JPH08146451A - Apparatus for producing circuit device - Google Patents

Abstract

PURPOSE: To provide an apparatus for producing a circuit device with which connection having sufficient strength of adhesion and electrical characteristics is realized at a temp. lower than heretofore. CONSTITUTION: This apparatus has a pressing tool 5 to execute impression of ultrasonic waves by pressing an electrode terminal part 2 and a wiring pattern 14 to be electrically connected thereto in a direction of bringing both into tight contact with each other in the state of superposing both on each other via an anisotropically conductive film or anisotropically conductive adhesive layer 3 interposed therebetween and a photoirradiation means for heating the regions where the electrode terminal part 2 and the wiring pattern 14 to be electrically connected thereto are superposed via the anisotropically conductive film or anisotropically conductive adhesive layer 4 by photoirradiation. The electrode terminal part 2 and the wiring pattern 14 to be electrically connected thereto are brought into tight contact with each other by adhering the anisotropically conductive film or anisotropically conductive adhesive 3 by the pressing tool 5 and are heated by ultrasonic impression and photoirradiation by the photoirradiation means, by which both are electrically and mechanically joined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit device manufacturing apparatus used for manufacturing an electronic circuit device.

[0002]

2. Description of the Related Art For example, an active matrix type color liquid crystal display panel has a so-called CF substrate (substrate on which a color filter is formed) 12 and a TFT substrate 1 (switching thin film transistor) as shown in a schematic sectional view of FIG. The substrate on which the liquid crystal 1 is formed and the liquid crystal 1
3 is sealed. In this case, for example, electrode pad portions 2 to which external wirings are connected are formed on the side edge portions of the TFT substrate 1, and the electrode pad portions 2 are formed by, for example, FPC.
A wiring pattern 14 as an external wiring formed on the (flexible printed board) 4 is connected via an anisotropic conductive film or an anisotropic conductive adhesive 3.

The FPC 4 is formed by adhering a copper foil on a flexible substrate made of, for example, a sheet-shaped polyimide with an adhesive, and pattern-etching the copper foil to form a required wiring pattern 14.

Further, as shown in FIG. 6A, the anisotropic conductive film 3A is formed in an insulating material 3c made of, for example, a thermosetting (epoxy, urethane, acrylic) binder or a thermoplastic (polyvinyl, butyral) binder. For example, the anisotropic conductive adhesive 3B shown in FIG. 6 is formed by dispersing conductive fine particles 3g of carbon, metal (nickel, solder, silver), or plastic plating (gold plating) in a sheet shape.
As shown in B, for example thermosetting (epoxy, urethane, acrylic) adhesives or thermoplastics (polyvinyl,
Butyral) An insulating agent 3c made of an adhesive is mixed and dispersed with 3 g of conductive fine particles made of carbon, metal (nickel, solder, silver) or plastic plating (gold plating).

Generally, the FPC and the electrode pad are bonded to each other in the anisotropic conductive film or the anisotropic conductive adhesive by pressurizing and heating the bonding part, that is, the overlapping part of the electrode pad and the FPC. The electrically conductive fine particles are used to electrically connect the electrode pad portion to the corresponding wiring pattern on the FPC, and mechanically bond the insulating film of the anisotropic conductive film or the anisotropic conductive adhesive. . At this time, an anisotropic conductive film or an anisotropic conductive adhesive may be temporarily pressure-bonded to the joint portion of the wiring pattern of the FPC in advance.

