KR20200072852A - Display Device - Google Patents

Abstract

The present invention relates to a display device of which the structure is altered such that, when a display panel is fastened in a cover structure in the display device, the display panel or a board can be connected without damage to a flexible cable provided to apply signals or deformation of a cover shield, thereby improving reliability in fastening. According to the present invention, the display device comprises: a display panel having a substrate, an array unit, and a touch sensor unit stacked together; a plurality of signal transmission films having one side connected to one side of the array unit, spaced apart from each other by a predetermined distance, and folded to a lower surface of the display panel; a first flexible film connected to one side of the touch sensor unit; a source printed circuit board connected to the other side of the plurality of signal transmission films on the lower surface of the display panel; a cover shield having a through hole of the first flexible film and covering a surface and a side surface of the source printed circuit board from the lower surface of the display panel; and a protrusion unit protruding from an inner surface of the cover shield toward the lower surface of the display panel between signal transmission films that are spaced apart from each other and adjacent to the through hole.

Description

Display Device

The present invention relates to a display device having improved reliability by changing the structure of a cover structure located on the rear side of a display panel.

In recent years, the display field for visually expressing electrical information signals has rapidly developed as the era of full-scale informatization has increased, and in response to this, various flat panel display devices with excellent performance of thinning, lightening, and low power consumption have been developed. Display Device) has been developed to rapidly replace the existing cathode ray tube (CRT).

Specific examples of the flat panel display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an organic light emitting display device (Organic Light Emitting Device: OLED) and the like.

Among them, a self-luminous display device such as an organic light emitting display device is considered as a competitive application for compactness of a device and clear color display without requiring a separate light source.

On the other hand, the organic light emitting display device is provided with an organic light-emitting element that self-emits in each sub-pixel, the organic light-emitting element is located between the two electrodes and the two electrodes, and transported electrons and holes when the light is recombined This flying light layer is provided.

The organic light emitting device (organic light emitting diode, etc.) has the advantage that it can be thinned as a self light emitting device using a thin light emitting layer between electrodes. A general organic light emitting display device has a structure in which an organic light emitting element connected to a pixel driving circuit is formed on a substrate, and light emitted from the organic light emitting element passes through the substrate or the barrier layer to display an image.

Since the organic light emitting display device is implemented without a separate light source device, it is easy to be implemented as a flexible, bendable, or foldable display device, and thus can be designed in various forms.

Accordingly, a display device such as an organic light-emitting display device including a self-luminous element is not only traditional electronic devices such as TVs, but also extends its application to various fields such as automobile dashboards, automobile windshields, mirror display units, and indoor and outdoor billboards. have. In this case, it is necessary to optimize for each display device use environment.

The present invention is to solve the above-mentioned problems, and when the display panel is fastened in the cover structure, it can be connected to the display panel or the board substrate without damaging or deforming the flexible cable provided to apply a signal or a configuration facing the same. It is a technical problem to provide a display device with improved reliability.

The display device of the present invention can change the structure of the cover shield to prevent pressure or shock when it meets with an adjacent flexible film in the fastening process, thereby securing device reliability and stability.

In the display device of the present invention, a display panel having a substrate, an array portion, and a touch sensor unit stacked thereon, a cover member positioned on the touch sensor unit to protect the display panel, and one side connected to one side of the array unit, A plurality of signal transmission films spaced apart from each other and folded to the lower surface of the display panel, the first flexible film connected to one side of the touch sensor unit, and the other sides of the plurality of signal transmission films on the lower surface of the display panel And a source printed circuit board connected to the signal, a cover shield having a through hole of the first flexible film, and covering a surface and a side surface of the source printed circuit board at a lower surface of the display panel, and a signal spaced apart from each other adjacent to the through hole A protrusion projecting from the inner surface of the cover shield to the lower surface of the display panel may be provided between the transfer films.

The cover shield and the protrusion may be integral.

The cover shield and the protrusion may be polycarbonate.

The through hole of the cover shield is located on the side of the cover shield, and the side portions of two signal transmission films adjacent to each other may be exposed through the through hole.

The signal transmission film may be located inside the passage hole, spaced apart from the signal transmission film, and the first flexible film may be drawn out of the passage hole.

A metal plate may be further attached to the lower surface of the display panel.

The protrusion may be attached to the metal plate through a double-sided tape.

The cover shield further has a transmission portion, and the first connector on the source printed circuit board may pass through the transmission portion in a vertical direction.

The substrate may be a plastic film.

On the outside of the surface of the cover shield, a core plate and a control printed circuit board may be further included.

A second flexible film connecting the control printed circuit board and the source printed circuit board may be further included with the core plate interposed therebetween.

The protrusion may maintain a first vertical distance between the cover shield and the core plate and a second vertical distance between the cover shield and the metal plate.

A display device according to another exemplary embodiment of the present invention includes a display panel having a substrate, an array unit, and a touch sensor unit stacked thereon, a first flexible film connected to one side of the touch sensor unit, and a through hole of the first flexible film. A cover shield covering the surface and side surfaces of the source printed circuit board on the lower surface of the display panel and a protrusion protruding toward the lower surface of the display panel from the inner surface of the cover shield adjacent to the through hole may be provided. .

The cover shield and the protrusion may be integral. In addition, the cover shield and the protrusion may be polycarbonate.

The pass hole of the cover shield is located on the side of the cover shield, and side parts of signal transmission films adjacent to each other connected to the display panel through the pass hole may be exposed.

The protrusion may be located between the signal transmission films adjacent to each other inside the passage hole.

The first flexible film may be withdrawn from the signal transmission films and out of the through hole.

A double-sided tape may be further included on the lower surface of the display panel and between the metal plate and the protrusion and the metal plate.

The display device of the present invention has the following effects.

First, the display device of the present invention is further provided with a support portion having a protruding shape on the inner side of the cover shield, and the support portion meets a metal plate located on the rear side of the display panel to prevent deformation of the cover shield during the fastening process. Can. Therefore, the reliability of the display device can be improved by keeping the distance between the cover shield and the printed circuit boards and the chip-on film constant.

Second, by providing the protrusions on the inner side of the cover shield, maintaining the vertical gap between the display panel and the cover shield, stably protecting the chip-on film or the printed circuit board protected by the cover shield, and reducing the panel crack caused by sagging of the cover shield. It is possible to prevent, thereby, driving and screen defects can be prevented.

Third, the rigidity of the cover structure is improved and supplemented, thereby reducing the process jig cost and shortening the process time.

Fourth, by supplementing the stiffness by changing the structure, it is possible to effectively relieve stress transmission in a structure to which an external force is applied, such as a flexible display device, by preventing stress transmission to adjacent components.

1 is an exploded perspective view showing a display device of the present invention
2 is a cross-sectional view taken along line I to I'of FIG. 1;
3 is a cross-sectional view showing a display panel of the display device of the present invention
4 is a cross-sectional view showing a display device according to a comparative example
5 is a perspective view of an enlarged portion of the touch FPC take-out and its surrounding area
FIG. 6 is a cross-sectional view taken along line II to II' in FIG. 5;
7 is a perspective view of the cover shield of FIG. 6 as viewed from the inside
8 is a perspective view of the display device of the present invention as viewed from the rear side

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Throughout the specification, the same reference numbers refer to substantially the same components. In the following description, when it is determined that a detailed description of the technology or configuration related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description is omitted. In addition, the component names used in the following description are selected in consideration of the ease of preparing the specification, and may be different from the actual product parts names.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for describing various embodiments of the present invention are exemplary, and the present invention is not limited to the details shown in the drawings. Throughout this specification, the same reference numerals refer to the same components. In addition, in the description of the present invention, when it is determined that detailed descriptions of related known technologies may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. When'include','have','consist of', etc. mentioned in this specification are used, other parts may be added unless'~man' is used. When a component is expressed as a singular number, the plural number is included unless otherwise specified.

In interpreting the components included in various embodiments of the present invention, it is interpreted as including an error range even if there is no explicit description.

In explaining various embodiments of the present invention, when describing the positional relationship, for example,'~top','~top','~bottom','~side', etc. When the positional relationship of parts is described, one or more other parts may be located between the two parts unless'right' or'direct' is used.

In describing various embodiments of the present invention, in the case of explaining the time relationship, temporal sequential relationships such as'after','following','after','before', etc. When is described, it may also include a case where it is not continuous unless'right' or'direct' is used.

In describing various embodiments of the present invention,'first','second', etc. may be used to describe various components, but these terms are only used to distinguish between similar components that are identical to each other. to be. Accordingly, in the present specification, the components modified with'first' may be the same as the components modified with'second' within the technical spirit of the present invention, unless otherwise specified.

Each of the features in various embodiments of the present invention can be partially or wholly combined or combined with each other, technically various interlocking and driving is possible, and each of the various embodiments can be independently implemented with respect to each other or together in an associative relationship. It may be feasible.

Since the drawings disclosed in the present specification have a main feature of the cover structure on the lower side of the display panel, in the following drawings, a state in which the display surface of the display panel is located at the lower side and the lower side (back side) of the display panel is raised to the upper portion is mainly described. do.

1 is an exploded perspective view showing the display device of the present invention, and FIG. 2 is a cross-sectional view taken along line I to I'in FIG. 1. 3 is a cross-sectional view showing a display panel of the display device of the present invention. 4 is a cross-sectional view showing a display device according to a comparative example.

Looking at the display device of the present invention with reference to FIGS. 1 and 2, the display device of the present invention is a display panel 150 having a base 151, an array unit 152, 153 and a touch sensor unit 155 together. And, the upper side of the display panel 150, that is, the cover member 100 which is positioned above the touch sensor unit to protect the display panel, and one side thereof is connected to one side of the display panel 150, and a certain distance from each other A plurality of chip-on-film (COF) 260 spaced apart and folded to a lower surface of the display panel 150, a first flexible film 410 connected to one side of the touch sensor unit, and the display panel A source printed circuit board 250 connected to the other sides of the plurality of chip-on films on the lower surface of 150 and a through hole 330 of the first flexible film 410, the source printed circuit board 250 ) A cover shield 300 covering the surface and side surfaces of the display panel 150 from the lower surface.

