KR102396021B1 - Chip on printed circuit unit and display apparatus comprising the same - Google Patents

Abstract

A display device according to an embodiment of the present specification includes a flexible display panel for displaying an image, a pad portion formed on one surface of the display panel, a rigid circuit board connected to the pad portion, and a driving IC mounted on the rigid circuit board, and the rigid circuit board is at least It is a multi-layer structure including two or more metal layers and at least three insulating layers formed between the metal layers, and is configured to be electrically connected to the driver IC and the pad part through one metal layer among the two or more metal layers of the rigid circuit board. Circuit boards related to driving can be manufactured in a compact and integrated form, and damage and disconnection defects during the process of driving IC can be reduced.

Description

A printed circuit unit having a driving chip and a display device including the same

The present invention relates to a printed circuit unit having a driving chip and a display device including the same.

Recently, as we enter the information age, the field of display that visually expresses electrical information signals has developed rapidly, and in response to this, various display devices with excellent performance such as thinness, weight reduction, and low power consumption have been developed. is being developed

Specific examples of such a display device include a liquid crystal display device (LCD), a field emission display device (FED), an organic light emitting display device (OLED), and a quantum dot display device. (Quantum Dot Display Device) etc. are mentioned.

Among them, the liquid crystal display includes an array substrate including thin film transistors, an upper substrate including a color filter and/or a black matrix, and a liquid crystal layer between the array substrate and the upper substrate. The liquid crystal display is a device in which an image is displayed by controlling the arrangement of liquid crystal layers according to an electric field applied between two electrodes in a pixel region and controlling light transmittance according to the arrangement.

In addition, the organic light emitting display device is a self-light emitting device, and is receiving widespread attention because it has advantages of a fast response speed, luminous efficiency, luminance, and viewing angle compared to other display devices.

Such display devices display various information including a plurality of pixels including a plurality of sub-pixels capable of displaying light of different wavelengths. Such a display device includes a thin film transistor for driving each pixel and the thin film transistor The active matrix method in which the pixel electrodes connected to the matrix are arranged in a matrix method is attracting the most attention because of its excellent resolution and video implementation capability.

In order to drive each pixel arranged in a matrix method, drive chips (Integrated circuits) of the display device are mounted on the display device and connected to data lines (or signal lines) or scan lines (or gate lines). do. The source drive IC supplies data lines and a data signal, and the gate drive IC sequentially supplies a scan signal (or gate pulse) to the scan lines in synchronization with the data signal.

As a method of mounting such a driving chip on a display device, a method of bonding a flexible circuit film on which the driving chip is mounted to a display device, a COG (Chip On Glass) method of directly bonding the driving chip on a substrate, and the like are known.

A flexible film for mounting the driving chip includes a Chip on Film (COF) or a Tape Carrier Package (TCP). The flexible film included in the display device is connected to a printed circuit board (PCB) that can primarily provide image information, such as a system board.

As described above, the display device basically requires a display panel including a pixel driven by a liquid crystal or organic light emitting layer, a flexible film including a driving chip, and a PCB such as a system board.

As display devices of various shapes and functions are required, a touch sensing system having various functions, such as multi-touch, force touch, or haptic, is required for a recent display device. At the same time, on the other hand, a flexible, thin, light, and thin bezel form is needed while having various forms such as smart phones, smartwatches, and wearables.

According to the demand of such display devices, it is necessary to apply various types of driving chips, flexible films, and PCBs.

The method of composing the driving chip and the PCB in the existing display panel can be broadly divided into two types. One is the COP (Chip On Panel) method, which mounts the driving chip on a substrate, and the other is the COF (Chip) method, which mounts the driving chip on a flexible film. On Film), the flexible film on which the driving chip is mounted acts as a relay between the pad part of the display panel and the PCB.

The COP method may be used in a large display that can accommodate a relatively wide bezel, and the COF method may be used in a small display in which the bezel needs to be minimized.

However, the present invention is not limited thereto, and the COF method may be used even in a large size or the COP method may be used in a small size.

However, when a high degree of design freedom is required for a small size such as a wearable among small displays, the existing form of bonding a PCB to a COF-type flexible film may be a limitation. Specifically, in the case of a smart watch, since the size of the device is very small, it is necessary to minimize the arrangement space of the flexible film and the PCB. This is essential in terms of performance and design, in which batteries and other devices must be placed in a limited space, in addition to the design aspects of small and diverse forms. However, it was not easy to integrate flexible films and PCBs.

