JPH07302973A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To provide a manufacturing method in which a conductive member on a flexible wiring board and an electrode formed on a board can be pressure- welded and connected by a photohardening adhesive resin. CONSTITUTION:A conductive member 5 and a cover film 3 are laminated on a flexible and UV-transmitting base film 2 so as to constitute a flexible wiring board 1. Tip parts of the conductive member are not covered with the cover film 3 so as to form exposed leads 6. The leads 6 are aligned with electrodes 8, and the leads 6 and the electrodes 8 are pressure-welded by using a UV- transmitting pressurization jig 10. A photohardening adhesive resin 9 which is provided with a volume compression function is filled between both boards, the photohardening adhesive resin 9 is irradiated with ultraviolet rays which have been transmitted through the pressurization jig 10 and the base film 2 so as to be hardened, and a connection state between the leads and the electrodes is intensified by a volume compression force. Since the leads and the electrodes can be connected at room temperature, the flexible board 1 can be made low-cost, and the use of the flexible board 1 can be expanded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a conductive member of a wiring board and an electrode of an electronic component mounted on a printed board or the like.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and portability of home electric appliances and industrial equipment, it has become necessary to mount electronic parts and the like at high density.

Here, generally, as a method for connecting electrodes of various substrates, there are solder bonding, connection using conductive rubber, pressure contact connection using an anisotropic conductive sheet, and the like.

The conventional soldering and pressure contact using an anisotropic conductive sheet will be described below by taking as an example the process of connecting a conductive member of a flexible wiring board and an electrode of a printed board on which electronic components and the like are mounted.

FIG. 13 is a sectional view showing a connection state between a conductive member of a flexible board and an electrode of a printed board by pressure contact connection using a conventional thermosetting resin having a volume contracting function. FIG. 14b is a cross-sectional view showing a soldering connection and a pressure contact connection using an anisotropic conductive sheet among the electrode connection methods.

As shown in FIG. 13, a flexible wiring board 1 is provided with a conductive member (not shown) on a flexible base film 2 via a first adhesive layer 4a, and an electrode member. The cover film 3 is provided on the above with the second adhesive layer 4b interposed therebetween, and is formed by laminating a total of five layers of members. Although not shown, the flexible wiring board 1
The part of the conductive member which is not covered by the cover film 3 is the lead part, and after the lead part and the electrode of the printed circuit board 7 are aligned with each other, they are pressure-contacted to each other, and then the flexible conductive member. A method in which a resin having a volume contracting function is filled between the printed circuit board 1 and the printed circuit board 7 to form a cured resin layer 9, and the contracting force strengthens the mechanical connection between the boards and the electrical connection between the electrodes. Is.

In the soldering method, as shown in FIG. 14a, the lead portion 6 of the flexible wiring board 1 and the electrode 8 on the printed board 7 are aligned with each other, and a soldering bonding layer 26 is formed between them. Thus, the mechanical connection between the substrates and the electrical connection between the conductive member and the electrode are simultaneously performed. Usually, copper whose surface is plated with solder is used as the lead 6.

In the pressure contact connection method using the anisotropic conductive sheet, as shown in FIG. 14b, the lead portion 6 of the flexible wiring board 1 and the electrode 8 of the printed circuit board 7 are aligned with each other, and the anisotropic conductive sheet is interposed therebetween. The flexible wiring board 1 is pressed and heated with the interposition of the above to form the adhesive layer 27, and the boards are connected to each other, and at the same time, the conductive member and the electrode are formed through the conductive particles 28 in the anisotropic conductive sheet. And are electrically connected.

[0009]

However, each of the above-mentioned conventional connection methods has the following problems.

In the case of the connection method using the volume shrinkage force of the thermosetting resin, the connection requires heating, so that the flexible wiring board 1 must have heat resistance. Therefore, it is necessary to use polyimide for the cover film 2 and the base film 3, which causes a problem of high material cost.

In the case of the soldering method, a flux cleaning step is necessary and since lead is used,
The impact on the global environment and the human body has become a problem. in addition,
Since the strength of soldering itself is small, sufficient connection strength cannot be obtained between the flexible wiring board 1 and the printed board 7. Further, since the solder needs to be heated, there is a problem that the material cost is high as described above.

In the case of the connection method using the anisotropic conductive sheet,
Since the anisotropic conductive sheet is supplied in the form of a sheet, there is a problem that a fillet having a high adhesive force cannot be produced.
Therefore, the peeling resistance between the adhesive layer 27 of the anisotropic conductive sheet and the flexible wiring board 1 and the printed circuit board 7 is small, and sufficient connection strength is obtained between the flexible circuit board 1 and the printed circuit board 7. I can't. Further, since it is necessary to heat the anisotropic conductive sheet, there is a problem that the material cost becomes high as described above.

On the other hand, as disclosed in, for example, Japanese Patent Application Laid-Open No. 4-82240, in the step of connecting the electrodes of the two substrates, one substrate is placed on a stage made of a material capable of transmitting ultraviolet rays. Then, the other substrate is placed above it with the electrodes of both electrodes aligned, and the photo-curable adhesive resin filled between the two substrates is irradiated with ultraviolet rays from below to connect the two substrates at room temperature. There is something.

However, in the above publication, the lower substrate is limited to the one having the transparency of ultraviolet rays, so that there is a problem that the use is limited.

The present invention has been made in view of the above problems, and an object thereof is that the substrate on which an electrode, which is a counterpart of the conductive member of the flexible substrate, is mounted has ultraviolet ray transparency. Even if it is not, by making it possible to connect at room temperature with a photo-curable adhesive resin, there is no flux cleaning step or the use of lead, and the connection strength between both boards is high.
And a method for manufacturing a versatile electronic component is provided.

[0016]

In order to achieve the above-mentioned object, the means taken by the invention of claim 1 is such that the base member is formed on the surface of the base member made of a material having ultraviolet ray transparency and flexibility. A conductive member that extends along the conductive member and a flexible cover member that covers a part of the conductive member are laminated, and the main body part in which the three members are laminated and the cover member of the conductive member are covered. An electronic device that prepares in advance a flexible first substrate configured so that the exposed portion without being exposed becomes a lead portion and connects the lead portion on the first substrate to an electrode of a second substrate on which an element or the like is mounted. As a method of manufacturing a component, the first step of mounting the second substrate on a stage with the surface on which the electrode is formed facing upward, and the first step
Positioning the second step of adhering a photo-curable adhesive resin having volumetric shrinkage to at least one of the substrate and the second substrate, the lead portion on the first substrate and the electrode of the second substrate. In addition, a third step of stacking the first substrate on the second substrate in combination, and a pressing jig which is made of a material capable of transmitting ultraviolet rays and has a tip functioning as a pressing surface are used. A fourth step of pressing the substrate to press the lead portion of the first substrate and the electrode of the second substrate into contact with each other, the pressure jig, and the base member of the first substrate to pass therethrough. A fifth step of irradiating the photocurable adhesive resin with ultraviolet rays.

