CN102550135A - Method for connecting electrodes and connection composition used therefor - Google Patents
Method for connecting electrodes and connection composition used therefor Download PDFInfo
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- CN102550135A CN102550135A CN201080037908XA CN201080037908A CN102550135A CN 102550135 A CN102550135 A CN 102550135A CN 201080037908X A CN201080037908X A CN 201080037908XA CN 201080037908 A CN201080037908 A CN 201080037908A CN 102550135 A CN102550135 A CN 102550135A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Disclosed is a method for connecting electrodes, wherein a first connection part that is formed on a transparent substrate (21) and comprises a first electrode (11) and a second connection part that is formed on a flexible substrate (11) and comprises a second electrode (12) are bonded with each other and the first electrode and the second electrode are electrically connected with each other. The method for connecting electrodes comprises : a step in which a connection composition (13, 14), which contains (a) a curable resin component and (b) a photocuring initiator component and which is delayed curable by irradiation of light, is applied to either the first connection part and/or the second connection part; a first light irradiation step in which the applied connection composition is irradiated with light; and a second light irradiation step in which the first connection part and the second connection part are pressed against each other before the connection composition is cured, while aligning the first electrode and the second electrode, and then the connection composition is further irradiated with light.
Description
Technical field
The present invention relates to prepare the for example method of display panels of flat-panel monitor, relate to the method for the electrode of the electrode that connects said flat-panel monitor and flexible base, board in more detail, and the material that connects them.
Background technology
Flat-panel monitor (for example LCD (LCD), OLED display and plasma display) has the transparency electrode that on glass substrate, forms (for example ITO (indium tin oxide), IZO (indium-zinc oxide) and SnO
2), and they generally are connected to external drive circuit through the flexible base, board of the importing/leadout electrode part in the periphery.
In order to connect the electrode on transparency electrode and the flexible base, board, use the anisotropic conductive film that comprises conductive particle.Place anisotropic conductive film between upper electrode and the lower electrode (being the electrode on transparency electrode and the flexible base, board) and utilize heating to carry out pressing with the position of aiming at, reach electrical connection thus in vertical direction and the maintenance lateral isolation.
But along with the development of high definition flat-panel monitor in recent years, it is thinner that the spacing of transparency electrode has become, and no longer can ignore with respect to the size of distance between centers of tracks conductive particle.Because the gathering of the conductive particle of relatively small amount, the risk of short circuit increases.So the problem that will solve is to guarantee the reliability of lateral isolation (being between the transparency electrode, between the electrode on the flexible base, board) and insulation.
JP-A-H7-302973 (patent document 1) and JP-A-H7-106369 (patent document 2) describe a plate base (flexible base, board etc.) thus on electrode and the electrode pressing on another plate base be connected to each other; The photo curable adhesive resin that wherein will have the volume contraction function is filled between these substrates, then ultraviolet light polymerization; And the connection between the volume contraction power intensifier electrode.
Because do not use anisotropic conductive film, utilize the method for these photo curable adhesive resins not cause the problem of lateral isolation property reduction.But the transparency electrode of flat-panel monitor often has the opaque metal level except that pixel in substrate part (line part) and/or importing/leadout electrode part, perhaps can use the thicker transparency electrode of film to reduce resistance.Therefore, the UV light of capacity can not arrive shading place of electrode.Even attempt to shine from the flexible base, board side with UV light, UV light still can not arrive shading place of electrode, because they are made of copper usually.In addition, the polyimides of making basement membrane commonly used does not make the light transmission in the ultraviolet range.So, do not reach required bonding strength, there is the not enough problem of bonding strength.Particularly, when the coupling part comprises two groups of electrode of electrode that spacing is thin and wider width, there is serious problem.
The open method of utilizing of JP-A-2008-305580 (patent document 3) with the composition encapsulation organic electroluminescent device that postpones curing properties.But this document only utilizes the curing of delay, and the technology of unexposed bonded-electrode.
The document of prior art
Patent document
Patent document 1:JP-A-H7-302973
Patent document 2:JP-A-H7-106369 (JP patent 3031134)
Patent document 3:JP-A-2008-305580
Summary of the invention
To above-mentioned general issues; Accomplish the present invention; Its objective is the curing of the method that provides through simple operation connection electrode with the shading light part that is implemented in the light no show behind the electrode; Even and the connection in the thin space also had excellent bond property and reliability, the resin combination that is suitable for this connection also is provided.