Conventionally, in the case of the COF (Chip On Film) method, a pad for bonding the driving IC is formed, and it is necessary to form a very fine line width and line distance of the pad. This is because, as the pad line width and line-to-line distance are finely formed, a highly integrated small driving IC can be used. As a device that can implement this, a driver IC can be mounted by forming a fine pattern with copper wiring on a flexible film. However, the process of bonding the flexible film on which the driving IC is mounted to the PCB must be performed separately, and for this purpose, the bonding process and the inspection process to check the bonding state had to be configured separately. As a separate process is configured, defects may occur during the process. Defects may occur. Specifically, because the rigid driver IC mounted during the bonding process or the inspection process is mounted on a flexible film, all the stress that may occur during the process is concentrated on the driver IC, causing the film and the driver IC junction to float or damage the driver IC. defects may occur. However, the technology that can form fine patterns like COF (Chip On Film) on the existing printed circuit board (PCB) was either incomplete or not universal, so it could not be applied to actual products.

In the COF method that minimizes the bezel of the display panel, an integrated PCB with a driving chip that can eliminate the bonding process between the flexible film and the PCB on which the driving chip is mounted and the inspection process to check the bonding between the flexible film and the PCB and a display device having the same.

Another object of the present invention is to provide an integrated PCB capable of reducing damage due to short circuit or deformation of the driving chip during a process of bonding the PCB on which the driving chip is mounted to the display panel, and a display device having the same.

In order to realize such an integrated PCB, a wiring structure composed of multiple layers can be designed to minimize the size of the PCB and the shape of the PCB can be freely modified.

It also aims to form a fine pattern on a specific wiring among multi-layer wiring so that the driver IC can be mounted on the PCB.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A display device according to an embodiment of the present specification includes a display panel for displaying an image, a pad unit formed on one surface of the display panel, a rigid circuit board connected to the pad unit, and a driving IC mounted on the rigid circuit board and at least two rigid circuit boards. It is a multilayer structure including at least three metal layers and at least three insulating layers formed between the metal layers, and includes electrically connecting the driving IC and the pad part through one metal layer among the two or more metal layers of the rigid circuit board.

A display device according to an embodiment of the present specification includes a contact portion formed on at least two or more metal layers of a rigid circuit board, and at least two or more metal layers stacked on top and bottom are interconnected through holes formed in at least three or more insulating layers.

A display device according to an embodiment of the present specification includes a contact area formed in at least two or more metal layers that is at least twice larger than an area of a hole formed in at least three or more insulating layers.

The pad part of the display device according to the exemplary embodiment of the present specification is formed on the upper surface of the display panel and the driving IC is formed on the lower surface of the rigid circuit board.

The pad part of the display device according to the exemplary embodiment of the present specification is formed on the upper surface of the display panel and the driving IC is formed on the upper surface of the rigid circuit board.

The connection portion of the display device according to the exemplary embodiment of the present specification includes one in which at least one metal layer and at least two insulating layers are removed to form at least one metal layer and at least one insulating layer.

The connection part of the display device according to the embodiment of the present specification includes a first pad on which the driving IC is mounted and a second pad on which the display panel is connected.

A display device according to an embodiment of the present specification includes at least a portion of at least one metal layer and at least two insulating layers formed on a connection part removed, and at least a part of the connection part is formed of at least one metal layer and at least one insulating layer.

A display device according to an exemplary embodiment of the present specification includes at least one metal layer among at least two metal layers made of copper.

The rigid circuit board of the display device according to the exemplary embodiment of the present specification includes a mixture of a rigid substrate part and a soft substrate part.

A display device according to an exemplary embodiment of the present specification includes a display panel, an integrated circuit board, a pad unit formed on the display panel, and the integrated circuit board includes an integrated unit, a driving IC mounting unit, and a driving panel connection unit, and the integrated unit includes at least two metal layers and At least three insulating layers are formed, at least two metal layers are connected through holes formed in the at least three insulating layers, and the driving IC is mounted on a connection layer that is one of the at least two metal layers of the driving IC mounting unit and the driving panel connecting unit. and electrically connected to the pad part.

In the integrated part of the display device according to the embodiment of the present specification, at least two metal layers include a total of four layers.

The display device according to the exemplary embodiment of the present specification includes a connection layer in an intermediate layer of two or three layers among the four metal layers.

The display device according to the embodiment of the present specification includes a connection layer in an outer layer of one or four layers among the four metal layers.

A display device according to an exemplary embodiment of the present specification includes one metal layer and one insulating layer in a driving IC mounting unit or a driving panel connection unit.

In the display device according to the embodiment of the present specification, in the driving IC mounting unit, a partial region around the driving IC is formed of one metal layer and one insulating layer, and the remaining region is formed in the same stacked structure as that of the integrated unit.

A display device according to an exemplary embodiment of the present specification includes a contact member formed in at least two metal layers in an integrated part, and two metal layers are electrically connected to each other through holes formed in at least three insulating layers.

The area of the contact member of the display device according to the embodiment of the present specification includes at least twice the area of the hole.

In the integrated circuit board of the display device according to the embodiment of the present specification, the integration part includes a mixture of a rigid substrate and a soft substrate, and the driving IC mounting part and the driving panel connection part are a flexible substrate.

In the integrated circuit board of the display device according to the embodiment of the present specification, the integration part, the driving IC mounting part, and the driving panel connection part include a mixture of a rigid substrate and a flexible substrate.

Specific details of other embodiments are included in the detailed description and drawings.

According to the embodiments of the present specification, it is possible to miniaturize the printed circuit unit including the driving chip and various components.

According to embodiments of the present invention, the process can be minimized by mounting the driving chip on the PCB without a process of bonding the COF on which the driving chip is mounted to the PCB.

According to the embodiments of the present invention, in the step of bonding and bending the PCB to the display panel to complete the set, damage that may occur in the driving chip mounted on the COF of the existing flexible material or driving from the driving chip and the driving chip pad formed in the COF It is possible to minimize process defects caused by the chip floating.

Effects of the present specification are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Since the content of the invention described in the problem to be solved above, the means for solving the problem, and the effect do not specify the essential characteristics of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a schematic view for explaining a display panel bonded to a printed circuit unit provided with a driving chip according to an embodiment of the present specification.
FIG. 2 is a cross-sectional view illustrating a display panel bonded to a printed circuit unit along a cross-section taken along line A-A' of FIG. 1 .
3 is a schematic view for explaining a display panel bonded to a printed circuit unit provided with a driving chip according to another embodiment of the present specification.
FIG. 4 is a cross-sectional view illustrating a display panel bonded to a printed circuit unit along a cross-section taken along line C-C' of FIG. 3 .
FIG. 5 is a diagram for explaining four sequentially stacked metal layers corresponding to region B of FIG. 1 and contact holes formed in the insulating layer on the metal layer for each layer.
6 is a cross-sectional view for explaining four sequentially stacked metal layers and a contact hole formed in the insulating layer on the metal layer based on the d-d' section of FIG. 5 .
7 is a cross-sectional view for explaining a contact hole according to another embodiment of the present specification.
8 is a cross-sectional view for explaining a contact hole according to another embodiment of the present specification.
9 is a cross-sectional view for explaining a mounting form of a driving chip according to another embodiment of the present specification.
10 is a cross-sectional view for explaining a mounting form of a driving chip according to another embodiment of the present specification.

Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments make the disclosure of the present invention complete, and those of ordinary skill in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is construed as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal relationship is described with 'after', 'following', 'after', 'before', etc. It may include cases that are not continuous unless this is used.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

In describing the components of the present specification, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, order, or number of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but other components may be interposed between each component. It should be understood that each component may be “interposed” or “connected”, “coupled” or “connected” through another component.

As used herein, the term “display device” refers to a liquid crystal module (LCM) including a display panel and a driving unit for driving the display panel, an organic light emitting display module (OLED Module), and a quantum dot module (Quantum Dot Module). may include a display device of And, LCM, OLED, a finished product (complete product or final product) including QD modules, such as notebook computers, televisions, computer monitors, automotive devices (automotive display) or other types of vehicle (vehicle) including the electric device A set electronic device such as an equipment display, a mobile electronic device such as a smart phone or an electronic pad, or a set device or set apparatus may also be included.

Accordingly, the display device in the present specification may include a set device that is a narrow display device itself, such as an LCM, OLED, QD module, etc., and an application product including an LCM, OLED, QD module, or the like, or an end-user device.

And, in some cases, LCM, OLED, and QD modules composed of a display panel and a driving unit are expressed as “display devices” in a narrow sense, and electronic devices including LCM, OLED, and QD modules are referred to as “set devices”. It can be expressed separately as For example, a display device in the narrow sense includes a liquid crystal (LCD), organic light emitting (OLED) or quantum dot display panel, and a source PCB that is a control unit for driving the display panel, and the set device is connected to the source PCB. It may be a concept further comprising a set PCB, which is a set controller that is electrically connected to control the entire set device.

The display panel used in this embodiment includes all types of liquid crystal display panels, organic light emitting diode (OLED) display panels, quantum dot display panels (QD) and electroluminescent display panels, etc. may be used, and the display panel used in the display device according to the embodiment of the present specification is not limited to the shape or size of the display panel.

More specifically, when the display panel is a liquid crystal display panel, it includes a plurality of gate lines and data lines, and pixels formed at intersections of gate lines and data lines. In addition, an array substrate including a thin film transistor as a switching element for controlling light transmittance in each pixel, an upper substrate including a color filter and/or a black matrix, and the like, and a liquid crystal layer formed between the array substrate and the upper substrate It may be composed of

In addition, when the display panel is an organic light emitting (OLED) display panel, it may include a plurality of gate lines and data lines, and pixels formed at intersections of the gate lines and the data lines. In addition, an array substrate including a thin film transistor as a device for selectively applying a voltage to each pixel, an organic light emitting device (OLED) layer on the array substrate, and an encapsulation substrate disposed on the array substrate to cover the organic light emitting device layer Alternatively, it may be configured to include an encapsulation substrate or the like. The encapsulation substrate may protect the thin film transistor and the organic light emitting device layer from external impact, and may prevent penetration of moisture or oxygen into the organic light emitting device layer. In addition, the layer formed on the array substrate may include an inorganic light emitting layer, for example, a nano-sized material layer or quantum dots.