The measure taken by the invention of claim 2 is as follows:
In the invention described above, the second step is performed after the fourth step, and in the second step, the photo-curing property is applied to the periphery of the lead portion of the first substrate and the electrode of the second substrate, which are in pressure contact with each other. This is a method of filling an adhesive resin.

The means taken by the invention of claim 3 is as follows:
Alternatively, in the second aspect of the invention, it is a method of using the first substrate having a lead portion which is pre-pressurized and plastically deformed so that the height from the surface of the base member is substantially uniform.

The means taken by the invention of claim 4 is as follows:
Alternatively, in the fourth aspect of the invention, in the fourth step, at least one side surface and a direction in which ultraviolet rays travel inside the pressing jig are inclined at substantially the same angle with respect to a normal line direction of the pressing surface. It is a method of using a pressure jig configured as described above.

The means taken by the invention of claim 5 is as follows:
Alternatively, in the second aspect of the present invention, the fourth step is a method of using a pressing jig which is composed of a large number of optical fibers bundled with each other, and the tip end surface of each optical fiber is a pressing surface.

The means taken by the invention of claim 6 is as follows.
In the fourth step, in the fourth step, a pressing jig configured such that the direction of the optical axis of the optical fiber is inclined by a predetermined angle with respect to the normal direction of the pressing surface of the pressing jig is provided. This is the method used.

The means taken by the invention of claim 7 is as follows:
Alternatively, in the second aspect of the invention, there is provided a method of using the first substrate in which at least one groove extending from the tip end surface of the lead portion in parallel with the side surface of the conductive member is formed at the tip end portion of the lead portion.

The means taken by the invention of claim 8 is as follows.
In the invention, the method of using the first substrate in which the width of the groove is smaller than the width of the remaining lead portion.

The means taken by the invention of claim 9 is as follows:
Or a method of performing the above steps between the lead portions of the first substrate and the electrodes of the plurality of second substrates by preparing a first substrate having a plurality of lead portions. is there.

According to a tenth aspect of the present invention, in the first or second aspect of the invention, an opening is provided in a portion of the stage below the electrode, and a high pressure gas connected to the opening is provided. A tank is provided, and in the fourth step, the high pressure gas from the high pressure gas tank is introduced into the opening when the pressure is applied by the pressure jig, and the pressure jig is applied to the second substrate. It is a method of applying a pressure against the pressure of.

According to the invention of claim 11, in the invention of claim 10, the elastic film is formed in the opening of the stage, and in the fourth step, when the high pressure gas is introduced. It is a method of applying a pressure against the pressure of the pressure jig to the second substrate by expanding the coating film.

According to a twelfth aspect of the present invention, in the third aspect of the invention, the first adhesive layer is provided between the base member and the conductive member, and the conductive member and the cover are provided. A second adhesive layer is provided between the first substrate and the member, and the first substrate is provided with a notch formed by notching a part of the cover member from the side surface. In the second step, the notch is formed in the notch. The photocurable adhesive resin is attached to the exposed first adhesive layer on the first substrate, and in the fifth step, the photocurable adhesive resin attached to the cutout portion of the cover member is also irradiated with ultraviolet rays. Is the way.

According to a thirteenth aspect of the present invention, in the invention of the twelfth aspect, the second step includes the first adhesive layer exposed in the cutout portion and a cover member around the first adhesive layer. This is a method of attaching a photocurable adhesive resin to a wide range.

According to a fourteenth aspect of the present invention, in the third aspect of the invention, at least a part of the cutout portion is provided on the surface of the base member of the first substrate opposite to the first conductive member. The method further comprises a step of attaching a reinforcing plate to a region extending over a portion covered with the cover film adjacent to the cutout portion.

According to a fifteenth aspect of the present invention, a means for laminating a conductive member extending along the base member on a surface of a base member made of glass and a cover member for covering a part of the conductive member are laminated. A first substrate in which a main body portion in which the above three members are laminated and a portion of the conductive member that is exposed without being covered by the cover member serves as a lead portion is prepared in advance, and the conductive member on the first substrate is As a method of manufacturing an electronic component connected to an electrode of a second substrate on which elements and the like are mounted, a first step of mounting the second substrate on a stage with the surface on which the electrode is formed facing upward, A second step of adhering a photo-curable adhesive resin having volumetric shrinkage to at least one of the first substrate and the second substrate; the lead portion of the conductive member on the first substrate; and the second step. With the electrodes on the substrate A third step of stacking and stacking the first substrate on the second substrate; at least one side surface made of a material capable of transmitting ultraviolet rays and having a tip functioning as a substantially planar pressing surface; And a pressure jig configured such that the direction in which ultraviolet rays propagate inside the pressure jig are inclined at substantially the same angle with respect to the normal direction of the pressure surface. A fourth step of pressurizing the lead portion of the first substrate and the electrode of the second substrate into pressure contact, the pressure jig and the base member of the first substrate being transmitted therethrough, and the adhesive resin And a fifth step of irradiating with ultraviolet light.

According to a sixteenth aspect of the invention, in the invention of the fifteenth aspect, in the fourth step, the plurality of optical fibers are bundled together, and the tip end surface of each optical fiber serves as a pressing surface. This is a method of using the configured pressure jig.

According to a seventeenth aspect of the invention, in the invention of the fifteenth or sixteenth aspect, an opening is provided in a portion of the stage corresponding to the lower side of the electrode, and a high pressure gas connected to the opening is provided. A tank is provided, and in the fourth step, the high pressure gas from the high pressure gas tank is introduced into the opening when the pressure is applied by the pressure jig, and the pressure jig is applied to the second substrate. It is a method of applying a pressure against the pressure of.

According to the invention of claim 18, in the invention of claim 17, in the opening of the stage, a film having elasticity is formed in advance, and in the fourth step, when the high pressure gas is introduced. It is a method of applying a pressure against the pressure of the pressure jig to the second substrate by expanding the coating film.

[0034]

According to the above construction, the following actions are brought about for each claim.

According to the first aspect of the present invention, since the pressing jig and the first substrate have ultraviolet transparency, the photo-curable adhesive resin is cured at room temperature even if the second substrate does not have ultraviolet transparency. It becomes possible. Therefore, the use of the flexible wiring board is expanded, and the base member and the cover member of the first substrate functioning as the flexible wiring board can be made of an inexpensive material. For example, it is not necessary to use expensive polyimide having excellent heat resistance as the material of the base member or the cover member, and it is possible to use, for example, inexpensive polyester.

According to the second aspect of the present invention, since the photo-curable adhesive resin is not attached between the surfaces of the conductive member on the first substrate and the electrodes of the second substrate which are in contact with each other, the photo-curable adhesive resin is not adhered. There is no need to push out. Therefore, even if the pressure contact force in the fourth step is small, the electric connection between the both is surely performed. Therefore, adverse effects on the second substrate itself, elements mounted on the second substrate, and the like are avoided.

According to the third aspect of the invention, in the fourth step, the lead portion is plastically deformed by pressure in advance,
Since the height of each part of the lead part from the base member is substantially uniform, the lead part and the electrode are reliably electrically connected even if the pressing force is small. Therefore, adverse effects on the second substrate itself, elements mounted on the second substrate, and the like are avoided.

In the invention of claim 4 or 6, the interference between the equipment above the stage on which the second substrate is installed and the pressing jig is avoided, and the alignment of the lead portion and the electrode is confirmed. It will be easier.

According to the fifth or sixteenth aspect of the invention, since the intensity of ultraviolet rays passing through the pressure jig formed of the optical fiber is attenuated very little, stronger ultraviolet rays are applied to the photocurable adhesive resin. Therefore, the time required to cure the photocurable adhesive resin is shortened and the productivity is improved.

In the invention of claim 7 or 8, since the volume shrinkage force of the photocurable adhesive resin acts not only on both ends of the lead but also on the groove portion, the compressive stress acting between the lead and the electrode becomes large, The electrical connection between the lead portion and the electrode is further strengthened.

According to the ninth aspect of the invention, the electrodes of the second substrate on which different kinds of elements are mounted are electrically connected to each other through the conductive member of the first substrate. Therefore, the application of the flexible wiring board is further expanded.

According to the tenth, eleventh, seventeenth or eighteenth aspect of the invention, even when the element or the like is mounted on the surface of the second substrate opposite to the surface on which the electrodes are formed, the opening of the stage is not covered. By burying the element or the like, the connection between the first substrate and the second substrate is performed without applying a pressing force by the pressure jig to the element or the like. Therefore, the reliability of the manufactured electronic component is improved.

In the twelfth aspect of the present invention, the adhesive force between the first adhesive layer of the first substrate and the photocurable adhesive resin acts on the notch instead of the cover member. Therefore, an adhesive force higher than the adhesive force between the cover member generally made of a plastic film and the photocurable adhesive resin is obtained, and the connection strength between the first substrate and the second substrate is improved.

In the thirteenth aspect of the present invention, even when the first substrate is bent in the vicinity of the cutout portion, it is bent in the region including the cover member. No sharp bends will occur. Therefore, a good connection state between the first substrate and the second substrate can be obtained without causing damage to the cover member or increase in the resistance value of the conductive member.

According to the fourteenth aspect of the present invention, even when the first substrate is bent in the vicinity of the notch, the reinforcing plate prevents the generation of a sharply bent portion. Therefore, a good connection state between the first substrate and the second substrate can be obtained without damaging the base member or increasing the resistance value of the conductive member.

According to the fifteenth aspect of the present invention, also for the first substrate having the base member made of the glass substrate, the applications of the first substrate are expanded similarly to the flexible wiring substrate.
In addition, since the pressure jig is tilted from the direction normal to the pressure surface, interference between the equipment above the stage and the pressure jig is avoided, and pressure is applied diagonally during pressure. Therefore, the impact force on the glass substrate is mitigated, and the glass substrate is prevented from being damaged.

[0047]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(First Embodiment) As shown in FIG. 1, a flexible wiring board 1 (first wiring board) used in this embodiment has a base film 2 (base member) and a cover film 3 (cover member). And the three conductive members 5 are formed between the first and second adhesive layers 4a and 4b between the two. Although only the structure near the end is shown in the figure, the flexible conductive member 1 extends a predetermined width for a predetermined length, and when attached to a printed circuit board or the like, it is normally bent at a part thereof. In many cases, plastic bending deformation is possible. In particular, in this embodiment, the base film 2 and the cover film 3, which are the main constituent members of the flexible wiring board 1, are made of a material which is not only flexible but also transparent to ultraviolet rays, such as polyester.

The conductive members 5 extend in parallel with each other in the longitudinal direction of the flexible wiring board 1, and at the tip end where the electrodes are connected to the printed circuit board, as shown in FIG. The elastic member 5 has a portion which is not covered with the cover film 3, and this portion has the lead 6
Is. Furthermore, a groove 12 is formed at the tip of the lead 6 by cutting a predetermined length in the longitudinal direction of the flexible conductive member from the tip surface of the lead 6. This groove 1
The width of 2 is larger than the width of the remaining portion of the lead 6 divided by the groove 12, but smaller than the distance between the three leads 6.

As will be described later, as shown in FIG. 4, the flexible wiring board 1 is covered with the cover film 3 at a part of the side of the base film 2 which is outside the conductive member 5. A notch 14 is formed as a notch, and as will be described later, by providing this notch 14, the connection strength between the flexible wiring board 1 and the printed board 7 is improved.

Next, steps for connecting the flexible wiring board 1 to the printed circuit board 7 such as an electronic component and a wiring board will be described with reference to FIGS. 2a to 2e.

First, as shown in FIG. 2A, a printed circuit board 7 such as an electronic component or a wiring board having electrodes 8 and a flexible wiring board 1 are opposed to each other. At this time, the printed circuit board 7 is placed on a stage (not shown) with the electrode 8 facing upward, and the flexible wiring board 1 is held with the lead 6 facing downward. Then, a wide area including the surface of the printed board 7 and the surface of the electrode 8 is coated with a photo-curable adhesive resin 9 having an insulating property and a volume shrinkage property, and the leads 6 of the flexible board 1 and the electrodes 8 of the printed board 7 are Align. The photocurable adhesive resin 9 may be applied to the flexible wiring board 1 side.

Next, as shown in FIG. 2B, the leads 6 of the flexible wiring board 1 are mounted on the electrodes 8 of the printed board 7. At this time, the leads 6 and the electrodes 8 of the printed circuit board 7
The photocurable adhesive resin 9 is interposed between the spaces (and the notch 14).