The first flexible film 410 is electrically connected to the touch sensor unit 155 and may receive a control signal from an external touch driver (not shown). The first flexible film 410 is a kind of flexible film, and electrical signals are transmitted including wiring inside the film.

In addition, a control printed circuit board 510 for external control of the display panel 150 may be disposed on the surface of the cover shield 300 with the core plate 500 interposed therebetween. The configuration outside the surface of the cover shield 300 may be omitted or component parts may be added depending on whether the display device is applied to an application such as a mobile phone, a monitor, a television, an interior home appliance, or a vehicle display device. This can be variable. In addition, the configuration outside the surface of the cover shield 300 is configured separately from the display panel 150 and is also referred to as a SET configuration in terms of determining the shape of the entire display device.

The control printed circuit board 510 and the source printed circuit board 250 have electrical signals transmitted and received through the connectors 515 and 270 located at each and the second flexible film 520 connected therebetween. Do it.

In the display device of the present invention, the chip-on film 260 is a kind of film, and is provided with a thin copper layer therein, connected thereto, and having a driving chip 261 on its surface. Here, the driving chip 261 generates signals corresponding to a plurality of wirings provided on the display panel 150 and transfers the signals to the internal wiring of the thin copper layer connected to the driving chip 261. The thin copper layer of the chip-on film 260 is partially exposed on both sides of the chip-on film 260, and is formed in the same process as a portion of the source printed circuit board 250 and the thin film transistor array 152 on the substrate 151. The pad electrodes 161 corresponding to the plurality of wirings are connected to each through an conductive film (ACF: Anisotropic Conductive Film, not shown).

In the present invention, the chip-on film 260 is also referred to as a signal transmission film in terms of transmitting signals.

In the drawing, although the chip-on film 260 is separately connected to the base 151 of the display panel 150, the present invention is not limited thereto, and when the base 151 is a plastic film, it is extended to extend. It is also possible to further include a driver IC (Integrated Circuit) directly to the driver. In this case, it is also called a COP (Chip on Plastic) method. In another case, the chip-on film 260 and the source printed circuit board 250 may be integrated and applied as a flexible printed circuit board (FPCB). In the case of the FPCB method, a driver IC for driving the flexible printed circuit board will be directly provided. In the display device of the present invention, the source printed circuit board is flexible to the position of the chip-on film, such as when the plastic substrate is extended and bent in the described COP method as well as the chip-on film method and is bent toward the back side of a considerable plastic substrate in the display portion and the flexible printed circuit board. It is also applicable to extend in one state.

In addition, the source printed circuit board 250 is located on the back side of the metal plate 220 and is fixed through a double-sided tape 265.

The source printed circuit board 250 includes a plurality of driving elements including a timing control unit 252, and the driving elements are disposed on a surface not facing the metal plate 220. The timing control unit 252 and the plurality of driving elements are connected to terminals on one side through internal wiring provided inside the source printed circuit board 250, and one end of the terminals and the chip-on film 260 is a conductive film It is connected through.

Meanwhile, in the display device of the present invention, the cover shield 300 covers and protects the source printed circuit board 250 and the chip-on film 260, and considers the flow during bonding of the chip-on film 260 to cover the cover shield 300 ) Provided with a step on the plane 300a, as shown in FIG. 2, may have more vertical separation from the chip-on film 260 than the source printed circuit board 250. The cover shield 300 has a through hole 330 through which the first flexible cable 410 connected to the touch sensor unit 155 passes.

A protruding portion 310 protruding in the vertical direction toward the metal plate 220 may be further provided inside the cover shield 300 adjacent to the through hole 330. In FIG. 2, the protrusion 310 is seen to penetrate the chip-on film 260, which is illustrated to indicate the vertical height of the protrusion 310, and substantially the protrusion 310 is the first flexible film. Among the portions where 410 is located, they are present between adjacent chip-on films 260, and thus, the protrusion 310 faces the metal plate 220 without penetrating the chip-on film 260.

The pass hole 330 of the cover shield 300 is located on the side of the cover shield 300, and two adjacent chip-on films 260 spaced apart from each other among at least three or more chip-on films through the pass hole 330 ) May be exposed.

On the other hand, the cover shield 300, on the other hand, is further provided with a transmissive portion 340, the second flexible film 520 is connected to the control printed circuit board 510 is transmitted through the connection to the source printed circuit board 250 Can have

The source printed circuit board 250 is provided with a connector 270 in addition to a timing controller 252 on its surface, and the connector 270 protrudes from the transmissive part 340 (see FIG. 2) to the cover shield 300. Can be. In addition, a core plate 500 is positioned on the cover shield 300 to prevent electrical interference, a control printed circuit board 510 is provided on the core plate 500, and a second flexible film 520 is provided. The connector 270 of the source printed circuit board 250 is connected between the connector 515 on the control printed circuit board 510.

