CN110190042A - Bind structure, binding method, display panel and display device - Google Patents
Bind structure, binding method, display panel and display device Download PDFInfo
- Publication number
- CN110190042A CN110190042A CN201910560134.1A CN201910560134A CN110190042A CN 110190042 A CN110190042 A CN 110190042A CN 201910560134 A CN201910560134 A CN 201910560134A CN 110190042 A CN110190042 A CN 110190042A
- Authority
- CN
- China
- Prior art keywords
- binding
- terminal
- conducting
- conducting resinl
- binding part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K59/1275—Electrical connections of the two substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/8322—Applying energy for connecting with energy being in the form of electromagnetic radiation
Abstract
The present invention relates to a kind of binding structure, binding method, display panel and display devices, the binding structure includes the first binding part, the second binding part and UV conducting resinl, and the region of the first binding terminal and the second binding terminal is not provided between the first binding terminal and corresponding second binding terminal and between the first and second binding parts；UV conducting resinl includes uv-curable glue and the conducting particles that is distributed in uv-curable glue；The corresponding path that conducts bound between terminal is provided by conducting particles under effect while UV conducting resinl is configured to the pressure force between ultraviolet light and the first and second binding parts, and insulating bond is formed in the region of no binding terminal by uv-curable glue.Without heating, without high-temperature heat treatment, therefore treatment temperature excessively high the problem of causing terminal contraposition to malfunction of existing anisotropy conductiving glue hot-pressing processing can be reduced or avoided in the production of the binding structure, so be conducive to the realization of the high-res of display panel.
Description
Technical field
The present invention relates to display fields, fill more particularly to a kind of binding structure, binding method, display panel and display
It sets.
Background technique
With the continuous development of virtual reality display technology (virtual reality, VR) and cell phone apparatus, to aobvious
Also in the continuous improvement, PPI numerical value is higher for the requirement of the resolution ratio (Pixels per inch, PPI) of display screen curtain, pixel parsing
Spend higher, that is, image can be shown with higher density by representing display screen, to obtain the thin of higher picture degree of verisimilitude and picture
Greasy degree, to improve user experience.But the resolution of display panel is higher, also means that pixel pitch is narrower, thus to external
More stringent requirements are proposed for the binding of the substrate of driving circuit and display panel.Current binding structure and binding method are unfavorable for showing
Show the realization of the high-res of panel.
Summary of the invention
Based on this, it is necessary to provide binding structure, binding method, display panel and the display dress of a kind of improvement above problem
It sets.
One aspect of the present invention provides a kind of binding structure, comprising:
First binding part has multiple first binding terminals；
Second binding part has and matched multiple second binds terminal one by one with the multiple first binding terminal；And
UV conducting resinl, be set to it is described first binding terminal and it is corresponding it is described second binding terminal between and described first
The region of the first binding terminal and the second binding terminal is not provided between binding part and the second binding part；
Wherein, the UV conducting resinl includes uv-curable glue and the conducting particles that is distributed in the uv-curable glue；
The UV conducting resinl be configured to ultraviolet light and it is described first binding part and it is described second binding part it
Between pressure force while effect under, by the conducting particles provide it is described first binding terminal and corresponding described second
Path is conducted between binding terminal, and by the uv-curable glue in the first binding part and the second binding part
Between do not have bind terminal region formed insulating bond.
On the one hand, there is no the UV conducting resinl in the region of terminal in ultraviolet light and pressure between the first binding part and the second binding part
Nonconducting adhesive layer is formed by curing under acting on while power.And between the first binding terminal and corresponding second binding terminal
UV conducting resinl is since terminal is to the barrier effect of ultraviolet light and under the action of being squeezed, the wherein uv-curable glue of UV conducting resinl
It will not be cured while be expressed into the region of not terminal, and due to not held between the first binding part and the second binding part
The uv-curable glue in region of son solidifies under action of ultraviolet light, so conducting particles therein will not to the first binding part and
There is no the region of terminal mobile between second binding part.Therefore, between the first binding terminal and corresponding second binding terminal
Conducting particles, which is assembled to form conductting layer and provide, conducts path；And first is not provided between the first binding part and the second binding part
The uv-curable glue in the region of binding terminal and the second binding terminal is formed by curing the insulating bond being not turned on.
On the other hand, the binding structure of the display panel, UV conducting resinl are configured to bind in ultraviolet light and first
Effect is lower while pressure force between part and the second binding part forms conductting layer by conducting particles, provides at the first binding end
Path is conducted between sub and corresponding second binding terminal.Conducting particles therein is each to different without being formed with resin compounded
Property conducting particles, as long as ultraviolet light and pressure force effect under will first binding part and second binding part between there is no the area of terminal
The ultra-violet curing adhesive curing in domain, and the uv-curable glue between the first binding terminal and corresponding second binding terminal is to non-terminal
Region squeezes out, and the conducting particles between the first binding terminal and corresponding second binding terminal is assembled to form conductting layer and provide electricity
Guiding path.And collective effect of the production of the binding structure through ultraviolet light and pressure force, without heating without high temperature
Heat treatment, such high temperature process becomes low temperature process, therefore existing anisotropy conductiving glue hot-pressing processing can be reduced or avoided
Treatment temperature excessively high the problem of causing terminal contraposition to malfunction, so be conducive to the realization of the high-res of display panel.
The conducting particles is nano-level conducting particle in one of the embodiments,.
The conducting particles is isotropism or anisotropic conducting particles in one of the embodiments,.
The UV conducting resinl includes the uv-curable glue being mutually mixed and conducting resinl in one of the embodiments,；
Wherein, the conducting particles is contained in the conducting resinl.
The conducting resinl is conductive silver glue in one of the embodiments,.
First binding end is substrate in one of the embodiments, and second binding end is circuit board.
First binding end is substrate in one of the embodiments, and second binding end is chip.
Another aspect of the present invention provides a kind of binding method, for binding the first binding part and the second binding part,
The first binding part has multiple first binding terminals, and the second binding part has and the multiple first binding terminal one
One matched second binding terminal；Include:
The multiple first binding terminal of the first binding part and described second are bound the multiple the second of part
Bind terminal contraposition；Wherein, it is described first binding terminal and it is corresponding it is described second binding terminal between and it is described first binding
The region that the first binding terminal and the second binding terminal are not provided between part and the second binding part is coated with
UV conducting resinl, the UV conducting resinl include uv-curable glue and the conducting particles that is distributed in the uv-curable glue；
The first binding part and the second binding part press and the UV conducting resinl is carried out simultaneously ultraviolet
Photocuring, so that the UV conducting resinl is provided by the conducting particles in the first binding terminal and corresponding described second
Path is conducted between binding terminal, and by the uv-curable glue in the first binding part and the second binding part
Between do not have bind terminal region formed insulating bond.
Another aspect of the present invention provides a kind of display panel, including binding structure described in any of the above embodiments, or
The binding structure that binding method as described in any one of the above embodiments is formed.
Another aspect of the present invention provides a kind of display device, including above-mentioned display panel.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the binding structure of the display panel of an embodiment；
Fig. 2 is the structural schematic diagram of alignment of the binding structure shown in FIG. 1 in binding procedure.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As described in background, the pixel resolution of display panel is higher, and the degree of verisimilitude of picture is higher, picture it is thin
Section will abundanter exquisiteness, user experience also can be better, for example, display panel of the existing OLED technology for VR equipment can be with
The PPI accomplished is 600 or so.Currently, each pixel is by thin film transistor (TFT) (Thin in OLED display panel
FilmTransistor, TFT) driving realizes that image is shown, specifically, pass through every a line grid line in scanning display panel,
And data voltage signal is applied to corresponding pixel by data line, realize that image is shown.
Traditional display panel generally uses external grid-driving integrated circuit (Integrated Circuit, IC) to carry out
Driving, or driven using array substrate driving circuit (Gate Driver on Array, GOA).Since GOA technology will
Gate driving circuit is directly produced in array substrate, and driving one-row pixels are needed using components such as multiple TFT and capacitors,
Circuit design is complex, once component breaks down, entire circuit can not just work, especially for flexible display panels,
Its stability is poor.Therefore it is commonplace at present using external grid-driving integrated circuit driving OLED display panel.
Wherein, the side that external grid-driving integrated circuit generally uses COF (Chip On Film, flip chip) to bind
Formula, or using the mode for directly binding (Chip On Plastic, COP) on flexible substrates.
It is that external gate driving IC is first attached to flexible circuit board (Flexible by taking COF binding mode as an example
Printed Circuit, FPC) on, then the flexible circuit board for being pasted with external gate driving IC is bundled in the base of display panel
On plate.
It is that external gate driving IC is directly bound in the binding area of the substrate of display panel by taking COP binding mode as an example,
Then circuit board (Flexible Printed Circuit, FPC) is reconnected.
