Disclosure of Invention
In view of this, the present application provides a display module, a manufacturing method thereof and a display device, in which a driving chip is disposed on a flexible substrate, and the driving chip is electrically connected to a display panel through the flexible substrate, so that the frame width of the display panel can be effectively reduced.
In order to solve the technical problem, the following technical scheme is adopted:
in a first aspect, the present application provides a display module, including: a display panel and a driving chip;
the display panel includes a display area and a non-display area surrounding the display area; the non-display area comprises a binding area; the non-display area comprises a plurality of first signal lines; the bonding region comprises a plurality of first conductive pads; the first signal line is electrically connected with the first conductive pad;
a flexible substrate is bound in the binding region, the flexible substrate comprises a first surface, a plurality of second conductive gaskets are arranged on the first surface, and the second conductive gaskets are bound with the first conductive gaskets;
the driving chip is located on the first surface of the flexible substrate, and the second conductive pad is electrically connected with the driving chip.
In a second aspect, the present application provides a method for manufacturing a display module, including:
manufacturing a display panel, wherein the display panel comprises a display area and a non-display area surrounding the display area; the non-display area comprises a binding area; the non-display area comprises a plurality of first signal lines; the bonding region comprises a plurality of first conductive pads; the first signal line is electrically connected with the first conductive pad;
manufacturing a flexible substrate, wherein the flexible substrate comprises a first surface, and the first surface comprises a plurality of second conductive gaskets;
binding at least one driving chip on the first surface of the flexible substrate, and electrically connecting the second conductive gasket to the driving chip;
a first conductive pad binding the flexible substrate to the binding region through the second conductive pad.
The third aspect, this application still another display device, including the display module assembly, this display module assembly is the display module assembly that this application provided.
Compared with the prior art, the display module, the manufacturing method thereof and the display device provided by the invention at least realize the following beneficial effects:
according to the display module, the manufacturing method of the display module and the display device, the driving chip is arranged on the flexible substrate, the driving chip does not need to occupy the space of the display panel, and the area of a non-display area of the display panel is favorably reduced. And according to the process precision of the display panel, arranging a first conductive gasket in a binding area of the display panel, arranging a second conductive gasket on the flexible substrate, and realizing the electric connection between each signal line in the display panel and the driving chip by binding the second conductive gasket and the first conductive gasket. In addition, the second conductive gasket on the second flexible substrate can be arranged according to the process precision of the display panel, so that the problem that the cost is increased due to the fact that the process precision of the FPC is far lower than that of the display panel can be solved, and the manufacturing cost is saved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a flexible substrate according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of the display module of the present application along the direction AA' in FIG. 1;
fig. 4 is a schematic structural diagram of another flexible substrate provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a flexible substrate according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a liquid crystal display module according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a first side portion provided in an embodiment of the present application;
fig. 8 is a schematic diagram illustrating an arrangement of conductive pads provided in an embodiment of the present application;
fig. 9 is a schematic view illustrating another arrangement of the conductive pads provided in the embodiments of the present application;
fig. 10 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram illustrating a display module according to an embodiment of the present disclosure;
fig. 12 is a flowchart illustrating a method for manufacturing a flexible substrate according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram illustrating a method for manufacturing a flexible substrate according to an embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a driver chip and an FPC according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of another driving chip and FPC provided in the embodiment of the present application;
fig. 16 is another flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 17 is a flowchart illustrating a method for manufacturing a display module including a second signal line according to an embodiment of the present disclosure;
fig. 18 is a flowchart illustrating a method for manufacturing a display module including a multiplexing unit according to an embodiment of the disclosure;
fig. 19 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 20 is a schematic structural diagram illustrating a method for fabricating a liquid crystal display module according to an embodiment of the present disclosure;
fig. 21 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 22 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. Furthermore, the term "coupled" is intended to encompass any direct or indirect electrical coupling. Thus, if a first device couples to a second device, that connection may be through a direct electrical coupling or through an indirect electrical coupling via other devices and couplings. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims. The same parts between the embodiments are not described in detail.
In order to effectively reduce the bezel width, the bezel is generally reduced by folding back the flexible panel, but this method is generally applied to an organic light emitting display panel. Because the liquid crystal panel needs to use the upper and lower glass substrates, the glass substrates cannot be bent, so the liquid crystal panel package generally adopts cof (chip On flix) and cog (chip On glass) processes for packaging, and the effect of reducing the frame width is obviously lower than that of the flexible organic light-emitting display panel. In addition, in the COF, the FPC to which the IC is attached to the bonding region by attaching the IC on the FPC (Flexible Printed Circuit), and since the process precision of the FPC is much lower than that of the display panel, the attachment cost of the IC on the FPC is high. COG attaches IC on little glass earlier, then links to each other with the little glass that attaches IC with display panel through FPC, because FPC's precision is low, to the display panel of high resolution, FPC need set up a large amount of channels, can show increase FPC's area to can cause the cost to rise.
In view of this, the present application provides a display module, a manufacturing method thereof and a display device, in which a driving chip is disposed on a flexible substrate, and the driving chip is electrically connected to a display panel through the flexible substrate, so that the frame width of the display panel can be effectively reduced.
