JPS62132331A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS62132331A
JPS62132331A JP27372085A JP27372085A JPS62132331A JP S62132331 A JPS62132331 A JP S62132331A JP 27372085 A JP27372085 A JP 27372085A JP 27372085 A JP27372085 A JP 27372085A JP S62132331 A JPS62132331 A JP S62132331A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
resin
wirings
electrode
chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27372085A
Other versions
JPH0682708B2 (en )
JPS62132331K1 (en )
Inventor
Hiroaki Fujimoto
Kenzo Hatada
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

PURPOSE: To improve the reliability of manufacturing a semiconductor device by disposing a resin used at the time of securing a semiconductor device to a circuit board only at substantially center of the device, and filling the resin in the remaining gap, thereby raining the bonding strength of the wirings to a LSI chip.
CONSTITUTION: Substantially the center of a portion to be secured with a LSI chip is coated with a resin 3 after a substrate 1 having wirings 2. The chip 4 is positioned at its electrode 5 to wirings 2' of the substrate 1, and pushed to be contacted with the substrate 1 by a pressing tool 6. At this time, the resin 3 is spread, but the electrode 5 is not covered with the resin 3, thereby obtaining a contact of the electrode 5 of the chip 4 with the wirings 2' in high reliability. A resin 7 is filled in a gap between the chip 4 and the substrate 1 to obtain a rigid bonding. The resin 7 may be different in components from the resin 3. Since the electrode 5 and the wirings 2 are contacted by the bonding strength of the resin 3 at this time, the resin 7 is not introduced to between the electrode 5 and the wirings 2. A protecting resin 8 is eventually formed.
COPYRIGHT: (C)1987,JPO&Japio
JP27372085A 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device Expired - Lifetime JPH0682708B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27372085A JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27372085A JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Publications (3)

Publication Number Publication Date
JPS62132331A true true JPS62132331A (en) 1987-06-15
JPS62132331K1 JPS62132331K1 (en) 1987-06-15
JPH0682708B2 JPH0682708B2 (en) 1994-10-19

Family

ID=17531619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27372085A Expired - Lifetime JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Country Status (1)

Country Link
JP (1) JPH0682708B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (en) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd Manufacture of semiconductor device
JPH01272491A (en) * 1988-04-25 1989-10-31 Seiko Instr Inc Mounting structure of semiconductor
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
JP2010040566A (en) * 2008-07-31 2010-02-18 Dainippon Printing Co Ltd Production method of electronic circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (en) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd Manufacture of semiconductor device
JPH0551179B2 (en) * 1986-01-22 1993-07-30 Fuji Xerox Co Ltd
JPH01272491A (en) * 1988-04-25 1989-10-31 Seiko Instr Inc Mounting structure of semiconductor
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
US6206066B1 (en) 1995-12-15 2001-03-27 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting an electronic component
US6527905B1 (en) * 1995-12-15 2003-03-04 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic components and apparatus and dispenser used in the method
JP2010040566A (en) * 2008-07-31 2010-02-18 Dainippon Printing Co Ltd Production method of electronic circuit board

Also Published As

Publication number Publication date Type
JPH0682708B2 (en) 1994-10-19 grant
JPS62132331K1 (en) 1987-06-15 grant

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term