Technical staff further study show that, in above two mode, current external gate driving IC is generally used entirely
The one-to-one line of output channel and grid line of the design of pin, i.e., external gate driving IC designs, to pass through gate driving electricity
The output channel on road provides gate drive signal for each grid line.In this way, grid line quantity is then defeated with external gate driving IC
Channel is consistent out, but in the display panel of high-res, pixel density is larger and pel spacing is relatively narrow, the number of corresponding grid line
Amount is consequently increased, and the spacing between grid line (terminal) also reduces therewith.The substrate of external gate driving IC and display panel
Binding electrical connection generally passes through pressure using membranaceous anisotropy conductiving glue (Anisotropic Conductive Films, ACF)
The mode that connects is realized.In the process, the operating temperature of existing anisotropy conductiving glue hot-pressing processing at least 130 DEG C with
On, generally at 200 DEG C or more, external gate driving IC expanded by heating can be extended out at these elevated temperatures, and terminal contraposition is easy to cause to go out
It is wrong.So being directed to the display panel of high-res, cabling quantity is larger and terminal spacing is smaller (grating spacing is small), and use is membranaceous
Anisotropy conductiving glue is unfavorable for the manufacture of high-res display panel.
In addition, flexible base board is generally bound by the way of COF (Chip on film) with external gate driving IC.Because
External gate driving IC is attached to the flip chip formed on flexible circuit board (Flexible Printed Circuit, FPC)
COF is soft materials, not will cause the rupture of line in flexible base board when binding under stress with flexible base board.And flip is thin
Film COF higher cost, and route cannot be done too carefully, therefore cannot correspond to high-resolution products.In addition, for example, by using COP mode
External gate driving IC, is directly bound on flexible substrates by binding by way of hot pressing.Due to external gate driving IC's
Hardness is higher, and in hot pressing, substrate is relatively soft, will cause the end for corresponding to external gate driving IC on the substrate of display panel
It is collapsed at sub- position, forms offset between other regions, the route in substrate is caused open circuit conditions occur.And hot pressing can make
It is raised around the downset areas of flexible base board, it causes the conducting particles in the ACF of binding region to assemble, short circuit phenomenon occurs.
Technical staff has found that the conductive particle size in anisotropy conductiving glue ACF is larger, can not only aggravate terminals of adjacent
Between short circuit, while can also aggravate above-mentioned collapse position conducting particles assemble, increase occur short circuit risk.With
Requirement to the resolution ratio of display screen constantly improves, and the area of binding region is smaller and smaller, in order to avoid conducting particles hair
The risk of raw short circuit, the partial size range of choice of conducting particles is also smaller and smaller, and the type selecting of existing anisotropy conductiving glue ACF
It is extremely complex, so the high-res of display panel are urgent need to solve the problem always.
Specifically, existing anisotropy conductiving glue ACF is in the current minimum grain size of its conducting particles of display panel industry
4 μm or so, which greatly limits the resolution of display panel, technical staff, which analyzes this and is primarily due to existing anisotropy, to be led
Electric glue ACF, which is generally required, is compounded to form the anisotropic conductive particles such as microcapsule-type, Jin Ertong for conducting particles and resin material
The anisotropy of conducting particles is crossed to realize the connection of the terminal of substrate and circuit board.In addition, being limited to existing anisotropy
Conducting resinl ACF needs to carry out high-temperature heat treatment process, and high-temperature heat treatment bring thermally expands so that terminal is inclined in binding procedure
It moves, and then seriously restricts the development of the high-res of display panel.
To solve the above problems, the present invention provides a kind of display panel and its binding structure, can preferably improve on
State problem.Correspondingly, the present invention also provides the production methods of the binding structure, that is, provide a kind of binding method.
Before the present invention is described in detail, some contents in the present invention are explained first, in order to more
Technical solution of the present invention is expressly understood.
(Bonding) electrical connection is bound, refers in the present invention, the route of circuit board and display panel can be conducted
A kind of technological means.
Display area/non-display area: display panel includes the active region for being used to form light-emitting component, and for for
Display provides the peripheral region that the cabling etc. of signal line does not allow to be cut off.For example, a display panel, may include subsequent
It is used to form the display area AA (Active Area, AA) of light-emitting component, can also include being subsequently used for the non-of display panel to show
Show region (region including setting IC and metal lead wire).
By taking COF binding mode as an example, the structure that Fig. 1 shows the binding structure of the display panel of one embodiment of the invention is shown
It is intended to；Fig. 2 shows the structural schematic diagrams of alignment of the binding structure shown in FIG. 1 of the invention in binding procedure.
For ease of description, attached drawing illustrates only structure relevant to the embodiment of the present invention.Below in conjunction with binding method pair
Binding structure is described in detail.
COF binding mode is usually that external gate driving IC is first attached to flexible circuit board (Flexible Printed
Circuit, FPC) on, then the flexible circuit board for being pasted with external gate driving IC is bundled on the substrate of display panel.
Referring to Fig. 1, the present invention provides the binding structure of the display panel 100 of an embodiment, including the first binding part
110, the second binding part 120 and UV conducting resinl 130.
First binding part 110 has multiple first binding terminals 111.