For joining the FPC and the electrode pad portion, for example, as shown in FIG. 6A, the anisotropic conductive film 3A is arranged on the wiring pattern 14 of the FPC 4, and the FPC 4 is connected via the anisotropic conductive film 3A. A method of heating and pressing with a pressing tool 5 in a direction in which the TFT substrate 1 and the TFT substrate 1 are brought into close contact with each other, or as shown in FIG. 6B, an anisotropic conductive adhesive 3B is applied to cover the wiring pattern 14 of the FPC 4, and this anisotropic conductive adhesive 3B is applied. By the method of heating and pressing by the flat pressing end surface of the pressing tool 5 in the direction in which the FPC 4 and the TFT substrate 1 are brought into close contact with each other via the conductive conductive adhesive 3B. In this way, as shown in FIG. 7, the electrode pad portion 2 and the FPC 4 are formed by the conductive fine particles 3g in the anisotropic conductive film 3A or the anisotropic conductive adhesive 3B.
The anisotropic conductive film 3A or the anisotropic conductive adhesive 3B is electrically connected to the corresponding wiring pattern 14 above.
The insulating material 3c is used for mechanical joining.

At this time, pressurization and heating are performed at a high temperature and a high pressure in order to shorten the working time. However, in this case, the joint and its surroundings are damaged by heat, and T
TF due to cracking or high temperature of the glass substrate that constitutes the FT substrate
Deterioration of characteristics of T, discoloration of CF and deterioration of liquid crystal are observed. Further, although low-temperature curing FPC is adopted to perform the joining, good electrical and mechanical joining is not achieved in this case. Further, the width and length to be joined require a width of several hundred μm and a length of several mm in order to obtain a sufficiently small electric connection resistance and a sufficiently high adhesive strength. This is a factor that hinders the improvement of production and the improvement of yield.

Further, since the pressing end surface of the pressing tool 5 for joining the above-mentioned electrode pad portion 2 and the wiring pattern 14 of the FPC 4 has a flat shape, if the heights of the electrode pad portions 2 are not uniform, It is not parallel to the pressing end surface of the pressing tool 5. Even when the electrode pad portion 2 is not installed correctly, the electrode pad portion 2 and the pressing end surface of the pressing tool 5 are not parallel to each other. At this time, there are places that are strongly pressed and places that are not pressed so much among many electrode pad portions.

Further, since the pressing is uniformly performed on the flat pressing end surface, the anisotropic conductive film 3A or the anisotropic conductive adhesive 3B is not pressed sufficiently between the adjacent electrode pad portions 2, The pressing force is dispersed, and the pressure applied to the electrode pad portion 2 and the wiring pattern 14 of the FPC 4 corresponding thereto is not sufficient, which makes it difficult to effectively perform the joining.

Further, the electrode pad portion 2 and the anisotropic conductive film 3A
Alternatively, when the pressing force applied to the anisotropic conductive adhesive 3B and the FPC 4 is not sufficient, the contact between the conductive fine particles 3g, the electrode pad portion 2 and the wiring pattern 14 becomes insufficient,
Particularly, when the conductive fine particles are not sufficiently dispersed, a gap is generated between the conductive fine particles, and the electrical connection resistance increases. Therefore, it is necessary to select a material having good dispersion in the conductive fine particles, which causes a cost increase.

As described above, in the conventional structure, for example, TF due to a high temperature is applied to the connection between the electrode pad portion and the wiring pattern in the manufacture of a circuit device such as a liquid crystal display panel.
There are problems that the characteristics of T, CF, and liquid crystal are poor, that mechanical bonding strength that is sufficiently high for bonding the electrode pad portion and the wiring pattern cannot be obtained, and that the resistance of the electrical connection portion increases.

[0012]

DISCLOSURE OF THE INVENTION The present invention proposes an apparatus for manufacturing a circuit device which solves the above-mentioned inconvenience and realizes an electrical connection having sufficient bonding (adhesion) strength and excellent electrical characteristics at a lower temperature than before. To do.

[0013]

In the apparatus of the present invention, ultrasonic waves are applied while pressing with a pressing tool at the time of joining.

The first aspect of the present invention has a pressing tool to which ultrasonic waves are applied to press-bond the electrode pad portion and a wiring pattern to be electrically connected to the electrode pad portion, and heating means for heating the joint portion. The configuration.

