JPH11195860A - Bonding member, multichip module with the bonding member and bonding method using the bonding member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a temporary bonding operation by a simple apparatus and to suppress a rise in the production cost of a multichip module. SOLUTION: When electric elements 2, 3, 4, 5 are bonded to a board 1, an ACF 10 as shown in the figure is used. The ACF 10 is constituted in such a way that a bonding layer 11 which is adhesive at room temperature and an anisotropic conductive layer 12 which is formed by dispersing and mixing conductive particles 12b into and with a resin 12a are laminated. When the electric elements 2, 3, 4, 5 are pressed to the board 1 so as to sandwich the ACF 10, both are bonded temporarily by the adhesive property of the bonding layer 11. Consequently, it is not required to perform a heating operation and a pressurizing operation when both are bonded temporarily as different from an ACF 10 in conventional cases. Both are bonded temporarily by a simple and low-cost apparatus which is provided with only a pressurizing function and which is not provided with a heating function, and a rise in the production cost of a multichip module can be suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive member for adhering two electric components while ensuring the mutual conductivity of the opposing electrodes of the two electric components, a multi-chip module provided with the adhesive member, and The present invention relates to a bonding method using the bonding member.

[0002]

2. Description of the Related Art Conventionally, as an adhesive member for adhering two electric components, which can ensure the conductivity between opposing electrodes of the two electric components, there are solder, a different material, and the like. Anisotropic conductive adhesive (hereinafter referred to as “AC
F ") is used.

FIG. 1 shows an example of a conventional structure in which two electric components (a substrate and an electric element) are bonded by soldering. Reference numeral 1 in the figure denotes a substrate made of glass epoxy, ceramic, or the like. The substrate 1 includes a plurality of electric elements (for example, ICs 2, passive elements 3 such as resistors and capacitors, and mechanical parts 4 such as connectors). 5) is bonded by solder 6. The electrodes 1a, 1b, 1c, 1d and the electrodes 2a, 3a, 4a, 5a are provided on the surface of the substrate 1 and the electric elements 2, 3, 4, 5 so that they face each other in a bonded state. Each is formed.

By the way, such electric elements 2, 3,
When soldering the substrates 4 and 5 to the substrate 1, various methods have been adopted in order to temporarily attach the electric elements 2, 3, 4, and 5 to the substrate 1.

As one of them, as shown in FIG. 2, an adhesive 7 is applied to the surface of the substrate 1 in advance, and the electric elements 2, 3 are mounted by a component mounting apparatus (hereinafter referred to as "mounter"). There is a method of mounting the substrates 4 and 5 at predetermined positions on the substrate 1. According to this method, the electric elements 2, 3, 4, and 5 mounted on the substrate 1 are adhered to the substrate 1 by the adhesive 7 and are temporarily attached.

As another method, as shown in FIG. 3, a creamy solder paste is used for the solder 6, and the electric elements 2, 3, 4, and 4 are mounted by a mounter in the same manner as described above.
5 is mounted at a predetermined position on the substrate 1. According to this method, the electric elements 2, 3, 4, 5 mounted on the substrate 1
Is temporarily attached by the adhesiveness of the solder 6.

On the other hand, the ACF is a resin in which conductive particles are dispersed and mixed in a resin. The ACF secures the conductivity between the electrodes facing each other in the two electric components, and the other electrodes (adjacent electrodes). A multi-chip module (MCM) using the ACF has been used in various fields.
No. 2179 and Japanese Patent Publication No. 61-27902.

Also, a driver IC for a liquid crystal display
When mounting the device, a direction to adopt a COG method using an ACF is being studied.

[0009]

However, when solder is used as an adhesive member, since the solder contains Pb, proper treatment of residues and wastes is required to remove adverse effects on the environment. It is necessary to carry out the process, and there is a problem that the cost is increased and the product cost is increased. In addition, it is necessary to use a flux to activate the surface of the bonding portion, and there is a possibility that fine particles of solder (solder balls) may be generated. However, a cleaning step is required to remove the flux and the solder balls. Therefore, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases. In addition, it is necessary to cover the bonding point with a resin such as epoxy or silicone to protect it from moisture and dust.
As described above, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases. When the pitch of the electrodes is 0.3 mm or less, there is a problem that the solders arranged adjacently adhere to each other, so that the insulation property between the adjacent electrodes cannot be secured. In addition, there is a problem that a defective product is easily generated in the soldering process for various reasons, and the production yield is reduced.

