JPS62239595A - Lead connection - Google Patents
Lead connectionInfo
- Publication number
- JPS62239595A JPS62239595A JP8287686A JP8287686A JPS62239595A JP S62239595 A JPS62239595 A JP S62239595A JP 8287686 A JP8287686 A JP 8287686A JP 8287686 A JP8287686 A JP 8287686A JP S62239595 A JPS62239595 A JP S62239595A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode
- jig
- electrodes
- ultraviolet light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004809 Teflon Substances 0.000 claims description 8
- 229920006362 Teflon® Polymers 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、特にディスプレイパネルの透明電極へ複数の
リード線を接続する場合に用いて好適なリード接続方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead connection method particularly suitable for connecting a plurality of lead wires to transparent electrodes of a display panel.
従来の技術
たとえば、液晶ディスプレイパネルや、ELデイスプレ
イパネルの電極は、一般にガラス板に5n02.工TO
等の導電膜で形成され、したがって駆動回路へ電気的に
接続するためには、駆動回路から延在したフレキシブル
基板を機械的に上記ディスプレイの電極に圧接するか、
もしくは上記電極上にNi、Au、Cr等の金属膜を形
成しておき、これと上記フレキシブル基板とをはんだ付
は固定する方法が用いられた。BACKGROUND OF THE INVENTION For example, electrodes for liquid crystal display panels and EL display panels are generally formed on a glass plate using a 5N02. Engineering TO
Therefore, in order to electrically connect to the drive circuit, a flexible substrate extending from the drive circuit is mechanically pressed against the electrodes of the display, or
Alternatively, a method has been used in which a metal film of Ni, Au, Cr, etc. is formed on the electrode, and this and the flexible substrate are fixed by soldering.
しかしながら、前者の圧接する方法においては、バネ材
等の圧接手段が必要となり、ディスプレイの小型、薄型
化を実現することができないという問題がある。また、
後者のディスプレイの電極上に金属膜を形成する方法は
、材料や設備がおおがかりとなり、この工程でのコスト
高を招くという問題を有する。However, the former method of press-contact requires a press-contact means such as a spring material, and there is a problem in that it is not possible to make the display smaller and thinner. Also,
The latter method of forming a metal film on the electrodes of a display has the problem that materials and equipment are required, leading to increased costs in this process.
これらの問題を解決する方法として、特開昭60−12
6894号公報(特願昭58−235301号)にみら
れるように、ディスプレイの電極とリードとを圧接し、
これを光硬化性樹脂で覆い硬化せしめ、これにより電極
とリードとを電気的に接続する方法が提案されている。As a method to solve these problems,
As seen in Publication No. 6894 (Japanese Patent Application No. 58-235301), the electrodes of the display and the leads are brought into pressure contact,
A method has been proposed in which this is covered with a photocurable resin and cured, thereby electrically connecting the electrode and the lead.
これを第7図に示す。まず、基板1に形成した電極2と
リード3とを位置合わせし、圧接する。そののち、基板
1上の電極2およびリード3を含めて光硬化性樹脂4で
覆い、紫外光を照射せしめて硬化させる。光硬化性樹脂
4の硬化により基板1の電極2とリード3の圧接した領
域は少なくとも樹脂で永久的に固定されることになるた
め、電気的に接続を完了することになる。This is shown in FIG. First, the electrodes 2 formed on the substrate 1 and the leads 3 are aligned and pressed together. Thereafter, the electrodes 2 and leads 3 on the substrate 1 are covered with a photocurable resin 4 and cured by irradiation with ultraviolet light. By curing the photocurable resin 4, the areas where the electrodes 2 and the leads 3 of the substrate 1 are in pressure contact are permanently fixed at least with the resin, thus completing the electrical connection.
この方法を実用的なレベルに発展させたものとして第8
図に示す方法を本発明者らは考案した。This method has been developed to a practical level.
The present inventors devised the method shown in the figure.