In the second aspect of the present invention, as shown in FIG. 1, the electrode pad portion 2 and the wiring pattern 14 to be electrically connected to the electrode pad portion 2, for example, the wiring pattern on the FPC 4 are anisotropic conductive films or different. A pressing tool 5 to which ultrasonic waves are applied to press in a direction in which they are in close contact with each other in an overlapping state with the interposition of a conductive conductive adhesive layer 3, an electrode pad portion 2, and wiring to be electrically connected to this. Light irradiation means for heating the region superposed with the pattern 14 with the anisotropic conductive film or the anisotropic conductive adhesive layer 3 interposed therebetween is irradiated with light.

With this device, the electrode pad portion 2
And the wiring pattern 14 to be electrically connected thereto are brought into close contact with each other by the pressing tool 5 through the anisotropic conductive film or the anisotropic conductive adhesive 3, and ultrasonic wave application and light irradiation by light irradiation means are performed. Electrical and mechanical joining is performed by heating.

In the third aspect of the present invention, as shown in FIG. 2, the electrode pad portion 2 and the wiring pattern 14 to be electrically connected to the electrode pad portion 2, for example, the wiring pattern on the FPC 4 are anisotropic conductive films or different. A pressing tool 5 to which ultrasonic waves are applied to press in a direction in which they are in close contact with each other in an overlapping state with the interposition of a conductive conductive adhesive layer 3, an electrode pad portion 2, and wiring to be electrically connected to this. It is configured to have a heating means for performing constant heating or pulse heating on a region overlapped with the anisotropic conductive film or anisotropic conductive adhesive layer 3 with the pattern 14.

With this device, the electrode pad portion 2
And the wiring pattern 14 to be electrically connected thereto are brought into close contact with each other by the pressing tool 5 via the anisotropic conductive film or the anisotropic conductive adhesive 3 and electrically and by applying ultrasonic waves and heating by a heating means. Perform mechanical joining.

As shown in FIG. 4, in the fourth aspect of the present invention, in the above-mentioned apparatus of the present invention, the pressing end surface of the pressing tool 5 is provided with the convex portion 11 arranged corresponding to the plurality of the electrode pad portions 2. And

[0020]

According to the above-mentioned structure of the present invention, the electrode pad portion 2
By applying ultrasonic waves while heating and pressing the wiring pattern 14 and the wiring pattern 14 with the pressing tool 5 at the time of joining, the joining can be reliably performed at a temperature lower than that of the conventional device, and damage to the surroundings is reduced. We were able to.

Further, according to the fourth aspect of the present invention, the pressing end surface of the pressing tool is provided with the projection corresponding to the electrode pad portion, so that a stronger pressing force is applied to each electrode pad portion than when the pressing end surface is flat. And the mechanical and electrical bond strength of the joint was improved.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the manufacturing apparatus of the present invention will be described in detail below with reference to the drawings.

In this embodiment, the liquid crystal display panel described with reference to FIG. 5 is manufactured. In this case, as described above, for example, the FPC as an external wiring is provided on the side edge portion of the TFT substrate 1.
This is the case where 4 is electrically and mechanically joined.

Example 1 In this example, an ultrasonic wave is applied and pressed under heating by light irradiation to electrically and mechanically bond the ultrasonic wave. As shown in FIG. 1, this apparatus includes a pressing tool 5 having a flat pressing end surface capable of applying ultrasonic waves while pressing the joint portion thereof, and a light beam 6 (for example, YAG laser, xenon lamp, halogen). (Which can be generated by a lamp or the like), a condensing lens 7 that allows the light beam 6 to pass through and irradiates the junction from obliquely above, and a condensing lens 7 disposed below the condensing lens 7 It comprises a light irradiation means including a shield glass 8 for protection. Next, the electrode pad portion 2 and the FPC 4 on the TFT substrate 1 by this device are
A method of joining with the upper wiring pattern 14 will be described.
A wiring pattern 14 on the FPC 4 to which the electrode pad section 2 is to be connected via the anisotropic conductive film 3 having a thickness of 30 μm on the electrode pad section 2 on the TFT substrate 1 installed in this device.
The FPC 4 is placed so that they face each other. Light beam 6
Is generated, and the joint portion is sufficiently heated by irradiating it obliquely from above through the condensing lens 7, then the pressing tool 5 is lowered from above, and pressing is performed from above the FPC 4, and from the pressing tool 5 to the joint portion. Apply ultrasonic waves. The electrically conductive particles 3g in the anisotropic conductive film 3 electrically connect the electrode pad portion 2 and the corresponding wiring pattern 14 on the FPC 4, and the insulating material 3c in the anisotropic conductive film 3 is melted and cured to mechanically. Join.

In this example, the light beam is emitted from obliquely above the joint, but it may be emitted from below the joint. Irradiation can also be performed diagonally above and below simultaneously. This is because the electrode pad portion of the TFT substrate is made of a transparent conductive film such as an ITO (composite oxide of indium and tin) film, so that the light beam is transmitted. Thereby, the bonded portion of the anisotropic conductive film can be heated.

Example 2 This example is an apparatus for performing joining by heating a pressing tool, applying ultrasonic waves, and pressing. As shown in FIG. 2, this device is capable of applying ultrasonic waves while pressing the joint portion, and further has a heater 9 by resistance heating inside the press portion to heat the joint portion. It consists of a flat pressing tool 5. Next, a method of joining the electrode pad portion 2 on the TFT substrate and the wiring pattern 14 on the FPC 4 by this device will be described. The FPC to be connected to the electrode pad portion 2 on the TFT substrate 1 installed in this device via the anisotropic conductive film 3 having a thickness of 30 μm
FPC so that the wiring patterns 14 on 4 are opposed to each other.
Place 4. Push down the pressing tool 5 from above, and
While pressing from above 4, ultrasonic waves are applied from the pressing tool 5 to the joint. At the same time, the heater 9 in the pressing tool heats the joint. In this way, the conductive particles 3 g in the anisotropic conductive film 3 are connected to the electrode pad portion and F
The electrical connection with the corresponding wiring pattern 14 on the PC 4 and the insulating material 3c in the anisotropic conductive film 3 are melted and hardened to perform mechanical joining.

In this example, a heater is provided in the pressing tool 5 to heat the joint portion.
A configuration may be adopted in which a heater is provided as an external heating means for heating.

Example 3 This example is an apparatus in which a pressing tool presses a part of a plurality of electrode pad parts and repeats this to connect the entire electrode pad part to a wiring pattern. As shown in FIG. 3, this apparatus applies a ultrasonic wave while pressing a holding jig 10 for fixing a substrate connected to the electrode pad portion 2 and an electric and mechanical joint portion as in the first embodiment. It comprises a rod-shaped pressing tool 5 and a light irradiating means for irradiating the light beam 6 obliquely from above to heat the joint. Next, a method of joining the electrode pad portion 2 on the TFT substrate and the wiring pattern 14 on the FPC 4 by this device will be described. The wiring pattern 14 on the FPC 4 to which the electrode pad portion 2 is to be bonded is opposed to the electrode pad portion 2 on the TFT substrate 1 installed in this device via the anisotropic conductive film 3A having a thickness of 30 μm. And put the FPC4. The FPC 4 is pressed and fixed from above the FPC 4 by the holding jig 10. After the rod-shaped pressing tool 5 is first aligned with the position of the electrode pad portion 2 to be connected, at the same time, similarly to the first embodiment, the light beam 6 is irradiated obliquely from above to heat the bonding portion, and then from above. The FPC 4 is lowered and pressed from above the FPC 4, and ultrasonic waves are applied from the pressing tool 5 to the joint portion including the connecting portion.

In this way, after a part of the electrode pad portion 2 is connected to the wiring pattern 14 of the FPC 4, the pressing tool 5 is raised to align with the position of the electrode pad portion 2 to be connected next. Then, the pressing tool 5 is lowered again, and heating is performed by pressing, applying ultrasonic waves, and irradiating a light beam. This is sequentially repeated to electrically and mechanically bond the entire electrode pad portion 2.

Here, the holding jig 10 is used to prevent the substrates from being deviated and inclined when the parts are pressed and joined.

In the third embodiment, the heating method by the same light beam as in the first embodiment is used, but the same heating method by a heater or the like as in the second embodiment can be adopted.

Example 4 In this example, the pressing end surface of the pressing tool has a convex portion corresponding to each electrode pad portion. As shown in FIG. 4, this device is a device in which the pressing end surface of the pressing tool 5 has a convex portion slightly larger than the size of the electrode pad portion. Similar to the above-described embodiment, the thickness 30 is formed on the electrode pad portion 2 on the TFT substrate 1.
A 3 μA anisotropic conductive film is covered, and an FPC 4 is placed thereon. As shown in FIG. 4, pressing and ultrasonic wave application are performed from above the FPC 4 by the pressing tool 5 whose pressing end surface has the unevenness 11 matching the shape of the electrode pad portion 2.
Here, the depth of the groove of the concave portion is thinner than that of the anisotropic conductive film 10 to 2
The width of the convex portion is set to 0 μm, which is larger than the width of the electrode pad portion.

As a result, the conductive fine particles between the electrode pad portions 2 are not crushed, but are heated and pressed to some extent to secure the adhesive strength and maintain a high insulation resistance between the electrode pad portions 2. Further, the restrictions on the dispersion of the conductive fine particles and the particle diameter are reduced, and the pitch of the electrode pad portions 2 and the manufacturing cost can be reduced.

The method of applying ultrasonic waves and the method of heating can be the same as those in the above-described first and second embodiments. According to this example, the portion of the anisotropic conductive film 3A above the electrode pad portion 2 can be selectively pressed and heated.

The above-mentioned embodiment is an example of the present invention.
Various other configurations are possible without departing from the scope of the present invention.

The heating in each of the above embodiments can be carried out either by continuous heating in which constant heating is continuously performed or by pulse heating in which heating is periodically performed at regular intervals. Pulse heating has the advantages that the temperature rises faster and the bonding speed also increases.

The above example is an example in which the electrode pad portion of the TFT substrate is joined to the FPC through the anisotropic conductive film. However, as the electrode pad portion, for example, an element having an electrode pad portion by a lead ball or bump is used. The device of the present invention can be similarly applied to the connection with the wiring pattern of the substrate on which this element is mounted. TAB (Tape automated Bondi
ng), it is also effective when bonded to a stud bump / plating bump electrode portion of a silicon chip via an anisotropic conductive film.

Furthermore, the MCM substrate and the TFT using α-Si
Even when the bare chip is bonded to the substrate via the anisotropic conductive adhesive, the effects of the present invention can be obtained by applying ultrasonic waves at the same time as heating and pressing.

[0039]

According to the present invention described above, ultrasonic waves are applied simultaneously with heating and pressurization at the time of joining an electrode pad portion made of an anisotropic conductive film to, for example, an FPC substrate, so that a low heating temperature can be achieved. Bonding can be performed, and damage to the bonding portion and the surroundings (glass, liquid crystal, etc.) can be reduced. Further, since the electrical and mechanical joining is surely performed, the area of the joining portion, that is, the width and the length of the joining portion can be further reduced, and as a result, the size of the substrate or the like can be reduced and the yield can be increased. You can

Further, when the pressing end surface of the pressing tool is formed into a shape having unevenness corresponding to the size of the electrode pad portion, the connecting portion with the electrode pad portion is selectively pressed and heated, so that the electrode pad portion The pressing force applied to the anisotropic conductive film is increased, the bonding (adhesion) strength is increased, and the insulation resistance in the anisotropic conductive film can be increased. Further, since the anisotropic conductive film in the joint portion can be efficiently heated, the joint work time can be shortened. Furthermore, as an additional effect, the adhesion of the conductive fine particles in the anisotropic conductive film is improved, so that it is possible to select a conductive material having a low degree of dispersion in the conductive film, and an inexpensive material can be adopted. Therefore, it is possible to reduce the overall cost.

[0041]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a circuit device manufacturing apparatus of the present invention.

FIG. 2 is a cross-sectional view showing another example of the circuit device manufacturing apparatus of the present invention.

FIG. 3 is a cross-sectional view showing still another example of the circuit device manufacturing apparatus of the present invention.

FIG. 4 is a cross-sectional view showing still another example of a device for manufacturing a circuit device of the present invention.

FIG. 5 is a schematic cross-sectional view of an active matrix liquid crystal display panel.

FIG. 6 is a cross-sectional view showing bonding by an A anisotropic conductive film. B is a cross-sectional view showing joining with an anisotropic conductive adhesive.

7 is a cross-sectional view showing a state after joining is completed from the state of FIG.

[Explanation of symbols]

 1 TFT substrate 2 Electrode pad part 3 Anisotropic conductive film or anisotropic conductive adhesive 3A Anisotropic conductive film 3B Anisotropic conductive adhesive 3c Insulating material 3g Conductive fine particles 4 FPC (flexible printed circuit board) 5 Pressing tool 6 Light Beam 7 Condensing Lens 8 Shield Glass 9 Heating Means 10 Holding Tool 11 Pressing Tool Pressing End Face Convex 12 CF Substrate 13 Liquid Crystal Layer 14 Wiring Pattern

Claims (4)

[Claims] 1. A pressing tool to which an ultrasonic wave is applied to press-bond an electrode pad part and a wiring pattern to be electrically connected to the electrode pad part, and a heating means for heating the bonding part. Circuit device manufacturing equipment. 2. An electrode pad portion and a wiring pattern to be electrically connected to the electrode pad portion are pressed in a direction in which they are in close contact with each other with an anisotropic conductive film or an anisotropic conductive adhesive layer interposed therebetween. The ultrasonically applied pressing tool and the electrode pad portion and the wiring pattern to be electrically connected thereto are superposed with the anisotropic conductive film or anisotropic conductive adhesive layer interposed. Light irradiation means for heating a region by light irradiation, and the anisotropic conductive film or anisotropic conductive adhesive for the electrode pad portion and the wiring pattern to be electrically connected thereto by the pressing tool. An apparatus for manufacturing a circuit device, which is characterized in that it is brought into close contact with the substrate by means of an ultrasonic wave and is heated by light irradiation by the light irradiation means to perform electrical and mechanical joining. 3. An electrode pad portion and a wiring pattern to be electrically connected to the electrode pad portion are attached to each other in a state of being superposed with an anisotropic conductive film or an anisotropic conductive adhesive layer interposed therebetween. A pressing tool to which ultrasonic waves for pressing are applied and the electrode pad portion and the wiring pattern to be electrically connected to the electrode pad portion are superposed with the anisotropic conductive film or anisotropic conductive adhesive layer interposed therebetween. A heating means for performing constant heating or pulse heating on the selected region, and the anisotropic conductive film or anisotropic conductive adhesion of the electrode pad portion and the wiring pattern to be electrically connected thereto by the pressing tool. An apparatus for manufacturing a circuit device, which is brought into close contact via a chemical agent to perform electrical and mechanical joining by applying the ultrasonic wave and heating by the heating means. 4. The apparatus for manufacturing a circuit device according to claim 1, wherein the pressing end surface of the pressing tool has a convex portion arranged corresponding to the plurality of electrode pad portions. .