On the other hand, when the above-mentioned ACF is used,
Since the conventional ACF itself did not have adhesiveness at room temperature, the electric elements 2, 3, 4, and 5 were mounted on the substrate 1 (temporarily attached) by mounting the electric elements 2, 3, 4, and 5 on the substrate. 1
Pressurizing and heating while holding the
F was designed to increase the adhesiveness. For this reason, pressurization and heating can be performed, and high accuracy can be maintained even under the pressure (generally about 1 to 5 kgf / cm ² ) and temperature (generally about 80 ± 10 ° C.) which must be applied to the bonded portion. Such a special and expensive mounter is required, and there is a problem that the manufacturing cost is increased. When there are a plurality of ACFs to be bonded to the substrate 1 and the temporary attachment is performed by heating, it is necessary to individually position and heat the ACFs one by one. In such a case, since one heating takes about 1 to 5 seconds,
There is a problem that the time for tacking is considerably long and productivity is deteriorated.

Accordingly, an object of the present invention is to provide an adhesive member that can suppress an increase in product cost.

Another object of the present invention is to provide an adhesive member capable of adhering even an electric element having a narrow electrode pitch.

Another object of the present invention is to provide an adhesive member that prevents a reduction in production yield.

Still another object of the present invention is to provide an adhesive member which can secure both the adhesiveness and anisotropic conductivity of an electric element.

Another object of the present invention is to provide an adhesive member capable of producing a liquid crystal display in which a driver IC and electric elements other than the driver IC are mixed and mounted.

Further, another object of the present invention is to provide a multi-chip module that achieves the various objects described above.

Still another object of the present invention is to provide a bonding method that achieves the various objects described above.

[0018]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and adheres two electric components to each other in a state where the opposing electrodes of the two electric components are kept electrically conductive. The adhesive member comprises: an adhesive layer having tackiness at room temperature; and an anisotropic conductive layer formed by dispersing and mixing conductive particles in a resin.
Bonding the two electrical components, and the anisotropic conductive layer secures the conductivity between the opposing electrodes in the two electrical components and ensures the insulation with the other electrodes,
It is characterized by the following.

Further, the present invention provides a substrate having a plurality of electrodes, a plurality of electric elements having the electrodes, and these substrates and the electric elements with the electrical conductivity between the substrates and the opposing electrodes in the electric elements being ensured. A multi-chip module including an adhesive member for adhering an element, wherein the adhesive member is disposed on the electric element side and has an adhesive layer having tackiness at room temperature; And an anisotropic conductive layer formed by dispersing and mixing conductive particles into the substrate, wherein the adhesive layer bonds the substrate and the electric element, and the anisotropic conductive layer forms the substrate and the electric element. It is characterized in that the conductivity of the opposing electrodes of the element is ensured and the insulation of the other electrodes is ensured.

Further, the present invention relates to a bonding method for bonding a substrate and an electric element in a state where the opposing electrodes of the substrate and the electric element are secured with each other. A step of disposing an anisotropic conductive layer that secures the conductivity of the other electrode while ensuring the conductivity of the electrode on the substrate side, and an adhesive layer having tackiness at room temperature, Disposing the anisotropic conductive layer or the electrode on the electric element side, and laminating these substrates and the electric element such that the electrode on the substrate side and the electrode on the electric element side face each other; Pressurizing and heating a bonding portion between the substrate and the electric element after the overlapping.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
An embodiment of the present invention will be described. Note that the same parts as those shown in FIG.

The bonding member 10 according to the present embodiment is similar to that of FIG.
As shown in the figure, an adhesive layer 11 having tackiness at room temperature
And an anisotropic conductive layer 12 formed by dispersing and mixing conductive particles 12b in a resin 12a. The adhesive layer 11 bonds the two electric components to each other, and The layer 12 ensures conductivity between the electrodes facing each other in the two electric components and also ensures insulation from other electrodes (that is, anisotropic conductivity).