この方法は加圧部材5を構成するコ字状体の先端に透明
板、たとえばガラス板6を一体化し、この加圧部材6お
よび透明板6にて、光硬化性樹脂(紫外線硬化型アクリ
レート樹脂)4が塗布された電極2上にリード3を圧接
し、所定の時間圧接してから、紫外光をライトガイド(
図示せず)により、加圧部材6と透明板6との間に導き
、透明板6を介して光硬化型樹脂4に照射し、これを硬
化させ、リード3と電極2とを電気的に接続するもので
ある。In this method, a transparent plate, for example, a glass plate 6, is integrated with the tip of a U-shaped body constituting the pressure member 5, and the pressure member 6 and the transparent plate 6 are made of a photocurable resin (ultraviolet curable acrylate resin). ) 4 is applied onto the electrode 2, and after keeping the lead 3 in pressure contact for a predetermined period of time, ultraviolet light is applied to the light guide (
(not shown) is guided between the pressure member 6 and the transparent plate 6, and the photocurable resin 4 is irradiated through the transparent plate 6 to cure it, thereby electrically connecting the lead 3 and the electrode 2. It is something that connects.
発明が解決しようとする問題点
しかるに、第8図に示す方法は加圧部材5で透明板6の
両端を極部的に押圧する形となるため、リード3と電極
2との接着部分の全長にわたって均一に圧接力が加わら
ず、このため透明板6の略中央部に位置する光硬化型樹
脂4が電極2とり一ド3の間から逃げきらず、両者の間
にとどまシ両者の間の抵抗が増すという問題点があった
。Problems to be Solved by the Invention However, in the method shown in FIG. 8, both ends of the transparent plate 6 are pressed locally using the pressure member 5. Pressure force is not applied uniformly over the area, and as a result, the photocuring resin 4 located approximately in the center of the transparent plate 6 cannot escape from between the electrodes 2 and 3, and remains between the two, resulting in a resistance between the two. There was a problem with the increase in
本発明は上記問題点を解決するもので、電極とリードの
接着部分の全長にわたって均一に圧接力を加えることが
でき、それでいて光硬化型樹脂を効果的に硬化させるこ
とのできるリード接続方法を提供しようとするものであ
る。The present invention solves the above-mentioned problems, and provides a lead connection method that can uniformly apply a pressure contact force over the entire length of the bonded portion between the electrode and the lead, and that can effectively cure the photocurable resin. This is what I am trying to do.
問題点を解決するだめの手段
本発明のリード接続方法は上記問題点を解決するために
、透明基板に形成された電極上に光硬化型樹脂を塗布し
、この電極上に複数のリードを位置合わせし、加圧部材
にてリードと電極とを所定の時間圧接し、その後圧接状
態を保持しながら電極および基板の下方より紫外光を照
射し、光硬化型樹脂を硬化せしめ、電極とリードとを電
気的に接続するものである。Means for Solving the Problems In order to solve the above problems, the lead connection method of the present invention coats a photocurable resin on an electrode formed on a transparent substrate, and positions a plurality of leads on this electrode. The leads and electrodes are pressed together for a predetermined period of time using a pressure member, and then, while maintaining the pressure contact state, ultraviolet light is irradiated from below the electrodes and substrate to harden the photocurable resin and bond the electrodes and leads together. It electrically connects the
作 用
本発明のリード接続方法によれば、リードと電極とを、
リードの上から加圧部材にて圧接し、電極の下方より紫
外光を照射するようにしているため、リードと電極との
圧接部分全長にわたって均一に圧接力を加えることがで
き、リードと電極との間の光硬化型樹脂を両者の間から
押し出すことができ、リードと電極との電気的接続を良
好に行なうことができるものである。Function: According to the lead connection method of the present invention, the lead and the electrode are connected to each other.
Since the lead is pressed from above with a pressure member and UV light is irradiated from below the electrode, pressure can be applied uniformly over the entire length of the pressure contact between the lead and electrode. The photocurable resin between the leads and the electrodes can be extruded from between the leads and the electrodes, thereby achieving good electrical connection between the leads and the electrodes.
実施例
以下本発明のリード接続方法の一例を第1図〜第4図を
用いて説明する。ここでは、液晶ディスプレイパネルの
電極にフィルムキャリアのリードを接続する場合を例に
とって説明する。図中1゜は液晶ディスプレイパネル、
10aはこの液晶ディスプレイパネル1oを構成する一
方の透明板よりなる基板で、たとえばプラスチック、ア
クリル。EXAMPLE An example of the lead connection method of the present invention will be described below with reference to FIGS. 1 to 4. Here, an example will be explained in which the leads of a film carrier are connected to the electrodes of a liquid crystal display panel. 1° in the figure is the liquid crystal display panel,
Reference numeral 10a denotes a substrate made of one transparent plate constituting this liquid crystal display panel 1o, and is made of, for example, plastic or acrylic.