The following detailed description is to be read in connection with the drawings and the detailed description.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure, fig. 2 is a schematic structural diagram of a flexible substrate according to an embodiment of the present disclosure, fig. 3 is a cross-sectional view of a display module according to an embodiment of the present disclosure along an AA' direction in fig. 1, and referring to fig. 1 to fig. 3, a display module 100 according to an embodiment of the present disclosure includes: a display panel 110 and a driving chip 130;
referring to fig. 1, the display panel 110 includes a display area 101 and a non-display area 102 surrounding the display area 101; the non-display area 102 includes a binding area 111; the non-display area 102 includes a plurality of first signal lines 113; the bonding region 111 includes a plurality of first conductive pads 112; the first signal line 113 is electrically connected to the first conductive pad 112;
referring to fig. 2 and 3, a flexible substrate 120 is bonded to the bonding region 111, the flexible substrate 120 includes a first surface 121, the first surface 121 is provided with a plurality of second conductive pads 122, and the second conductive pads 122 are bonded to the first conductive pads 112;
referring to fig. 2, the driving chip 130 is located on the first surface 121 of the flexible substrate 120, and the second conductive pad 122 is electrically connected to the driving chip 130.
Specifically, referring to fig. 1 to fig. 3, the display module 100 provided in the present embodiment includes a display panel 110 and a driving chip 130, the display panel 110 includes a display area 101 and a non-display area 102, the non-display area 102 surrounds the display area 101, the non-display area 102 includes a bonding area 111, and the bonding area 111 is provided with a plurality of first conductive pads 112. The non-display area 102 further includes a plurality of first signal lines 113, and the first signal lines 113 are electrically connected to the first conductive pads 112. The display module 100 further includes a flexible substrate 120, wherein a plurality of second conductive pads 122 are disposed on a first surface 121 of the flexible substrate 120, and the flexible substrate 120 is bound to the display panel 110 by binding the first conductive pads 112 and the second conductive pads 122, so that electrical connection is achieved between the two. The driving chip 130 is disposed on the first surface 121 of the flexible substrate 120, that is, the driving chip 130 and the second conductive pad 122 are disposed on the same surface of the flexible substrate 120, and the driving chip 130 is electrically connected to the second conductive pad 122, so that the signal of the driving chip 130 can be transmitted to the display panel 110 through the second conductive pad 122, and the normal display of the display panel 110 is controlled.
In the display module 100 provided in the embodiment of the present application, the driving chip 130 is disposed on the flexible substrate 120, so that the driving chip 130 does not occupy the space of the display panel 110, which is beneficial to reducing the area of the non-display area 102 of the display panel 110. According to the process precision of the display panel 110, the first conductive pads 112 are disposed in the bonding regions 111 of the display panel 110, the second conductive pads 122 are disposed on the flexible substrate 120, and the second conductive pads 122 and the first conductive pads 112 are bonded, so that the electrical connection between the signal lines in the display panel 110 and the driving chip 130 can be realized. The second conductive pad 122 on the second flexible substrate 120 can be set according to the process precision of the display panel 110, so that the problem of cost increase caused by the process precision of the FPC being far lower than the process precision of the display panel 110 can be avoided, and the manufacturing cost can be saved.
It should be noted that the first signal line 113 in this embodiment may be at least one of a touch control line, a data line or a shift register driving line, for example, when the first signal line 113 is a touch control line, the driving chip 130 sends a touch control signal to the first signal line 113 through the second conductive pad 122 and the first conductive pad 112, and sends the touch control signal to a touch control electrode in the display panel 110 through the first signal line 113, so as to implement a touch control function, when the first signal line 113 is a data line, the driving chip 130 sends a data signal to the first signal line 113, and sends the data signal to each pixel unit in the display panel 110 through the first signal line 113, so as to display the display panel 110, when the first signal line 113 is a shift register driving line, the first signal line 113 may be a clock signal line, an STV signal line, a VGH, a VG L, and the like, besides, the first signal line 113 may also be other signal lines, this application does not limit this, and fig. 1-3 merely illustrates that the flexible substrate 120 and the driving chip 130 are arranged through the second conductive pads 122, and the actual arrangement of the second conductive pads 130 and the second conductive pads 130 is not limited.
Alternatively, referring to fig. 3, the second conductive pad 122 and the first conductive pad 112 are bound by an anisotropic conductive adhesive 131. Specifically, referring to fig. 3, in the present embodiment, the first conductive pad 112 and the second conductive pad 122 are bound by an Anisotropic conductive film 131 (ACF), and a small gold ball is disposed inside the ACF colloid, and when the conductive pad is pressed up and down, the gold ball between the top and the bottom will collide together to form a circuit conduction. The ACF has the characteristics of continuous processing and very low material loss, and therefore, the ACF is used to bind the first conductive pads 112 and the second conductive pads 122, which is simple in process and beneficial to cost saving. It should be noted that, in order to clearly embody the connection relationship between the first conductive pad 112 and the second conductive pad 122, the embodiment shown in fig. 3 implements the first conductive pad 112 and the second conductive pad 122 as protruding structures, and does not limit the structures of the first conductive pad 112 and the second conductive pad 122 on the display panel or the flexible substrate, for example, in some other embodiments of the present application, the surface of the second conductive pad 122 does not protrude from the flexible substrate when the second conductive pad 122 is on the flexible substrate.
Optionally, referring to fig. 2, the flexible substrate 120 includes a plurality of second signal lines 123, one end of each of the second signal lines 123 is electrically connected to the second conductive pad 122, and the other end of each of the second signal lines 123 is electrically connected to the driving chip 130. Specifically, referring to fig. 2, in order to realize the electrical connection between the driving chip 130 and the second conductive pad 122, in this embodiment, a plurality of second signal lines 123 are disposed on the flexible substrate 120, two ends of the second signal lines 123 are respectively connected to the second conductive pad 122 and the driving chip 130, so as to realize the electrical connection between the driving chip 130 and the second conductive pad 122, and signals provided by the driving chip 130 are sent to the second conductive pad 122 through the second signal lines 123 and transmitted to the display panel 110 through the first conductive pad 112, so as to realize the functions of display or touch control. It should be noted that the second signal line 123 herein may be used to transmit a touch signal, a data signal, or other signals, and functions as a fan-out trace, and the fan-out trace is disposed on the flexible substrate 120, and the flexible substrate 120 is bent to the back of the display panel 110, so that the fan-out trace is prevented from occupying the space of the display panel 110, and the frame width can be effectively reduced while the functions of display or touch are implemented.
Optionally, fig. 4 is a schematic structural diagram of another flexible substrate 120 provided in the embodiment of the present application, please refer to fig. 4, in which the flexible substrate 120 includes a plurality of multiplexing units 124 and a plurality of third signal lines 125, the multiplexing units 124 are electrically connected to the driving chip 130 through the third signal lines 125, and the multiplexing units 124 are also electrically connected to the second conductive pads 122. Specifically, referring to fig. 4, in the present embodiment, a plurality of multiplexing units 124 are disposed on the flexible substrate 120, one end of each multiplexing unit 124 is electrically connected to the second conductive pad 122, and the other end is electrically connected to the driving chip 130 through a third signal line 125. The multiplexing unit 124 is used to electrically connect the driving chip 130 and the second conductive pad 122, so that a signal can be transmitted to different signal lines through a port of the driving chip 130 in a time-sharing manner, and thus the number of ports of the driving chip 130 to be occupied can be reduced, which is beneficial to reducing the requirement on the number of ports of the chip, and the manufacturing cost can be reduced.
Optionally, referring to fig. 4, the multiplexing unit 124 at least includes a first switch unit 1241, a second switch unit 1242, a first control signal line 1243, and a second control signal line 1244; a control end of the first switch unit 1241 is electrically connected to a first control signal line 1243, and a control end of the second switch unit 1242 is electrically connected to a second control signal line 1244; the second conductive pad 122 includes a plurality of first sub-conductive pads 1220 and a plurality of second sub-conductive pads 1221, a second pole of the first switching unit 1241 is electrically connected to the first sub-conductive pads 1220, and a second pole of the second switching unit 1242 is electrically connected to the second sub-conductive pads 1221; in the same multiplexing unit 124, the first pole of the first switching unit 1241 and the first pole of the second switching unit 1242 are connected to the same third signal line 125.
Specifically, referring to fig. 4, the multiplexing unit 124 includes at least two switch units, such as a first switch unit 1241 and a second switch unit 1242, wherein a control end of the first switch unit 1241 is connected to a first control signal line 1243, and the first switch unit 1241 is controlled to be turned on or off by the first control signal line 1243; the control end of the second switch unit is connected to a second control signal line 1244, and the second switch unit 1242 is controlled to be turned on or off by the second control signal line 1244. The second conductive pad 122 includes a plurality of first sub-conductive pads 1220 and a plurality of second sub-conductive pads 1221, a second pole of the first switching unit 1241 is electrically connected to the first sub-conductive pads 1220, a second pole of the second switching unit 1242 is electrically connected to the second sub-conductive pads 1221, and first poles of the first switching unit 1241 and the second switching unit 1242 in the same multiplexing unit 124 are connected to the same third signal line 125, that is, first poles of the first switching unit 1241 and the second switching unit 1242 in the same multiplexing unit 124 are connected to the same port of the driving chip 130.
In a first time period, the first control signal line 1243 provides a turn-on signal, the first switch unit 1241 is turned on, the second switch unit 1242 is turned off, and the first port of the driving chip 130 transmits a signal to the first sub conductive pad 1220 through the first switch unit 1241; in a second time period, the second control signal line 1244 provides a turn-on signal, the second switch unit 1242 is turned on, the first switch unit 1241 is turned off, and the first port of the driving chip 130 transmits a signal to the second sub conductive pad 1221 through the second switch unit 1242. Therefore, signals can be transmitted to the first sub-conductive pad 1220 or the second sub-conductive pad 1221 through the first port of the driver chip 130 in a time-sharing manner, so that the number of ports of the driver chip 130 required to be occupied can be reduced, the requirement on the number of ports of the chip can be reduced, and the manufacturing cost can be reduced.
It should be noted that the multiplexing unit 124 includes two switch units, which is only an illustrative illustration and is not meant to be a limitation of the present application, in different embodiments, the number of the switch units in the multiplexing unit 124 may be specifically set according to actual needs, for example, please refer to fig. 5, fig. 5 shows another schematic structural diagram of the flexible substrate 120 provided in the embodiments of the present application, in the embodiment shown in fig. 5, each multiplexing unit 124 includes three switch units, three switch units in the same multiplexing unit 124 are commonly connected to the same port of the driving chip 130, the same port of the driving chip 130 may transmit signals to different three signal lines in a time-sharing manner, which is more beneficial to reducing the requirement on the number of ports of the chip, and thus the manufacturing cost can be reduced.