In the present invention, the adhesive layer 1 having tackiness is used.
1 consists of a polymer agent layer which flows at room temperature before curing. In the present invention, as a material of the adhesive layer 11, for example, * SBR, * natural rubber, * polybutyl acrylate, * a so-called pressure-sensitive adhesive (that is, a tackifier is mixed with a silicone resin or a synthetic rubber, And, if necessary, a mixture of a plasticizer and an antioxidant).

Next, a multi-chip module (hereinafter, referred to as “MCM”) formed using the above-mentioned adhesive member will be described with reference to FIG.

The MCM 13 has a plurality of electrodes 1a, 1
b, 1c, 1d and electrodes 2a, 3a, 4
a, 5a and a plurality of electric elements 2, 3, 4, 5 facing each other (1a and 4a, 1b and 2a, 1c and 3a,
These substrates 1 are kept in a state where the conductivity of 1d and 5a) is secured.
And bonding member 10 for bonding electric elements 2, 3, 4, and 5
And The substrate 1, the electric elements 2, 3, 4, 5 and the adhesive member 10 are shown separated for convenience. Also, the electrodes 1a, 1b, 1 on the substrate side
c, 1d are formed at positions facing the electrodes 2a, 3a, 4a, 5a on the electric element side in a state where the electric elements 2, 3, 4, 5 are bonded.

In the MCM 13, the adhesive layer 11 is disposed on the side of the electric elements 2, 3, 4, 5 to bond the substrate 1 and the electric elements 2, 3, 4, 5. The anisotropic conductive layer 12 is disposed on the side of the substrate 1 and opposing electrodes (1a and 4a, 1b and 2a, 1c and 3a,
1d and 5a) are ensured, and the insulation with other electrodes is ensured.

Here, the electrodes 2a, 2a,
When the thicknesses of the electric elements 3a, 4a, and 5a are different from each other, the thickness of the adhesive layer 11 at each of the adhesion points of the electric elements 2, 3, 4, and 5 is changed to the thickness of each electric element adhered to the adhesion point. The thickness is preferably equal to or greater than the thickness of the electrode. In this case, the thickness of the adhesive layer 11 may be substantially uniform over the entire surface of the substrate 1 as a thickness greater than the maximum electrode thickness. As a result, the adhesive layer 11 has a thickness equal to or greater than the thickness of the electrode of the electric element at any location (the entire surface of the substrate 1).

Similarly, the electrodes 2 of the plurality of electric elements are
When the thicknesses of a, 3a, 4a, and 5a are different from each other, the thickness of the adhesive layer at each of the bonding points of the electric elements 2, 3, 4, and 5 is such that the electric elements 2, 3, and 3 are bonded to the bonding points.
If the thickness of the electrodes 2a, 3a, 4a, and 5a is equal to or greater than the thickness of the electrodes 4a and 5a (that is, the thickness of the bonding layer at the bonding portion of the electric element 2 is equal to or greater than the thickness of the electrode 2a, The thickness of the adhesive layer at the position where the electric element 3 is bonded is not less than the thickness of the electrode 3a, the thickness of the adhesive layer at the position where the electric element 4 is bonded is not less than the thickness of the electrode 4a, (If the thickness of the adhesive layer at the position where the electric element 5 is bonded is equal to or greater than the thickness of the electrode 5a), reference numerals 20 and 30 in FIGS.
As shown by, the thickness of the adhesive layer may not be uniform over the entire surface of the substrate 1. The electrode 4a of the electric element 4 and the electrode 5a of the electric element 5 are
When the thickness is larger than the thicknesses a and 3a, the thickness of the adhesive layer where the electric elements 4 and 5 are adhered is made thicker than the location where the electric elements 2 and 3 are adhered according to the thickness of the electrodes 4a and 5a. Is also good.

Examples of the electric element include a semiconductor element such as an IC chip, a passive element such as a resistor and a capacitor, and a mechanical component such as a connector.

As a substrate to which the electric elements 2, 3, 4, 5 are adhered, a liquid crystal display panel 50 (more precisely, a glass substrate 51 as a component of the liquid crystal display panel 50) as shown in FIG. 7 is used. Can be mentioned.

