JPS62132331A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS62132331A
JPS62132331A JP27372085A JP27372085A JPS62132331A JP S62132331 A JPS62132331 A JP S62132331A JP 27372085 A JP27372085 A JP 27372085A JP 27372085 A JP27372085 A JP 27372085A JP S62132331 A JPS62132331 A JP S62132331A
Authority
JP
Japan
Prior art keywords
resin
wirings
electrode
chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27372085A
Other versions
JPH0682708B2 (en
JPS62132331K1 (en
Inventor
Hiroaki Fujimoto
Kenzo Hatada
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP27372085A priority Critical patent/JPH0682708B2/en
Publication of JPS62132331A publication Critical patent/JPS62132331A/en
Publication of JPS62132331K1 publication Critical patent/JPS62132331K1/en
Publication of JPH0682708B2 publication Critical patent/JPH0682708B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

PURPOSE: To improve the reliability of manufacturing a semiconductor device by disposing a resin used at the time of securing a semiconductor device to a circuit board only at substantially center of the device, and filling the resin in the remaining gap, thereby raining the bonding strength of the wirings to a LSI chip.
CONSTITUTION: Substantially the center of a portion to be secured with a LSI chip is coated with a resin 3 after a substrate 1 having wirings 2. The chip 4 is positioned at its electrode 5 to wirings 2' of the substrate 1, and pushed to be contacted with the substrate 1 by a pressing tool 6. At this time, the resin 3 is spread, but the electrode 5 is not covered with the resin 3, thereby obtaining a contact of the electrode 5 of the chip 4 with the wirings 2' in high reliability. A resin 7 is filled in a gap between the chip 4 and the substrate 1 to obtain a rigid bonding. The resin 7 may be different in components from the resin 3. Since the electrode 5 and the wirings 2 are contacted by the bonding strength of the resin 3 at this time, the resin 7 is not introduced to between the electrode 5 and the wirings 2. A protecting resin 8 is eventually formed.
COPYRIGHT: (C)1987,JPO&Japio
JP27372085A 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device Expired - Lifetime JPH0682708B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27372085A JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27372085A JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Publications (3)

Publication Number Publication Date
JPS62132331A true JPS62132331A (en) 1987-06-15
JPS62132331K1 JPS62132331K1 (en) 1987-06-15
JPH0682708B2 JPH0682708B2 (en) 1994-10-19

Family

ID=17531619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27372085A Expired - Lifetime JPH0682708B2 (en) 1985-12-05 1985-12-05 A method of manufacturing a semiconductor device

Country Status (1)

Country Link
JP (1) JPH0682708B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (en) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd Manufacture of semiconductor device
JPH01272491A (en) * 1988-04-25 1989-10-31 Seiko Instr Inc Mounting structure of semiconductor
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
JP2010040566A (en) * 2008-07-31 2010-02-18 Dainippon Printing Co Ltd Production method of electronic circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (en) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd Manufacture of semiconductor device
JPH0551179B2 (en) * 1986-01-22 1993-07-30 Fuji Xerox Co Ltd
JPH01272491A (en) * 1988-04-25 1989-10-31 Seiko Instr Inc Mounting structure of semiconductor
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
US6206066B1 (en) 1995-12-15 2001-03-27 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting an electronic component
US6527905B1 (en) * 1995-12-15 2003-03-04 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic components and apparatus and dispenser used in the method
JP2010040566A (en) * 2008-07-31 2010-02-18 Dainippon Printing Co Ltd Production method of electronic circuit board

Also Published As

Publication number Publication date
JPH0682708B2 (en) 1994-10-19
JPS62132331K1 (en) 1987-06-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term