Optionally, fig. 6 is a schematic structural diagram of a liquid crystal display module 100 provided in the embodiment of the present application, please refer to fig. 6, in which the display module 100 is a liquid crystal display module, an organic light emitting display module, or a micro light emitting display module. Specifically, referring to fig. 6, the flexible substrate 120 is bound to the display panel 110, and the flexible substrate 120 is folded back to reduce the bezel width without bending the panel, so that the bezel width can be reduced even if the panel is a non-flexible panel that is not bendable. Therefore, the display module 100 in the present application may be a liquid crystal display module, an organic light emitting display module, or a micro light emitting display module, and when the display module 100 is a liquid crystal display module, the display module includes an array substrate 103, a liquid crystal 104, and a color film substrate 105, the liquid crystal 104 is located between the array substrate 103 and the color film substrate 105, a step is provided between the array substrate 103 and the color film substrate 105, and the binding region 111 is located on the step, and the frame width of the liquid crystal display panel can be effectively reduced by binding the flexible substrate 120 to the step region and bending the flexible substrate to a side of the array substrate away from the color film substrate, so that the problem that the frame is reduced by folding the flexible panel back in the prior art can be solved, and the frame cannot be applied to a liquid crystal display panel, so that the frame.
Alternatively, referring to fig. 6, when the display module 100 is a liquid crystal display module 100 board; the display module 100 further includes a backlight module 140, the backlight module 140 includes a back plate 141, the back plate 141 includes a bottom plate 143 and a side portion 142 intersecting the bottom plate 143, and the driving chip 130 contacts the bottom plate 143. Specifically, the liquid crystal display module 100 further includes a backlight module 140 for providing a light source for the display panel 110, in addition to the display panel 110, the backlight module 140 generally includes a back plate 141, the back plate 141 includes a bottom plate 143 and a side portion 142 intersecting the bottom plate 143, a receiving cavity for receiving the light source and the optical film is formed between the bottom plate 143 and the side portion 142, and optionally, the back plate 143 is made of a metal material. In this embodiment, the driving chip 130 is disposed to contact the bottom plate 143, so that the driving chip 130 is grounded through the bottom plate 143, and thus, static electricity generated during operation of the driving chip 130 can be directly conducted to the bottom plate 143 of the backlight module 140, thereby avoiding the problem that the driving chip 130 cannot normally operate due to static electricity accumulation, which is beneficial to prolonging the service life of the display module 100, and further, enabling the driving chip 130 to dissipate heat better.
It should be noted that fig. 6 is only for illustrating that the driving chip 130 is in contact with the bottom plate 143, so as to enable the driving chip 130 to better dissipate heat or conduct static electricity, which does not represent an actual structure of the backlight module 140, and besides the back plate 141, the backlight module 140 further includes structures such as an optical film and a light source, which are not described herein again.
Optionally, fig. 7 is a schematic structural diagram of the first side portion 145 provided in the embodiment of the present application, please refer to fig. 6 and fig. 7, the side portion 142 includes the first side portion 145, and the first side portion 145 is located on a side of the bonding area 111 away from the display area 101 along the first direction; the first side portion 145 comprises a hollow portion 146, and the orthographic projection of the flexible substrate 120 on the plane of the first side portion 145 is located in the range defined by the hollow portion 146; the first direction is a direction pointing to the binding area 111 along the display area 101. Specifically, referring to fig. 6 and 7, the backlight module 140 includes a bottom plate 143 and four side portions 142 surrounding the bottom plate 143, in this embodiment, the side portion 142 located on a side of the bonding region 111 away from the display region 101 along the first direction is referred to as a first side portion 145, where the first direction refers to a direction pointing to the bonding region 111 along the display region 101, when the flexible substrate 120 bends toward the back of the display panel 110, an overlapping region exists between the flexible substrate 120 and the first side portion 145, an edge of the first side portion 145 may damage the flexible substrate 120, and the flexible substrate 120 is provided with a signal line, when the signal line is damaged, the problem that the display panel 110 cannot normally operate is caused. Therefore, in this embodiment, the overlapping region is hollowed to form a hollowed portion 146, and an orthographic projection of the flexible substrate 120 on the plane where the first side portion 145 is located within a range defined by the hollowed portion 146, so that when the flexible substrate 120 is bent toward the back of the display panel 110, the back plate 141 does not exist in the bent region, thereby preventing the back plate 141 from damaging the flexible substrate 120, and ensuring normal operation of the display panel 110.
Optionally, fig. 8 is a schematic diagram illustrating an arrangement manner of first conductive pads provided in an embodiment of the present application, and fig. 9 is a schematic diagram illustrating another arrangement manner of first conductive pads provided in an embodiment of the present application, please refer to fig. 8 to 9, in which a bonding region 111 includes at least one first conductive pad group 114, and the first conductive pad group 114 includes a plurality of first conductive pads 112 arranged along a second direction; the second direction intersects the first direction. Specifically, the bonding area 111 of the display panel 110 is provided with a plurality of first conductive pads 112, the first conductive pads 112 form at least one first conductive pad group 114, and the conductive pads located in the same first conductive pad group 114 are arranged along a second direction, and the second direction and the first direction are mutually crossed. Because the array process precision of the display panel 110 is high, particularly for high-resolution products, the number of signal lines on the display panel 110 is large, and the number of the first conductive pads 112 to be arranged is also large, and when the number of the signal lines on the display panel 110 is too large, the arrangement density of the first conductive pads 112 needs to be increased accordingly, but if the density of the first conductive pads 112 is too large, a risk of short circuit exists between adjacent first conductive pads 112, therefore, when the number of the signal lines on the display panel 110 is too large, two or more rows of conductive pads can be arranged, and the first conductive pads 112 connected with adjacent signal lines are alternately arranged in a staggered manner, so that the problem that the risk of short circuit exists when the density of the first conductive pads 112 is too large can be avoided, and the problem of poor display can be avoided.