Further, the adhesive layer 11 and the anisotropic conductive layer 12
If these are arranged on the side of the electric elements 2, 3, 4, 5 and the substrate 1, they may be laminated in two layers (see FIG. 4) or not (in other words, the adhesive layer 11 even if another layer is interposed between anisotropic conductive layer 12)
good.

Next, a method of bonding the electric elements 2, 3, 4, and 5 to the substrate 1 will be described.

First, the electrodes 1a, 1b, 1
disposing the anisotropic conductive layer 12 so as to cover c and 1d;
The anisotropic conductive layer 12 or the electrodes 2a, 3 on the electric element side
The adhesive layer 11 is arranged so as to cover a, 4a and 5a.

Next, the electrodes 1a, 1b, 1
c, 1d and the electrodes 2a, 3a, 4a, 5 on the electric element side
a, these substrates 1 and the electric elements 2,
Overlay 3, 4, and 5. Thereby, the substrate 1 and the electric elements 2, 3, 4, and 5 are temporarily attached.

Further, after the overlapping, the substrate 1
And the electric elements 2, 3, 4, 5 are pressed and heated.

Next, effects of the present embodiment will be described.

According to the present embodiment, since the adhesive layer 11 has tackiness at room temperature, the electric elements 2, 3, 4, 5
At the time of mounting (temporary attachment) on the substrate 1, it is only necessary to apply pressure, and heating is unnecessary. Therefore, even if a special mounter capable of heating is not used (that is, even if the device is inexpensive and does not have a heating function like a soldering mounter), temporary mounting is possible, and an increase in manufacturing cost is suppressed. be able to. Further, since it is not necessary to hold the electric elements 2, 3, 4, and 5 until the adhesive member 10 is heated to a predetermined temperature (about 80 ± 10 ° C. as described above), Can be reduced to the same level (about 0.1 to 0.3 seconds) as in the case of soldering. further,
It is possible to avoid deterioration of the tacking position accuracy due to heating.

Further, since there is no need for heating at the time of temporary attachment, the time for temporary attachment can be shortened, and the productivity is improved.

On the other hand, in this embodiment, since solder is not used as the adhesive member, problems inherent in solder can be avoided. That is, there is no need to treat residues and wastes due to the inclusion of Pb, so that costs for the treatment can be saved and an increase in product cost can be suppressed. Further, since there is no use of flux or generation of solder balls, a step of cleaning these is not required, and an increase in manufacturing cost can be suppressed. Further, since almost the entire surface of the substrate 1 is covered with the adhesive layer 11 and the anisotropic conductive layer 12, the substrate 1 is protected from moisture and dust. Can be. Even if the pitch of the electrodes is 0.3 mm or less, insulation between adjacent electrodes can be ensured. Defective products are less likely to occur, and the production yield is improved.

On the other hand, the adhesive member 10 according to the present embodiment includes an adhesive layer 11 for bonding two electric components, and an anisotropic conductive layer 12 formed by dispersing and mixing conductive particles 12b in a resin 12a. And an anisotropic conductive layer 12 is provided so that the anisotropic conductive layer 12 secures the conductivity between the electrodes facing each other in the two electrical components and also secures the insulation from the other electrodes. It has become. Therefore,
Even when a plurality of electric elements 2, 3, 4, 5 having different thicknesses from the electrodes 2a, 3a, 4a, 5a are bonded,
By arbitrarily selecting the particle size of the conductive particles 12b, it is possible to secure both the adhesiveness and the anisotropic conductivity of the electric element (that is, the conductivity between the opposing electrodes and the insulation between other electrodes). . The selection of the resin characteristics is determined by the material of the electric element and the electrode thickness.

Therefore, in a liquid crystal display, a driver IC and an electric element other than the driver IC (for example, a semiconductor element such as a controller IC, a passive element such as a resistor and a capacitor, and a mechanical component such as a connector) can be mounted together. In addition, a liquid crystal display (a so-called system-on-panel) in which these electric elements are mixed and mounted can be produced. That is, according to the present embodiment, it is possible to obtain a low-cost and highly reliable MCM or system-on-panel.