エポキシ、ポリイミド、テフロン等の有機材料や、ガラ
ス板等の無機材料で構成することができる。It can be made of organic materials such as epoxy, polyimide, and Teflon, or inorganic materials such as glass plates.
この透明基板10 aの上面に複数の透明電極11を形
成している。この電極11はS no2.I T O等
の導電膜で形成される。一方、12はこの複数の電極1
1に対応して形成された半導体素子をパッケージングす
るだめのフィルムキャリアで、たとえばポリイミドフィ
ルム12aの一面に銅箔をエツチング加工してリード1
2bを形成してなる。A plurality of transparent electrodes 11 are formed on the upper surface of this transparent substrate 10a. This electrode 11 is S no 2. It is formed of a conductive film such as ITO. On the other hand, 12 is the plurality of electrodes 1
A film carrier for packaging a semiconductor element formed in accordance with lead 1, for example, by etching copper foil on one surface of a polyimide film 12a.
2b is formed.
なお、リード12bの先端には、Auメッキ処理が施さ
れている。Note that the ends of the leads 12b are plated with Au.
このリード12bと電極11とを電気的に接続する。ま
ず、基板10aおよび複数の電極11上に第3図に示す
ように光硬化型絶縁樹脂、たとえば紫外線硬化型変性ア
クリレート系樹脂13を塗布し、この各電極11上にフ
ィルムキャリア12の各リード12bを位置合わせする
。この状態で金属製の加圧部材14にてリード12bの
上から、リード12bと電極11とを圧接する。リード
12bと電極11を所定の時間(たとえば約16秒)、
加圧し、その後加圧した状態で基板10aの下方より上
記圧接部分に紫外光源16より紫外光を照射し、光硬化
型絶縁樹脂13を硬化させる。This lead 12b and electrode 11 are electrically connected. First, as shown in FIG. 3, a photo-curable insulating resin, such as an ultraviolet-curable modified acrylate resin 13, is applied onto the substrate 10a and a plurality of electrodes 11, and each lead 12b of the film carrier 12 is coated on each electrode 11. Align. In this state, the metal pressure member 14 presses the lead 12b and the electrode 11 from above the lead 12b. The lead 12b and the electrode 11 are connected for a predetermined period of time (for example, about 16 seconds).
Pressure is applied, and then, in the pressurized state, ultraviolet light is irradiated from the ultraviolet light source 16 to the pressed portion from below the substrate 10a to harden the photocurable insulating resin 13.
以上基本的な接続方法を説明したが、実際には液晶ディ
スプレイパネル1oは治具、さらには加工装置本体の上
に載置して上記接続作業を行なう。Although the basic connection method has been described above, in reality, the liquid crystal display panel 1o is placed on a jig or further on a processing device main body to perform the above connection work.
本例では第1図、第3図に詳細に示すように、液晶ディ
スプレイパネル10を治具パレット16の上に位置決め
して載置し、さらに紫外光源16を内蔵する加工装置本
体17の上に上記治具パレット16を位置決めして載置
する。そして、このとき加工装置本体17内の紫外光源
15の紫外光がリード12bと電極11との接続部分に
到達できるように、まず治具パレット16は、上記リー
ド12bと電極11との接続部分に対応して紫外光の通
過を許すスリット18を設けた金属製の治具台16aと
、この治具台16a上に一体化された透明板、たとえば
ガラス板16bとにより構成し、また加工装置本体17
にも治具台16aと同様に紫外光の通過を許すスリット
19を設けている。In this example, as shown in detail in FIGS. 1 and 3, the liquid crystal display panel 10 is positioned and placed on a jig pallet 16, and is further placed on a processing device main body 17 that contains an ultraviolet light source 16. The jig pallet 16 is positioned and placed. At this time, the jig pallet 16 is first placed at the connection portion between the lead 12b and the electrode 11 so that the ultraviolet light from the ultraviolet light source 15 in the processing device main body 17 can reach the connection portion between the lead 12b and the electrode 11. It consists of a metal jig stand 16a provided with a corresponding slit 18 that allows ultraviolet light to pass through, and a transparent plate, for example, a glass plate 16b, integrated on the jig stand 16a, and a processing apparatus main body. 17
Similarly to the jig table 16a, a slit 19 is provided for allowing ultraviolet light to pass through.