Based on the same inventive concept, the present application further provides a method for manufacturing a display module 100, fig. 10 is a flowchart illustrating the method for manufacturing the display module 100 according to the embodiment of the present application, and fig. 11 is a schematic structural diagram illustrating the method for manufacturing the display module according to the embodiment of the present application, please refer to fig. 10-11, and the method for manufacturing the display module 100 according to the embodiment of the present application includes:
step 10: manufacturing a display panel 110, referring to fig. 1, the display panel 110 includes a display area 101 and a non-display area 102 surrounding the display area 101; the non-display area 102 includes a binding area 111; the non-display area 102 includes a plurality of first signal lines 113; the bonding region 111 includes a plurality of first conductive pads 112; the first signal line 113 is electrically connected to the first conductive pad 112;
step 20: manufacturing a flexible substrate 120, referring to fig. 2, the flexible substrate 120 includes a first surface 121, and the first surface 121 includes a plurality of second conductive pads 122;
step 30: referring to fig. 2, at least one driving chip 130 is bonded to the first surface 121 of the flexible substrate 120, and the second conductive pad 122 is electrically connected to the driving chip 130;
step 40: referring to fig. 3, the flexible substrate 120 is bound to the first conductive pad 112 of the binding region 111 by the second conductive pad 122.
Specifically, referring to fig. 1 and 10-11, in the manufacturing method of the display module 100 according to the embodiment of the present application, in step 10, a display panel 110 is manufactured, where the display panel 110 includes a display area 101 and a non-display area 102 surrounding the display area 101, the non-display area 102 includes a bonding area 111, and the bonding area 111 is provided with a plurality of first conductive pads 112; the non-display area 102 further includes a plurality of first signal lines 113, and the first signal lines 113 are electrically connected to the first conductive pads 112. The flexible substrate 120 is manufactured through step 20, a plurality of second conductive pads 122 are manufactured on the first surface 121 of the flexible substrate 120, and at least one driving chip 130 is bonded on the first surface 121 of the flexible substrate 120 through step 30, that is, the driving chip 130 and the second conductive pads 122 are located on the same surface of the flexible substrate 120, and the second conductive pads 122 are electrically connected to the driving chip 130. After the flexible substrate 120 is manufactured, in step 40, the first conductive pad 112 and the second conductive pad 122 are bound, so that the flexible substrate 120 is bound on the display panel 110, the electrical connection between the driving chip 130 and the display panel 110 is realized, the signal of the driving chip 130 can be transmitted to the display panel 110, and the normal function of the display panel 110 is realized.
According to the manufacturing method of the display module 100 provided by the embodiment of the application, according to the process precision of the display panel 110, the first conductive pad 112 is arranged in the bonding region 111 of the display panel 110, the second conductive pad 122 is manufactured on the flexible substrate 120, and the driving chip 130 is arranged on the flexible substrate 120, so that the driving chip 130 does not need to occupy the space of the display panel 110, and the area of the non-display region 102 of the display panel 110 is favorably reduced. And by bonding the second conductive pads 122 and the first conductive pads 112, the electrical connection between each signal line in the display panel 110 and the driving chip 130 can be realized. . In addition, the second conductive pad 122 on the second flexible substrate 120 can be set according to the process precision of the display panel 110, so that the problem of cost increase caused by the process precision of the FPC being far lower than the process precision of the display panel 110 can be avoided, and the manufacturing cost can be saved.
Optionally, fig. 12 is a flowchart illustrating a method for manufacturing the flexible substrate 120 according to an embodiment of the present application, and fig. 13 is a schematic structural diagram illustrating a method for manufacturing the flexible substrate according to an embodiment of the present application, please refer to fig. 12 and fig. 13, in step 20, the method for manufacturing the flexible substrate 120 specifically includes: step 21: providing a substrate 106; step 22: manufacturing a flexible mother board 107 on a substrate 106, wherein a plurality of groups of second conductive pads 122 are arranged on a first surface 121 of the flexible mother board 107, and optionally, a conductive circuit layer is prepared on one side of the flexible mother board 107 away from the substrate 106, and the conductive circuit layer comprises a plurality of groups of second conductive pads 122; step 23: the substrate 106 and the flexible motherboard 107 are cut to form a plurality of first substrates 106 and flexible substrates 120. Specifically, referring to fig. 12 and 13, when the flexible substrate 120 is manufactured in step 20, a substrate 106 is first provided in step 21, where the substrate 106 may be, for example, a glass substrate, then a flexible motherboard 107 is manufactured on one surface of the substrate 106 in step 22, and a plurality of sets of second conductive pads 122 are disposed on a first surface 121 of the flexible motherboard 107, where any set of second conductive pads 122 includes a plurality of second conductive pads 122 arranged along a second direction. After the flexible motherboard 107 including the second conductive pads 122 is fabricated, the flexible motherboard 107 and the substrate 106 are cut in step 23 to form a plurality of flexible substrates 120 including the first substrate 106. In the embodiment, the flexible mother board 107 is arranged on the large glass substrate, and the small flexible substrate 120 is formed after the flexible mother board 107 is cut, so that the display panel 110 and the flexible substrate 120 can be manufactured by independent processes, when the process of the flexible mother board is manufactured on large glass by using the current process for manufacturing the display panel, compared with the copper plating process of a conventional flexible circuit board, the process of manufacturing the display panel is used, the accuracy of the manufactured circuit is higher, and particularly, the process has great advantages for high-resolution products; and the prepared large glass substrate can be cut into a plurality of small flexible substrates and substrates, namely a plurality of flexible substrates can be prepared by one-time process, thus being beneficial to reducing the cost.
