JPH07106369A - Connection of electrode - Google Patents

Abstract

PURPOSE:To provide a method of improving the reliability of connection of an electrode without leaving a photosetting resin between the electrode and a lead. CONSTITUTION:An electrode 2 and a lead 4 are connected to each other while a photo-setting resin 3 interposing between the electrode and the lead on the center part 7 of the electrode 2 is efficiently extruded by using a projected pressing jig 5 provided with a pressing surface 6 having a constant curvature 9. Thereby, as a bonding agent between the electrode 2 and the lead 4 is extruded, the continuity failure between the electrode and the lead due to a residual bonding agent of the bonding agent is prevented form being generated and the reliability of connection of the electrode is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting electrodes in high-density, thin, and small-sized packaging of semiconductor elements and the like.

[0002]

2. Description of the Related Art As home appliances, industrial equipment, etc. are made smaller, thinner, and portable, it is necessary to make semiconductor devices, electronic parts, etc. smaller and thinner.
Electrodes for semiconductor elements, electronic parts, etc., or electrodes taken out as external terminals via flexible leads,
The general technology for connecting electrodes such as wiring boards is
Examples of methods include solder joining, joining with conductive rubber, and pressure welding with anisotropic conductive rubber. However, these methods have problems in that heating is required in the connection step, pretreatment of the electrodes is required, and that fine pitch electrodes cannot be used.

The electrode connection technology using a photo-curable resin described below solves all of the above problems. This technology is extremely simple, and has the features that it does not require heating in the connection process, does not require pretreatment of the electrodes, and can be used for fine pitch electrodes.

A conventional process for connecting electrodes using a photocurable resin will be described below with reference to the drawings. First, as shown in FIG. 5A, a photocurable resin 53 is applied to the electrode 52 of the substrate 51, and the lead 54 and the electrode 52 of the substrate 51 are aligned with each other.

The photo-curable resin 53 is insulative and is made of an ultraviolet-curable epoxy, silicone, acrylic resin or the like.
When the substrate 51 is a semiconductor element, the electrode 52 is made of Al or the like and has a size of 30 to 150 μm and a thickness of 0.5 to 1 μm.
Is. At this time, the lead 54 is formed by etching Cu on the film carrier and performing Sn plating, Au plating, or the like.

Alternatively, when the substrate 51 is an El and a liquid crystal display panel, a conductive film such as SnO 2 or ITO is formed on the electrode 52. The leads 54 at this time are formed by forming a Cu foil pattern on a polyimide film or a glass epoxy film.

Alternatively, the substrate 51 is a general electronic component, and solder plating, A
It can also be applied when u plating or the like is formed.

Next, as shown in FIG. 5B, the lead 54 is mounted on the electrode 52 of the substrate. At this time, the photocurable resin 53 is interposed between the lead 54 and the electrode 52 of the substrate 51.

Next, as shown in FIG. 5C, the lead 54 is pressed by the pressure jig 55 and the lead 54 and the electrode 52 of the substrate 51.
Press and. The photo-curable resin 53 interposed between the lead 54 and the electrode 52 is pushed out by the pressing force,
And the electrode 52 are electrically connected. The pressing surface 56 of the pressing jig 55 used here is made flat. The surface of the pressure jig 55 is coated with Teflon so that the photo-curable resin 53 does not adhere to the pressure jig 55.

Next, as shown in FIG. 5D, the photocurable resin 53
The resin 53 is cured by irradiating it with ultraviolet rays.

Next, as shown in FIG. 5 (e), the pressure is removed to complete the joining. Even if the pressure is removed, the lead 54 and the electrode 52 of the substrate 51 are cured because the photocurable resin 53 is cured.
Are pressed together and an electrical connection is obtained.

[0012]

However, the above-mentioned structure has the following problems.