Second binding part 120, which has, matched multiple second binds terminal 121 one by one with multiple first binding terminals 111.
Referring to Fig. 2, multiple first binding terminals 111 of the first binding part 110 are bound multiple the of part 120 with second
The two corresponding contrapositions (as shown in Figure 2) of binding terminal 121；Wherein, the first binding terminal 111 and corresponding second binding terminal 121
Between and the first binding part 110 and the second binding part 120 between be not provided with the first binding terminal 111 and the second binding terminal 121
Region be coated with UV conducting resinl 130.
Wherein, UV conducting resinl 130 includes uv-curable glue 131 and the conducting particles being distributed in uv-curable glue 131
133。
First binding part 110 and the second binding part 120 press and ultraviolet light solidification is carried out to UV conducting resinl simultaneously,
So that UV conducting resinl 130 is between the first binding terminal 111 and corresponding second binding terminal 121 and first binds 110 He of part
The region that the first binding terminal 111 and the second binding terminal 121 are not provided between second binding part 120 is respectively formed conductting layer
132 and the insulating bond 134 that is not turned on.I.e. the conducting particles 133 of UV conducting resinl 130 provides the first binding terminal 111 and right
Path is conducted between the second binding terminal 121 answered, the solidification of uv-curable glue 131 bonding first in UV conducting resinl 130
Part 110 and the second binding part 120 are bound, i.e. UV conducting resinl 130 provides the first binding part 110 and the by uv-curable glue 131
Cohesive force between two binding parts 120.The binding structure of obtained display panel 100 is as shown in Figure 1.
Referring to Fig. 1, conductting layer 132 is located between the first binding terminal 111 and corresponding second binding terminal 121.Please
Refering to fig. 1 and Fig. 2, conductting layer 132 are led by the UV being set between the first binding terminal 111 and corresponding second binding terminal 121
Electric glue 130 is formed under effect while ultraviolet light and the first binding part 110 and second bind the pressure force between part 120.And
Conductting layer 132 provides the first binding terminal 111 and corresponding second binding end by the conducting particles 133 in UV conducting resinl 130
Path is conducted between son 121.
Referring to Fig. 1, insulating bond 134 is located between the first binding part 110 and the second binding part 120.Please refer to Fig. 1
And Fig. 2, insulating bond 134 is by the UV conducting resinl 130 between the first binding part 110 and the second binding part 120 ultraviolet
Effect is lower while pressure force between light and the first binding part 110 and the second binding part 120 forms.And insulating bond 134
Pass through the first binding part 110 of the solidification of uv-curable glue 131 bonding and the second binding part 120 in UV conducting resinl 130.
On the one hand, the UV conducting resinl 130 in the region of terminal is not had to exist between the first binding part 110 and the second binding part 120
Nonconducting insulating bond 134 is formed by curing under acting on while ultraviolet light and pressure.And first binds terminal 111 and corresponds to
Second binding terminal 121 between UV conducting resinl 130 since terminal is to the barrier effect of ultraviolet light and the effect being squeezed
Under, wherein the uv-curable glue 131 of UV conducting resinl 130 will not be cured and be expressed into the region of not terminal, and due to
There is no the uv-curable glue 131 in the region of terminal solid under action of ultraviolet light between first binding part 110 and the second binding part 120
Change, so conducting particles therein 133 will not have the area of terminal between the first binding part 110 and the second binding part 120
Domain is mobile.It is led so the aggregation of conducting particles 133 between the first binding terminal 111 and corresponding second binding terminal 121 is formed
Lead to layer 132 and provide and conducts path；And the first binding terminal is not provided between the first binding part 110 and the second binding part 120
111 and second the uv-curable glue in region of binding terminal 121 be formed by curing insulating bond 134.
On the other hand, the binding structure of the display panel 100, UV conducting resinl 130 are configured in ultraviolet light and
Effect is lower while pressure force between one binding part 110 and the second binding part 120 forms conductting layer by conducting particles 131
132, it provides and conducts path between the first binding terminal 111 and corresponding second binding terminal 121.Conductive particle therein
Son 133 is without forming anisotropic conductive particles with resin compounded, as long as by the first binding under ultraviolet light and pressure force effect
There is no the uv-curable glue 131 in the region of terminal to solidify between part 110 and the second binding part 120, and the first binding 111 He of terminal
Uv-curable glue 131 between corresponding second binding terminal 121 is squeezed out to non-terminal area, the first binding terminal 111 and right
The aggregation of conducting particles 133 between the second binding terminal 121 answered, which forms conductting layer 132 and provides, conducts path.And this is tied up
Collective effect of the production of structure through ultraviolet light and pressure force is determined, without heating without high-temperature heat treatment, such high temperature
Processing procedure becomes low temperature process, therefore the treatment temperature that existing anisotropy conductiving glue hot-pressing processing can be reduced or avoided is excessively high leads
The problem of causing terminal contraposition error, so be conducive to the realization of the high-res of display panel 100.