Each feature of the various embodiments of the present specification may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each embodiment may be independently implemented with respect to each other or implemented together in a related relationship. may be

A PCB on which various components are mounted in addition to a driving chip for driving a display device includes various components such as transistors, resistors, diodes, arithmetic chips, capacitances, connectors, and ICs to implement a display device having various functions. It is necessary to increase the degree of integration of the same parts.

Therefore, it is necessary to integrate the flexible member (or flexible film, COF) with the PCB on which the driving chip that drives the display panel and various components are mounted in order to miniaturize the display device and the printed circuit part, simplify the process flow, and reduce process defects. this came to be In order to realize a display device that satisfies these demands, each component is being miniaturized and integrated, and various technologies are used for this purpose.

In particular, unlike a flexible member (or flexible film, COF), it is very difficult to implement a wiring resolution sufficient to mount a driving chip in a PCB. Therefore, the driving chip must be mounted on a flexible member (or flexible film, COF), and a separate process for bonding the PCB to the flexible member is required. A process of mounting the driving chip on a flexible member and bonding the flexible member to the PCB and then to the display device has been conventionally performed. However, since the flexible member on which the driving chip is mounted is made of a flexible material, the bonding with the driving chip having rigid or hard physical properties is deteriorated or the driving chip is damaged during various bonding processes.

Therefore, the inventors of the present invention have been contemplating to miniaturize and integrate the PCB by implementing a complex printed circuit on the PCB. In addition, I began to think about ways to reduce process defects caused by the flexible member while directly mounting the driving chip mounted on the flexible member on a PCB made of a harder material.

Hereinafter, an embodiment of the present specification will be described in detail with reference to the accompanying drawings and embodiments.

1 is a schematic view for explaining a display panel bonded to a printed circuit unit provided with a driving chip according to an embodiment of the present specification.

Referring to FIG. 1 , there is a printed circuit unit 200 , a driving chip 300 , and a plurality of components 350 , and there is a display panel 100 connected to the printed circuit unit 200 . The printed circuit unit 200 includes an integration unit 400 , a driving IC mounting unit 500 , and a driving panel connection unit 600 . A plurality of components 350 such as transistors, resistors, diodes, arithmetic chips, capacitances, and connectors necessary for driving the panel may be disposed in the integrated unit 400 . In addition, in the printed circuit unit 200 , the driving IC mounting unit 500 and the driving panel connecting unit 600 are etched in an integrated structure to have a thickness difference from the integrated unit 400 .

The display panel 100 further includes an optical film 104 to filter the light emitted from the display panel 100 to be visible to the viewer.

FIG. 2 is a cross-sectional view illustrating a cross-sectional view taken along line A-A' of FIG. 1 .

Referring to FIG. 2 , a plurality of electrodes and a plurality of insulating layers are disposed in the integrated part 400 of the printed circuit part 200 in a multi-layered structure. The first hard layer 210 , the first metal layer 220 , the first insulating layer 230 , the second metal layer 240 , the second insulating layer 250 , the third metal layer 260 , the third insulating layer 270 , It may be formed in a multi-layer structure including the fourth metal layer 280 and the second hard layer 290 . Among them, the first hard layer 210 and the second hard layer 290 may have an insulating function and a function of protecting layers formed therein. Although not shown in the drawing, the first metal layer 220 is disposed under the first hard layer 210 to form a hole on the first hard layer 210, and a test pad through the exposed first metal layer 220 is applied. can be formed In addition, a hole may be formed in the second hard layer 290 and a transistor, a resistor, a diode, an arithmetic chip, a capacitance, a connector, etc. necessary for driving the panel may be connected to the exposed fourth metal layer 280 . The driving IC 300 is mounted on the first electrode pad formed on the driving IC mounting unit 500 to transmit a driving signal to the inside of the display panel 100 through the second metal layer 240 . The driving IC may also be mounted on the third metal layer, and the second metal layer 240 or the third metal layer 260 may be referred to as an inner layer because the second metal layer 240 or the third metal layer 260 is a metal layer inside the integrated part. In addition, the driving signal of the driving IC may be transmitted to the inside of the display panel 100 through the electrode pad formed on the driving panel connection unit 600 and the electrode pad 102 of the display panel 100 . To this end, in the printed circuit unit 200 on which a plurality of metal layers and a plurality of insulating films are stacked, a pad region on which the driving IC 300 is to be mounted and a pad region to be bonded to the pad of the display panel 100 are selectively etched to form the driving IC 300 . ) on which the first pad is mounted and the second pad bonded to the display panel may be formed. The selective etching can leave only the first insulating film 230 and the second metal layer 240 remaining, so that the driving IC 300 is mounted on the exposed portion of the second metal layer 240 and insulating the driving IC 300 periphery. To this end, a solder resist 310 may be disposed to surround the driving IC 300 , and a second pad to be connected to the electrode pad 102 of the display panel 100 may be formed. The position at which the driving IC 300 is mounted may be on the back side or the top side of the display panel 100 . In the display panel 100 , the pad electrode 102 may be formed on the lower substrate 101 , and the upper substrate 103 and the optical film 104 may be disposed thereon. And during the bonding process between the display panel 100 and the printed circuit unit 200 , the second metal layer 240 corresponding to the second pad of the printed circuit unit 200 is bonded to the pad electrode 102 formed on the display panel 100 . can In this case, an anisotropic conductive film 110 (ACF: Anisotropic Conductive Film) may be disposed for a smooth electrical connection between the two electrodes.

The fine pattern of the pad for the driving IC 300 and the pad for the display panel 100 formed in the driving IC mounting unit 500 and the driving panel connecting unit 600 has a pitch of about 20 μm to 30 μm. Preferred. The pitch referred to herein includes the line width and line distance of the pad for electrically bonding to the driving IC 300 or the display panel 100, and specifically, the line width may be 9 μm to 10 μm and the line distance 16 μm. However, it is not necessarily limited to the corresponding pitch and may be variously modified.

The first metal layer 220 to the fourth metal layer 280 may be formed of copper (Cu) or an alloy of copper (Cu) and tin (Sn) or gold (Au). Copper (Cu) is widely used as a material for wiring because it is inexpensive and has good conductivity. Gold (Au) is also a low-resistance metal and is good as a material for wiring. This may limit its use.

3 is a schematic view for explaining a display panel bonded to a printed circuit unit provided with a driving chip according to an embodiment of the present specification.

Referring to FIG. 3 , there is a printed circuit unit 200 , a driving chip 300 , and a plurality of components 350 , and there is a display panel 100 connected to the printed circuit unit 200 . The printed circuit unit 200 includes an integration unit 400 , a driving IC mounting unit 500 , and a driving panel connection unit 600 . A plurality of components 350 such as transistors, resistors, diodes, arithmetic chips, capacitances, and connectors necessary for driving the panel may be disposed in the integrated unit 400 . Unlike FIG. 1 , only the periphery of the driving IC 300 mounting portion of the driving IC mounting unit 500 is etched so that the thickness is extremely different, but in the remaining areas the integration unit 400 and the driving IC mounting unit 500 and the driving panel connection unit The thickness of 600 may be the same. Similarly, the polarizing film 104 may be disposed on the display panel 100 .

FIG. 4 is a cross-sectional view illustrating a cross-sectional view taken along line C-C' of FIG. 3 .

Referring to FIG. 4 , a plurality of electrodes and a plurality of insulating layers are disposed in the integrated part 400 of the printed circuit part 200 in a multi-layered structure. The first hard layer 210, the first metal layer 220, the first insulating layer 230, the second metal layer 240, the second insulating layer 250, the third metal layer 260, the third insulating layer ( 270 ), the fourth metal layer 280 , and the second hard layer 290 may be formed in a multi-layered structure. Among them, the first hard layer 210 and the second hard layer 290 may have an insulating function and a function of protecting layers formed therein. Although not shown in the drawing, the first metal layer 220 is disposed under the first hard layer 210 to form a hole on the first hard layer to form a test pad through the exposed first metal layer 220 . there is. In addition, a hole may be formed in the second hard layer 290 and a transistor, a resistor, a diode, an arithmetic chip, a capacitance, a connector, etc. necessary for driving the panel may be connected to the exposed fourth metal layer 280 . The driving IC 300 is mounted on the electrode pad formed on the driving IC mounting unit 500 to transmit a driving signal to the inside of the display panel 100 through the second metal layer 240 . The driving IC may also be mounted on the third metal layer, and the second metal layer 240 or the third metal layer 260 may be referred to as an inner layer because the second metal layer 240 or the third metal layer 260 is a metal layer inside the integrated part. In addition, the driving signal of the driving IC may be transmitted to the inside of the display panel 100 through the electrode pad formed on the driving panel connection unit 600 and the electrode pad 102 of the display panel 100 . To this end, in the printed circuit unit 200 in which a plurality of metal layers and a plurality of insulating layers are stacked, a pad region on which the driving IC 300 is to be mounted and a pad region to be bonded to the pad of the display panel 100 are selectively etched to form the driving IC ( 300) may be formed to be mounted on a first pad and a second pad bonded to the display panel. In the selective etching, only a partial region adjacent to the driving IC 300 mounted on the driving IC mounting unit 500 and the region to be connected to the electrode pad 102 of the display panel 100 in the driving panel connecting unit 600 is the second etching process. Etching is performed to remove the insulating layer 250 , the third insulating layer 270 , the second hard layer 290 , and the third metal layer 260 and the fourth metal layer 280 so that the driving IC 300 is formed with the second metal layer. (240) It is mounted on the exposed portion, and a solder resist 310 (solder resist) is disposed to surround the periphery of the driving IC 300 for insulation of the periphery of the driving IC 300, and the electrode pad 102 of the display panel 100 ) to form a region to be connected to. The position at which the driving IC 300 is mounted may be on the back side or the top side of the display panel 100 . In the display panel 100 , the pad electrode 102 may be formed on the lower substrate 101 , and the upper substrate 103 and the optical film 104 may be disposed thereon. And during the bonding process between the display panel 100 and the printed circuit unit 200 , the second metal layer 240 corresponding to the second pad of the printed circuit unit 200 is bonded to the pad electrode 102 formed on the display panel 100 . can In this case, an anisotropic conductive film 110 (ACF: Anisotropic Conductive Film) may be disposed for a smooth electrical connection between the two electrodes.

