JPH059031B2 - - Google Patents
Info
- Publication number
- JPH059031B2 JPH059031B2 JP12606286A JP12606286A JPH059031B2 JP H059031 B2 JPH059031 B2 JP H059031B2 JP 12606286 A JP12606286 A JP 12606286A JP 12606286 A JP12606286 A JP 12606286A JP H059031 B2 JPH059031 B2 JP H059031B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- pressure
- group
- resin
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ELデイスプレイパネルや液晶デイ
スプレイパネルと、これを駆動する半導体素子の
電極から延在した配線リードとの接続方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of connecting an EL display panel or a liquid crystal display panel to a wiring lead extending from an electrode of a semiconductor element that drives the display panel.
従来の技術
近年、液晶デイスプレイパネルやELデイスプ
レイパネルを用いて、画像表示や文字表示する機
器が増加している。これらデイスプレイパネルは
肉厚を薄くできる特徴はあるものの、鮮明な画像
や高精細度のキヤラクターを表示する場合、前記
デイスプレイパネルに形成されている走査線の数
を増やさなければならない。この事は、液晶デイ
スプレイやELデイスプレイがよりCRTの表示性
能に接近し、附加価値を高めるうえでも不可欠の
事である。ところが、前記走査線の数を増やして
しまうと、デイスプレイパネルの電極数も比例し
て増大する。電極数の増大は、これを駆動するた
めの駆動用のLSIの数も増大する結果となるもの
である。BACKGROUND ART In recent years, the number of devices that display images and characters using liquid crystal display panels and EL display panels has increased. Although these display panels have the feature that they can be made thinner, in order to display clear images or high-definition characters, it is necessary to increase the number of scanning lines formed on the display panel. This is essential for liquid crystal displays and EL displays to approach the display performance of CRTs and increase added value. However, if the number of scanning lines is increased, the number of electrodes of the display panel will also increase proportionally. An increase in the number of electrodes results in an increase in the number of driving LSIs for driving the electrodes.
したがつて、液晶デイスプレイパネルやELデ
イスプレイパネルの性能向上を計ろうとすれば、
必然的に、前記駆動用LSIとデイスプレイパネル
の電極との接続点数が増え、信頼性を低下さす原
因となるばかりか、実装コストが著しく増大し、
実用化をはばむ原因となつている。 Therefore, if you are trying to improve the performance of LCD display panels or EL display panels,
Inevitably, the number of connection points between the driving LSI and the electrodes of the display panel increases, which not only causes a decrease in reliability, but also significantly increases mounting costs.
This is a cause that hinders practical application.
発明が解決しようとする問題点
第２図で従来の方法を説明する。例えば液晶デ
イスプレイ２０上に形成した電極２１と駆動用
LSIが搭載されたフイルムリード２２とを接合す
る場合、前記液晶デイスプレイ２０上の電極上に
光硬化性樹脂２３を塗布し（第２図ａ）、加圧治
具２４を降下２５せしめ、加圧しながら紫外線を
デイスプレイ２０の裏面から照射２６し、前記フ
イルムリード２２と電極２１上の光硬化性樹脂２
３を加圧によつて一部除去すると共に、樹脂を硬
化する（第２図ｂ）。この時、光硬化性樹脂２３
は加圧治具２４により一部除去されるため第２図
ｂの如く加圧治具２４の壁面に沿つて盛り上つた
状態２３′となる。硬化した光硬化性樹脂が加圧
治具２４の壁面を覆つているために、加圧治具２
４を上昇２６せしめる時に硬化した樹脂に応力が
作用し、フイルムリード２２と液晶デイスプレイ
２０の電極２１の接合面が剥れ（第２図ｃ）、初
期の目的を達し得ない。これは加圧治具を上昇す
る時に加圧治具の壁面に付着した光硬化性樹脂
が、加圧治具の上昇を妨げるために発生するもの
で、フイルムリードと電極間の接触抵抗の増大を
まねき、電気的特性を損ねるばかりか、著しい場
合には、液晶デイスプレイを破損するものであつ
た。Problems to be Solved by the Invention The conventional method will be explained with reference to FIG. For example, electrodes 21 formed on the liquid crystal display 20 and driving
When bonding the film lead 22 on which the LSI is mounted, a photocurable resin 23 is applied onto the electrodes on the liquid crystal display 20 (FIG. 2a), and the pressure jig 24 is lowered 25 to apply pressure. UV rays are irradiated 26 from the back side of the display 20 while the photocurable resin 2 on the film leads 22 and the electrodes 21 is exposed.
3 is partially removed by applying pressure, and the resin is cured (FIG. 2b). At this time, the photocurable resin 23
is partially removed by the pressure jig 24, resulting in a raised state 23' along the wall surface of the pressure jig 24 as shown in FIG. 2b. Since the hardened photocurable resin covers the wall surface of the pressure jig 24, the pressure jig 2
4 is raised 26, stress acts on the hardened resin, and the bonding surface between the film lead 22 and the electrode 21 of the liquid crystal display 20 peels off (FIG. 2c), making it impossible to achieve the initial purpose. This occurs because the photocurable resin that adheres to the wall of the pressure jig when the pressure jig is raised prevents the pressure jig from rising, increasing the contact resistance between the film lead and the electrode. This not only impairs the electrical characteristics but also damages the liquid crystal display in severe cases.