The present invention relates to following project.
1, the method that is used for the bonding the first pontes and second coupling part; Wherein said the first pontes is included in first electrode that forms on the transparency carrier; Said second coupling part is included in second electrode that forms on the flexible base, board; Thus said first electrode is connected with said second electrode electricity, said method comprises:
With binding compsns coat in said the first pontes and said second coupling part one of at least on step; Said binding compsns comprises (a) curable resin Composition and causes component with (b) photocuring, and has through rayed and postpone the character of solidifying;
Said binding compsns is carried out light-struck first rayed step;
The second rayed step: before said binding compsns solidifies; After with said first electrode and said second electrode alignment; With said the first pontes and the pressing each other of said second coupling part, and irradiates light said the first pontes and the maintenance pressing of said second coupling part simultaneously.
2, top project 1 described method, wherein said curable resin Composition (a) comprises epoxy resin.
3, top project 1 described method, wherein said photocuring cause component (b) and comprise cationic photoinitiator.
4, top project 1 described method, the wherein said first rayed step comprise that irradiation has the light that after at least 30 seconds time of delay, causes the required energy range of said binding compsns curing.
5, top project 1 described method, the wherein said first rayed step comprise that irradiation has the light that after 30 seconds-120 minutes time of delay, causes the required energy range of said binding compsns curing.
6, top project 1 described method, the wherein said second rayed step comprise the light that irradiation has is enough to cause immediately the energy that said binding compsns solidifies.
7, each described method among the top project 1-6 also is included in the step that the assembly that makes gained after the said second rayed step leaves standstill at ambient temperature.
8, the binding compsns that is used for top each described method of project 1-7, wherein said binding compsns comprises:
(a) curable resin Composition; With
(b) cationic photoinitiator;
Wherein said binding compsns have after the said first rayed step 30 seconds or the longer time the delay curing properties and in the said second rayed step, solidify.
The present invention advantageously will realize after rayed that the curing immediately of desired intensity combines with delay curing, and this delay curing makes can not be by light-struck partly solidified.Therefore; The present invention can provide the method through simple operation connection electrode; It does not need too much equipment to realize the curing in the shading light part of the light no show behind the electrode; Even and also having excellent bond property and reliability for the connection in the thin space, the present invention also provides the resin combination that is suitable for said connection.
Description of drawings
Fig. 1 shows that said first electrode is connected with said second electrode electricity and the sketch map of bonding mode.
Detailed description of the present invention
The present invention relates to following method: be used for the first pontes is bonded to second coupling part; Said the first pontes is included in first electrode that forms on the transparency carrier; Said second coupling part is included in second electrode that forms on the flexible base, board, simultaneously said first electrode electricity is connected to said second electrode.
Said transparency carrier is restriction not, but it can be the substrate that constitutes flat-panel monitor (for example LCD, OLED display and plasma display), and it is for example insulating properties substrate such as glass substrate and hyaline membrane substrate, particularly glass substrate.The first pontes is present on the said transparency carrier, and said the first pontes comprises and be used for first electrode that is electrically connected with external circuit (particularly second electrode on the flexible base, board), and being electrically connected and mechanical adhesion of realization and said flexible base, board.Said first electrode is by transparent conductive material (for example ITO (indium tin oxide), IZO (indium-zinc oxide) and SnO
2), metal (for example Ag, Cu, Au, Al, Mo, W, Cr, Ti and Nd), the alloy (Al alloy such as Al-Nd, Cu alloy such as Cu-Mn etc.) that one of comprises in these metals at least, the formations such as sandwich construction of these materials.In the situation of sandwich construction, two kinds or more kinds of material needn't have equal line width (line-width).For example, said electrode can have structure: wherein said transparent conductive material (for example ITO and IZO) will on substrate, form for example the upper surface and the side surface of the circuit processed of Mo cover by metal (comprising alloy).
Said flexible base, board is restriction not, but it can be that for example, the insulating properties polymer film is polyimides and PETG for example, generally speaking, often uses polyimide film.Second coupling part is present on the said flexible base, board; Said second coupling part comprises and is used for second electrode that is electrically connected with the circuit (first electrode on the particularly said transparency carrier) of flat-panel monitor, and being electrically connected and mechanical adhesion of realization and said transparency carrier.Said second electrode is generally processed by Cu.The thickness of Cu is restriction not, but it can be to be not more than tens of approximately μ m, for example, and 1-20 μ m, and the thickness of 1-10 μ m etc.