It should be noted that wherein alignment refer to the first binding terminal 111 and it is corresponding second binding terminal 121 it
Between in contraposition state, the step do not need to first binding part 110 and second binding part 120 apply pressure.It is understood that
In some embodiments, lesser pressure can also be applied, which is far smaller than above-mentioned by the first binding part 110 and the second binding
The pressure that part 120 is pressed.
Therefore technical staff creatively has found, which selects specific UV conducting resinl 130, and by pressing and
Ultraviolet light acts on while solidification, can realize without using anisotropic conductive particles in terminal area conducting and non-terminal
The insulation in region, so the problem of being not necessarily in face of partial size type selecting of the existing anisotropy conductiving glue ACF to conducting particles 133.
That is, conducting particles 133 in the present invention is not by anisotropy conductiving glue ACF to the partial size type selecting of conducting particles 133
Limitation, the binding method have broken generally recognizing for this field " needing to realize specific direction conducting by anisotropic conductive particles "
Know, therefore in some embodiments, conducting particles 133 can be nano-level conducting particle.So compared to 133 partial size of conducting particles
Biggish anisotropy conductiving glue ACF allows greater number of cabling and smaller terminal spacing, and is also avoided that each to different
Property conducting resinl ACF the larger problem for being easy that short circuit occurs with adjacent terminal of 133 partial size of conducting particles, be further conducive to reality
The high-res of existing display panel 100.
As stated above, the conducting particles 133 in the present invention is not by anisotropy conductiving glue ACF to conducting particles 133
Partial size type selecting limitation, conducting particles 133 be not necessarily to and resin compounded formed anisotropic conductive particles, that is to say, that conductive particle
Son 133 can be for without anisotropic conducting particles, such as isotropism conducting particles.Of course it is to be understood that in order to more preferable
Ground makes conducting particles 133 realize the conducting between the first binding terminal 111 and corresponding second binding terminal 121, makes simultaneously
Insulation between two adjacent binding terminals, conducting particles 133 can also be anisotropic conducting particles.
It should be noted that the pressing and ultraviolet light solidification in above-mentioned binding method need to carry out simultaneously.The study found that if first
It carries out ultraviolet light solidification to be pressed again, because the uv-curable glue 131 in UV conducting resinl 130 will lead in solid state
Subsequent pressing step can not be successfully progress；And if first pressed, then terminate pressing after carrying out ultraviolet light solidification again,
Some rebounds are had between the first binding part 110 and the second binding part 120 in the step that ultraviolet light solidifies, cause to cause to solidify
The distance between first binding terminal 111 and corresponding second binding terminal 121 afterwards increase, and then lead to the first binding terminal
Resistance between 111 and corresponding second binding terminal 121 increases.Therefore the step of pressing step and ultraviolet light solidify needs simultaneously
Carry out, pressing step by first binding terminal 111 and it is corresponding second binding terminal 121 between uv-curable glue 131 to
Do not have terminal region squeeze out while, to first binding part 110 and second binding part 120 between uv-curable glue 131 into
The lesser conductting layer 132 of the good resistance of conducting and the good insulating bond 134 that insulate can be made in the solidification of row ultraviolet light.
It is understood that conductting layer 132 and insulating bond 134 are formed in same processing step by UV conducting resinl 130.It is i.e. logical
Crossing one step press and a ultraviolet light solidification can be realized.It is understood that the press equipment that process for pressing uses can wrap in an example
The upper lower cutter head and ultraviolet source for pressing are included, wherein any one cutter head passes through for ultraviolet source.It, can when pressing
First binding part 110 to be laminated and the second binding part 120 are placed between upper lower cutter head, ultraviolet source is passed through from a cutter head
Reach uv-curable glue.Simultaneously make it is close to each other between lower cutter head, by first binding part 110 and second binding part
120 pressings.
It further, is quartzy cutter head for the cutter head that ultraviolet source passes through.In a specific example, lower cutter head be for
The quartzy cutter head that ultraviolet source passes through.To be laminated first can be bound to part 110 when work and the second binding part 120 is placed in and cuts
On head, lower cutter head is played a supporting role, and then declines upper cutter head close to lower cutter head, binds part 110 and second for first
Part 120 is bound to press.
