KR200160829Y1 - Module structure of liquid crystal display device - Google Patents

Abstract

Disclosed is an LCD module structure according to the present invention for enhancing durability of a liquid crystal display module (hereinafter referred to as LCD) module that is vulnerable to mechanical stress. In the LCD module according to the present invention, a printed circuit board having a plurality of grooves is mounted on a predetermined portion on a mold frame having a plurality of panel supports, and the plurality of grooves are inserted therein, and are integrally connected to the printed circuit board. Preferably, an LCD panel is mounted on a predetermined portion on the mold frame, and a TCP on which a driver driver IC is mounted is attached on the printed circuit board, and the driver driver IC and the printed circuit board are electrically connected by an input pad of TCP. The drive driver IC and the LCD panel are configured to be electrically connected by an output pad of TCP. As a result, it is possible to minimize TCP defects generated in 1) the part where the PCB for the PCB and the input pad are electrically connected, and the part where the LCD panel and the output pad TCP are electrically connected, and 2) the size of the LCD module. Slimming becomes possible.

Description

LCD Display Module Structure

The present invention relates to a liquid crystal display (hereinafter referred to as LCD) module structure, more specifically, a straight to enhance the durability and reduce the module size of the LCD module vulnerable to mechanical stress (stress) The present invention relates to an LCD module structure for a thin film transistor of a straight type.

Recently, with the development of new advanced video devices such as high definition TVs (hereinafter referred to as HDTVs), there is a demand for flat panel displays. The flat panel display has advantages such as thinness, high definition, and light weight as compared to the CRT, which is a conventional display device. It is increasing.

In particular, as a representative element of a flat panel display, an active matrix LCD, which combines liquid crystal technology and semiconductor technology, is recognized as a next-generation display to replace CRTs, and active research is being conducted on it, and the most widely used LCD is amorphous silicon. And an active matrix type TFT-LCD using TFT using polycrystalline silicon as a switching element.

In order to enlarge the effective display area ratio of the LCD panel to the total LCD module area as much as possible, the TFT-LCD panel has a thin structure when manufacturing an LCD module. TAB mounting technology with carrier package) is used for electrical connection.

The TAB mounting technology is largely divided into a process of connecting TCP to an LCD panel, and a process of connecting the TCP to a printed circuit board (hereinafter, referred to as a PCB). In this case, a straight type of TCP is used. TCP and the bent type TCP can be mentioned.

Of these, the most commonly used straight type TCP has the disadvantage of increasing the overall size of the TFT-LCD module compared to the case of using the bent type TCP, but uses less expensive film. Therefore, there is an advantage in cost compared to the vent type that requires a relatively large amount of film.

On the other hand, the vent type TCP is designed to bend the TCP by increasing the size of the TCP, and has the advantage of solving the mechanical weakness, which is the biggest disadvantage of the straight type, and minimizing the size of the module. In addition, the film is very expensive, and the overall driver driver IC price is relatively high compared to the case of applying a straight type TCP.

In the present invention, with reference to the plan and cross-sectional view shown in Figs. 1 and 2 will be described with respect to the LCD module structure applying the TCP of the straight type directly related to the present invention. 1 is a plan view illustrating a conventional LCD module structure having a structure in which an LCD panel and a PCB are electrically connected to a driving driver IC by a straight type TCP, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1. The illustrated cross section is shown.

Referring to the above plan view and cross-sectional view, a conventional LCD module is largely characterized in that the PCB 10 and the TFT substrate 12a of the LCD panel 12 are connected to the drive driver IC 16 by the TCP 14 for the tab (TAB). It can be seen that the PCB 10 and the LCD panel 12 that are electrically connected and thus connected are configured to be mounted on the mold frame 18.

In FIG. 1, reference numeral a denotes an active area where an actual image is displayed on an LCD panel, reference numeral 16a denotes a driver driver IC, and reference numeral 13a denotes a lead formed on the lower surface of the base film of the TCP 14 and the PCB ( 10 shows a solder portion formed on a predetermined portion of the base film in order to connect them, and reference numeral 13b denotes a connection portion to which a lead formed on the bottom surface of the base film of the TCP 14 and the TFT substrate 12a of the LCD panel 12 are connected. Indicates.

The LCD panel 12 includes a TFT substrate 12a in which a plurality of data lines and a gate line are vertically intersected with each other, and a TFT and a pixel electrode are formed to be connected to their intersections, and a black matrix and a color filter. The C / F substrate 12b, on which the filter) and the ITO material common electrode are formed, is disposed to face each other, and has a structure in which liquid crystal is injected into a space of several μm therebetween.

In addition, the PCB 10 and the LCD panel 12 are mounted on the mold frame 18 in a state where they are spaced apart from each other by a predetermined interval, and the PCB 10 and the LCD panel 12 are lower in the spaced space therebetween. A panel support 20 made of a mold frame material designed to be integrally connected with the mold frame 18 placed thereon protrudes with the TCP 14 interposed therebetween.

As such, the panel support 20 is formed in the space between the PCB 10 and the LCD panel 12 to protect the LCD panel 12 from external mechanical stress or impact. In this case, the PCB 10 supplies a signal to the semiconductor chip 16 from the outside and mechanically supports the semiconductor chip 16.

In this case, the driver driver IC 16 and the PCB 10 are connected to each other at the portion where the PCB 10 and the input pad 14a of the TCP 14 are connected by lead soldering with lead, whereas the LCD 10 In the part where the TFT substrate 12a of the panel 12 and the output pad 14b of the TCP 14 are connected, the drive driver IC 16 using an anisotropic conductive film (hereinafter, referred to as ACF) instead of lead. ) And the LCD panel are connected. Related drawings are specifically illustrated in the cross-sectional view of FIG. 2.

Therefore, when a signal is applied to the driving driver IC 16 through the PCB 10, the driver IC 16 sends a signal input through the PCB 10 to the LCD panel 12, the LCD The LCD module is driven so that the panel 12 displays an image.

However, when the LCD module is designed to have the structure as described above, the weak part of the LCD module (for example, the part where the TCP input pad and the PCB are connected and the part where the TCP output pad and the LCD panel are connected) is external. Due to the inability to adequately receive adequate protection from mechanical stress, the following disadvantages arise:

First, when the PCB 10 is pressed or bent at a portion where the input pad 14a of the TCP and the PCB 10 are soldered, the connection part thereof is easily disconnected, and thus a signal is not applied to the driving driver IC 16 so that the connection is disconnected. Poor phenomenon occurs. Solder pads in this area are particularly vulnerable to mechanical stress and require urgent supplementation.

Second, the portion where the output pad 14b of the TCP is bonded to the LCD panel 12 is also vulnerable to external mechanical pressure, so that when the LCD panel 12 and the PCB 10 are independently pressured, the bonding portion Since the tearing phenomenon occurs, the output of the drive driver IC 16 cannot be properly transmitted to the LCD panel 12.

Third, due to the panel support 20 which is made to be integrally connected with the mold frame 18 to fix the LCD panel 12, there is always a certain distance between the PCB 10 and the LCD panel 12. Because of this, there is a disadvantage that this increases the overall size of the module.

Therefore, the present invention was devised to improve the above-mentioned disadvantages, and when the LCD module is manufactured, the two are attached using an adhesive so that the PCB and the LCD panel are integrally connected, but at the connection part into the groove provided in the PCB. It is an object of the present invention to provide an LCD module structure that can realize the mechanical reliability of the LCD module and the slimming of the overall module size by designing the support frame connected integrally with the mold frame.

1 is a plan view showing the LCD module structure according to the prior art,

FIG. 2 is a cross-sectional view illustrating the AA ′ cutting surface structure of FIG. 1;

3 is a plan view showing the LCD module structure according to the present invention,

FIG. 4 is a cross-sectional view illustrating the AA ′ cutting surface structure of FIG. 3; FIG.

5 is an enlarged plan view of the PCB of FIG.

In order to achieve the above object, in the present invention, the PCB is mounted on the mold frame so that the panel support is inserted into the groove provided in the PCB, and the LCD panel is mounted on the mold frame so as to be integrally connected with the PCB. One side of the drive driver IC mounted thereon is provided with an LCD module structure configured to be connected to the input pad of the TCP by soldering, and the other side thereof to the output pad of the TCP by the conductive adhesive.

When the LCD module is designed to have the above structure, the gap between the PCB and the LCD module can be reduced, thereby realizing compactness of the module size. In addition, since the LCD panel and the PCB are integrally connected by an adhesive (for example, adhesive or double-sided tape), the LCD panel and the PCB are applied to the part where the PCB and the TCP input pad are connected, and the part where the LCD panel and the TCP output pad are connected. External mechanical stress can be minimized.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

The present invention prevents the occurrence of TCP defects caused by external mechanical stress and at the same time realizes the slimming of the size of the TFT-LCD module, which is a technology focused on the plan and cross-sectional views shown in FIGS. 3 and 4. Looking in detail with reference to the following. 3 is a plan view illustrating the LCD module structure according to the present invention, and FIG. 4 is a cross-sectional view illustrating the AA ′ cutting surface structure of FIG. 3.

Referring to the plan view and the cross-sectional view, the TFT-LCD module according to the present invention has a plurality of grooves 104 into which the panel support 106 is to be inserted on a mold frame 108 having a plurality of panel supports 106. The provided PCB 100 and the LCD panel 102 are mounted so as to be integrally connected to each other by an adhesive 114, and the TCP 112 having the driver IC 110 mounted thereon is attached to the PCB 100. The drive driver IC 110 and the PCB 100 are electrically connected by the input pad 112a of TCP, and the drive driver IC 110 and the LCD panel 102 are the output pad 112b of the TCP. It is made to be electrically connected by.

In FIG. 3, reference numeral a denotes an active area where an actual image is displayed on the LCD panel, reference numeral 110a denotes a driving IC mounted on TCP, and reference numeral 113a denotes a lead formed on the lower surface of the base film of the TCP 112. And a solder portion formed on a predetermined portion of the base film to connect the PCB 100 to each other. Reference numeral 113b denotes a lead formed on the bottom surface of the base film of the TCP 112 and the TFT substrate 102a of the LCD panel 102. This connection part to be connected is shown.

The LCD panel 102 is a TFT substrate 102a in which a plurality of data lines and gate lines are vertically intersected with each other, and a TFT and a pixel electrode are formed so as to be connected to their intersections, a black matrix, a color filter, and an ITO. The C / F substrate 102b on which the common electrode of material is formed is disposed to face each other, and has a structure in which liquid crystal is injected into a space of several μm therebetween.

As shown in the plan view shown in FIG. 5, the plurality of grooves 104 formed in the PCB 100 are manufactured to have a width somewhat larger than the plurality of panel supports 106 provided in the mold frame 108. This is to allow the panel support 106 to fit smoothly into the groove 104.

At this time, the plurality of grooves 104 provided in the PCB 100 is preferably manufactured to have a width (W) of 4.6 to 5.2mm, the panel support 106 provided in the mold frame 108 Is preferably manufactured to have a width (for example, 3.6 to 4.2mm) smaller than the groove 104 formed in the PCB 100. In this case, the panel support 106 is manufactured to be integrally connected with the mold frame 108, and is made of the same material (eg, a plastic material) as the mold frame 108.

According to the plan view, it can be seen that the plurality of grooves 104 formed in the PCB 100 are manufactured to have a structure in which a boundary surface in contact with the LCD panel 102 is opened while being spaced apart from each other by a predetermined interval.

As such, when the LCD module is manufactured to fit the panel support 106 into the groove 104 formed in the PCB 100, the LCD panel 102 may be protected from external mechanical stress or impact. In addition, since the gap between the PCB 100 and the LCD panel 102, which were inevitably existed when manufacturing the existing LCD module, can be removed, the slimming of the module size can be realized.

In addition, in the present invention, the PCB 100 and the LCD panel 102 are attached to be integrally connected by an adhesive (for example, an adhesive or a double-sided tape) 114. In this case, the PCB 100 and the LCD panel 102 are attached. Since the LCD module is more stably fixed, the LCD module has considerable resistance from external mechanical stress, thereby minimizing the defect of the TCP 112.

In addition, the connection between the input pad 112a of the TCP and the PCB 100 taps so that internal leads (not shown) formed in the base film of the TCP 112 correspond to connection patterns (not shown) of the PCB 100. Connected by soldering, the connection between the output pad 112b of the TCP and the LCD panel 112a is a TFT substrate 102a in which leads (not shown) formed on the lower surface of the base film of the TCP 112 form the LCD panel 102. Is connected by ACF, which is a conductive adhesive, to correspond to the connection patterns (e.g., gate pads).

As described above, according to the present invention, a straight type TCP is used, but since the LCD module is manufactured so that the PCB and the LCD panel are integrally connected by an adhesive, 1) the PCB and the LCD panel are fixed to each other, It can have a considerable resistance from mechanical stress, thereby minimizing TCP defects caused in the existing ILB and OLB sections, and 2) eliminating the gap between the LCD panel and the PCB. 3, the panel support is inserted through the groove formed in the PCB, so that the LCD panel can be fixed to the mold frame in a stable state.

Claims (11)

A mold frame provided with a plurality of panel supports, a printed circuit board mounted on the mold frame with a plurality of grooves inserted into the grooves, and integrally connected to the printed circuit board; A liquid crystal display panel having a structure in which a color filter substrate and a thin film transistor substrate mounted on a frame are assembled, and mounted on the printed circuit board, one side of which is connected to the PCB by an input pad of TCP and the other side of the A liquid crystal display device module structure comprising a drive driver IC configured to be connected to an LCD panel by an output pad. The structure of claim 1, wherein the plurality of grooves provided in the printed circuit board are disposed to be spaced apart from each other by a predetermined interval, and an interface surface in contact with the liquid crystal display device panel is opened. The liquid crystal display device module structure as claimed in claim 1, wherein the plurality of grooves provided in the printed circuit board have a width of 4.6 to 5.2 mm. The structure of claim 1, wherein the panel support provided in the mold frame has a width of 3.6 to 4.2 mm. The liquid crystal display module structure of claim 1, wherein the liquid crystal display panel and the printed circuit board are bonded by an adhesive. 6. The structure of claim 5, wherein the liquid crystal display panel and the printed circuit board are bonded with one selected from an adhesive or a double sided tape. The structure of claim 1, wherein the panel support is made of the same material as the mold frame. The structure of claim 7, wherein the panel support is made of a plastic material. The structure of claim 1, wherein the input pad of the TCP and the PCB are connected by lead soldering using lead. The liquid crystal display device module structure according to claim 1, wherein the output pad of the TCP and the liquid crystal display device panel are connected by a conductive adhesive. The liquid crystal display device module structure according to claim 10, wherein the conductive adhesive is an anisotropic conductive film.