On the other hand, the electrodes 2a, 3 of the plurality of electric elements
In the case where the thicknesses of a, 4a, and 5a are different from each other, and the thickness of the adhesive layer 11 is equal to or more than the maximum electrode thickness and is made substantially uniform over the entire surface of the substrate 1, the electric element The product cost can be reduced while maintaining good adhesion.

[0043]

(Embodiment 1) In this embodiment, as shown in FIG. 7, electric elements 2, 3, 4, 5 such as a driver IC and a controller IC are connected to a glass substrate 51 constituting a liquid crystal display panel 50. Adhered to the surface.

According to this embodiment, various electrical functions can be realized on the panel, and a small, thin, multifunctional liquid crystal display can be provided at low cost. In addition, the same effects as in the above embodiment were obtained. (Embodiment 2) In this embodiment, the AC shown in FIG.
As shown in FIG. 4, a plurality of electric elements 2, 3, 4, and 5 having different electrode thicknesses were bonded to the substrate 1 using F (adhesive member).

The adhesive layer 20 in this ACF is
As shown in FIG. 5 (a), the thickness of the adhesive layer at each of the bonding points of the electric elements 2, 3, 4, and 5 is such that the electrode 2a of each of the electric elements 2, 3, 4, and 5 is bonded to the bonding point. , 3a, 4a, 5
The places where the electric elements 4 and 5 having a large electrode thickness are arranged (see reference numerals 20a and 20c) are arranged so that the electric elements 2 and 3 having a small electrode thickness are arranged so that the thickness becomes larger than the thickness of a. 20b). The adhesive layer 20 and the anisotropic conductive layer 12 are formed on the entire surface of the substrate 1.

In the structure of this embodiment, the adhesive layer has a two-layer structure in the regions 20a and 20c where the adhesive layer is thickened, and the adhesive layer has a single-layer structure in the other regions 20b. Can be achieved by

Such a configuration can be achieved by forming the adhesive layer 20 and the anisotropic conductive layer 12 with a long reel-to-reel and bonding them together.

FIG. 5B shows the ACF used in this embodiment.
Is a plan view, but regions 20a,
20c is not particularly limited to the illustrated one. The configuration other than the above is the same as that of the first embodiment.

Here, the thickness t3 of the adhesive layer 20 was determined using the following equation.

[0050]

[Formula 1] t21 + t3 ＋ t1 + t7 + α, where t21; thickness t1 of the anisotropic conductive layer 12; thickness t7 of the substrate-side electrodes 1a, 1b, 1c, 1d; and electric element-side electrodes 2a, 3a, The thickness of 4a and 5a is determined in consideration of the amount of the adhesive layer 20 flowing out and the effect of sealing the electric element, and is preferably set to 0 to 10 μm, and ideally to about 5 μm. good.

The thickness t1 of the substrate-side electrode is 0.1 μm or less in the case of an ITO (indium tin oxide) electrode of the glass substrate 51 for a liquid crystal display panel, and can be ignored.

Further, the electrode thickness t7 of the electric element varies depending on the type of the electric element, but is generally about 15 μm for a bump electrode of a semiconductor element and about 25 μm for a passive element such as a resistor or a capacitor. In the case of a lead frame electrode such as a mechanical component, the thickness is about 150 μm.

Further, the thickness t2 of the anisotropic conductive layer 12
1 was 8 μm.

That is, in this embodiment, the adhesive layer 20
The thickness t3 of the semiconductor element was set to 12 μm, that of the passive element was set to 22 μm, and that of the mechanical component was set to 147 μm.

According to this embodiment, the same effect as in the above embodiment can be obtained even when the electrode thickness of the electric element is extremely different.

Further, a highly reliable MCM or system-on-panel can be created by the same process as that using a conventionally known ACF. Therefore, there is no need to significantly change the manufacturing equipment and process conditions from the conventional one,
The effect on production will be enormous. (Embodiment 3) In this embodiment, as shown in FIG.
An anisotropic conductive layer 12 is formed on the entire surface of the substrate 1. In a region 30b where the electric elements 2 and 3 having a small electrode thickness are adhered, the adhesive layer 30 has a single-layer structure, and the electric element 4 having a large electrode thickness is formed. , 5 are bonded to each other in the regions 30a and 30b, and the bonding layers are not formed in the other regions. Other configurations are the same as those of the second embodiment.

According to the present embodiment, since the area where the adhesive layer 30 is formed is reduced, the consumption of materials used can be reduced, and the product cost can be reduced.

Since the intermediate layer (layer between the adhesive layer 30 and the anisotropic conductive layer 12) in the regions 30a and 30b does not directly contact the electric elements 4 and 5, It is not necessary to consider the adhesiveness with the material, and the material can be selected for convenience in production. (Embodiment 4) This embodiment relates to a method for bonding the above-described substrate 1 and the electric elements 2, 3, 4, and 5.

In this embodiment, as shown in FIG.
Adhesive layers having tackiness at room temperature were applied to the electric elements 2, 3, 4, and 5 as indicated by reference numerals 40a, 40b, and 40c, and an anisotropic conductive layer 12 was applied to the substrate 1 side. .

Next, the electrodes 1a, 1b, 1c, 1
The substrate 1 and the electric elements 2, 3, 4, and 5 were overlapped and pressed so that d and the electrodes 2a, 3a, 4a, and 5a on the electric element side faced each other. Since the adhesive layers 40a, 40b, and 40c have tackiness at room temperature, the substrate 1 and the electric elements 2, 3,
Temporary attachment with 4,5 was completed.

Thereafter, heating and pressure bonding (final attachment) were performed.
As a result, the electric elements 2, 3, 4, and 5 were bonded to the substrate 1 in a state where the opposing electrodes were kept electrically conductive.
Here, a conventionally known anisotropic conductive adhesive was used for the anisotropic conductive layer 12.

The adhesive layer is thinly applied to the electric elements 2 and 3 having a small electrode thickness as indicated by reference numeral 40b.
An adhesive layer 40 is applied to the electric elements 4 and 5 having a large electrode thickness.
A thick coating may be applied as shown by a and 40c.

[0063]

As described above, according to the present invention,
Since the adhesive layer has tackiness at room temperature, the temporary attachment of the two electric components is completed only by pressing, and heating during the temporary attachment is unnecessary. Therefore, even if a special mounter capable of heating is not used (that is, even if the device is inexpensive and does not have a heating function like a soldering mounter), temporary mounting is possible, and an increase in manufacturing cost is suppressed. be able to. Further, since it is not necessary to hold the electric component until the adhesive member is heated to a predetermined temperature, the time for temporary attachment is about the same as that for soldering (0.
(About 1 to 0.3 seconds). Further, it is possible to avoid deterioration of the tacking position accuracy due to heating.

On the other hand, since solder is not used as the adhesive member, problems inherent in solder can be avoided. That is, it is not necessary to treat residues and wastes due to the inclusion of Pb, so that the cost for the treatment can be saved and the increase in product cost can be suppressed. Further, since there is no use of flux or generation of solder balls, a step of cleaning these is not required, and an increase in manufacturing cost can be suppressed. Further, since almost the entire surface of the substrate is covered with the adhesive layer or the anisotropic conductive layer, the substrate is protected from moisture and dust, so that there is no need to separately coat a resin, and an increase in manufacturing cost can be suppressed. Even if the pitch of the electrodes is 0.3 mm or less, insulation between adjacent electrodes can be ensured. Defective products are less likely to occur, and the production yield is improved.

Further, the adhesive member according to the present invention comprises an adhesive layer for bonding two electric components, and a resin in which conductive particles are dispersed.
And an anisotropic conductive layer formed by mixing the two electrical components. Insulation with the electrodes is ensured. Therefore, even when a plurality of electric elements having different electrode thicknesses are bonded to each other, the adhesiveness and anisotropic conductivity of the electric elements (that is, the opposing electric properties) Both the mutual conductivity of the electrodes and the insulation between other electrodes) can be ensured.

Therefore, in the liquid crystal display, both the driver IC and electric elements other than the driver IC (for example, semiconductor elements such as a controller IC, passive elements such as resistors and capacitors, and mechanical parts such as connectors) are mounted together. Thus, a liquid crystal display (a so-called system-on-panel) in which these electric elements are mixed and mounted can be produced. That is, according to the present embodiment, it is possible to obtain a low-cost and highly reliable MCM or system-on-panel.