Next, as shown in FIG. 2c, the lead 6 is pressed by a pressing jig 10 made of a material having a UV-transmitting property such as quartz glass, and the lead 6 and the electrode 8 of the printed circuit board 7 are pressed against each other. To do. At this time, the photocurable adhesive resin 9 interposed between the lead 6 and the electrode 8 is pushed out by the pressing force, and the lead 6 and the electrode 8 are electrically connected.

The photocurable adhesive resin 9 is applied to the pressing jig 10.
Teflon coating or the like is applied at least in the vicinity of the pressing surface of the pressing jig 10 so as not to adhere to the surface.

Next, as shown in FIG.
Further, the photo-curable adhesive resin 9 filled between the substrates is irradiated with the ultraviolet light transmitted through the base film 2 to cure the photo-curable adhesive resin 9. Thereby, the flexible wiring board 1
And the printed circuit board 7 are mechanically connected.

Next, as shown in FIG. 2e, the pressure jig 10
The pressurization by is released, and the connection process is completed. Even if the pressure is removed, the leads 6 of the flexible substrate 1 and the printed circuit board 7 are still compressed by the volume contraction force of the cured photo-curable adhesive resin 9.
The electrode 8 is pressure-contacted with the electrode 8 to more firmly maintain the electrical connection.

Therefore, in this embodiment, since the photocurable adhesive resin is used, the flexible wiring board 1 and the printed board 7 can be connected at room temperature without heating. Therefore, as a material for forming the base film 2 and the cover film 3 of the flexible wiring board 1, it is not necessary to use an expensive material such as polyimide having high heat resistance, and inexpensive polyester can be used. Further, since no solder is used, neither lead nor a cleaning step is required.

In particular, in this embodiment, since the pressure jig 10 having an ultraviolet ray transmitting property is used, it is possible to irradiate the ultraviolet ray from the flexible wiring board 1 side. Therefore, the material forming the second wiring board is not limited to, for example, glass having ultraviolet transparency. This allows
It is possible to connect the flexible wiring board 1 to an opaque substrate such as a printed board at room temperature, and it is possible to reduce the cost of the flexible wiring board 1 and expand its applications.

The photo-curable adhesive resin 9 used in the present invention includes UV-curable epoxy, silicone, acrylic and the like. In addition, the electrodes 8 of the printed circuit board 7 and the surfaces of the leads 6 of the flexible wiring substrate 1 may have Au, Cu, S
It is plated with n, Ni, solder, etc.

Next, the groove 6 is formed in the lead 6 in this embodiment.
The action and effect of forming the above will be described with reference to FIG. In FIG. 3, a part of FIG. 2e is shown enlarged in a more realistic dimensional ratio.

As shown in FIG. 3, when the photo-curable adhesive resin 9 is cured, a concave portion 11 corresponding to the volume contracting force is generated in a region located between the adjacent leads 6 of the base film 2, and this volume is increased. A compressive stress is generated between the lead 6 and the electrode 8 due to the contracting force. Moreover, in this embodiment, since the lead 12 is provided with the groove 12, a recess 13 corresponding to the volume contracting force of the photocurable adhesive resin 9 is also formed in the groove 12 and the lead contracts by this volume contracting force. A compressive stress is generated between 6 and the electrode 8. That is, considering the tip portion of one lead 6, there are column-shaped urging members that generate a compressive stress between the lead and the electrode at a total of four locations at both ends and two intermediate locations. Therefore, by forming the groove 12 in the tip portion of the lead 6 as in the present embodiment, the electrical connection between the lead and the electrode can be more firmly held. Further, as will be described later, the adhesive force between the photo-curable adhesive resin 9 and the first adhesive layer 4a on the base film 2 acts on the groove 12, but this adhesive force is applied to the leads 6 as described later. Is larger than the adhesive force of the photocurable adhesive resin 9 with respect to. As a result, the reliability of connection between both substrates can be significantly improved.

In this embodiment, since the width of the groove 12 is smaller than the width of each remaining portion of the lead 6, the area of the remaining portion of the lead 6 is ensured to be sufficiently wide, and the electric resistance at the tip of the lead 6 is high. There is no fear of rising.

At this time, since the distance between the leads 6 is larger than the width of the groove 12, the depth d1 of the concave portion 11 is increased.
Is larger than the depth d2 of the recess 13. That is,
The compressive stress between the lead and the electrode due to the volume shrinkage force of the photo-curable adhesive resin between the leads 6 adjacent to each other is the groove 12
Is larger than the compressive stress of the part.

Next, as shown in FIG. 4, the function and effect of the flexible wiring board 1 in the case where the notch 14 is provided on the side of the conductive member 5 of the cover film 3 will be described. 5a and 5b show the state in the step of connecting the flexible wiring board 1 and the printed board 7 (step shown in FIG. 2b), and show the sectional state of both boards corresponding to the section taken along the line VV of FIG. . As shown in FIG. 5a, the photocurable adhesive resin 9 filled in the cutout portion 14 connects the first adhesive layer 4a and the printed board 7. The adhesive strength between the adhesive layer 4 and the substrate 7 in the cutout portion 14 is significantly higher than the adhesive strength between the cover film 3 made of polyester and the printed board 7.

Specifically, the adhesive force between the first adhesive layer 4a and the photocurable adhesive resin 9 is usually about 200 g /
Values of mm and above are obtained.

When the cutout 14 is formed in the flexible substrate 1, in the step shown in FIG. 2A, the photocurable adhesive resin 9 is applied to a wide area including the cover film 3 around the cutout 14. It is preferable to apply it to The reason will be described below.

For example, when the photo-curable adhesive resin 9 is not sufficiently filled in the entire notch 14 as in the conventional connecting step shown in FIG. 13, the radius of curvature of bending becomes small and it is bent. It becomes a state. Therefore, the base film 2 is damaged, and although not shown in FIG. 13, the conductive member 5 near the bent portion is also bent with a small radius of curvature, so that microcracks are generated and the flexible wiring board 1 has a The resistance value of the conductive member 5 may increase.

However, as shown in FIG. 5A, if the photocurable adhesive resin 9 is filled in a wider area than the cutout portion 14, the cutout portion 1 is bent even if the flexible wiring board 1 is bent.
Since the boundary between the cover film 4 and the cover film 3 is covered with the photo-curable adhesive resin 9, it is not bent. Therefore,
The effect that the base film 2 is not damaged and the resistance value of the conductive member 5 is not increased can be exhibited.