On the other hand, the cover shield 300 of the present invention can be molded to avoid electrical interference with the inside and outside of the source printed circuit board 250, the chip-on film 260 and the first and second flexible films 410 and 520. It is made of insulating plastic material, for example, polycarbonate (PC).

In addition, a surface facing the source printed circuit board 250 and the chip-on film 260 in terms of a function that the cover shield 300 covers the source printed circuit board 250 and the chip-on film 260 is called an inner surface. The opposite side is called the outer side. The outer surface of the cover shield 300 may face the second flexible film 520 connected from the control printed circuit board 510.

The first and second flexible films 410 and 520 are provided with wirings and a film layer protecting them, respectively. Since they have wiring inside, they have a stiffness of a certain level or more to prevent cracking thereof. In particular, the second flexible film 520 directly faces the cover shield 300 when connecting between the connectors 515 and 270. If, as in the comparative example of FIG. 4, the cover shield 30 does not have a protrusion. In this case, the second flexible film 520 having relatively high stiffness presses the cover shield 300 in the fastening process, so that the deformation of the cover shield 300 may be applied. At this time, when the cover shield 300 sags to contact the chip-on film 260 due to the deformation of the cover shield 300, the driving chip 261 on the chip-on film 260 is a chip-on film 260 There is also a risk of causing electrical interference or physical stress to the inner wiring or the pad electrode 161 on the substrate 151.

In contrast, the display device of the present invention is to cover the cover shield 300 so as to maintain a certain vertical separation distance from the source printed circuit board 250 and the chip on film 260 to solve the problem of the comparative example ) Is provided with a protrusion 310 toward the metal plate 220 from the inner surface, so that the deformation of the cover shield 300 can be prevented when connecting between the connectors 515 and 270 of the second flexible film 520, It is also possible to prevent electrical interference or physical stress between components inside the shield 300.

Each of the first and second flexible films 410 and 520 has internal wiring inside the film, and is also referred to as a flat flexible cable (FFC).

In the display device of the present invention, a specific configuration of the protrusion 310 will be described in detail with reference to the drawings of FIG. 5 or less.

Meanwhile, in the display device of the present invention, the cover member 100 corresponds to a display surface side viewed by a viewer, and is a configuration in which a viewer's touch operation is directly applied. The area inside the dotted line shown in FIG. 1 is an area in which an actual image is projected, and is called an active area AA, and its outer area is called a non-display area NA. The active area AA and the non-display area NA are defined in the same corresponding area in the display panel 150. The cover member 100 is on a display surface where a viewer views an image, and is also called a cover window or a cover glass in that the image is transmitted as a kind of transparent film or glass. The cover member 100 transmits light emitted from the display panel 150 to the outside and is attached to protect the surface of the display panel 150. In the cover member 100, the active area AA is divided into a transparent part, and the non-display area NA is divided into a shield part, so that the configuration under the non-display area NA can be prevented. The cover member 100 may be made of a material having a large Young's modulus, that is, a material having high hardness, in order to reduce cracks due to external impact. Typically, glass can be made of a high-hardness material, but the thickness of a typical glass substrate (substrate) is 0.5 mm or more, and there is a risk of breaking when folded or bent. Accordingly, when a flexible state, such as a flexible, bendable, or rollable display device, is required, the material of the cover member 100 is made of glass having a thickness of 0.1 mm or less or a constant transmittance. The above-mentioned transparent plastic substrate is made of a material of high hardness.

The display device of the present invention is, for example, a form provided on a part of a windshield of an automobile. Accordingly, when the cover member 100 is described as an example, the overall shape is a non-symmetrical rectangle, the left side follows the oblique direction, the right side follows the vertical line direction, and the upper and lower sides follow the horizontal line. The cover member 100 is formed to protect the display panel 150, and the display panel 150 will generally conform to the shape of the cover member 100.

However, such a shape is an example, and the display device of the present invention is applicable to a rectangle, a square, another form of a polygon, or a circular or elliptical shape. In order to prevent damage to the display panel 150 when ease of handling at the time of processing and an image projecting surface have a bend, the cover member 100 and the metal plate 220 on the display panel 150 as well as the display panel 150 are prevented. It is preferable that all the upper and lower components such as) have flexibility.

In this case, the image comes out to the cover member 100 side, and the cover member 100 will be arranged on the side facing the viewer so as to be the top surface.

In the display panel 150, a thin film transistor array 152 and an organic light emitting device array 153 are stacked on a substrate 151, and a touch sensor unit 155 is positioned on the organic light emitting device array 153. .

The thin film transistor array 152 and the organic light emitting diode array 153 may include one or more thin film transistors (TFTs) and the thin film transistors for each of a plurality of sub-pixels defined in a matrix in the active area AA of the substrate 151. It consists of an organic light emitting device (OLED) to be connected. It will be described in detail with reference to FIG. 3.