Since conducting particles 133 is not necessarily to form anisotropic conductive particles with resin compounded, as long as pressing under pressure
It closes and squeezes out uv-curable glue 131 therein to non-terminal area, it can be in the first binding terminal 111 and corresponding second binding
It is connected and then provides between terminal 121 and conduct path.That is to say, the present invention binds the UV conducting resinl in structure and binding method
Independent of the anisotropy of conducting particles is arrived, so also not requiring it with paramagnetism, and it is needed only to be capable of conduction
Particle.In some embodiments, conducting particles 133 can be diamagnetism metallic or paramagnetic metal particle.In this hair
In bright, it can also be paramagnetic metal particle that conducting particles 133, which can be diamagnetism metallic,.
In some embodiments, UV conducting resinl 130 is mainly mixed by uv-curable glue 131 and conducting resinl, i.e., it is wrapped
Include the uv-curable glue 131 being mutually mixed and conducting resinl.Contain above-mentioned conducting particles 133 in the conducting resinl.Using ultra-violet curing
Glue 131 and conducting resinl are mixed and made into UV conducting resinl 130, can be conducive to good point of conducting particles 133 in uv-curable glue 131
It dissipates, is uniformly distributed conducting particles 133 wherein.It is understood that the preparation method of UV conducting resinl 130 is without being limited thereto, such as one
In a little examples, it can directly be dispersed conducting particles 133 in ultraviolet cured adhesive by adding dispersing agent.
Further, conducting resinl is conductive silver glue.It is readily appreciated that, generally, conductive silver glue is mainly by resin matrix, leads
Charged particle 133 and dispersing additive composition；Wherein, conducting particles 133 can be gold, silver, copper, aluminium, zinc, iron, the powder of nickel, graphite
And at least one of some conductive compounds.In some embodiments of the invention, the conducting particles 133 in conductive silver glue is
Nanoscale.
Specifically, in a specific example, the conducting particles 133 in conductive silver glue is nano silver particles.
Further, uv-curable glue 131, can be ultraviolet mainly including photoinitiator, reactive diluent and prepolymer
Solidify under the action of light, and then realizes the binding connection of non-terminal area.
Specifically, the embodiment of above-mentioned Fig. 1 and Fig. 2 is using COF binding technique, further, the first binding part 110
For substrate, the second binding part 120 is circuit board.In some instances, circuit board is flexible circuit board or flip chip.
Flip chip are formed that is, first external gate driving IC can be integrated on flexible circuit board, then using upper
It states binding method and passes through UV conducting resinl 130 while pressing and ultraviolet light solidification under effect, by the flexible electrical in flip chip
Road plate and substrate are bound, and then realize the binding of flip chip and substrate.
Further, substrate is flexible base board.After the above-mentioned formation flip chip the step of and before binding step,
It further comprises the steps of: and the flexible circuit board in flip chip is bent to the screen back side (surface opposite where substrate and display area
Surface).It so bends and then cured together in pressing and ultraviolet light by UV conducting resinl 130 using above-mentioned binding method
Under Shi Zuoyong, flexible circuit board and substrate are bound, and then realize the binding of flip chip and substrate.
Specifically, the material of flexible circuit board can be polyimides or polyester film.
It is understood that above-mentioned binding method is not limited to COF binding technique, it is also applied for COP binding technique.That is it is not
The binding being only applicable between substrate and circuit board is equally applicable to tying up between substrate and external gate driving IC (i.e. chip)
It is fixed.I.e. first binding part 110 is substrate, and the second binding part 120 is chip.Similar, external gate driving IC (i.e. chip)
With multiple second binding terminals, matched with multiple first binding terminal one-to-one correspondence of substrate.It is understood that the first binding part
110 and second binding part 120 be also not necessarily limited to this, be applicable in the similar structures of binding in need.
It the difference is that, is direct with COF binding technique when above-mentioned binding method is suitable for COP binding technique
External gate driving IC is acted on while pressing and ultraviolet light solidify using above-mentioned binding method by UV conducting resinl 130
Under, external gate driving IC and substrate are bound.Then circuit board is reconnected.
Further, substrate is flexible base board.After binding step, before connecting circuit board, further comprising the steps of: will collect
It is bent to the screen back side (surface of surface opposite where substrate and display area) at the substrate for having external gate driving IC, so that
The circuit board of the substrate and the screen back side that are integrated with external gate driving IC, which is realized, to be connected.
Correspondingly, the present invention also provides the display device in an embodiment, which can be aobvious for virtual reality
Show technology (virtual reality, VR), mobile phone, tablet computer, television set, display, laptop, Digital Frame, vehicle
Carry any products or components having a display function such as equipment, wearable device or internet of things equipment.
The display device includes above-mentioned display panel 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of binding structure characterized by comprising
First binding part has multiple first binding terminals；
Second binding part has and matched multiple second binds terminal one by one with the multiple first binding terminal；And
UV conducting resinl is set between the first binding terminal and the corresponding second binding terminal and described first binds
The region of the first binding terminal and the second binding terminal is not provided between part and the second binding part；
Wherein, the UV conducting resinl includes uv-curable glue and the conducting particles that is distributed in the uv-curable glue；
The UV conducting resinl is configured between ultraviolet light and the first binding part and the second binding part
Under being acted on while pressure force, provided by the conducting particles in the first binding terminal and corresponding second binding
Path is conducted between terminal, and through the uv-curable glue between the first binding part and the second binding part
The region for not binding terminal forms insulating bond.
2. binding structure according to claim 1, which is characterized in that the conducting particles is nano-level conducting particle.
3. binding structure according to claim 1, which is characterized in that the conducting particles is isotropism or anisotropy
Conducting particles.
4. described in any item binding structures according to claim 1~3, which is characterized in that the UV conducting resinl includes mutually mixed
The uv-curable glue and conducting resinl closed；
Wherein, the conducting particles is contained in the conducting resinl.
5. binding structure according to claim 4, which is characterized in that the conducting resinl is conductive silver glue.
6. binding structure according to claim 1, which is characterized in that first binding end is substrate, and described second ties up
Fixed end is circuit board.
7. binding structure according to claim 1, which is characterized in that first binding end is substrate, and described second ties up
Fixed end is chip.
8. a kind of binding method, for binding the first binding part and the second binding part, the first binding part has multiple first
Terminal is bound, the second binding part, which has, matched second binds terminal one by one with the multiple first binding terminal；It is special
Sign is, comprising:
By the multiple second binding of the multiple first binding terminal of the first binding part and the second binding part
Terminal contraposition；Wherein, it is described first binding terminal and it is corresponding it is described second binding terminal between and it is described first binding part and
The region that the first binding terminal and the second binding terminal are not provided between the second binding part is coated with UV and leads
Electric glue, the UV conducting resinl include uv-curable glue and the conducting particles that is distributed in the uv-curable glue；
The first binding part and the second binding part press and UV light is carried out to the UV conducting resinl simultaneously
Change, so that the UV conducting resinl is provided by the conducting particles in the first binding terminal and corresponding second binding
Path is conducted between terminal, and through the uv-curable glue between the first binding part and the second binding part
The region for not binding terminal forms insulating bond.
9. a kind of display panel, which is characterized in that including binding structure as described in any one of claims 1 to 7, or such as right
It is required that the binding structure that binding method described in 8 is formed.
10. a kind of display device, which is characterized in that including display panel as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560134.1A CN110190042A (en) | 2019-06-26 | 2019-06-26 | Bind structure, binding method, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910560134.1A CN110190042A (en) | 2019-06-26 | 2019-06-26 | Bind structure, binding method, display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110190042A true CN110190042A (en) | 2019-08-30 |
Family
ID=67723511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910560134.1A Pending CN110190042A (en) | 2019-06-26 | 2019-06-26 | Bind structure, binding method, display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110190042A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544434A (en) * | 2019-09-04 | 2019-12-06 | 云谷（固安）科技有限公司 | display panel, manufacturing method thereof and display device |
| CN110580855A (en) * | 2019-09-17 | 2019-12-17 | 合肥鑫晟光电科技有限公司 | Chip on film, chip on film substrate, manufacturing method thereof and display device |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN113534511A (en) * | 2021-07-30 | 2021-10-22 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN114078945A (en) * | 2021-11-16 | 2022-02-22 | 合肥维信诺科技有限公司 | Bonding structure and display device |
| CN114143986A (en) * | 2021-11-24 | 2022-03-04 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
| CN114170925A (en) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5223965A (en) * | 1991-07-23 | 1993-06-29 | Ricoh Company, Ltd. | Electrode connecting device of liquid crystal display element having a protecting film for absorbing stress applied to the electrode at a thermal press-fixing time |
| JPH07106369A (en) * | 1993-10-05 | 1995-04-21 | Matsushita Electric Ind Co Ltd | Connection of electrode |
| CN1316481A (en) * | 2000-02-22 | 2001-10-10 | 索尼化学株式会社 | Sealing material |