Said first electrode and said second electrode constitute the group of a plurality of electrodes usually.The not special restriction of their spacing, and they can have different spacings and width in the electrode group.Usually, even thin space is for for example in the electrode group, 10 μ m-200 μ m; Even 100 μ m or littler; 50 μ m or littler particularly still can reach being electrically connected of said first electrode and said second electrode, and reliability are excellent; And do not undermine between the electrode on the same substrate of the present invention the insulating properties of (between said each first electrode, between said each second electrode).
In first step of the present invention, with said binding compsns coat in said the first pontes and said second coupling part one of at least on.Hereinafter is described the material of said binding compsns.The not special restriction of its coating process can be adopted conventional rubbing method, for example, and distributor rubbing method, silk screen printing etc.
Then, the binding compsns that has been coated with is carried out first rayed (i.e. the first rayed step).Through first rayed, binding compsns does not solidify immediately, but it solidified after certain period.Promptly take place to postpone to solidify.Be the machinable time that can carry out bonding operation therebetween time of delay.Be used for light-struck wave-length coverage and be preferably ultraviolet and/or visible-range.In order to ensure rayed, preferably from scribbling the surface irradiation light of said binding compsns to said binding compsns.But this is from the back side illuminaton shield light of electrode and stay not irradiated part.
In the present invention, can suitably confirm time of delay of being used to solidify, the time that can process according to said method.In a kind of concrete method, it is preferably 30 seconds or longer, and more preferably 2 minutes or longer, even more preferably 5 minutes or longer.With regard to machinability, preferred about 1 day or shorter, more preferably from about 10 hours or shorter, even more preferably 2 hours or shorter.
In the present invention, term " solidification delay time " has identical implication with " machinable time ", and is meant that composition keeps permission to process the time of the state of (for example to collimator electrode) therebetween.When said composition postpones to solidify, can after the time longer, reach final strength than the solidification delay time.
Can be through the prescription control solidification delay time of the said binding compsns of adjustment.Simultaneously, preferably solidify and solidify immediately through light-struck energy control lag.Therefore, the irradiation energy in said first rayed is the required interior energy of scope of solidification delay time that reaches predetermined.Particularly, it depends on the prescription of said binding compsns, but it is preferably low to obtain enough machinable time, and it for example is, 1500mJ/cm
2Or littler, preferably less than 1500mJ/cm
2, more preferably 500mJ/cm
2Or it is littler.
Then; In machinable time; Settle on the said transparency carrier first electrode and second electrode on the said flexible base, board so that they against each other; And with the aligned in position of said first electrode and said second electrode, then with said the first pontes and said second coupling part each other pressing be connected.At this moment, apply enough pressure so that said first electrode contacts with said second electrode.
Then, when keeping this state, coupling part (following said the first pontes and the said second coupling part portions joined are called the coupling part) carried out second rayed, and said binding compsns solidifies (i.e. the second rayed step) immediately.The scope of optical wavelength can be identical or different with said first light-struck optical wavelength range, and still, said light wavelength is preferably in the scope of ultraviolet light and/or visible light.When the adverse effect to liquid crystal material etc. throws into question, can only shine said coupling part with visible region.When the transmissivity of attempting to see through the electrode pair ultraviolet light range on said transparency carrier irradiation and the said transparency carrier is low, if comprise visible-range, then still maybe photocuring.In addition, when attempting to see through said flexible base, board irradiation, also preferably with comprising that the light of visible light carries out photocuring, because polyimides commonly used does not make ultraviolet light see through.Can carry out rayed through said transparency carrier or said flexible base, board.In addition, also preferably shine from both sides.
Through the said second rayed step, said binding compsns is cured in the part of exposure.Therefore, the irradiation energy in said second rayed should be the amount that said binding compsns is solidified immediately of being enough to.Though can suitably select irradiation energy according to the prescription and the method for binding compsns, need to solidify immediately, therefore, it is, for example, 1500mJ/cm
2Or higher, preferred 3000mJ/cm
2Or it is higher.
Through above-mentioned second rayed, the most of binding compsns in the connecting portion office solidifies.But, the part in said first electrode and/or said second electrode shading place that possibly exist the light of capacity to arrive.Although said first electrode and said second electrode contact with each other and realize the conduction, they not exclusively are the plane under microscopic examination, and often can give said electrode recessed-male structure or embedded structure.Shown in signal among Fig. 1, resin 13 does not exist part through receiving photocuring at said first electrode 11 with said second electrode 12.And the resin 14 between said first electrode and said second electrode can not receive the light in the said second rayed step.