The substrate 151 supports various components of the display panel 150. The substrate 151 may be formed of a transparent insulating material, for example, an insulating material such as glass or plastic. When the substrate 151 is made of plastic, it may be referred to as a plastic film or plastic substrate. For example, the substrate 151 may be in the form of a film including one selected from the group consisting of polyimide-based polymers, polyester-based polymers, silicone-based polymers, acrylic polymers, polyolefin-based polymers, and copolymers thereof. Among these materials, polyimide is mainly used as a plastic substrate because it can be applied to high-temperature processes and is a material that can be coated. The substrate (array substrate) is also referred to as a concept including an element and a functional layer formed on the substrate 151, for example, a switching TFT, a driving TFT connected to the switching TFT, an organic light emitting element connected to the driving TFT, a protective film, and the like. .

In some cases, a buffer layer (not shown) may be positioned on the substrate 151. The buffer layer is a functional layer for protecting a thin film transistor (TFT) from impurities such as alkali ions flowing out of the substrate 151 or lower layers. The buffer layer may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof.

The thin film transistor array 152 includes a thin film transistor 130 in which a gate electrode 132, a gate insulating film 112, a semiconductor layer 134, an interlayer insulating film 114, and source and drain electrodes 136 and 138 are sequentially arranged. , TFT). The thin film transistors 130 and TFT are provided in at least one of a plurality of sub-pixels provided in the active area AA on the substrate 151.

The formation order of the semiconductor layer 134 and the gate electrode 132 may be changed.

The semiconductor layer 134 is positioned at a predetermined portion on the substrate 151 or the buffer layer. The semiconductor layer 134 may be made of polysilicon (p-Si), in which case a predetermined region may be doped with impurities. Further, the semiconductor layer 134 may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene. Furthermore, the semiconductor layer 134 may be made of oxide. The gate insulating layer 112 may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material. The gate electrode 132 may be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof. And the like.

The first interlayer insulating layer 114 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material. A contact hole through which the source and drain regions are exposed may be formed by selectively removing the first interlayer insulating layer 114.

The source and drain electrodes 136 and 138 are formed of a single layer or a multi-layer shape as an electrode material on the first interlayer insulating layer 114.

The source and drain electrodes 136 and 138 are covered, and an inorganic protective layer 116 and a planarization layer 118 may be positioned on the thin film transistor. The inorganic protective film 116 and the planarization layer 118 protect the thin film transistor and planarize the upper portion. The inorganic protective film 116 may be formed of an inorganic insulating film such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx), and the planarization layer 118 is made of an organic insulating film such as benzocyclobutene (BCB) or acrylic (Acryl). Each of the inorganic protective layer 116 and the planarization layer 118 may be formed of a single layer, or may be composed of a double layer or multiple layers. In some cases, one of the two layers may be omitted. .

It is referred to as a thin film transistor array 152 including thin film transistors 130 and TFT provided in each sub-pixel on the substrate 151, an inorganic protective film 116, and a planarization layer 118.

The organic light emitting device (OLED) connected to the thin film transistor (TFT) may have a form in which the first electrode 122, the organic light emitting layer 124, and the second electrode 126 are sequentially arranged. That is, the organic light emitting device (OLED) is the first electrode 122 and the first electrode 122 connected to the drain electrode 138 through the connection hole 148 provided in the planarization layer 118 and the inorganic protective layer 116. ), the organic light emitting layer 124 and the second electrode 116 located on the organic light emitting layer 114.

When the display panel 150 is a top emission method in which the second electrode 126 emits light, the first electrode 122 may include an opaque conductive material having high reflectance. In this case, the reflective conductive material included may be, for example, silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof. .

The bank 128 opens the light emitting area and is formed in the remaining areas except the light emitting area. Accordingly, the bank 128 has a bank hole exposing the first electrode 122 corresponding to the emission region. The bank 128 may be made of an inorganic insulating material such as a silicon nitride film (SiNx) or a silicon oxide film (SiOx) or an organic insulating material such as BCB, acrylic resin or imide resin.

The organic light emitting layer 124 is positioned on the first electrode 122 exposed by the bank 128. The organic light emitting layer 124 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. In addition, the organic light emitting layer 124 may be composed of a single light emitting layer structure that emits one light in a single stack, or a multiple stack structure including a plurality of stacks and a single light emitting layer of the same color in each stack. Can be configured. In this case, for displaying various colors, adjacent sub-pixels may be arranged to emit different emission colors. For example, sub-pixels having red, green, and blue emission layers may have a side-by-side or triangular shape. In some cases, an arrangement of white sub-pixels may be added. The other organic light emitting layer 124 may have a stacked structure including a plurality of stacked light emitting layers emitting different colors to express white color. When white is expressed in a stacked structure, a separate color filter may be further added to each sub-pixel.