Further, in the case where the thicknesses of the electrodes of the plurality of electric elements are different from each other, the thickness of the adhesive layer is made substantially uniform over the entire surface of the substrate, and the thickness of the adhesive layer is not less than the maximum electrode thickness. In this case, the product cost can be reduced while maintaining good adhesion of the electric element.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a conventional structure in which two electric components (a substrate and an electric element) are bonded by solder.

FIG. 2 is a diagram showing an example of a method of temporarily attaching an electric element.

FIG. 3 is a diagram showing another example of a method of temporarily attaching an electric element.

FIG. 4 shows an example of the structure of an adhesive member according to the present invention, and M
The figure which shows an example of the structure of CM.

5A and 5B are diagrams showing another example of the structure of the adhesive member, and FIG.
Is a side view, and (b) is a plan view.

6A and 6B are diagrams showing still another example of the structure of the adhesive member, wherein FIG. 6A is a side view, and FIG. 6B is a plan view.

FIG. 7 is a diagram showing an example in which an adhesive member is applied to a liquid crystal display.

FIG. 8 is a diagram for explaining a bonding method using a bonding member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate (electric part) 2 IC (electric part, electric element) 2a electrode 3 Passive element (electric part, electric element) 3a electrode 4,5 Mechanical part (electric part, electric element) 4a, 5a Electrode 10 ACF (adhesive member) 11) adhesive layer 12 anisotropic conductive layer 12a resin 12b conductive particles 13 MCM (multi-chip module) 50 liquid crystal display panel 51 glass substrate

Claims (10)

[Claims] An adhesive member for adhering two electric components in a state where the opposing electrodes of the two electric components are secured to each other, comprising: an adhesive layer having tackiness at room temperature; And an anisotropic conductive layer formed by dispersing and mixing the two components. The adhesive layer bonds the two electrical components, and the anisotropic conductive layer faces the two electrical components. An adhesive member, which ensures the mutual conductivity of the electrodes and the insulation of the other electrodes. 2. The adhesive member according to claim 1, wherein the adhesive layer comprises a polymer agent layer that flows at room temperature before curing. 3. A substrate having a plurality of electrodes, a plurality of electric elements having the electrodes, and the substrate and the electric element are adhered to each other in a state in which conductivity between the electrodes facing each other in the substrate and the electric element is ensured. In a multi-chip module comprising: an adhesive member, the adhesive member is disposed on the electrical element side and has an adhesive layer having tackiness at room temperature, and is disposed on the substrate side and has conductive particles in a resin. An anisotropic conductive layer formed by dispersion and mixing, wherein the adhesive layer bonds the substrate and the electric element, and the anisotropic conductive layer faces the substrate and the electric element. A multi-chip module comprising: securing conductivity between electrodes and securing insulation from other electrodes. 4. The multi-chip module according to claim 3, wherein the adhesive layer comprises a polymer agent layer that flows at room temperature before curing. 5. When the thicknesses of the electrodes of the plurality of electric elements are different from each other, the thickness of the adhesive layer at each adhesion point of the electric element is the thickness of the electrode of each electric element adhered to the adhesion point. The multi-chip module according to claim 3, wherein the multi-chip module has a thickness greater than or equal to the thickness. 6. The multichip module according to claim 5, wherein the thickness of the adhesive layer is made substantially uniform over the entire surface of the substrate and is equal to or greater than the maximum electrode thickness. 7. The multi-chip module according to claim 3, wherein said substrate is a liquid crystal display panel. 8. The multichip module according to claim 7, wherein the substrate is a glass substrate as a component of a liquid crystal display panel. 9. A bonding method for bonding a substrate and an electric element in a state where the electrodes and the opposing electrodes of the substrate and the electric element are secured to each other. Disposing an anisotropic conductive layer that secures and insulates from other electrodes so as to cover the electrode on the substrate side; and bonding the adhesive layer having tackiness at room temperature to the anisotropic conductive layer. Arranging the substrate or the electric element so that the electrode on the substrate side and the electrode on the electric element side face each other; and A step of pressing and heating a bonding portion between the substrate and the electric element, the bonding method comprising: 10. The bonding method according to claim 9, wherein the anisotropic conductive layer is formed by dispersing and mixing conductive particles in a resin.