本発明はこのような従来の問題に鑑み、デイス
プレイパネルと回路基板のリード群を光硬化性樹
脂で接合する際に、より信頼性の高い接続を得る
事を目的とする。 In view of these conventional problems, it is an object of the present invention to obtain a more reliable connection when bonding lead groups of a display panel and a circuit board using a photocurable resin.
問題点を解決するための手段
本発明は、デイスプレイパネル等の電極とリー
ド群との間に絶縁樹脂を介在させ、加圧しながら
紫外線照射させる接続方法において、前記加圧治
具の端面が加圧方向に対しテーパを有した治具を
用いる構成であつて、接続の信頼性を高めんとす
るものである。Means for Solving the Problems The present invention provides a connection method in which an insulating resin is interposed between an electrode of a display panel or the like and a lead group, and ultraviolet rays are irradiated while pressurizing the end face of the pressurizing jig. This configuration uses a jig tapered in the direction, and is intended to improve the reliability of the connection.
作 用
本発明によれば、治具が加圧方向に対しテーパ
を有するため、硬化後容易に治具をとることが可
能となる。Effect According to the present invention, since the jig has a taper with respect to the pressing direction, it becomes possible to easily remove the jig after curing.
実施例
第１図で本発明の接続方法の実施例を説明す
る。液晶デイスプレイ２０上にITO膜で形成した
電極２１が設けられており、前記電極２１上に光
硬化型の絶縁性樹脂２３を塗布する。次に駆動用
LSIが接続されたフイルムリード群２２と前記電
極２１とを位置合せ、加圧治具１４を降下させる
（第１図ａ）。本発明の特徴である加圧治具１４は
加圧するフイルムリード群の方向にその端面がテ
ーパを有すると共に、治具全体あるいは治具の表
面がテフロン等の前記絶縁性樹脂に対し付着力の
弱い材料で構成されている。また加圧治具１４の
硬度は少なく共前記リード群の材料とほぼ等しい
か、高目の値を有する。これは、加圧時に、前記
加圧治具の硬度がフイルムリード群の材料よりも
小さいと、フイルムリード群間に前記加圧治具が
入りこみ、加圧治具を取去る時、フイルムリード
群も同時に引きはがしてしまうことになる。Embodiment An embodiment of the connection method of the present invention will be explained with reference to FIG. An electrode 21 formed of an ITO film is provided on the liquid crystal display 20, and a photocurable insulating resin 23 is applied onto the electrode 21. Next for driving
The film lead group 22 connected to the LSI and the electrode 21 are aligned, and the pressing jig 14 is lowered (FIG. 1a). The pressing jig 14, which is a feature of the present invention, has an end face tapered in the direction of the film lead group to be pressurized, and the entire jig or the surface of the jig has a weak adhesion force to the insulating resin such as Teflon. Composed of materials. Further, the hardness of the pressing jig 14 is low, and both have a hardness that is approximately equal to or higher than that of the material of the lead group. This is because when the pressure is applied, if the hardness of the pressure jig is smaller than the material of the film lead group, the pressure jig gets stuck between the film lead groups, and when the pressure jig is removed, the film lead group It will also be torn off at the same time.
電極上に塗布される絶縁性樹脂２３はエポキシ
系、アクリル系、シリコン系、ブタジエン系、ポ
リイミド系等の光硬化性樹脂で、硬化の主体が紫
外線によるものであるが、熱硬化性を一部併用し
た樹脂も用いる事ができる。また、絶縁性樹脂２
３の塗布は、デイスプレイの電極上あるいはフイ
ルムリード群２２側に塗布しても良い。更にフイ
ルムリード群２２は例えば、Cu箔にAuめつき処
理した構成を用いれば、著しく高い信頼性を得る
事ができる。 The insulating resin 23 applied on the electrode is a photocurable resin such as epoxy, acrylic, silicone, butadiene, or polyimide, and is cured mainly by ultraviolet rays, but some thermosetting resins are used. A resin used in combination can also be used. In addition, insulating resin 2
The coating No. 3 may be applied on the electrodes of the display or on the film lead group 22 side. Further, if the film lead group 22 is made of, for example, Cu foil plated with Au, extremely high reliability can be obtained.
次に第１図ｂの如く、加圧した状態で、デイス
プレイパネル２０の裏面より紫外線を照射２６
し、前記光硬化性の絶縁性樹脂を硬化させ、終れ
ば加圧治具１４を上昇２５′させる（第１図ｃ）。
この時、硬化した絶縁性樹脂２３″は加圧治具１
４の壁面に付着するが、前記加圧治具１４の表面
がテフロン系の材質で構成され、しかも壁面がテ
ーパを有するため、加圧治具１４は容易に上昇で
き、硬化した絶縁性樹脂２３″にストレスを与え
る事がないものである。 Next, as shown in FIG.