ここでは、液晶ディスプレイパネル1oの基板10 a
の三辺におのおの電極11を形成していることより、こ
れらに対応して三個のスリットを治具台16a、加工装
置本体17におのおの形成している。Here, a substrate 10a of a liquid crystal display panel 1o
Since the electrodes 11 are formed on each of the three sides, three slits are formed in the jig table 16a and the processing device main body 17 in correspondence with these.
このような装置において、液晶ディスプレイパネル1o
を治具パレット16上に位置決めし、さらに治具パレッ
ト16を加工装置本体17に位置決めしておいて、上記
電極11および基板10a上に光硬化型絶縁樹脂13を
塗布し、第1図、第2図に示すようにキャリアフィルム
12の各リード12bを複数の電極11と位置合わせす
る。次に加圧部材14を下降せしめて、リード12bの
上から、電極11とリード12bとを圧接する。In such a device, a liquid crystal display panel 1o
is positioned on the jig pallet 16, and the jig pallet 16 is further positioned on the processing device main body 17, and the photocurable insulating resin 13 is applied onto the electrode 11 and the substrate 10a, and the process shown in FIGS. As shown in FIG. 2, each lead 12b of the carrier film 12 is aligned with the plurality of electrodes 11. Next, the pressure member 14 is lowered to press the electrode 11 and the lead 12b into contact with each other from above the lead 12b.
所定の時間、圧接して光硬化型絶縁樹脂13の大部分を
各電極11の間に押し出してから、紫外光源15を動作
させ、スリット19,18、透明板16b、基板10
aを通して紫外光を光硬化型樹脂13に照射し、光硬化
型絶縁樹脂13を硬化させて電極11とリード12bと
の電気的接続を完了する。第4図はその状態を示すもの
で、電極11とリード12bとは主に、並列に並ぶ電極
11およびリード12b同士の間に位置する光硬化型絶
縁樹脂13によって接続される。After pressing for a predetermined time to push out most of the photocurable insulating resin 13 between the electrodes 11, the ultraviolet light source 15 is operated to remove the slits 19, 18, transparent plate 16b, and substrate 10.
The photocurable insulating resin 13 is irradiated with ultraviolet light through a, thereby curing the photocurable insulating resin 13 and completing the electrical connection between the electrode 11 and the lead 12b. FIG. 4 shows this state, and the electrodes 11 and leads 12b are connected mainly by the photocurable insulating resin 13 located between the electrodes 11 and leads 12b arranged in parallel.
かかる方法によれば、加圧部材14によって、リード1
2bと電極11との接続部分をその全長にわたって均一
に圧接することができるため、リード12bと電極11
との間の光硬化型絶縁樹脂13は殆んど両者の間から追
い出され、並列に位置する電極11およびリード12b
同士の間に位置することになり、両者の電気的接続が極
めて良好となる。なお、フィルムキャリア12において
、リード12bに対しては接続部分を除きはんだレジス
ト膜2oが施されている。According to this method, the lead 1 is
Since the connecting portion between the lead 12b and the electrode 11 can be uniformly pressed over the entire length, the connection between the lead 12b and the electrode 11
Most of the photocurable insulating resin 13 between the two is expelled from between the electrodes 11 and leads 12b located in parallel.
The electrical connection between the two is extremely good. In addition, in the film carrier 12, a solder resist film 2o is applied to the leads 12b except for the connecting portions.
第6図、第6図に他の実施例を示す。上記した第1図〜
第4図に示す実施例において、金属性加圧部材14の加
圧面が平滑であれば、全リードと電極に対して圧接力は
均一となるが、そうでないときは均一な圧接力は得にく
いという問題がある。Other embodiments are shown in FIGS. Figure 1 above
In the embodiment shown in FIG. 4, if the pressing surface of the metallic pressure member 14 is smooth, the pressing force will be uniform for all the leads and electrodes, but if it is not, it will be difficult to obtain a uniform pressing force. There is a problem.
また、圧接時、一部のリード12bの上に塵めいが付着
していると、このときも全リードと電極に対して均一な
圧接力を加えることはできなくなる。Furthermore, if dust adheres to some of the leads 12b during press-contact, it becomes impossible to apply a uniform press-contact force to all the leads and electrodes at this time as well.
第6図、第6図に示す方法はこの問題点を解決するもの
である。The method shown in FIGS. 6 and 6 solves this problem.