As shown in FIG. 6A, the lead 54 is pressed by using a pressing jig 55 having a flat pressing surface 56. At this time, as shown in FIG. 6B, the lead 54 is simultaneously pressed into contact with the central portion 57 of the electrode 52 and the end portion 58 of the electrode 52. Therefore, the lead 54 and the end portion 5 of the electrode 52 as shown in FIG.
The photo-curable resin 53 between 8 is extruded, but the lead 5
The photo-curable resin 53 between the electrode 4 and the central portion 57 of the electrode 52 remains without being extruded. Since the photocurable resin 53 is insulative, there is a problem that this causes a connection failure.

In view of the above problems, the present invention provides a connection method in which the photocurable resin 53 does not remain between the lead 54 and the electrode 52.

[0015]

According to the present invention, a photocurable resin is interposed between or near an electrode on a first substrate or an electrode protruding from a first substrate and an electrode on a second substrate. Then, the electrode on the first substrate or the electrode protruding from the first substrate is pressed by a pressure jig whose pressing surface is a convex shape having a constant curvature, and the electrode on the first substrate or the It is intended to provide a method for connecting electrodes, which is characterized in that an electrode protruding from a first substrate and an electrode on the second substrate are brought into pressure contact with each other to photo-cur the photo-curable resin.

[0016]

According to the present invention, in the connecting step, the convex pressing jig whose pressing surface has a constant curvature is used. for that reason,
First, the portion of the lead corresponding to the central portion of the electrode is pressed. At that time, the photocurable resin between the leads and the central portion of the electrode is pushed out by the pressing force. Then, the portion of the lead corresponding to the end of the electrode is pressed, and the photocurable resin between the lead and the end of the electrode is pushed out by the pressing force. Therefore, the photo-curable resin between the lead and the electrode is efficiently extruded, does not remain, and high connection reliability is obtained.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

First, as shown in FIG. 1A, a photocurable resin 3 is applied to the electrode 2 of the substrate 1, and the lead 4 and the electrode 2 of the substrate 1 are aligned with each other.

The photocurable resin 3 is insulative, and is made of ultraviolet curable epoxy, silicone, acrylic resin or the like. When the substrate 1 is a semiconductor element, the electrode 2 is Al or the like,
The dimensions are 30 to 150 μm and the thickness is 0.5 to 1 μm. At this time, the lead 4 is formed by etching Cu on the film carrier and performing Sn plating, Au plating, or the like.

Alternatively, when the substrate 1 is El and a liquid crystal display panel, a conductive film such as SnO 2 or ITO is formed on the electrode 2. At this time, the lead 4 is formed by forming a Cu foil pattern on a polyimide film or a glass epoxy film. Alternatively, it is also applicable when the substrate 1 is a general electronic component and both the electrode 2 and the lead 4 are formed with solder plating, Au plating, or the like.

Next, as shown in FIG. 1B, the lead 4 is mounted on the electrode 2 of the substrate. At this time, the photocurable resin 3 is interposed between the lead 4 and the electrode 2 of the substrate 1.

Next, as shown in FIG. 1C, the lead 4 is pressed by the pressure jig 5 to press the lead 4 and the electrode 2 of the substrate 1 into pressure contact with each other. The photocurable resin 3 interposed between the lead 4 and the electrode 2 is
The lead 4 and the electrode 2 are pushed out by the pressing force and are electrically connected. Pressure surface 6 of pressure jig 5 used here
Is a convex shape having a constant curvature 9 unlike the conventional one. The surface of the pressure jig 5 is coated with Teflon so that the photocurable resin 3 does not adhere to the pressure jig 5.

Next, as shown in FIG. 1D, the photocurable resin 3 is irradiated with ultraviolet rays to be cured. Next, as shown in FIG. 1 (e), the pressure is removed to complete the joining. Even if the pressure is removed, the lead 4 and the electrode 2 of the substrate 1 are pressed against each other because the photo-curable resin 3 is cured, and an electrical connection is obtained.

The curved surface 9 of the pressing surface 6 has a two-dimensional curved surface 9 (that is, a part of a cylindrical surface) as shown in FIG.
A three-dimensional curved surface 9 (that is, a part of a spherical surface) as shown in (b)
There is. The pressure jig 5 having the two-dimensional curved surface 9 is suitable when the pressure area 10 of the lead 4 shown by the hatched portion is rectangular,
The pressing jig 5 having the three-dimensional curved surface 9 is suitable when the pressing area 10 of the lead 4 is substantially square or circular.