But in the present invention, resin 14 has received the light in the said first rayed step and has postponed and solidified, thereby resin 14 also reaches final curing.So, the bonding securely each other and reliability increase of electrode.
Said delay is solidified and can after the said second rayed step or during the said second rayed step, be taken place.Usually, postpone cured portion and after the said second rayed step, reach final strength.After the said second rayed step, obtain predetermined bonding strength, and operation becomes easy.Therefore, can remove fixture used in the said second rayed step (for example be used for said the first pontes and said second coupling part fixture of pressing) each other.The fixture that perhaps, can keep installation is accomplished until postponing to solidify.
After the said second rayed step, can carry out follow-up assembling.Perhaps, after the said second rayed step, bonded part is remained under the temperature of ambient temperature or rising postpone to solidify, thereby reach good bond, can carry out follow-up assembling then to accomplish.
In the present invention, will after rayed, reach solidifying immediately and do not make and can being combined by light-struck partly solidified delay curing of desired intensity, realization connects and does not need too much equipment reliably through simple method.
<binding compsns >
The binding compsns that is used for method of the present invention is described.Said composition comprises:
(a) curable resin Composition and
(b) photocuring causes component.
Said binding compsns is the system that can postpone to solidify and preferably can realize solidifying immediately and postponing curing through change rayed condition.The system of preferred especially photic cationic polymerization.
Said curable resin Composition (a) is the resin of cationically type polymerization, for example, comprises the compound of functional group's (for example epoxy radicals, oxetanyl, vinyl ether group, epithio base and aziridine base) of cationically type polymerization.The compound (below be called epoxy resin) that especially preferably contains epoxy radicals.
The epoxy resin that this paper uses comprises the epoxy resin of the epoxy resin, cycloaliphatic epoxy resin and various other types that contain aromatic rings.Said epoxy resin can use separately, perhaps 2 kinds or more kinds of combination use.
The instance that contains the epoxy resin of aromatic rings comprises: bisphenol-type epoxy resin (for example bis phenol-a epoxy resins, bisphenol-f epoxy resin and bis-phenol-S epoxy resin); Novolac epoxy resin (for example phenol formaldehyde (PF) epoxy resin (phenol novolac epoxy resin) and cresol-novolak epoxy resin); And biphenyl type epoxy resin YX4000 (trade mark for example; Japan Epoxy Resin Co.Ltd.).The said epoxy resin that contains aromatic rings contains at least one epoxy radicals usually in a molecule.Can suitably select the epoxide equivalent of said resin.
The instance of said cycloaliphatic epoxy resin comprises: those (the for example cyclohexene oxide in the molecule and cyclopentene oxide structures) that contain the epoxy radicals that links to each other with the structure with ring distortion; Preferably in a molecule, contain those of two or more these type of epoxy radicals.The representative instance of said cycloaliphatic epoxy resin comprises those that represented by formula (1) to (5).Said cycloaliphatic epoxy resin can use separately, perhaps uses with another kind of epoxy resin combination, and preferred especially the combination with the epoxy resin that contains aromatic rings used.
In the present invention, at least a bisphenol-type epoxy resin and the epoxy resin in the dicyclopentadiene-type epoxy resin that is selected from hydrogenation can be used as said epoxy resin ingredient.These epoxy resin can use separately, and perhaps with another kind of epoxy resin, preferred especially the combination with the epoxy resin that contains aromatic rings used.
The bisphenol-type epoxy resin of hydrogenation is can be through the compound that the phenyl ring hydrogenation in the bisphenol-type epoxy resin (for example bis phenol-a epoxy resins, bisphenol-f epoxy resin, bis-phenol-S epoxy resin etc.) is obtained.The bis phenol-a epoxy resins of hydrogenation is expressed from the next:
Above compound generally obtains with form of mixtures, and said compound has different n numbers, and n average out to 0-is about 5, and for example 0-is about 2, particularly 0-1.
Dicyclopentadiene-type epoxy resin is expressed from the next:
And generally obtain with form of mixtures, it is about 5 that said dicyclopentadiene-type epoxy resin has different n numbers and a n average out to 0-, and for example 0-is about 2, particularly 0-1.