第5図、第6図において第1図〜第4図と同一物には同
一番号を付して詳細な説明は省略する。In FIGS. 5 and 6, the same parts as in FIGS. 1 to 4 are given the same numbers and detailed explanations will be omitted.
図中、第1図〜第4図に示す実施例と異なる点は、加圧
部材14にてリード12bを直接押圧するのではなく、
加圧部材14とリード12bとの間にテフロン板21を
配して、テフロン板21を介してリード12bと電極1
1とを圧接するようにした点である。上記テフロン板2
1は加圧部材14の加圧面に接着固定しておいてもよい
が、交換できるように取付けておくのが望ましい。In the figure, the difference from the embodiment shown in FIGS. 1 to 4 is that the pressure member 14 does not directly press the lead 12b.
A Teflon plate 21 is arranged between the pressure member 14 and the lead 12b, and the lead 12b and the electrode 1 are connected via the Teflon plate 21.
1 and 2 are in pressure contact with each other. Above Teflon plate 2
1 may be adhesively fixed to the pressure surface of the pressure member 14, but it is preferable to attach it so that it can be replaced.
かかる構成によれば、加圧部材14の加圧面の平滑度が
不十分であっても、また一部のリード12b上にチリ等
が付着していてもテフロン板21がこれを吸収するため
、全リード12bと電極11に対し均一な圧接力を加え
ることができ、より良好な電気的接続が可能となる。ま
た、第1図〜第4図の例では加圧部材14に光硬化型樹
脂側脂13が付着する場合もあったが、かかるテフロン
板21を用いることによりこのような問題点もなくなり
、より一層、接続作業が良好に行えるものである。According to this configuration, even if the pressure surface of the pressure member 14 has insufficient smoothness, or even if dust or the like adheres to some of the leads 12b, the Teflon plate 21 absorbs this. Uniform contact force can be applied to all leads 12b and electrodes 11, allowing better electrical connection. In addition, in the examples shown in FIGS. 1 to 4, there were cases where the photocurable resin side fat 13 adhered to the pressure member 14, but by using such a Teflon plate 21, such problems are eliminated and the problem becomes more Furthermore, the connection work can be performed more favorably.
なお、図示していないが、第1図〜第6図においてフィ
ルムキャリヤ12のリード12bの先端の変形を防止す
るため、全てのリード12bの先端をポリイミドで結合
するようにしてもよい。Although not shown, in order to prevent the tips of the leads 12b of the film carrier 12 from being deformed in FIGS. 1 to 6, the tips of all the leads 12b may be bonded with polyimide.
発明の効果
以上のように、本発明によれば、リードと電極とを加圧
部材で圧接し、電極の下方より紫外光を照射して光硬化
型樹脂傳脂を硬化せしめ、リードと電極との電気的接続
をはかるようにしているため、全リードと電極とに対し
均一な圧接力を加えることができ、両者の良好な電気的
接続をはかることができる。Effects of the Invention As described above, according to the present invention, a lead and an electrode are brought into pressure contact with each other using a pressure member, and ultraviolet light is irradiated from below the electrode to harden the photocurable resin, thereby bonding the lead and the electrode together. Since the electrical connection is achieved, a uniform pressure contact force can be applied to all the leads and electrodes, and a good electrical connection between them can be achieved.
第1図は本発明の一実施例におけるリード接続方法を示
す側面断面図、第2図は第1図の要部町面図、來3図は
同リード接続方法が適用される液晶ディスプレイパネル
を含む構成を示す斜視図、第4図はリードと電極との接
続状態を示す正面断面図、第5図は本発明の他のリード
接続方法の一例を示す側面断面図、第6図は第6図の場
合のリードと電極との接続状態を示す正面断面図、第7
図、第8図はおのおの従来のリード接続方法を示す断面
図である。
10a・・・・・・基板、11・・・・・・電極、12
・・・・・・キャリアフィルム、12b・・・・・・リ
ード、13・山・・光硬化型樹脂、14・・・・・・加
圧部材、15・・・・・・紫外光源、16・・・・・・
治具パレット、18.19・・・・・・スリット。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名嬉3
図
第4図
業外光礫
第5図
第6図Fig. 1 is a side sectional view showing a lead connection method according to an embodiment of the present invention, Fig. 2 is a top view of the main part of Fig. 1, and Fig. 3 shows a liquid crystal display panel to which the lead connection method is applied. 4 is a front sectional view showing the connection state between the leads and electrodes, FIG. 5 is a side sectional view showing an example of another lead connection method of the present invention, and FIG. A front cross-sectional view showing the connection state between the lead and the electrode in the case shown in Fig. 7.