A method of designing the curved surface 9 of the pressing surface 6 will be described with reference to FIG. If the width of the lead 4 to be pressed is L and the lead 4 corresponding to the central portion 7 of the electrode 2 is pressed by the thickness D earlier than the lead 4 corresponding to the end 8 of the electrode 2, the pressing surface The curvature R of the curved surface 9 of 6 can be designed by R = D / 2 + L ² / (8D). The thickness D is set so that the lead 4 or the electrode 2 of the substrate 1 is deformed when the lead 4 is pressed to absorb the shape of the curved surface 9 of the pressing surface 6. This is because if the shape of the curved surface 9 is not absorbed, the lead 4 and the electrode 2
This is because there is a gap between the two and the photocurable resin 3 remains there.

The effect of using this embodiment will be described. As shown in FIG. 4A, the pressing surface 6 of the pressing jig 5 has a constant curved surface 9
Since it has a convex shape with, when pressure is applied as shown in FIG.
The part of the lead 4 corresponding to the central part 7 of the electrode 2 is first pressed. At that time, the photocurable resin 3 between the lead 4 and the central portion 7 of the electrode 2 is pushed out by the pressing force.

Next, as shown in FIG. 3C, the portion of the lead 4 corresponding to the end 8 of the electrode 2 is pressed, and the photocurable resin 3 between the lead 4 and the end 8 of the electrode 2 is pressed. Is pushed out by. For this reason, the photocurable resin 3 between the lead 4 and the electrode 2 is efficiently extruded, does not remain, and high connection reliability is obtained. As described above, the conventional problems are solved.

[0028]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, in the connecting step, the pressurizing jig 5 has a convex surface 6 having a constant curved surface 9.
Is used. Therefore, first, the portion of the lead 4 corresponding to the central portion 7 of the electrode 2 is pressed. Then lead 4
The photocurable resin 3 between the center part 7 of the electrode 2 and the electrode 2 is extruded by the pressing force. Then, the portion of the lead 4 corresponding to the end portion 8 of the electrode 2 is pressed, and the photocurable resin 3 between the lead 4 and the end portion 8 of the electrode 2 is extruded by the pressing force. For this reason, the photocurable resin 3 between the lead 4 and the electrode 2 is efficiently extruded, does not remain, and high connection reliability is obtained.

[Brief description of drawings]

FIG. 1 is a process drawing of an embodiment of an electrode joining method of the present invention.

FIG. 2 is an explanatory view of the shape of the pressing surface of the pressing jig used in the process of the embodiment.

FIG. 3 is an explanatory view of a method for designing the shape of the pressing surface of the pressing jig used in the process of the embodiment.

FIG. 4 is an explanatory diagram of the effect of the present invention.

FIG. 5 is a process diagram showing a conventional electrode joining method.

FIG. 6 is an explanatory view of problems in the conventional process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 substrate 2 electrode 3 photocurable resin 4 lead 5 pressing jig 6 pressing surface 7 central part of electrode 2 8 end part of electrode 2 curvature of curved surface (R) 10 pressing region 51 substrate of conventional example 52 conventional example Electrode 53 Conventional photocurable resin 54 Conventional example lead 55 Conventional example pressing jig 56 Conventional example pressing surface 57 Central portion of conventional electrode 52 58 End portion of conventional example electrode 52

Claims (1)

[Claims] 1. A photocurable resin is interposed between or near an electrode on a first substrate or an electrode protruding from a first substrate and an electrode on a second substrate to form a light-curable resin on the first substrate. Electrode or the electrode protruding from the first substrate and the second electrode
The step of aligning the electrodes on the substrate, pressing the electrodes on the first substrate or the electrodes protruding from the first substrate with a pressing jig whose pressing surface has a convex shape having a constant curvature, An electrode comprising a step of press-contacting an electrode on a first substrate or an electrode protruding from the first substrate with an electrode on the second substrate, and a step of photocuring the photocurable resin. Connection method.