Next, as shown in FIG. 5b, the effect and effect of the case where the reinforcing plate 15 is provided on the back surface of the region over the notch 14 and the cover film 3 in the flexible wiring board 1 will be described. In this example, the reinforcing plate 15 is provided in a region corresponding to a region extending between the cutout portion 14 and the portion where the cover film is present on the surface of the base film 2 opposite to the surface on which the cover film 3 is laminated. ing. If such a reinforcing plate 15 is provided, even if the photocurable adhesive resin 9 is not sufficiently filled in the cutout portion 14, the radius of curvature of the bent portion can be maintained large, and as shown in FIG. The flexible wiring board 1 does not bend. Therefore, by providing the reinforcing plate 15,
The peeling strength of the flexible wiring board 1 from the printed board 7 can be improved.

The reinforcing plate 15 may be attached to the flexible wiring board 1 in advance before performing the connecting step, or may be attached during the connecting step.

Next, a specific example of the shape of the pressing jig other than the shape shown in FIG. 2 will be described.

As shown in FIG. 6a, when the direction in which ultraviolet rays travel inside the pressure jig 10, that is, the pressure jig 10 itself is tilted with respect to the normal to the front end surface of the pressure jig 10, It is possible to avoid interference with a member above the pressure jig 10. For example, even if a member such as a protective cover attached to the apparatus is present above the stage on which the printed circuit board is placed, it may cause interference between the protective cover and the pressing jig 10. Instead, the step of connecting the printed circuit board 7 and the flexible wiring board 1 can be performed. Also,
Even when confirming the alignment state of the printed circuit board 7 and the flexible wiring board 1 by visual observation from above,
The pressure jig 10 does not hinder the confirmation work.
Therefore, the connection accuracy can be improved.

However, the lower side surface of the side surface of the pressing jig 10 does not have to be formed along the traveling direction of ultraviolet rays. For example, as shown in FIG. 6 b, the upper portion of the lower side surface may be vertical and only the lower portion may be inclined with respect to the normal direction of the pressure surface 16 of the pressure jig 10.

7A and 7B show a case where the pressure jig 10 is composed of a plurality of optical fibers 17 bundled together, and the tip surface of the optical fiber 17 is the pressure surface 16 of the pressure jig 10. Shows the structure of. By using the optical fiber 17 as the pressing jig 10, it is possible to irradiate the photocurable adhesive resin 9 with ultraviolet rays having high illuminance.
The time required to cure the photocurable adhesive resin 9 is short,
This has the effect of improving productivity. Although the entire optical fiber 17 may be linear and inclined with respect to the normal direction of the pressing surface 16 as shown in FIG. 7a, the upper portion of the optical fiber 17 is vertical and the lower portion is the pressing surface 16 as shown in FIG. 7b. May be inclined with respect to the normal direction of.

Next, FIG. 8A shows a state in the connecting step in the case where a part of the front end surface of the pressing jig 10 is the pressing surface 16. FIG. 8B is a diagram showing a state in the connecting step when the tip of the pressure jig 10 has a stepped shape and a part of the tip is the pressure surface 16. Figure 8
As shown in a, at the tip of the pressing jig 10, the most advanced pressing surface has a shape protruding from the surroundings, and it is configured to be able to irradiate a wider area than the pressing area with ultraviolet rays. By using the pressure jig 10 having the configuration shown in FIGS. 8a and 8b, there is an effect of curing the photocurable adhesive resin 9 protruding from the flexible wiring board 1.

(Second Embodiment) Next, a second embodiment will be described with reference to FIGS. 9a to 9f. In this embodiment, different kinds of substrate electrodes such as a printed circuit board, a semiconductor element, and an electronic component inside the electronic device, for example, electrodes of the semiconductor element and electrodes of the printed circuit board can be connected via the flexible wiring board 1.

As shown in FIG. 9a, a semiconductor substrate 18 having a semiconductor element having an electrode 8a mounted thereon is placed on a stage (not shown) with the electrode 8a facing upward, and has a first seed 6a at one end. The flexible wiring board 1 having the second lead 6b at the other end is held with the first lead 6a facing downward, and the photocurable adhesive resin 9 is applied around the electrode 8a of the semiconductor substrate 18. In this state, the first lead 6a of the flexible wiring board 1 and the electrode 8a of the semiconductor substrate 18 are aligned.

Next, as shown in FIG. 9b, the first lead 6
a is mounted on the electrode 8 a of the semiconductor substrate 18. At this time, the photo-curable adhesive resin 9 is interposed all around the first lead 6a and the electrode 8a of the semiconductor substrate 18.

Next, as shown in FIG. 9c, the pressing jig 10 is used.
The first lead 6a is pressed by the first lead 6a and the electrode 8a of the semiconductor substrate 18 is pressed against each other. Further, as shown in FIG. 9d, the ultraviolet light transmitted through the pressing jig 10 and the base film 2 is applied between the two substrates. The photocurable adhesive resin 9 filled in is irradiated to cure the photocurable adhesive resin 9.

Next, as shown in FIG. 9e, the pressing jig 10 is used.
The pressure applied by is released, and the connection between the flexible wiring board 1 and the semiconductor substrate 18 is completed.

The above connecting process is the same as that of the first embodiment shown in FIG.
This is basically the same as the connecting step described with reference to FIGS. That is, the first lead 6a and the electrode 8a of the semiconductor substrate 18 are brought into pressure contact with each other by the volume contracting force generated by the curing of the photocurable adhesive resin 9, and the connection state between them is firmly maintained.

In this embodiment, as shown in FIG. 9f, the second lead 6b at the other end of the flexible wiring board 1 and the electrode 8b of the printed circuit board 7 are the same as the steps shown in FIGS. 9a to 9e. A process is performed to connect both substrates.

Alternatively, the step of connecting the semiconductor substrate 18 and the flexible wiring board 1 and the step of connecting the printed circuit board 7 and the flexible wiring board 1 can be simultaneously performed. In that case, the time required for the process can be shortened.

As described above, in this embodiment, like the electrode 8a of the semiconductor element mounted on the semiconductor substrate 18 and the electrode 8b of the printed board 7, the electrodes of the electronic components and the respective substrates are made flexible. It can be electrically connected via the wiring board 1. In that case, similarly to the first embodiment, the pressure jig 10 is made of a material having ultraviolet ray transparency, thereby reducing the cost of the material forming the flexible wiring board by the room temperature connection, and The applications can be expanded. In addition, in FIG.
In FIG. 9c and FIG. 9d, the direction of the ultraviolet rays that pass through the inside of the pressing jig 10 is parallel to the normal line of the pressing surface of the pressing jig. It goes without saying that the direction of the ultraviolet rays passing through the inside of the tool may be inclined with respect to the normal line of the pressing surface.

(Third Embodiment) Next, a third embodiment will be described with reference to FIGS. 10a to 10e.

Although the flexible wiring board 1 having the structure described in the first embodiment may be used, in the present embodiment,
The lead 6 is used by being plastically deformed by applying pressure in advance.

First, as shown in FIG. 10A, the leads 6 of the flexible wiring board 1 are mounted on the electrodes 8 of the printed board 7. At this time, unlike the first and second embodiments, the photocurable adhesive resin is not yet applied.

Next, as shown in FIG. 10b, the pressure jig 1
The lead 6 is pressed by 0 to bring the lead 6 and the electrode 8 into pressure contact. Through this step, the lead 6 and the electrode 8 are electrically connected.

Next, as shown in FIG. 10c, a photo-curable adhesive resin 9 is filled in the gap between the flexible wiring board 1 and the printed circuit board 7, and light is applied around the area where the leads 6 and the electrodes 8 are pressed. Fill with curable adhesive resin 9.

Next, as shown in FIG. 10d, the pressure jig 1
The photo-curable adhesive resin 9 is irradiated with the ultraviolet rays of 0 and transmitted through the base film 2 to cure the photo-curable adhesive resin 9.

Next, as shown in FIG. 10e, the pressure jig 1
The pressure applied by 0 is released, and the connection between both substrates is completed. The pressure contact function between the lead and the electrode due to the volume contraction force of the photocurable adhesive resin 9 is the same as that in each of the above embodiments.

In this embodiment, since the photo-curable adhesive resin 9 is filled after the lead 6 and the electrode 8 are pressed against each other, the lead 6
The photocurable adhesive resin 9 does not enter between the contact surfaces of the electrode 8 and the electrode 8. Therefore, as a first effect, the lead 6 and the electrode 8
Since it is not necessary to press the photo-curable adhesive resin 9 between them by pressing, electrical connection can be obtained with a low pressure. Therefore, the printed board 7 is hardly damaged by the pressure. The second effect is that since the photo-curable adhesive resin 9 does not exist between the lead 6 and the electrode 8, the lead 6 and the electrode 8 are
The contact resistance value decreases because the contact area increases. Therefore, the reliability of the connection is further improved by the above two effects.

Further, in this embodiment, since the leads 6 of the flexible wiring board 1 are plastically deformed by pressure in advance before the connection step is performed, the following effects are obtained. That is, there are fine irregularities on the surface of the lead 6, and in order to electrically connect the lead 6 and the electrode 8,
The surface of the lead 6 is flattened by applying pressure to
It is necessary to increase the contact area between the electrode and the electrode 8. In that respect, the lead 6 that has been plastically deformed by applying pressure in advance has a flat surface, so that the structure shown in FIG.
When the lead 6 and the electrode 8 are pressed into contact with each other in the step shown in b, the pressure required to plastically deform the lead 6 is not necessary. Therefore, there is an effect that electrical connection can be obtained with a low pressing force, and the printed board is not damaged by the pressurization.

(Fourth Embodiment) Next, a fourth embodiment will be described with reference to FIGS. 11a to 11c. This embodiment is particularly suitable when the electronic component 19 is mounted on the surface of the printed circuit board 7 opposite to the surface on which the electrodes 8 are formed, as shown in FIG. 11a.

As shown in FIG. 11A, the printed circuit board 7 is mounted on the stage 20. An opening 21 is formed in a region of the stage 20 located below the electrode 8 of the printed board 7. An electronic component 19 is mounted on the lower surface of the printed circuit board 7 in the figure, and the electronic component 19 is buried in the opening 19 of the stage 20,
The support surface of 0 and the electronic component 19 do not come into contact with each other. The opening 21 is connected to the cavity 22 inside the stage 20. The cavity 22 is connected to a high pressure gas tank 24 via a high pressure gas supply valve 23,
Moreover, it is connected to the outside air via the exhaust valve 25. In addition,
An elastic film may be stretched over the opening 21.

Then, as shown in FIG. 11 a, a photo-curable adhesive resin 9 is applied to the vicinity of the electrode 8 on the printed board 7, the lead 6 and the electrode 8 are aligned, and the lead 6 is placed on the electrode 8. Mount.

Next, as shown in FIG. 11b, the pressure jig 1
The lead 6 is pressed by 0 to bring the lead 6 and the electrode 8 into pressure contact. At this time, the high-pressure gas supply valve 23 is simultaneously opened to introduce the high-pressure gas from the high-pressure gas tank 24 into the cavity 22,
By placing the cavity portion 22 in a high pressure state, a pressure against the pressing force of the pressure jig 10 is applied to the printed board 7.

When the elastic film is stretched over the opening 21, the elastic film expands to apply a pressure against the pressing force of the pressing jig 10 to the printed board 7. (Not shown).

Then, in the state shown in FIG. 11b, the light passing through the pressure jig 10 and the base film 2 is applied to the photo-curable adhesive resin 9 interposed between the substrates, and the photo-curable adhesive resin 9 is irradiated.
Cure.

Next, as shown in FIG. 11c, the exhaust valve 25 is opened at the same time as the pressurization is removed, and the high pressure gas supply valve 2 is opened.
3 is closed to bring the cavity 21 to atmospheric pressure. This allows
The connection process ends.

Next, the function and effect of the stage 20 having the opening 21 in this embodiment will be described. The printed circuit board 7 has a structure in which the stage 20 has no opening 21.
Of the electronic component 1 on the surface opposite to the surface on which the electrode 8 of FIG.
9 is mounted, the electronic component 20 is sandwiched between the printed board 7 and the stage 20 when the lead 6 and the electrode 8 are pressed against each other by the pressure jig 10, and the electronic component 2
The pressure will be concentrated on 0. And electronic component 1
There is a possibility that a problem such as detachment of 9 from the printed circuit board 7 or damage may occur.

However, in this embodiment, since the opening 21 is provided in the stage 20, the electronic component 19 is mounted on the stage 2.
It does not come into contact with 0, and the above-mentioned problems do not occur. Also,
By applying a high pressure to the cavity 22, a pressure against the pressing force of the pressure jig 10 is applied to the printed board 7,
It is possible to prevent the printed circuit board 7 from being deformed and prevent the printed circuit board 7 from being deformed.