8 are sectional views each showing a conventional lead connection method. 10a...Substrate, 11...Electrode, 12
...Carrier film, 12b...Lead, 13. Mountain...Photo-curing resin, 14...Pressure member, 15...Ultraviolet light source, 16・・・・・・
Jig pallet, 18.19...slit. Name of agent: Patent attorney Toshio Nakao and one other person
Figure 4 Figure 5 Figure 6
Claims (4)
化型絶縁樹脂を塗布し、この電極上にリードを位置合わ
せし、加圧部材によって上記リードと電極とを圧接し、
その後圧接状態を保持しながら上記透明基板の下方より
紫外光を照射して上記光硬化型絶縁樹脂を硬化せしめ、
上記電極とリードとを電気的に接続するようにしたリー
ド接続方法。(1) Coating a photocurable insulating resin on at least an electrode formed on a transparent substrate, aligning a lead on this electrode, and pressing the lead and electrode together with a pressure member;
After that, while maintaining the pressed state, UV light is irradiated from below the transparent substrate to harden the photocurable insulating resin,
A lead connection method that electrically connects the electrode and the lead.
して載置され、上記治具パレットの下方に紫外光源が設
置されるとともに、上記治具パレットは、金属性をなし
電極とリードとの接続部分に対応して紫外光の通過を許
すスリットを有する治具台と、この治具台上に一体化さ
れた透明板とより構成されてなる特許請求の範囲第1項
記載のリード接続方法。(2) The transparent substrate is positioned and placed on at least a jig pallet, an ultraviolet light source is installed below the jig pallet, and the jig pallet is made of metal and is connected to electrodes and leads. 2. The lead connection method according to claim 1, comprising: a jig stand having slits that allow ultraviolet light to pass through corresponding to the parts; and a transparent plate integrated onto the jig stand.
れ、上記治具パレットは金属性加工装置本体に位置決め
して載置され、この加工装置本体内に紫外光源が設置さ
れるとともに、上記治具パレットは、金属性をなし電極
とリードとの接続部分に対応して紫外光の通過を許すス
リットを有する治具台と、この治具台上に一体化された
透明板とより構成され、上記加工装置本体は上記治具パ
レットのスリットに対応してスリットを形成してなる特
許請求の範囲第1項記載のリード接続方法。(3) The transparent substrate is positioned and placed on a jig pallet, the jig pallet is positioned and placed on a metal processing device main body, an ultraviolet light source is installed in the processing device main body, and The above-mentioned jig pallet consists of a jig stand that is made of metal and has a slit that corresponds to the connecting part between the electrode and the lead and allows ultraviolet light to pass through, and a transparent plate that is integrated on the jig stand. 2. The lead connection method according to claim 1, wherein the processing device main body has slits corresponding to the slits of the jig pallet.
このテフロン板を介してリードと電極とを圧接するよう
にしたことを特徴とする特許請求の範囲第1項記載のリ
ード接続方法。(4) Place a Teflon plate between the pressure member and the lead,
2. The lead connection method according to claim 1, wherein the lead and the electrode are brought into pressure contact through the Teflon plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8287686A JPS62239595A (en) | 1986-04-10 | 1986-04-10 | Lead connection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8287686A JPS62239595A (en) | 1986-04-10 | 1986-04-10 | Lead connection |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62239595A true JPS62239595A (en) | 1987-10-20 |
Family
ID=13786490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8287686A Pending JPS62239595A (en) | 1986-04-10 | 1986-04-10 | Lead connection |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62239595A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049821A (en) * | 1990-04-27 | 1992-01-14 | Kaijo Corp | Bonding device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109190A (en) * | 1983-11-18 | 1985-06-14 | アルプス電気株式会社 | Method of connecting terminal |
JPS60133681A (en) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | Electrically connecting method |
-
1986
- 1986-04-10 JP JP8287686A patent/JPS62239595A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60109190A (en) * | 1983-11-18 | 1985-06-14 | アルプス電気株式会社 | Method of connecting terminal |
JPS60133681A (en) * | 1983-12-21 | 1985-07-16 | 株式会社精工舎 | Electrically connecting method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049821A (en) * | 1990-04-27 | 1992-01-14 | Kaijo Corp | Bonding device |
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