It should be noted that fig. 13 is only shown to schematically illustrate a process of cutting the flexible motherboard 107 to form a flexible substrate, and does not represent an actual size of the flexible motherboard 107, in an actual manufacturing process, when the flexible motherboard 107 is cut, the flexible motherboard may be cut into the flexible substrate 120 only bound with one driver chip 130, or cut into the flexible substrate 120 used for binding two driver chips 130, when two driver chips 130 are bound on the cut flexible substrate 120, one FPC150 may be bound on the flexible substrate 120, and the two driver chips 130 share the same FPC150, as shown in fig. 14, fig. 14 is a schematic structural diagram of the driver chip and the FPC provided in the embodiment of the present application; alternatively, two FPCs 150 may be bound to the flexible substrate 120, so that the two driver chips 130 are respectively connected to different FPCs 150, as shown in fig. 15, and fig. 15 is another schematic structural diagram of the driver chip and the FPC provided in the embodiment of the present application. Of course, the flexible motherboard 107 may also be cut into a larger flexible substrate 120, so that a plurality of driver chips 130 may be bound on the flexible substrate 120, and specifically, the driver chips may be flexibly selected according to actual needs, which is not limited in this application.
The flexible substrate 120 formed after the cutting in step 23 is attached to the first substrate 108, so that when the driver chip 130 is bonded to the flexible substrate 120 in step 30, the flexible substrate 120 is still attached to the first substrate 108, and the first substrate 108 can support the flexible substrate 120, so as to facilitate the bonding of the driver chip 130. Optionally, referring to fig. 11, 13 and 16, after the flexible substrate 120 is bound to the first conductive pad 112 of the binding region 111 through the second conductive pad 122, the method further includes: step 50: the first substrate 108 is peeled off from the flexible board 120. Specifically, referring to fig. 11, 13 and 16, in order to facilitate the binding of the flexible substrate 120 and the display panel 110, the flexible substrate 120 in the step 40 is attached to the first substrate 108, and after the flexible substrate 120 is bound to the display panel 110, the flexible substrate 120 needs to be bent to the back of the display panel 110, so that after the first conductive pad 112 and the second conductive pad 122 are bound, the first substrate 108 is peeled from the flexible substrate 120 through the step 50, so as to bend the flexible substrate 120 to the back of the display panel 110, thereby meeting the design requirement of a narrow bezel of the display module 100.
Optionally, fig. 17 is a flowchart illustrating a manufacturing method of the display module 100 including the second signal line 123 according to an embodiment of the present disclosure, referring to fig. 2 and fig. 17, before the bonding of the at least one driving chip 130 on the first surface 121 of the flexible substrate 120, the method further includes: step 24: manufacturing a plurality of second signal lines 123 on the flexible substrate 120, so that one ends of the second signal lines 123 are electrically connected with the second conductive pads 122; after the driving chip 130 is bonded to the first surface 121 of the flexible substrate 120, the other end of the second signal line 123 is electrically connected to the driving chip 130. Specifically, in order to realize the electrical connection between the driving chip 130 and the second conductive pad 122, before the driving chip 130 is bonded, a plurality of second signal lines 123 are fabricated on the flexible substrate 120 through step 24, and one ends of the second signal lines 123 are connected to the second conductive pad 122. After the second signal line 123 is manufactured, the driving chip 130 is bound on the flexible substrate 120, and the driving chip 130 is connected to the other end of the second signal line 123, so that the driving chip 130 and the second conductive pad 122 can be electrically connected through the second signal line 123, a signal provided by the driving chip 130 is sent to the second conductive pad 122 through the second signal line 123, and is transmitted to the display panel 110 through the first conductive pad 112, and functions such as display or touch are realized. It should be noted that the second signal line 123 herein may be a fan-out trace, for example, a signal line connected to a touch line or a signal line connected to a data line, and the fan-out trace is disposed on the flexible substrate 120, and the flexible substrate 120 is bent to the back of the display panel 110, so that the fan-out trace is prevented from occupying the space of the display panel 110, and the frame width can be effectively reduced while the functions of displaying or touching are implemented.
Optionally, fig. 18 is a flowchart illustrating a manufacturing method of the display module 100 including the multiplexing unit 124 according to an embodiment of the present application, and referring to fig. 4, fig. 5 and fig. 18, before the bonding of the at least one driving chip 130 on the first surface 121 of the flexible substrate 120, the method further includes: step 25: fabricating a plurality of multiplexing units 124 and a plurality of third signal lines 125 on the flexible substrate 120, wherein the multiplexing units 124 are electrically connected to one ends of the third signal lines 125 and the second conductive pads 122, respectively; after the driving chip 130 is bonded to the first surface 121 of the flexible substrate 120, the other end of the third signal line 125 is electrically connected to the driving chip 130.
Specifically, referring to fig. 4, 5 and 18, in order to realize the electrical connection between the driving chip 130 and the second conductive pad 122, before the driving chip 130 is bonded, a plurality of multiplexing units 124 and a plurality of third signal lines 125 are fabricated on the flexible substrate 120 through step 25, wherein one end of the multiplexing unit 124 is electrically connected to the second conductive pad 122, and the other end is electrically connected to the third signal lines 125. After the multiplexing unit 124 and the third signal line 125 are manufactured, the driving chip 130 is bound on the flexible substrate 120, the driving chip 130 is connected with the other end of the third signal line 125, and the multiplexing unit 124 and the third signal line 125 are used for realizing the electrical connection between the driving chip 130 and the second conductive pad 122, so that signals can be transmitted to different signal lines through one port of the driving chip 130 in a time-sharing manner, the number of ports of the driving chip 130 which need to be occupied can be reduced, the requirement on the number of ports of the chip can be reduced, and the manufacturing cost can be reduced.
Optionally, fig. 19 is a flowchart illustrating a manufacturing method of the display module 100 according to an embodiment of the present application, and fig. 20 is a schematic structural diagram illustrating a manufacturing method of a liquid crystal display module according to an embodiment of the present application, please refer to fig. 19 to fig. 20, in which the display panel 110 is a liquid crystal display panel, and after the flexible substrate 120 is bonded to the first conductive pad 112 of the bonding region 111 through the second conductive pad 122, the method further includes: step 60: the backlight module 140 is manufactured, the backlight module 140 includes a back plate 141, the back plate 141 includes a bottom plate 143 and a side portion 142 intersecting the bottom plate 143, and the driving chip 130 contacts the bottom plate 143.
Specifically, referring to fig. 19 to 20, the present application reduces the bezel width by binding the flexible substrate 120 with the display panel 110 and folding back the flexible substrate 120 without bending the panel, so that the bezel width can be reduced even if the panel is a non-flexible panel that is not bendable. Therefore, the display module 100 in the present application may be a liquid crystal display module 100, an organic light emitting display module 100, or a micro light emitting display module 100, when the display module 100 is the liquid crystal display module 100, the flexible substrate 120 is bonded to the display panel 110, and then the backlight module 140 is manufactured through step 60, where the backlight module 140 includes a light source, an optical film and a back plate 141, the back plate 141 includes a bottom plate 143 and a side portion 142 intersecting the bottom plate 143, and an accommodating cavity for accommodating the light source and the optical film is formed between the bottom plate 143 and the side portion 142. In this embodiment, the driving chip 130 is disposed in contact with the bottom plate 143, so that the driving chip 130 is grounded through the bottom plate 143, and thus, static electricity generated during the operation of the driving chip 130 can be directly conducted to the bottom plate 143 of the backlight module 140, thereby achieving better heat dissipation of the driving chip 130, avoiding the problem that the driving chip 130 cannot normally operate due to the accumulation of static electricity, and being beneficial to prolonging the service life of the display module 100.
Optionally, fig. 21 is a further flowchart illustrating a manufacturing method of the display module 100 according to an embodiment of the present application, please refer to fig. 7 and fig. 21, in which the side portion 142 includes a first side portion 145, and the first side portion 145 is located on a side of the bonding region 111 away from the display region 101 along the first direction; the manufacturing method further comprises the following steps: step 61: the first side portion 145 is etched to form a hollow portion 146, so that an orthographic projection of the flexible substrate 120 on a plane where the first side portion 145 is located within a range defined by the hollow portion 146. Specifically, referring to fig. 7 and 21, the backlight module 140 includes a bottom plate 143 and four side portions 142 surrounding the bottom plate 143, in this embodiment, the side portion 142 located on a side of the bonding region 111 away from the display region 101 along the first direction is referred to as a first side portion 145, where the first direction refers to a direction pointing to the bonding region 111 along the display region 101, when the flexible substrate 120 bends toward the back of the display panel 110, an overlapping region exists between the flexible substrate 120 and the first side portion 145, an edge portion of the first side portion 145 may damage the flexible substrate 120, and the flexible substrate 120 is provided with a signal line, when the signal line is damaged, the problem that the display panel 110 cannot normally operate is caused. Therefore, in this embodiment, through step 61, the overlapped region is etched to form the hollow portion 146, so that the orthographic projection of the flexible substrate 120 on the plane where the first side portion 145 is located within the range defined by the hollow portion 146, and thus, when the flexible substrate 120 is bent toward the back of the display panel 110, since the back plate 141 does not exist in the bent region, the back plate 141 can be prevented from damaging the flexible substrate 120, and the normal operation of the display panel 110 can be ensured.
Based on the same inventive concept, the present application further provides a display apparatus, fig. 22 is a schematic structural diagram of a display apparatus 200 provided in the present application, please refer to fig. 22, the display apparatus 200 includes a display module 100, and the display module 100 is any one of the display modules 100 provided in the embodiments of the present application. It should be noted that, for the embodiments of the display device 200 provided in the present application, reference may be made to the embodiments of the display module 100, and the same parts are not described again. The display device 200 provided by the present application may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
According to the embodiments, the application has the following beneficial effects:
according to the display module, the manufacturing method of the display module and the display device, the driving chip is arranged on the flexible substrate, the driving chip does not need to occupy the space of the display panel, and the area of a non-display area of the display panel is favorably reduced. According to the process precision of the display panel, the first conductive gasket is arranged in the binding area of the display panel, the second conductive gasket is arranged on the flexible substrate, and the second conductive gasket and the first conductive gasket are bound, so that the electric connection between each signal line in the display panel and the driving chip can be realized, the fan-out wiring is not required to be arranged on the display panel, the fan-out area is not required to be arranged on the display panel, the occupied space of the fan-out area can be avoided, and the frame width of the display panel can be effectively reduced. In addition, the second conductive gasket on the second flexible substrate can be arranged according to the process precision of the display panel, so that the problem that the cost is increased due to the fact that the process precision of the FPC is far lower than that of the display panel can be solved, and the manufacturing cost is saved.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (18)
1. A display module, comprising: a display panel and a driving chip;
the display panel includes a display area and a non-display area surrounding the display area; the non-display area comprises a binding area; the non-display area comprises a plurality of first signal lines; the bonding region comprises a plurality of first conductive pads; the first signal line is electrically connected with the first conductive pad;
a flexible substrate is bound in the binding region, the flexible substrate comprises a first surface, a plurality of second conductive gaskets are arranged on the first surface, and the second conductive gaskets are bound with the first conductive gaskets;
the driving chip is located on the first surface of the flexible substrate, and the second conductive pad is electrically connected with the driving chip.
2. The display module of claim 1,
the second conductive pad and the first conductive pad are bound by anisotropic conductive glue.
3. The display module of claim 1,
the flexible substrate comprises a plurality of second signal lines, one ends of the second signal lines are electrically connected with the second conductive pads, and the other ends of the second signal lines are electrically connected with the driving chip.
4. The display module of claim 1,
the flexible substrate comprises a plurality of multiplexing units and a plurality of third signal lines, the multiplexing units are electrically connected to the driving chip through the third signal lines, and the multiplexing units are electrically connected with the second conductive pads.
5. The display module of claim 4,
the multiplexing unit at least comprises a first switch unit, a second switch unit, a first control signal line and a second control signal line;
the control end of the first switch unit is electrically connected with the first control signal line, and the control end of the second switch unit is electrically connected with the second control signal line;
the second conductive pad includes a plurality of first sub conductive pads and a plurality of second sub conductive pads, a second pole of the first switching unit is electrically connected to the first sub conductive pads, and a second pole of the second switching unit is electrically connected to the second sub conductive pads;
in the same multiplexing unit, the first pole of the first switching unit and the first pole of the second switching unit are electrically connected to the same third signal line.
6. The display module according to claim 1, wherein the display module is a liquid crystal display module or an organic light emitting display module or a micro light emitting display module.
7. The display module according to claim 6, wherein when the display module is a liquid crystal display module;
the display module further comprises a backlight module, the backlight module comprises a back plate, the back plate comprises a bottom plate and a side part intersected with the bottom plate, and the driving chip is in contact with the bottom plate.
8. The display module of claim 7,
the side part comprises a first side part, and the first side part is positioned on one side of the binding area far away from the display area along a first direction; the first side part comprises a hollow part, and the orthographic projection of the flexible substrate on the plane of the first side part is positioned in the range limited by the hollow part; the first direction is a direction pointing to the binding region along the display region.
9. The display module of claim 1,
the bonding region includes at least one first conductive pad group including a plurality of first conductive pads arranged in a second direction; the second direction intersects the first direction.
10. The display module of claim 1,
the first signal line is at least one of a touch line, a data line or a shift register driving line.
11. A manufacturing method of a display module is characterized by comprising the following steps:
manufacturing a display panel, wherein the display panel comprises a display area and a non-display area surrounding the display area; the non-display area comprises a binding area; the non-display area comprises a plurality of first signal lines; the bonding region comprises a plurality of first conductive pads; the first signal line is electrically connected with the first conductive pad;
manufacturing a flexible substrate, wherein the flexible substrate comprises a first surface, and the first surface comprises a plurality of second conductive gaskets;
binding at least one driving chip on the first surface of the flexible substrate, and electrically connecting the second conductive gasket to the driving chip;
a first conductive pad binding the flexible substrate to the binding region through the second conductive pad.
12. The method for manufacturing a display module according to claim 11, wherein the manufacturing of the flexible substrate specifically includes:
providing a substrate;
manufacturing a flexible motherboard on the substrate, wherein a plurality of groups of second conductive gaskets are arranged on the first surface of the flexible motherboard;
and cutting the substrate and the flexible mother board to form a plurality of first substrates and flexible substrates.
13. The method for manufacturing a display module according to claim 12,
after the flexible substrate is bound to the first conductive pad of the binding region by the second conductive pad, further comprising: and peeling the first substrate from the flexible substrate.
14. The method for manufacturing a display module according to claim 11, wherein before the at least one driver chip is bonded to the first surface of the flexible substrate, the method further comprises:
manufacturing a plurality of second signal wires on the flexible substrate, and electrically connecting one ends of the second signal wires with the second conductive pads;
and after a driving chip is bound on the first surface of the flexible substrate, the other end of the second signal wire is electrically connected with the driving chip.
15. The method for manufacturing a display module according to claim 11, wherein before the at least one driver chip is bonded to the first surface of the flexible substrate, the method further comprises:
manufacturing a plurality of multiplexing units and a plurality of third signal lines on the flexible substrate, wherein the multiplexing units are respectively and electrically connected with one end of each third signal line and the second conductive gasket;
and after a driving chip is bound on the first surface of the flexible substrate, the other end of the third signal line is electrically connected with the driving chip.
16. The method of claim 11, wherein the display panel is a liquid crystal display panel, and after the flexible substrate is bonded to the first conductive pad of the bonding region through the second conductive pad, the method further comprises:
and manufacturing a backlight module, wherein the backlight module comprises a back plate, the back plate comprises a bottom plate and a side part intersected with the bottom plate, and the driving chip is contacted with the bottom plate.
17. The method of claim 16, wherein the side portion comprises a first side portion, and the first side portion is located on a side of the bonding region away from the display region along a first direction;
the manufacturing method further comprises the following steps:
and etching the first side part to form a hollow part, so that the orthographic projection of the flexible substrate on the plane of the first side part is positioned in the range limited by the hollow part.
18. A display device comprising the display module of any one of claims 1-10.
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| CN202010344004.7A CN111458941A (en) | 2020-04-27 | 2020-04-27 | Display module, manufacturing method thereof and display device |
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