The fine pattern of the pad for the driving IC 300 and the pad for the display panel 100 formed in the driving IC mounting unit 500 and the driving panel connecting unit 600 has a pitch of about 20 μm to 30 μm. Preferred. The pitch referred to herein includes the line width and line distance of the pad for electrically bonding to the driving IC 300 or the display panel 100, and specifically, the line width may be 9 μm to 10 μm and the line distance 16 μm. However, it is not necessarily limited to the corresponding pitch and may be variously modified.

The first metal layer 220 to the fourth metal layer 280 may be formed of copper (Cu) or an alloy of copper (Cu) and tin (Sn) or gold (Au). Copper (Cu) is widely used as a material for wiring because it is inexpensive and has good conductivity. Gold (Au) is also a low-resistance metal and is good as a material for wiring. This may limit its use.

5 is an enlarged view of region B of FIG. 1 in which multi-layered metal layers are arranged from the lower layer. Region B is a region in which multiple metal layers are interconnected through holes formed in the insulating film.

5, in the region B formed in the integrated part 400 of the printed circuit part 200, a fourth metal layer 280, a third metal layer 260, a second metal layer ( 240) and the first metal layer 220 are formed wider than the wiring to form contact regions 225, 245, 265, and 285 for interconnection. In addition, a contact hole may be formed in the insulating film formed between the respective metal layers. In more detail, a contact hole 275 is formed in the third insulating layer 270 formed on the fourth metal layer 280 , and a contact hole 255 is formed in the second insulating layer 250 formed on the third metal layer 260 . , a contact hole 235 may be formed in the first insulating layer 230 formed on the second metal layer 240 . For better understanding, the interconnection width of the metal layers 220, 240, 260, and 280 formed on the integration unit 400 may be about 9 to 10 μm, and the contact regions 225, 245, 265, 285 may be formed in a square having one side of about 75 μm. The contact holes 235 , 255 , and 275 formed on the contact regions 225 , 245 , 265 , and 285 may have a circular or square shape of about 25 μm. The reason for forming the contact areas 225, 245, 265, and 285 to be three times larger than that of the contact holes 235, 255, 275 is that even if the positions of the contact holes 235, 255, 275 have a gap compared to the target position due to process deviation, each metal layer ( 220, 240, 260, 280) is designed to ensure electrical connection.

6 is a cross-sectional view taken along the line D-D' of FIG. 5 .

Referring to FIG. 6 , as a cross-sectional structural diagram for confirming the interconnection between the metal layers of the multilayer structure in the area of the integrated unit 400 of the printed circuit unit 200, the outermost first hard layer 210 and the second hard layer 290 There is this. The first to fourth metal layers 220 , 240 , 260 , and 280 are sequentially disposed between the first hard layer 210 and the second hard layer 290 , and at least one insulating layer is disposed between the adjacent metal layers. This is interposed. The fourth metal layer 280 is connected to the third metal layer 260 through a contact hole 275 formed in the third insulating layer 270 on the fourth metal layer 280 . The third metal layer 260 is connected to the second metal layer 240 through a contact hole 255 formed in the second insulating layer 250 on the third metal layer 260 . The second metal layer 240 is connected to the first metal layer 220 through a contact hole 235 formed in the first insulating layer 230 on the second metal layer 240 . Accordingly, from the first metal layer to the fourth metal layer, all multi-layered metal layers are electrically connected to each other. However, the connection structure of all multi-layers is not the same and can be transformed into various structures according to the design purpose.

7 is another example of the multi-layered metal layer connection of the integrated part 400 according to the embodiment of the present specification.

Referring to FIG. 7 , a first hard layer 210 and a second hard layer 290 on the outermost side as a cross-sectional structural diagram for confirming the connection between the metal layers of the multilayer structure in the area of the integrated part 400 of the printed circuit unit 200 There is a third insulating layer 270 on the fourth metal layer 280 , a contact hole 275 for a contact is formed to be connected to the third metal layer 260 , and a second second insulating layer 270 is formed on the third metal layer 260 . The insulating layer 250 , the second metal layer 240 , the first insulating layer 230 , and the first metal layer 220 may be formed to form a single contact hole 257 to connect the metal layers.

8 is another example of the multi-layered metal layer connection of the integrated part 400 according to the embodiment of the present specification.

Referring to FIG. 8 , as a cross-sectional structural diagram for confirming the interconnection between the metal layers of the multi-layer structure in the area of the integrated part 400 of the printed circuit unit 200, the outermost first hard layer 210 and the second hard layer 290 and from the fourth metal layer 280 to the third insulating layer 270 , the third metal layer 260 , the second insulating layer 250 , the second metal layer 240 , the first insulating layer 230 and the first metal layer. By forming 220 , one contact hole 277 may be formed to connect the respective metal layers.

9 is a cross-sectional view for explaining another example of the printed circuit unit 200 according to an embodiment of the present specification.

Referring to FIG. 9 , unlike the structure of the printed circuit unit 200 of FIGS. 2 or 4 described above, the driving IC 300 is configured as a second metal layer 240 or a third metal layer 260 of the driving IC mounting unit 500 . It may be mounted on the first metal layer 220 other than this. In addition, by forming the first hard layer 210 to remain on the first metal layer 220 may be configured to protect the first metal layer (220).

In addition, the surface mounted on the driver IC mounting unit 500 of the driver IC 300 may be the lower surface of the first metal layer 220 , but a portion of the first hard layer 210 is removed and the first metal layer 220 is upper It may be configured so that the first insulating layer 230 remains after being formed on the .

10 is a cross-sectional view for explaining another example of the printed circuit unit 200 according to an embodiment of the present specification.

Referring to FIG. 10 , the driving IC 300 of the printed circuit unit 200 is to be mounted on the fourth metal layer 220 rather than the second metal layer 240 or the third metal layer 260 of the driving IC mounting unit 500 . can In addition, the second hard layer 290 may be formed to remain under the fourth metal layer 280 to protect the fourth metal layer 280 .

And the surface mounted on the driving IC mounting unit 500 of the driving IC 300 may be the upper surface of the fourth metal layer 280 , but a part of the second hard layer 290 is removed and the fourth metal layer 280 is lower It may be configured so that the third insulating layer 270 remains after being formed on the .

A display device according to an embodiment of the present specification includes a display panel for displaying an image, a pad unit formed on one surface of the display panel, a rigid circuit board connected to the pad unit, and a driving IC mounted on the rigid circuit board and at least two rigid circuit boards. It is a multilayer structure including at least three metal layers and at least three insulating layers formed between the metal layers, and includes electrically connecting the driving IC and the pad part through one metal layer among the two or more metal layers of the rigid circuit board.

A display device according to an embodiment of the present specification includes a contact portion formed on at least two or more metal layers of a rigid circuit board, and at least two or more metal layers stacked on top and bottom are interconnected through holes formed in at least three or more insulating layers.

A display device according to an embodiment of the present specification includes a contact area formed in at least two or more metal layers that is at least twice larger than an area of a hole formed in at least three or more insulating layers.

The pad part of the display device according to the exemplary embodiment of the present specification is formed on the upper surface of the display panel and the driving IC is formed on the lower surface of the rigid circuit board.

The pad part of the display device according to the exemplary embodiment of the present specification is formed on the upper surface of the display panel and the driving IC is formed on the upper surface of the rigid circuit board.

The connection portion of the display device according to the exemplary embodiment of the present specification includes one in which at least one metal layer and at least two insulating layers are removed to form at least one metal layer and at least one insulating layer.

The connection part of the display device according to the embodiment of the present specification includes a first pad on which the driving IC is mounted and a second pad on which the display panel is connected.

A display device according to an embodiment of the present specification includes at least a portion of at least one metal layer and at least two insulating layers formed on a connection part removed, and at least a part of the connection part is formed of at least one metal layer and at least one insulating layer.

A display device according to an exemplary embodiment of the present specification includes at least one metal layer among at least two metal layers made of copper.

The rigid circuit board of the display device according to the exemplary embodiment of the present specification includes a mixture of a rigid substrate part and a soft substrate part.

A display device according to an embodiment of the present specification includes a display panel, an integrated circuit board, a pad unit formed on the display panel, and the integrated circuit board includes an integrated unit, a driving IC mounting unit, and a driving panel connection unit, and the integrated unit includes at least two metal layers and At least three insulating layers are formed, at least two metal layers are connected through holes formed in the at least three insulating layers, and the driving IC is mounted on a connection layer that is one of the at least two metal layers of the driving IC mounting unit and the driving panel connecting unit. and electrically connected to the pad part.

In the integrated part of the display device according to the embodiment of the present specification, at least two metal layers include a total of four layers.

The display device according to the exemplary embodiment of the present specification includes a connection layer in an intermediate layer of two or three layers among the four metal layers.

The display device according to the embodiment of the present specification includes a connection layer in an outer layer of one or four layers among the four metal layers.

A display device according to an exemplary embodiment of the present specification includes one metal layer and one insulating layer in a driving IC mounting unit or a driving panel connection unit.