The second electrode 126 is positioned on the organic emission layer 124. When the display panel 150 is a top emission method, the second electrode 126 is made of a transparent conductive material such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). The formed or formed of a semi-transmissive metal or a metal alloy such as MgAg may emit light generated from the organic light emitting layer 124 to the second electrode 126.

In FIG. 3, the organic light emitting device array 153 is formed by stacking the first electrode 122, the organic light emitting layer 124, and the second electrode 126 on the thin film transistor array 152. In addition to the layered structure, it may be configured to include a capping layer (not shown) on the top. The capping layer protects the organic light emitting diode (OLED) and helps extract light emitted from the second electrode 126.

The organic light emitting device array 153 includes an encapsulation layer 140. The encapsulation layer 140 prevents oxygen and moisture penetration from outside in order to prevent oxidation of the light emitting material and the electrode material. When the organic light emitting diode (OLED) is exposed to moisture or oxygen, a pixel shrinkage phenomenon in which the emission region is reduced may occur, or a dark spot in the emission region may occur. The encapsulation layer 140 is made of glass, metal, aluminum oxide (AlOx), or silicon (Si)-based materials made of inorganic films 142 and 146 and the stress between each layer due to the warp of the display panel 100 It serves as a buffer to mitigate, and is formed in an alternating configuration of the organic layer 144 that enhances the flattening performance. Here, the component of the organic film 144 may be an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon oxycarbon (SiOC). At this time, the first and second inorganic films 142 and 146 block the penetration of moisture and oxygen, and the organic film 144 serves to planarize the surface of the first inorganic film 142. The reason for forming the encapsulation layer as a multi-layered thin film layer is to make the movement path of moisture or oxygen longer and more complicated than the single layer, making it difficult to penetrate moisture/oxygen to the organic light emitting element array 153.

Although not shown, in some cases, a protective layer is further formed between the organic light emitting device (OLED) and the encapsulation layer 140, so that the side surface of the encapsulation layer 140 is peeled or uniform during the manufacturing process of the encapsulation layer 140. The encapsulation layer 140 may be protected from being affected. In some cases, since the encapsulation layer 140 is an essential component for an organic light emitting device (OLED) that is susceptible to moisture, it is also referred to as a configuration of the organic light emitting device array 153. 2 and 3 show the organic light emitting device array 153 in a configuration including the encapsulation layer 140 and the organic light emitting device (OLED).

Meanwhile, the display device 150 of the present invention further includes a touch sensor unit 155 on the organic light emitting element array 153 to recognize a viewer's (user's) touch operation.

The touch sensor unit 155 is arranged to cross each other and has a first touch wire 1154 and a second touch wire 1152b on the same side of which a voltage signal is applied and the other senses a voltage signal. . The first touch wiring 1154 and the second touch wiring are provided with a main pattern 1154e (not shown) patterned in the same shape as a polygon or a circle on the touch insulating layer 1158, and adjacent main patterns are provided. For connection, the first and second bridge patterns 1154b and 1152b are shown on different layers. In the drawing, although the first bridge pattern 1154b is formed directly on the organic light emitting element array 153, the present invention is not limited thereto, and an insulating layer or an insulating substrate is further provided on the organic light emitting element array 153. A first bridge pattern 1154b may be provided on the upper portion. The second bridge pattern 1152b is located on the same layer as the main pattern of the second touch wiring, that is, on the touch insulating layer 1158 and may be integrally formed. In this case, the main pattern 1154e of the first touch wiring 1154 is electrically separated from the second touch wiring.

An adhesive layer (not shown) may be further provided between the cover member 100 and the touch sensor unit 155 to form a bonding state with each other.

On the other hand, for the application of the voltage signal and the sensing of the signal by the touch sensor unit 155, the first flexible film 410 is located at one end of the first touch wiring 1154 and the second touch wiring 1152b. It can be connected to the field (not shown). For example, the touch pads may be located on the same layer as the first bridge pattern 1154b, that is, on the organic light emitting element array 153.

In order to increase the strength and/or rigidity of the display panel 150, one or more support layers 200 may be provided below the substrate 151, that is, on the opposite side of the display surface. The support layer 200 is attached to the opposite side (second side) of the side (first side) where the organic light emitting element is located on both sides of the substrate 151. The support layer 200 is polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethylene ether phthalate (polyethylene ether phthalate), polycarbonate (polycarbonate), polyarylate (polyarylate), poly It may be made of a thin film composed of a combination of polyether imide, polyether sulfonate, polyimide, polyacrylate or other suitable polymer. Other suitable materials that can be used to form the support layer 200 may be thin glass, a metal foil shielded with a dielectric, a multi-layer polymer, a polymer film containing a polymer material combined with nanoparticles or microparticles, and the like. have.

Meanwhile, a metal plate 220 is provided on the rear surface (lower surface) of the support layer 200 that is not in contact with the display panel 150. The metal plate 220 is made of Al or an Al alloy layer or a metal of the Ag or Ag alloy layer, and reflects light falling down the display panel 150 to return to the organic light emitting device (OLED) or absorb light. To prevent the emission of light to the back surface of the metal plate 220.

5 is a perspective view of an enlarged portion of the touch FPC lead-out portion and its surrounding area, and FIG. 6 is a cross-sectional view taken along line II to II' in FIG. 5. FIG. 7 is a perspective view of the cover shield of FIG. 6 viewed from the inside, and FIG. 8 is a perspective view of the display device of the present invention as viewed from the rear side.

First, referring to FIGS. 1 and 5 to 8 to describe the overall shape of the cover shield 300, the cover shield 300 is the surface of the source printed circuit board 250 and the chip-on film 260 connected thereto. ) Spaced apart from the plane 300a covering the first side 330b covering the sides of the plurality of chip-on films 260 and the sides connected to the chip-on film 260 on the source printed circuit board 250. It includes a second side 330c that covers the viewing side. The first side 330b and the second side 330c may have different heights. The first side 330b that covers the chip-on film 260 may have a higher height. Accordingly, as shown in FIG. 6, the plane 300a of the cover shield 300 may be divided into first and second planes 300a1 and 300a2 having a step difference, and a second plane covering the chip-on film 260. The portion 300a2 may have a greater vertical separation distance g from the metal plate 220 than the first flat portion 300a1 that does not overlap the chip-on film 260.

In addition, the second flexible film 520 is provided on the cover shield 300 for connection of the second flexible film 520 between the control printed circuit board 510 and the source printed circuit board 250 located on different layers. The control printed circuit board 510 is provided with a transmissive portion 340 to be folded toward the source printed circuit board 250. A plurality of transmission parts exposing a plurality of driving elements or connectors formed on the surface of the source printed circuit board 250 may be provided.

The transmissive portion 340 is provided in a form in which a part of the area is removed from the plane 300a of the cover shield 300, and the through hole 330 has a first side surface to allow the first flexible film 410 to exit. 300b), the width of the first flexible film 410 in consideration of the width and both margins is removed. The margins of both sides of the first side surface 300b at this time are flows that may occur when the first flexible film 410 is connected to the control printed circuit board 510 or an additional set (not shown) within approximately several mm. It is determined at a level such that it does not contact the first side surface 300b adjacent to the cover shield 300 on the back.

Meanwhile, FIGS. 5 and 6 show a state in which the cover shield 300 is fastened to the rear side of the display panel 150, and the outer surface of the cover shield 300 is observed, and FIG. 6 shows a single cover shield ( 300) as viewed from the inside, and the inside surface of the cover shield 300 is observed.

5 and 6, the first flexible film 410 connected to the touch sensor unit (see 155 of FIG. 2) is pulled out through the through hole 330 of the side of the cover shield 300. In the through hole 330, the side of the chip-on film 260 folded to the lower surface (back) of the display panel 150 is exposed and observed. Corresponding to the chip-on film 260 adjacent to each other observed in the through hole 330, the protrusion 310 is integrally formed with the cover shield 300 in the vertical direction from the inner surface of the plane 300a of the cover shield 300. It is provided. 6 and 7, the protrusion 310 faces the metal plate 220 and may directly face the metal plate 220 and cause noise or scratch, so to avoid this, a cushioning material or double-sided tape 320 may be used. It may be further provided between the metal plate 220 and the protrusion 310. The protrusion 310 and the double-sided tape 320 are vertically spaced between the metal plate 220 and the flat inner surface 300a of the cover shield 300 on the inner surface of the flat shield 300a of the cover shield 300. The gap (g) is supported and the shape of the cover shield 300 is stably maintained even if the cover shield and the flexible film meet, thereby preventing a problem that the shape of the cover shield is changed.

When a cushioning material is provided between the metal plate 220 and the protrusion 310, the material is made of a material such as an elastic rubber or a resin material such as acrylic resin, and in the case of the double-sided tape 320 An adhesive epoxy resin or the like can be used.

As shown in FIG. 6, the protrusion 310 is positioned to be located inside the first side surface 300b of the cover shield 300, and accordingly, the space is located inside the space above the portion where the chip-on film 260 is located. The protrusion 310 is disposed, and may face the metal plate 220 disposed on the rear surface of the display panel 150.

8 is a perspective view of the display device of the present invention as viewed from the rear side.

8, the second flexible film (from the outside of the cover shield 300) so as to be connected to the connector 270 on the source printed circuit board 250 exposed through the transmission portion 340 of the cover shield 300 It can be connected to the control printed circuit board 510 through 520). The control printed circuit board 510 may include a plurality of driving elements and connectors 515 on its surface, and the connector 515 and the second flexible film 520 are connected. In some cases, the control printed circuit board 510 may partially overlap the plane 300a of the cover shield 300, and may be located on the metal plate 220, as shown. The position may be fixed through the tape 530 so as to partially overlap the metal plate 220 or the cover shield 300.

The display device of the present invention is a cover structure for protecting a source printed circuit board, and the cover shield can be molded to prevent interference with adjacent boards and flexible films and is formed of an insulating plastic material, for example, polycarbonate material. . At this time, by forming a vertical protrusion toward the metal plate from the inner surface of the cover shield, the vertical protrusion can stably maintain the vertical spacing between the cover shield and the metal plate, and prevent deformation of the cover shield. Accordingly, the chip-on film width that may occur in the deformation of the cover shield can prevent damage to the display panel and the like. Accordingly, reliability can be improved to prevent display panel cracks or external screen defects that may be caused by deformation of the cover shield.

In addition, by allowing a double-sided tape or a buffer material to be interposed between the vertical protrusion of the cover shield and the metal plate facing each other, it is possible to prevent the noise during the fastening process by applying a fixing force, and the cover shield is determined by the force or stress generated during the fastening process. It is possible to prevent deviation from the position.

The stiffness of the cover structure is improved and complemented to reduce the process jig cost and shorten the process time.

By supplementing the stiffness by changing the structure, it is possible to effectively relieve stress transmission in a structure to which external force is applied, such as a flexible display device, by preventing stress transmission to adjacent components. In the flexible display device, surface bending of the display panel is required, and thus, stress for bending is continuously applied to other components. In this case, stress transmission can be usefully alleviated.

The above-described display device of the present invention can be usefully applied to a device having a surface bend that requires external force in a work process such as attaching and fastening a display portion of an automobile windshield, an instrument panel, or the like.

On the other hand, the present invention described above is not limited to the above-described embodiments and the accompanying drawings, it is possible to various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention, the technical field to which the present invention pertains It will be obvious to those with ordinary knowledge.

100: cover member 150: display panel
151: substrate 152: thin film transistor array
153: organic light emitting element array 155: touch sensor unit
200: support layer 220: metal plate
250: source printed circuit board 260: chip on film
261: pad electrode 300: cover shield
300a: plane 300b: first side
300c: second side 310: protrusion
330: passing hole 340: transmissive part
410: first flexible film 510: control printed circuit board
270, 515: connector 520: second flexible film

Claims (20)

A display panel having a substrate, an array portion, and a touch sensor portion laminated;
A plurality of signal transmission films connected to one side of the array unit and spaced apart from each other at a predetermined distance and folded to a lower surface of the display panel;
A first flexible film connected to one side of the touch sensor unit;
A source printed circuit board connected to the other side of the plurality of signal transmission films on a lower surface of the display panel;
A cover shield having a through hole of the first flexible film and covering the surface and side surfaces of the source printed circuit board on the lower surface of the display panel; And
A display device having a protrusion protruding from an inner surface of the cover shield toward a lower surface of the display panel between signal transmission films spaced apart from each other adjacent to the through hole. According to claim 1,
The cover shield and the projection are integral display devices. According to claim 2,
The display device with the cover shield is a polycarbonate. According to claim 1,
The through hole of the cover shield is located on the side of the cover shield,
A display device in which side portions of two signal transmission films adjacent to each other are exposed through the through hole. The method of claim 4,
The signal transmission film is located inside the passage hole,
A display device having a separation from the signal transmission film and the first flexible film being drawn out of the through hole. According to claim 1,
A display device further comprising a metal plate attached to a lower surface of the display panel. The method of claim 6,
The protrusion is a display device attached to the metal plate through a double-sided tape. According to claim 1,
The cover shield further has a permeable portion,
The first connector on the source printed circuit board, the display device passing the transmission portion in the vertical direction. According to claim 1,
The substrate is a plastic film display device. According to claim 1,
A display device further comprising a core plate and a control printed circuit board outside the surface of the cover shield. The method of claim 10
A display device further comprising a second flexible film interposing the core plate and connecting the control printed circuit board and the source printed circuit board. The method of claim 10,
The protrusion includes a first vertical distance between the cover shield and the core plate and a second vertical distance between the cover shield and the metal plate. According to claim 1,
The display device further includes a cover member positioned on the touch sensor unit to protect the display panel. A display panel having a substrate, an array portion, and a touch sensor portion laminated;
A first flexible film connected to one side of the touch sensor unit;
A cover shield having a through hole of the first flexible film and covering the surface and side surfaces of the source printed circuit board on the lower surface of the display panel; And
A display device having a protrusion protruding from an inner surface of the cover shield adjacent to the through hole toward a lower surface of the display panel. The method of claim 14,
The cover shield and the projection are integral display devices. The method of claim 15,
The display device with the cover shield is a polycarbonate. The method of claim 14,
The through hole of the cover shield is located on the side of the cover shield,
A display device wherein side portions of signal transmission films adjacent to each other connected to the display panel through the through hole are exposed. The method of claim 17,
A display device in which the protrusion is positioned between the signal transmission films adjacent to each other inside the passage hole. The method of claim 17,
A display device having a separation from the signal transmission films and the first flexible film being drawn out of the through hole. The method of claim 14,
A metal plate on a lower surface of the display panel; And
A display device further comprising a double-sided tape between the protrusion and the metal plate.

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