Then, the photocurable insulating resin is cured, and when the cure is completed, the pressing jig 14 is raised 25' (FIG. 1c).
At this time, the hardened insulating resin 23'' is
However, since the surface of the pressure jig 14 is made of Teflon-based material and the wall surface has a taper, the pressure jig 14 can be easily lifted, and the cured insulating resin 23 ``It does not cause stress.
また前記フイルムリード群２２のデイスプレイ
パネル２０の電極２１と接する面は少なく共凹凸
を有し、電極２１面とフイルムリード群２２の凹
凸で形成される凹部には前記絶縁性樹脂が存在
し、これがフイルムリード群と電極とを固着する
作用をし、凸部が電極表面と接し、これによつて
電気的接続を可能ならしめるものである。 Further, the surface of the film lead group 22 that is in contact with the electrode 21 of the display panel 20 has a small amount of unevenness, and the insulating resin is present in the recess formed by the surface of the electrode 21 and the unevenness of the film lead group 22. This serves to fix the film lead group and the electrode, and the protrusion comes into contact with the electrode surface, thereby enabling electrical connection.
発明の効果
加圧治具の壁面がテーパを有するために、加
圧および樹脂の硬化後に前記加圧治具を取去る
時に、容易に加圧治具を硬化した樹脂領域から
抜き取る事ができ、接合されたフイルムリード
群とデイスプレイパネルの電極間に応力を作用
させる事がないため、信頼性の高い接続を得る
ことができる。Effects of the Invention Since the wall surface of the pressure jig has a taper, when the pressure jig is removed after pressure is applied and the resin is cured, the pressure jig can be easily pulled out from the cured resin area. Since no stress is applied between the bonded film lead group and the electrodes of the display panel, a highly reliable connection can be obtained.
また、加圧治具が前記絶縁性樹脂に対し、付
着しにくい材料、例えばテフロン等で構成され
るため、前記加圧治具により加圧し、樹脂を硬
化した後の、加圧治具の抜き取りが著しく応力
が少ない状態で行なえ信頼性の高い接続を得る
ことができる。 In addition, since the pressure jig is made of a material that does not easily adhere to the insulating resin, such as Teflon, the pressure jig can be removed after applying pressure with the pressure jig and curing the resin. This can be done with significantly less stress and a highly reliable connection can be obtained.
第１図は本発明の一実施例での接続工程を示す
図、第２図は従来の接続工程を示す図である。
１４……加圧治具、２０……デイスプレイパネ
ル、２１……電極、２２……フイルムリード群、
２３……絶縁性樹脂、２６……光照射。
FIG. 1 is a diagram showing a connecting process in an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional connecting process. 14... Pressure jig, 20... Display panel, 21... Electrode, 22... Film lead group,
23... Insulating resin, 26... Light irradiation.
Claims (1)
つ、加圧方向に対し端面がテーパを有した加圧治
具を用い、配線リード群と基板電極との間に絶縁
性樹脂を介して、前記加圧治具で圧接し、前記絶
縁性樹脂を硬化せしめ、前記配線リード群と基板
電極とを電気的に接続することを特徴とするリー
ド群の接続方法。 ２ 加圧治具がテフロン系で構成される事を特徴
とする特許請求の範囲第１項記載のリード群の接
続方法。 ３ 絶縁性樹脂が少なくとも光硬化性を有するこ
とを特徴とする特許請求の範囲第１項記載のリー
ド群の接続方法。 ４ 配線リードの基板電極と接する面に凹凸が形
成されている事を特徴とする特許請求の範囲第１
項記載のリード群の接続方法。[Claims] 1. Using a pressure jig that is made of a material to which insulating resin does not adhere after curing and whose end face is tapered in the direction of pressure, an insulating material is created between the wiring lead group and the substrate electrode. A method for connecting a group of leads, characterized in that the group of wiring leads and the substrate electrode are electrically connected by applying pressure with the pressure jig through a resin and curing the insulating resin. 2. The method for connecting a group of leads according to claim 1, wherein the pressure jig is made of Teflon. 3. The method for connecting a group of leads according to claim 1, wherein the insulating resin has at least photocurability. 4. Claim 1, characterized in that the wiring lead has irregularities formed on the surface in contact with the substrate electrode.
How to connect the lead group described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606286A JPS62280887A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606286A JPS62280887A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62280887A JPS62280887A (en) | 1987-12-05 |
| JPH059031B2 true JPH059031B2 (en) | 1993-02-03 |
Family
ID=14925682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12606286A Granted JPS62280887A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62280887A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2662598B2 (en) * | 1989-03-08 | 1997-10-15 | 日立化成工業株式会社 | Circuit connection device |
| JPH03125441A (en) * | 1989-10-09 | 1991-05-28 | Rohm Co Ltd | Manufacture of electronic parts |
-
1986
- 1986-05-30 JP JP12606286A patent/JPS62280887A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62280887A (en) | 1987-12-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |