JPS62283581A - Joint apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a bonding device for bonding electrodes and leads on a substrate made of a translucent material while maintaining continuity.

Conventional technology In recent years, as circuits have become thinner, in addition to mechanical bonding and soldering, a method of bonding using photocurable resin has been devised as a method of bonding electrodes and leads while maintaining continuity. , a joining device has been made using that method.

An example of the above-mentioned conventional bonding device using photocurable adhesive will be described below with reference to the drawings.

FIG. 5 shows a schematic diagram of a conventional bonding device using photocurable resin. In FIG. 5, 14 is a base, 15 is a substrate made of a transparent material, 16 is an electrode on the substrate 15, 17 is a lead connected to the electrode 16, and 18 is an electrode 16 and υ to 17
19 is a releasable pressure piece that is placed on the joint between the electrode 16 and the lead 17 to correct bias in pressure and facilitate peeling; 20 is a releasable pressure piece 19
21 is a pressure tool attached to the glass plate 20 offset from the position of the releasable pressure piece 19; 22 is a pressure tool 21;
23 is a bracket that fixes the air cylinder, and 24 is an ultraviolet irradiation device that passes through the glass plate and cures the photocurable resin 18 at the joint between the electrode 16 and the lead 1a. A photocurable resin 18 is applied to the electrode 16 of the substrate 15, the lead 17 is positioned, and a releasable pressure piece 19 is placed on the joint. The pressure tool 21 is lowered by the air cylinder 22, and the releasable pressure piece 19 is pressed by the glass plate 2o. An ultraviolet ray irradiation device 24 irradiates the glass plate 20 with ultraviolet rays from above. When the photocurable resin 18 is cured, the pressure tool 21 is raised. Problems to be Solved by the Invention However, in the above configuration, the releasable pressure piece 19
Since the pressure tool 21 is offset from the part where the electrode 1e and lead 17 are processed via the glass plate 2o, the glass plate 2o is deformed by the moment, and there is a problem that uniform and stable pressure cannot be applied. was.

Furthermore, since the glass plate 2o is pressurized, there is also the problem that it may break during use.

In view of the above-mentioned problems, the present invention provides a welding device that can perform uniform and stable pressurization and has a pressurizing tool with excellent durability.

Means for Solving the Problems In order to solve the above problems, the bonding apparatus of the present invention includes a means for applying a photocuring resin to the leads and electrodes on a substrate made of a transparent material, and a means for coating the leads and electrodes in one direction. means for pressurizing;
This structure includes a light irradiation means that irradiates light from the opposite direction through the substrate. In addition to the above configuration, a second aspect of the present invention is provided with means for cooling or insulating the light between the leads and electrodes and the light irradiation means.

Operation According to the above-described configuration, the pressure sole of the present invention can press the electrode and the lead from an offset direction, so that uniform and stable pressure contact can be performed. Furthermore, since light such as ultraviolet light is irradiated onto the electrodes and leads from the direction opposite to the pressing direction, the pressing tool does not need to be transparent.
Since it can be made from metal, it won't break like when glass plates are used.

According to the second aspect of the present invention, the heat generated from the light irradiation means can be absorbed or blocked, so that the leads, electrodes, and their connections can be prevented from being adversely affected.

EXAMPLE Hereinafter, a joining apparatus according to an example of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic diagram of a joining device in a first embodiment of the present invention. In Fig. 1, 1 is a base, 2 is a substrate made of a transparent material, 3 is an electrode on the substrate 2, 4 is a lead that is connected to the electrode 3, and 5 is a photocuring resin that connects the electric sign 3 and the lead 4. , 6 is a releasable pressurizing piece that corrects bias in the pressurizing force and facilitates peeling, or a metal pressurizing tool that presses the electrode 3 and the lead 4 via the releasable pressurizing piece 6 , 8 9 is an air cylinder that moves the pressure tool 7 up and down, and 9 is a bracket that fixes the air cylinder 8. The center line of the pressure tool 7 is the electrode 3 and lead 4
is on the pressure contact point.

1o is an ultraviolet irradiation device that cures the photocurable resin 5 through the substrate 2. The ultraviolet light from this ultraviolet irradiation device 1° passes through the transparent hole 3o of the paste 1 and the substrate 2, reaches the photocurable resin 6, and cures it.

The operation of the bonding apparatus configured as described above will be described below with reference to FIGS. 2 and 3.

As shown in FIG. 2, a photocuring resin 5 is applied to the electrode 3. A lead 4 is supplied above the electrode 3 and below the pressure tool and the releasable pressure piece 6, and placed on the electrode 3.

As shown in FIG. 3, a pressure tool 7 and a releasable pressure piece 6
is lowered, and the electrode 3 and lead 4 are brought into contact with each other. Ultraviolet irradiation device 10) Cures the photocurable resin 5. The pressure tool 7 and the releasable pressure piece 6 are raised.

As described above, according to this embodiment, uniform and stable bonding is achieved by applying pressure to the electrodes and leads from directly above using a pressure tool and a releasable pressure piece, and by making the pressure tool from metal. This also extends the life of the pressure tool.

Note that in the first embodiment, the photocuring resin was applied to the electrode and then the leads were placed thereon, but it may be applied after the leads are placed thereon.

Next, a second embodiment of the present invention will be described with reference to the drawings.

FIG. 4 is a schematic diagram of a joining device in a second embodiment of the present invention. In the figure, reference numeral 11 is a water cooling jacket that is located between the base 1 and the ultraviolet irradiation device 10 and has an opening 12 in a portion through which ultraviolet rays pass, and a hollow portion 13 other than which water flows. The water cooling jacket 11 absorbs the heat generated from the ultraviolet irradiation device 1o and prevents it from being transmitted from the base 1 to the upper part. Therefore, there is no adverse effect on the substrate 2 or on the bonding between the electrode 3 and the lead 4.

In place of a cooling means such as the water cooling jacket 11, a heat insulating means can also be used.

Effects of the Invention As described above, according to the present invention, it is possible to uniformly and stably bond the electrode and the lead, and the pressurizing means can be made of metal, thereby improving durability.

Further, according to the second aspect of the present invention, it is possible to prevent the heat generated from the light irradiation device from having an adverse effect on the objects to be bonded and the bonding thereof.

[Brief explanation of drawings]

FIG. 1 is a schematic side view of a bonding device according to a first embodiment of the present invention, FIGS. 2 and 3 are schematic side views showing steps of the bonding device according to the first embodiment, and FIG. 4 is a schematic side view of a bonding device according to a first embodiment of the present invention. FIG. 5 is a schematic side view of a bonding device in the second embodiment, and FIG. 5 is a schematic side view of a conventional bonding device. 2...Substrate, 3...Electrode, 4...
...Lead, 6...Photocuring resin, 6...
・Releasable pressure piece, 7... Pressure tool, 10...
...UV irradiation device. Name of agent: Patent attorney Toshio Nakao and 1 other person2-
Class 1 J-・Electrode C-19t5)? +10,000 p no E3 so 7-1 xuan pressure sole 8--1 T shilling Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) A means for applying photocurable resin to the leads and electrodes on a substrate made of a translucent material, a means for pressurizing the leads and electrodes from one direction, and a light irradiation means for irradiating light from the opposite direction through the substrate. A joining device characterized by comprising: (2) means for applying photocurable resin to the leads and electrodes on the substrate made of a translucent material; means for pressurizing the leads and electrodes from one direction; and light irradiation means for irradiating light from the other direction through the substrate; A bonding device comprising a means for cooling or insulating heat between the light irradiation means and the leads and electrodes.