JPS62239595A - Lead connection - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead connection method particularly suitable for connecting a plurality of lead wires to transparent electrodes of a display panel.

BACKGROUND OF THE INVENTION For example, electrodes for liquid crystal display panels and EL display panels are generally formed on a glass plate using a 5N02. Engineering TO
Therefore, in order to electrically connect to the drive circuit, a flexible substrate extending from the drive circuit is mechanically pressed against the electrodes of the display, or
Alternatively, a method has been used in which a metal film of Ni, Au, Cr, etc. is formed on the electrode, and this and the flexible substrate are fixed by soldering.

However, the former method of press-contact requires a press-contact means such as a spring material, and there is a problem in that it is not possible to make the display smaller and thinner. Also,
The latter method of forming a metal film on the electrodes of a display has the problem that materials and equipment are required, leading to increased costs in this process.

As a method to solve these problems,
As seen in Publication No. 6894 (Japanese Patent Application No. 58-235301), the electrodes of the display and the leads are brought into pressure contact,
A method has been proposed in which this is covered with a photocurable resin and cured, thereby electrically connecting the electrode and the lead.

This is shown in FIG. First, the electrodes 2 formed on the substrate 1 and the leads 3 are aligned and pressed together. Thereafter, the electrodes 2 and leads 3 on the substrate 1 are covered with a photocurable resin 4 and cured by irradiation with ultraviolet light. By curing the photocurable resin 4, the areas where the electrodes 2 and the leads 3 of the substrate 1 are in pressure contact are permanently fixed at least with the resin, thus completing the electrical connection.

This method has been developed to a practical level.
The present inventors devised the method shown in the figure.

In this method, a transparent plate, for example, a glass plate 6, is integrated with the tip of a U-shaped body constituting the pressure member 5, and the pressure member 6 and the transparent plate 6 are made of a photocurable resin (ultraviolet curable acrylate resin). ) 4 is applied onto the electrode 2, and after keeping the lead 3 in pressure contact for a predetermined period of time, ultraviolet light is applied to the light guide (
(not shown) is guided between the pressure member 6 and the transparent plate 6, and the photocurable resin 4 is irradiated through the transparent plate 6 to cure it, thereby electrically connecting the lead 3 and the electrode 2. It is something that connects.

Problems to be Solved by the Invention However, in the method shown in FIG. 8, both ends of the transparent plate 6 are pressed locally using the pressure member 5. Pressure force is not applied uniformly over the area, and as a result, the photocuring resin 4 located approximately in the center of the transparent plate 6 cannot escape from between the electrodes 2 and 3, and remains between the two, resulting in a resistance between the two. There was a problem with the increase in

The present invention solves the above-mentioned problems, and provides a lead connection method that can uniformly apply a pressure contact force over the entire length of the bonded portion between the electrode and the lead, and that can effectively cure the photocurable resin. This is what I am trying to do.

Means for Solving the Problems In order to solve the above problems, the lead connection method of the present invention coats a photocurable resin on an electrode formed on a transparent substrate, and positions a plurality of leads on this electrode. The leads and electrodes are pressed together for a predetermined period of time using a pressure member, and then, while maintaining the pressure contact state, ultraviolet light is irradiated from below the electrodes and substrate to harden the photocurable resin and bond the electrodes and leads together. It electrically connects the

Function: According to the lead connection method of the present invention, the lead and the electrode are connected to each other.
Since the lead is pressed from above with a pressure member and UV light is irradiated from below the electrode, pressure can be applied uniformly over the entire length of the pressure contact between the lead and electrode. The photocurable resin between the leads and the electrodes can be extruded from between the leads and the electrodes, thereby achieving good electrical connection between the leads and the electrodes.

EXAMPLE An example of the lead connection method of the present invention will be described below with reference to FIGS. 1 to 4. Here, an example will be explained in which the leads of a film carrier are connected to the electrodes of a liquid crystal display panel. 1° in the figure is the liquid crystal display panel,
Reference numeral 10a denotes a substrate made of one transparent plate constituting this liquid crystal display panel 1o, and is made of, for example, plastic or acrylic.

It can be made of organic materials such as epoxy, polyimide, and Teflon, or inorganic materials such as glass plates.

A plurality of transparent electrodes 11 are formed on the upper surface of this transparent substrate 10a. This electrode 11 is S no 2. It is formed of a conductive film such as ITO. On the other hand, 12 is the plurality of electrodes 1
A film carrier for packaging a semiconductor element formed in accordance with lead 1, for example, by etching copper foil on one surface of a polyimide film 12a.
2b is formed.

Note that the ends of the leads 12b are plated with Au.

This lead 12b and electrode 11 are electrically connected. First, as shown in FIG. 3, a photo-curable insulating resin, such as an ultraviolet-curable modified acrylate resin 13, is applied onto the substrate 10a and a plurality of electrodes 11, and each lead 12b of the film carrier 12 is coated on each electrode 11. Align. In this state, the metal pressure member 14 presses the lead 12b and the electrode 11 from above the lead 12b. The lead 12b and the electrode 11 are connected for a predetermined period of time (for example, about 16 seconds).
Pressure is applied, and then, in the pressurized state, ultraviolet light is irradiated from the ultraviolet light source 16 to the pressed portion from below the substrate 10a to harden the photocurable insulating resin 13.

Although the basic connection method has been described above, in reality, the liquid crystal display panel 1o is placed on a jig or further on a processing device main body to perform the above connection work.

In this example, as shown in detail in FIGS. 1 and 3, the liquid crystal display panel 10 is positioned and placed on a jig pallet 16, and is further placed on a processing device main body 17 that contains an ultraviolet light source 16. The jig pallet 16 is positioned and placed. At this time, the jig pallet 16 is first placed at the connection portion between the lead 12b and the electrode 11 so that the ultraviolet light from the ultraviolet light source 15 in the processing device main body 17 can reach the connection portion between the lead 12b and the electrode 11. It consists of a metal jig stand 16a provided with a corresponding slit 18 that allows ultraviolet light to pass through, and a transparent plate, for example, a glass plate 16b, integrated on the jig stand 16a, and a processing apparatus main body. 17
Similarly to the jig table 16a, a slit 19 is provided for allowing ultraviolet light to pass through.

Here, a substrate 10a of a liquid crystal display panel 1o
Since the electrodes 11 are formed on each of the three sides, three slits are formed in the jig table 16a and the processing device main body 17 in correspondence with these.

In such a device, a liquid crystal display panel 1o
is positioned on the jig pallet 16, and the jig pallet 16 is further positioned on the processing device main body 17, and the photocurable insulating resin 13 is applied onto the electrode 11 and the substrate 10a, and the process shown in FIGS. As shown in FIG. 2, each lead 12b of the carrier film 12 is aligned with the plurality of electrodes 11. Next, the pressure member 14 is lowered to press the electrode 11 and the lead 12b into contact with each other from above the lead 12b.

After pressing for a predetermined time to push out most of the photocurable insulating resin 13 between the electrodes 11, the ultraviolet light source 15 is operated to remove the slits 19, 18, transparent plate 16b, and substrate 10.
The photocurable insulating resin 13 is irradiated with ultraviolet light through a, thereby curing the photocurable insulating resin 13 and completing the electrical connection between the electrode 11 and the lead 12b. FIG. 4 shows this state, and the electrodes 11 and leads 12b are connected mainly by the photocurable insulating resin 13 located between the electrodes 11 and leads 12b arranged in parallel.

According to this method, the lead 1 is
Since the connecting portion between the lead 12b and the electrode 11 can be uniformly pressed over the entire length, the connection between the lead 12b and the electrode 11
Most of the photocurable insulating resin 13 between the two is expelled from between the electrodes 11 and leads 12b located in parallel.
The electrical connection between the two is extremely good. In addition, in the film carrier 12, a solder resist film 2o is applied to the leads 12b except for the connecting portions.

Other embodiments are shown in FIGS. Figure 1 above
In the embodiment shown in FIG. 4, if the pressing surface of the metallic pressure member 14 is smooth, the pressing force will be uniform for all the leads and electrodes, but if it is not, it will be difficult to obtain a uniform pressing force. There is a problem.

Furthermore, if dust adheres to some of the leads 12b during press-contact, it becomes impossible to apply a uniform press-contact force to all the leads and electrodes at this time as well.

The method shown in FIGS. 6 and 6 solves this problem.

In FIGS. 5 and 6, the same parts as in FIGS. 1 to 4 are given the same numbers and detailed explanations will be omitted.

In the figure, the difference from the embodiment shown in FIGS. 1 to 4 is that the pressure member 14 does not directly press the lead 12b.
A Teflon plate 21 is arranged between the pressure member 14 and the lead 12b, and the lead 12b and the electrode 1 are connected via the Teflon plate 21.
1 and 2 are in pressure contact with each other. Above Teflon plate 2
1 may be adhesively fixed to the pressure surface of the pressure member 14, but it is preferable to attach it so that it can be replaced.

According to this configuration, even if the pressure surface of the pressure member 14 has insufficient smoothness, or even if dust or the like adheres to some of the leads 12b, the Teflon plate 21 absorbs this. Uniform contact force can be applied to all leads 12b and electrodes 11, allowing better electrical connection. In addition, in the examples shown in FIGS. 1 to 4, there were cases where the photocurable resin side fat 13 adhered to the pressure member 14, but by using such a Teflon plate 21, such problems are eliminated and the problem becomes more Furthermore, the connection work can be performed more favorably.

Although not shown, in order to prevent the tips of the leads 12b of the film carrier 12 from being deformed in FIGS. 1 to 6, the tips of all the leads 12b may be bonded with polyimide.

Effects of the Invention As described above, according to the present invention, a lead and an electrode are brought into pressure contact with each other using a pressure member, and ultraviolet light is irradiated from below the electrode to harden the photocurable resin, thereby bonding the lead and the electrode together. Since the electrical connection is achieved, a uniform pressure contact force can be applied to all the leads and electrodes, and a good electrical connection between them can be achieved.

[Brief explanation of drawings]

Fig. 1 is a side sectional view showing a lead connection method according to an embodiment of the present invention, Fig. 2 is a top view of the main part of Fig. 1, and Fig. 3 shows a liquid crystal display panel to which the lead connection method is applied. 4 is a front sectional view showing the connection state between the leads and electrodes, FIG. 5 is a side sectional view showing an example of another lead connection method of the present invention, and FIG. A front cross-sectional view showing the connection state between the lead and the electrode in the case shown in Fig. 7.
8 are sectional views each showing a conventional lead connection method. 10a...Substrate, 11...Electrode, 12
...Carrier film, 12b...Lead, 13. Mountain...Photo-curing resin, 14...Pressure member, 15...Ultraviolet light source, 16・・・・・・
Jig pallet, 18.19...slit. Name of agent: Patent attorney Toshio Nakao and one other person
Figure 4 Figure 5 Figure 6

Claims (4)

[Claims] (1) Coating a photocurable insulating resin on at least an electrode formed on a transparent substrate, aligning a lead on this electrode, and pressing the lead and electrode together with a pressure member;
After that, while maintaining the pressed state, UV light is irradiated from below the transparent substrate to harden the photocurable insulating resin,
A lead connection method that electrically connects the electrode and the lead. (2) The transparent substrate is positioned and placed on at least a jig pallet, an ultraviolet light source is installed below the jig pallet, and the jig pallet is made of metal and is connected to electrodes and leads. 2. The lead connection method according to claim 1, comprising: a jig stand having slits that allow ultraviolet light to pass through corresponding to the parts; and a transparent plate integrated onto the jig stand. (3) The transparent substrate is positioned and placed on a jig pallet, the jig pallet is positioned and placed on a metal processing device main body, an ultraviolet light source is installed in the processing device main body, and The above-mentioned jig pallet consists of a jig stand that is made of metal and has a slit that corresponds to the connecting part between the electrode and the lead and allows ultraviolet light to pass through, and a transparent plate that is integrated on the jig stand. 2. The lead connection method according to claim 1, wherein the processing device main body has slits corresponding to the slits of the jig pallet. (4) Place a Teflon plate between the pressure member and the lead,
2. The lead connection method according to claim 1, wherein the lead and the electrode are brought into pressure contact through the Teflon plate.