Said epoxy resin ingredient can comprise other known diluent, and it can be the compound that contains epoxy radicals, vinyl ethers, oxetane compound, polyalcohol etc.
The examples for compounds that contains epoxy radicals as diluent comprises: aliphatic alkyl list glycidyl ether or aliphatic alkyl diglycidyl ether (for example cyclohexanedimethanol diglycidyl ether, butyl glycidyl base ether, 2-ethylhexyl glycidyl ether and allyl glycidyl ether); Alkyl glycidyl base ester (for example methyl propenoic acid glycidyl base ester and tertiary carboxylic acid glycidyl esters); Styrene oxide; Aralkyl list glycidyl ether (for example phenylglycidyl ether, cresyl glycidyl ether, to secondary butyl phenenyl glycidyl ether and nonyl phenylglycidyl ether); The tetrahydrofurfuryl alcohol glycidyl ether.
The instance that is used as the vinyl ethers of diluent comprises simple function or polyfunctional vinyl ethers, for example, and cyclohexanedimethanol divinyl ether, triethylene glycol divinyl ether and hydroxy butyl vinyl ether.
The instance of oxetane compound comprises the compound by formula (6) expression:
Polyalcohol except as the diluent, increases the adhesiveness of resin system of the present invention effectively; And polyalcohol comprises alkyl polyols, polyester polyol, polyether polyol, acrylic type polyalcohol, polybutadiene type polyalcohol and phenol type polyalcohol.In these, preferred alkyl polyalcohol, the pure and mild PPG of polyester polyols, special preferred, polyethers polyalcohol.When being used for increasing adhesiveness, with respect to the said curable resin Composition (amount that does not comprise polyalcohol) of 100 weight portions, the amount of contained polyalcohol is the 0.1-40 weight portion, preferred 2-15 weight portion.
The instance of alkyl polyols comprises ethylene glycol, 1,4-butanediol, 1,6-hexylene glycol, 1,8-ethohexadiol, neopentyl glycol, cyclohexanedimethanol, trimethylolpropane, pentaerythrite etc.
The instance of PEPA comprises condensed type PEPA, addition-aggretion type PEPA, polycarbonate polyol etc.The condensed type PEPA can pass through diol compound (for example ethylene glycol, propane diols, diethylene glycol, 1; 4-butanediol, neopentyl glycol, 1,6-hexylene glycol, 3-methyl isophthalic acid, 5-pentanediol, 1; 9-nonanediol, 1; 4-cyclohexanedimethanol (hexanedimethanol), dimeric dibasic acid two pure and mild polyethylene glycol) obtain with the condensation reaction of organic multicomponent acid (for example adipic acid, M-phthalic acid, terephthalic acid (TPA) and decanedioic acid), and its molecular weight is preferably 100-100,000.Addition-aggretion type PEPA can comprise polycaprolactone, and its molecular weight is preferably 100-100,000.Polycarbonate polyol can each directly prepares through phosgenation or ester-interchange method since polyalcohol with dipheryl carbonate base ester.Its molecular weight is preferably 100-100, and 000.
The instance of PPG comprises PEG-type, PPG-type, PTG-type etc., and the PEG-type polyalcohol compound that contains active hydrogen capable of using is as the addition polymerization acquisition of reaction atarting material through ethylene oxide; And its molecular weight is preferably 100-100,000.The PPG-type polyalcohol compound that contains active hydrogen capable of using is as the addition polymerization acquisition of reaction atarting material through propylene oxide; And its molecular weight is preferably 100-100,000.PTG-type polyalcohol can obtain through the cationic polymerization of oxolane; And its molecular weight is preferably 100-100,000.
In the present invention; In the resin (compound that for example contains functional group's (for example epoxy radicals, oxetanyl, vinyl ether group, epithio base and aziridine base) of cationically type polymerization) of cationically type polymerization; Said curable resin Composition (a) preferably comprises epoxy resin as key component, as if the resin that needs also randomly comprise other cationically type polymerization, reactive diluent etc.The amount of epoxy resin in said curable resin Composition (a) is generally 50 weight % or bigger, preferred 70 weight % or bigger, also preferred 100 weight %.
Said cationic photoinitiator is by A
+B
-The salt of expression, it produces active cationic substance through rayed.Cation A
+Be preferably aromatic series iodide ion or aromatic matte ion.By formula Ar
1-I
+-Ar
2In the aromatic series iodide ion of expression, with I
+The Ar that links to each other
1And Ar
2Group is preferably aromatic group independently of one another, particularly randomly contains substituent phenyl.