In the display device according to the embodiment of the present specification, in the driving IC mounting unit, a partial region around the driving IC is formed of one metal layer and one insulating layer, and the remaining region is formed in the same stacked structure as that of the integrated unit.

A display device according to an exemplary embodiment of the present specification includes a contact member formed in at least two metal layers in an integrated part, and two metal layers are electrically connected to each other through holes formed in at least three insulating layers.

The area of the contact member of the display device according to the embodiment of the present specification includes at least twice the area of the hole.

In the integrated circuit board of the display device according to the embodiment of the present specification, the integration part includes a mixture of a rigid substrate and a soft substrate, and the driving IC mounting part and the driving panel connection part are a flexible substrate.

In the integrated circuit board of the display device according to the embodiment of the present specification, the integration part, the driving IC mounting part, and the driving panel connection part include a mixture of a rigid substrate and a flexible substrate.

The display device of the present invention described above is not limited by the above-described embodiments and drawings, and it will be apparent to those skilled in the art that various substitutions, modifications and changes are possible. .

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be interpreted by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: display panel
101: lower substrate 102: panel pad electrode
103: upper substrate 104: optical film
110: anisotropic conductive film (ACF)
200: printed circuit unit
210, 290: first and second hard layers
220, 240, 260, 280: first, second, third and fourth metal layers
225, 245, 265, 285: contact area
235, 255, 257, 275, 277: contact hole
230, 250, 270: first, second and third insulating layers
300: driving IC 310: solder resist
350: plurality of parts
400: integration
500: driving IC mounting unit
600: drive panel connection part

Claims (20)

a flexible display panel for displaying an image;
a pad portion formed on one surface of the display panel;
a rigid circuit board connected to the pad part; and
The rigid circuit board includes a connection part on which a driving IC is mounted,
The rigid circuit board is a multi-layer structure including at least two or more metal layers and at least three or more insulating layers formed between the metal layers,
The driving IC and the pad part are electrically connected to each other through one metal layer among the two or more metal layers of the rigid circuit board;
A contact portion is formed on the at least two or more metal layers of the rigid circuit board,
A display device in which at least two or more metal layers stacked up and down are interconnected through holes formed in the at least three or more insulating layers.
delete The method of claim 1,
A contact area formed in the at least two or more metal layers is at least twice larger than an area of a hole formed in the at least three or more insulating layers.
The method of claim 1,
The pad part is formed on an upper surface of the display panel, and the driving IC is formed on a lower surface of the rigid circuit board.
The method of claim 1,
The pad part is formed on the upper surface of the display panel, and the driving IC is formed on the upper surface of the rigid circuit board.
The method of claim 1,
The connection portion is formed of at least one metal layer and at least one insulating layer by removing at least one metal layer and at least two insulating layers.
7. The method of claim 6,
The connection unit includes a first pad on which the driving IC is mounted and a second pad on which the display panel is connected.
The method of claim 1,
At least a portion of the at least one metal layer and the at least two insulating layers formed on the connection part is removed, so that at least a part of the connection part is formed of at least one metal layer and at least one insulating layer.
The method of claim 1,
At least one metal layer among the at least two metal layers is a copper material.
The method of claim 1,
The rigid circuit board is a display device in which a rigid substrate part and a soft substrate part are mixed.
display panel;
integrated circuit board;
a pad portion formed on the display panel;
The integrated circuit board is composed of an integrated part, a driving IC mounting part, and a driving panel connection part,
At least two metal layers and at least three insulating layers are formed in the integrated part, the at least two metal layers are connected through holes formed in the at least three insulating layers, and the at least the driving IC mounting part and the driving panel connection part The driving IC is mounted on the connection layer, which is one of the two metal layers, and is electrically connected to the pad part,
A contact member is formed on the at least two metal layers in the integrated part,
A display device in which the at least two metal layers are electrically connected through holes formed in the at least three insulating layers.
12. The method of claim 11,
In the integrated part, the at least two metal layers are formed of a total of four layers.
13. The method of claim 12,
of the four metal layers, the connection layer is in an intermediate layer of two or three layers.
13. The method of claim 12,
of the four metal layers, the connection layer is in an outer layer of one or four layers.
12. The method of claim 11,
A display device having one metal layer and one insulating layer in the driving IC mounting part or the driving panel connection part.
12. The method of claim 11,
In the driving IC mounting unit, a portion of a region around the driving IC is formed of one metal layer and one insulating layer, and the remaining region is formed in the same stacked structure as that of the integrated unit.
delete 12. The method of claim 11,
An area of the contact member is at least twice larger than an area of the hole.
12. The method of claim 11,
In the integrated circuit board, the integrated part is a combination of a hard substrate and a soft substrate, and the driving IC mounting part and the driving panel connecting part are a soft substrate.
12. The method of claim 11,
In the integrated circuit board, the integrated part, the driving IC mounting part, and the driving panel connecting part are a display device in which a hard substrate and a soft substrate are mixed.

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