(Fifth Embodiment) Next, a fifth embodiment will be described with reference to FIGS. 12a and 12b.

In FIG. 12a, a substrate having a conductive member 35 on a glass substrate 32 is used instead of the flexible wiring substrate, and the conductive member 35 of this substrate and the electrode 8 on the printed circuit board 7 are electrically connected. It is a figure which shows the state of each member in the case of doing. The photocurable resin 9 is irradiated with ultraviolet rays through the pressure jig 10 and the glass substrate 32, and the volume contraction force of the photocurable adhesive resin 9 is used to mechanically connect the both substrates and the conductive member 35. And the point of making electrical connection with the electrode 8 are
This is the same as each of the above embodiments.

In this embodiment, in this case, the side surfaces of the pressure jig 10 and the direction of the ultraviolet rays passing through the inside of the pressure jig 10 are relative to the normal direction of the tip surface of the pressure jig 10. Is leaning. By such a method, it is possible to avoid interference with other devices and accurately confirm the alignment state of the conductive member 35 and the electrode 8. In addition, the pressure jig 10
The impact force on the glass substrate 32 at the time of pressure contact is relieved by the pressing force of the glass substrate 3 acting obliquely, and the glass substrate 3
It is possible to prevent damage such as 2.

Further, FIG. 12b shows that when a bump 36 is further formed on the conductive member 35 on the glass substrate 32 and the bump 36 and the electrode 8 of the printed circuit board 7 are electrically connected, It is a figure which shows a state. Further, in this embodiment, the width of the pressure jig 10 is made larger than the width of the glass substrate 32 so that the photocurable adhesive resin 9 protruding from the glass substrate 32 can be surely cured.

[0108]

As described above, according to the invention of each claim, the following effects are exhibited.

According to the first aspect of the invention, the cost of the flexible wiring board can be reduced and the applications can be expanded.

According to the second or third aspect of the invention, it is possible to surely perform the connection between the conductive member and the electrode while reducing the pressure contact force at the time of performing the pressure contact connection between the conductive member and the electrode. It is possible to improve.

According to the invention of claim 4 or 6, it is possible to avoid the interference between the pressure jig and the equipment above the stage on which the second substrate is installed, and to confirm the alignment between the lead portion and the electrode. It can be facilitated.

According to the invention of claim 5 or 16, productivity can be improved by shortening the time required for curing the photocurable adhesive resin.

According to the invention of claim 7 or 8,
By increasing the compressive stress acting between the electrodes, the electrical connection between the lead portion and the electrodes can be strengthened.

According to the invention of claim 9, the use of the flexible wiring board can be expanded to electrical connection between different kinds of elements and the like.

According to the tenth, eleventh, seventeenth or eighteenth aspect of the invention, even when the element or the like is mounted on the surface of the second substrate opposite to the surface on which the electrode is formed, The first substrate-the second substrate without applying the pressure force by the pressure jig.
The boards can be connected to each other, and thus the reliability of the electronic component manufactured can be improved.

According to the twelfth aspect of the invention, it is possible to improve the connection strength between the first substrate and the second substrate.

According to the invention of claim 13 or 14, the first
It is possible to improve the connection strength between the substrate and the second substrate, prevent damage to the cover member in the first substrate, and prevent the resistance value of the conductive member from increasing.

According to the fifteenth aspect of the present invention, the use of the first substrate having the glass substrate as the base member is expanded, the interference between the equipment above the stage and the pressing jig is avoided, and the glass at the time of pressing is pressed. It is possible to reduce the impact force on the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view of a flexible wiring board according to a first embodiment.

FIG. 2 is a cross-sectional view showing changes in each member in the connection step of the first embodiment.

FIG. 3 is a cross-sectional view showing a connection state at a tip portion of a lead between a flexible wiring board and a printed board.

FIG. 4 is a perspective view of a flexible wiring board provided with a cutout portion.

FIG. 5 is a cross-sectional view showing the relationship between the filling state of the photocurable adhesive resin in the cutout portion and the state of the bent portion of the flexible wiring board.

FIG. 6 is a cross-sectional view showing a connected state of both substrates when a pressure jig having a side surface inclined with respect to the normal direction of the front end surface is used.

FIG. 7 is a cross-sectional view showing a connection state of both substrates when a pressure jig in which optical fibers are bundled is used.

FIG. 8 is a cross-sectional view showing a connection state of both substrates by a pressing jig having an ultraviolet irradiation area wider than a pressing surface.

FIG. 9 is a cross-sectional view showing changes in the state of each member in the connection step of the second embodiment.

FIG. 10 is a cross-sectional view showing changes in the state of each member in the connecting step of the third example.

FIG. 11 is a cross-sectional view showing changes in the state of each member in the connecting step of the fourth example.

FIG. 12 is a sectional view showing a state of each member at the time of press contact connection of the fifth embodiment.

FIG. 13 is a cross-sectional view showing a state of each member at the time of connection using a conventional photocurable adhesive resin.

FIG. 14 is a cross-sectional view showing a state of each member at the time of connection with a conventional solder and anisotropic conductive adhesive.

[Explanation of symbols]

 1 Flexible Wiring Board 2 Base Film 3 Cover Film 4 Adhesive Layer 5 Conductive Member 6 Lead 7 Printed Circuit Board 8 Electrode 9 Photocurable Adhesive Resin 10 Pressing Fixture 11 Recess 12 Groove 13 Recess 14 Cutout 15 Reinforcing Plate 16 Addition Pressure surface 17 Optical fiber 18 Semiconductor substrate 19 Electronic component 20 Stage 21 Opening 22 Cavity 23 High pressure gas supply valve 24 High pressure gas tank 25 Exhaust valve

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazunari Nishihara 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (18)

[Claims] 1. A conductive member extending along the base member on the surface of a base member made of a material having a property of transmitting ultraviolet rays and a flexibility, and a flexible cover for covering a part of the conductive member. A flexible first substrate configured such that a lead portion is formed by stacking a member and a main body portion in which the above three members are laminated and an exposed portion of the conductive member that is not covered by the cover member serves as a lead portion. A method of manufacturing an electronic component, comprising: preparing and connecting a lead portion on the first substrate to an electrode of a second substrate on which an element or the like is mounted, wherein the surface on which the electrode is formed faces upward. A first step of mounting the substrate on a stage; and a second step of attaching a photo-curable adhesive resin having volumetric shrinkability to at least one of the first substrate and the second substrate.
And a third step of aligning the lead portion on the first substrate and the electrode of the second substrate so that the first substrate is superposed on the second substrate, and ultraviolet rays can be transmitted. A pressure jig which is made of a different material and whose tip functions as a pressure surface, presses the first substrate and presses the lead portion of the first substrate and the electrode of the second substrate. And a fifth step of irradiating the photocurable adhesive resin with ultraviolet rays through the pressure jig and the base member of the first substrate. Production method. 2. The method for manufacturing an electronic component according to claim 1, wherein the second step is performed after the fourth step, and in the second step, the lead portion of the first substrate is pressure-welded. And a photocurable adhesive resin around the electrodes of the second substrate. 3. The method of manufacturing an electronic component according to claim 1 or 2, wherein a first substrate having a lead portion which is pre-pressurized and plastically deformed so that the height from the surface of the base member is substantially uniform is used. A method of manufacturing an electronic component, comprising: 4. The method of manufacturing an electronic component according to claim 1, wherein in the fourth step, at least one side surface and a direction in which ultraviolet rays travel inside the pressure jig are the pressure surface. A method for manufacturing an electronic component, comprising using a pressure jig configured to be inclined at substantially the same angle with respect to a normal direction. 5. The method of manufacturing an electronic component according to claim 1, wherein in the fourth step, a large number of optical fibers bundled with each other are formed, and the tip end surface of each optical fiber is a pressing surface. A method of manufacturing an electronic component, characterized by using a pressure jig. 6. The method of manufacturing an electronic component according to claim 5, wherein in the fourth step, the direction of the optical axis of the optical fiber is at a predetermined angle with respect to the normal direction of the pressing surface of the pressing jig. A method for manufacturing an electronic component, comprising using a pressure jig configured to be inclined. 7. The method of manufacturing an electronic component according to claim 1, wherein at least one groove extending from a tip end surface of the lead portion in parallel with a side surface of the conductive member is formed at a tip end portion of the lead portion. A method of manufacturing an electronic component, comprising using the first substrate. 8. The method of manufacturing an electronic component according to claim 7, wherein the first substrate is used in which the width of the groove is smaller than the width of the remaining lead portion. . 9. The method of manufacturing an electronic component according to claim 1, wherein a first conductive member having a plurality of lead portions is prepared, and the lead portions of the first substrate and a plurality of the second substrates are provided. A method for manufacturing an electronic component, comprising performing the above steps with each of the electrodes. 10. The method of manufacturing an electronic component according to claim 1, wherein an opening is provided in a portion of the stage below the electrode, and a high pressure gas tank connected to the opening is provided. In the fourth step, the high-pressure gas from the high-pressure gas tank is introduced into the opening during pressurization by the pressurizing jig so that the pressure of the pressurizing jig is prevented against the second substrate. A method of manufacturing an electronic component, which comprises applying a pressure to be applied. 11. The method of manufacturing an electronic component according to claim 10, wherein a film having elasticity is formed in the opening of the stage, and in the fourth step, the film is expanded when the high pressure gas is introduced. By doing so, a pressure against the pressure of the pressing jig is applied to the second substrate, and the method for manufacturing an electronic component. 12. The method of manufacturing an electronic component according to claim 3, wherein a first adhesive layer is provided between the base member and the conductive member, and the first adhesive layer is provided between the conductive member and the conductive member. To the second
An adhesive layer is provided, and a first substrate having a cutout formed by cutting out a part of the cover member from a side surface is used. In the second step, the first substrate on the cutout is exposed. An electronic component characterized in that a photocurable adhesive resin is adhered also to the first adhesive layer, and in the fifth step, the photocurable adhesive resin adhered to the cutout portion of the cover member is also irradiated with ultraviolet rays. Manufacturing method. 13. The method of manufacturing an electronic component according to claim 12, wherein in the second step, light is applied to a wider area including the first adhesive layer exposed in the cutout and a cover member around the first adhesive layer. A method of manufacturing an electronic component, which comprises applying a curable adhesive resin. 14. The method of manufacturing an electronic component according to claim 3, wherein in the fourth step, at least the cutout portion is formed on a surface of the base member of the first substrate opposite to the first conductive member. A method of manufacturing an electronic component, further comprising: a step of providing a reinforcing plate in a region extending over a portion covered by a cover film adjacent to a part and the cutout portion. 15. A main body in which a conductive member extending along the base member and a cover member covering a part of the conductive member are laminated on the surface of a base member made of glass, and the three members are laminated. Part and the exposed portion of the conductive member which is not covered by the cover member serves as a lead portion in advance, and the lead portion on the first substrate of the second substrate on which an element or the like is mounted is prepared. A method of manufacturing an electronic component connected to an electrode, comprising: a first step of mounting the second substrate on a stage with a surface on which the electrode is formed facing upward, the first substrate and the second substrate. Secondly, a photo-curable adhesive resin having volumetric shrinkage is attached to at least one of the substrates.
And a step of overlaying the first substrate on the second substrate by aligning the lead portion of the conductive member on the first substrate with the electrode of the second substrate. And at least one side surface and a direction in which ultraviolet rays travel inside the pressing jig are normal to the pressing surface and are made of a material that allows ultraviolet rays to pass through and the tip functions as a substantially planar pressing surface. A pressure jig configured to be inclined at substantially the same angle with respect to the direction is used to pressurize the first substrate so that the lead portion of the first substrate and the electrode of the second substrate are separated from each other. Manufacture of an electronic component, comprising: a fourth step of press-contacting; and a fifth step of irradiating the adhesive resin with ultraviolet rays through the pressure jig and the base member of the first substrate. Method. 16. The method of manufacturing an electronic component according to claim 15, wherein in the fourth step, a plurality of optical fibers bundled with each other are formed, and the tip end surface of each optical fiber is a pressing surface. A method of manufacturing an electronic component, characterized by using a pressure jig. 17. The method of manufacturing an electronic component according to claim 15, wherein an opening is provided in a portion of the stage corresponding to the lower side of the electrode, and a high pressure gas tank connected to the opening is provided. In the fourth step, the high-pressure gas from the high-pressure gas tank is introduced into the opening during pressurization by the pressurizing jig so that the pressure of the pressurizing jig is prevented against the second substrate. A method of manufacturing an electronic component, which comprises applying a pressure to be applied. 18. The method of manufacturing an electronic component according to claim 17, wherein a film having elasticity is formed in the opening of the stage, and in the fourth step, the film is expanded when the high pressure gas is introduced. By doing so, a pressure against the pressure of the pressing jig is applied to the second substrate, and the method for manufacturing an electronic component.