| CN1348976A (en) * | 2000-10-16 | 2002-05-15 | 索尼化学株式会社 | Binder and adhesive film |
| CN102550135A (en) * | 2009-07-24 | 2012-07-04 | 汉高公司 | Method for connecting electrodes and connection composition used therefor |
| CN202399615U (en) * | 2011-12-27 | 2012-08-29 | 天马微电子股份有限公司 | Laminating device for display panel |
| CN204215117U (en) * | 2014-12-02 | 2015-03-18 | 昆山国显光电有限公司 | Display device |
| CN108753177A (en) * | 2018-05-23 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | A kind of conducting resinl, the manufacturing method of display panel, display panel and display device |
-
2019
- 2019-06-26 CN CN201910560134.1A patent/CN110190042A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5223965A (en) * | 1991-07-23 | 1993-06-29 | Ricoh Company, Ltd. | Electrode connecting device of liquid crystal display element having a protecting film for absorbing stress applied to the electrode at a thermal press-fixing time |
| JPH07106369A (en) * | 1993-10-05 | 1995-04-21 | Matsushita Electric Ind Co Ltd | Connection of electrode |
| CN1316481A (en) * | 2000-02-22 | 2001-10-10 | 索尼化学株式会社 | Sealing material |
| CN1348976A (en) * | 2000-10-16 | 2002-05-15 | 索尼化学株式会社 | Binder and adhesive film |
| CN102550135A (en) * | 2009-07-24 | 2012-07-04 | 汉高公司 | Method for connecting electrodes and connection composition used therefor |
| CN202399615U (en) * | 2011-12-27 | 2012-08-29 | 天马微电子股份有限公司 | Laminating device for display panel |
| CN204215117U (en) * | 2014-12-02 | 2015-03-18 | 昆山国显光电有限公司 | Display device |
| CN108753177A (en) * | 2018-05-23 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | A kind of conducting resinl, the manufacturing method of display panel, display panel and display device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544434A (en) * | 2019-09-04 | 2019-12-06 | 云谷（固安）科技有限公司 | display panel, manufacturing method thereof and display device |
| CN110580855A (en) * | 2019-09-17 | 2019-12-17 | 合肥鑫晟光电科技有限公司 | Chip on film, chip on film substrate, manufacturing method thereof and display device |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN113534511A (en) * | 2021-07-30 | 2021-10-22 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN113534511B (en) * | 2021-07-30 | 2024-02-06 | Tcl华星光电技术有限公司 | Binding structure, manufacturing method thereof and display device |
| CN114078945A (en) * | 2021-11-16 | 2022-02-22 | 合肥维信诺科技有限公司 | Bonding structure and display device |
| CN114143986A (en) * | 2021-11-24 | 2022-03-04 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
| CN114170925A (en) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110190042A (en) | Bind structure, binding method, display panel and display device | |
| US10756119B2 (en) | Display device and method for manufacturing same | |
| US8980043B2 (en) | Anisotropic conductive film, joined structure and method for producing the joined structure | |
| CN108957878A (en) | Display module and preparation method thereof and display device | |
| WO2021022642A1 (en) | Bonding structure and manufacturing method therefor and display panel | |
| KR102386367B1 (en) | Connection body, connection body production method, connection method, anisotropic conductive adhesive | |
| WO2014034102A1 (en) | Display device and method for producing same | |
| CN107393895A (en) | Display device | |
| JP5685473B2 (en) | Anisotropic conductive film, method for manufacturing bonded body, and bonded body | |
| JP6324746B2 (en) | Connection body, method for manufacturing connection body, electronic device | |
| KR102639862B1 (en) | Connection body and connection body production method | |
| DE112015002027T5 (en) | Method for bonding flexible printed circuit boards | |
| WO2013129437A1 (en) | Method for manufacturing connection element, and anisotropic electroconductive adhesive | |
| JP7096210B2 (en) | Connections, manufacturing methods for connections, connection methods for electronic components, and electronic components | |
| TW201432017A (en) | Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method | |
| CN106502006B (en) | A kind of modified sealant, display panel and preparation method thereof | |
| CN106318244A (en) | Nuclear layer technology anisotropic conductive film | |
| CN209328538U (en) | Anisotropic conductive film structure | |
| KR20170120478A (en) | Display device and fabrication method for the same | |
| KR102047225B1 (en) | non-conductive type adhesive means and display device using the same | |
| CN114170925A (en) | Display module and manufacturing method thereof | |
| JP2003045236A (en) | Anisotropy conductive film and connection method of integrated circuit device | |
| JP2017182709A (en) | Anisotropic conductive connection structure | |
| TWI331887B (en) | Eletrical connecting structure and method | |
| JP2005122078A (en) | Liquid crystal display and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20190830 Assignee: BAZHOU YUNGU ELECTRONIC TECHNOLOGY Co.,Ltd.|KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER Co.,Ltd.|KUNSHAN GO-VISIONOX OPTO-ELECTRONICS Co.,Ltd. Assignor: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd. Contract record no.: X2019990000155 Denomination of invention: Bind structure, binding method, display panel and display device License type: Common License Record date: 20191030 |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20191206 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Applicant after: Guangzhou Guoxian Technology Co.,Ltd. Address before: 065500 Hebei Langfang County Guan emerging industry demonstration area Applicant before: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190830 |