In the aromatic matte ion that is expressed from the next:
With center S
+The Ar that links to each other
1, Ar
2And Ar
3Group is preferably aryl independently of one another, particularly randomly contains substituent phenyl.
Said anion B
-Comprise SbF
6 -, B (aryl)
4 -Ion such as B (C
6F
5)
4 -, PF
6 -, AsF
6 -And BF
4 -This B (aryl)
4 -Ion is except being B (C
6F
5)
4 -, can also be B (C
6F
4OCF
3)
4 -Or B (C
6F
4CF
3)
4 -The limiting examples of said cationic photoinitiator is by representing with following formula.Though provide wherein anion B
-Be SbF
6 -Or B (C
6F
5)
4 -The instance of cationic photoinitiator, with PF
6 -, AsF
6 -, BF
4 -Deng being anion B
-The instance of initator be through using PF
6 -, AsF
6 -, BF
4 -Deng the SbF that substitutes in the following compound
6 -And the salt that gets.
With SbF
6 -Or B (aryl)
4 -Ion is as anion B
-Initator generally show higher curing rate.And with PF
6 -, AsF
6 -, BF
4 -Deng as anion B
-Initator lower curing rate generally is provided.
The kind of preferably confirming said cationic photoinitiator is solidified to obtain suitable delay of the present invention with amount, preferably realizes postponing to solidify and solidifying immediately according to light-struck condition.
Usually, with respect to the said curable resin Composition (a) of 100 weight portions, the addition that said photocuring causes component (b) is preferably, for example, and 0.1 weight portion-10 weight portion, preferred 0.5 weight portion-5 weight portion.Also preferably add for example thioxanthones of sensitising agent as required.
Said binding compsns also can comprise additive, resin groups is graded to improve or to adjust such as flowable, coating, anti-corrosive properties, curing properties and the character the physical property after solidifying.
The component that can comprise as required comprises, for example, and silane coupler, diluent, modifier, surfactant, anticorrosion stabilizer, antifoaming agent, levelling agent etc.; But be not limited to these.
Said silane coupler does not have special restriction; Comprise that (gamma-amino propyl group) triethoxy-silicane, (γ-sulfydryl propyl group) trimethoxy monosilane, (γ-(methacryloxy) propyl group) trimethoxy monosilane, (γ-glycidoxypropyl) trimethoxy monosilane, SH6062, SZ6030 are (above all; Toray-Dow Corning Silicone Inc.), KBE903, KBM803 (above whole, Shin-Etsu Silicone Inc.) etc.
Embodiment
Embodiment
Detailed description can be used for the instantiation of the binding compsns of method of attachment of the present invention.
(composition in preparation embodiment and the Comparative Examples)
With material mixing shown in the table 1 and froth breaking in a vacuum.
(measurement viscosity)
Utilize HAAKE PK1-type viscosimeter, measure viscosity down at 25 ℃.
(measure and postpone curing properties and machinable time)
To coat on the slide (76x 26x 1mm) from the sample of embodiment or Comparative Examples, and, utilize high-pressure mercury lamp then at 100mW/cm with the direction lamination of another slide with 90 °
2Illumination under the irradiation 1 second.Attempt moving two slides, confirm as machinable time in the time that these slides become when being difficult to move with finger.
In the sample of the composition that utilizes embodiment 1, after rayed, move slide continuing to reach the about 10 minutes enough fingers of ability, confirm that therefore its machinable time is about 10 minutes.And in the sample of the composition that utilizes Comparative Examples 1, slide is fixing after rayed, confirms that therefore this sample does not have the delay curing properties.
(connecting uncured state) with shading place of confirming metal electrode after being connected
The composition of embodiment is coated on the glass substrate (metal electrode that has formation on it), utilized high-pressure mercury lamp then at 100mW/cm
2Illumination under the irradiation 1 second.After 1 minute, the lamination polyimide film, and utilize high-pressure mercury lamp at 100mW/cm
2Illumination under from glass substrate side irradiation 30 seconds.After irradiation is accomplished 1 hour, peel off the solid state of polyimide film with the composition of observing the outward appearance that connects and the embodiment on the metal electrode.The compositions table of embodiment 1 reveals the good adhesiveness to glass substrate and polyimide film, even and in shading place of metal electrode also full solidification.
On the other hand, because the composition of Comparative Examples 1 does not have the delay curing properties, it is coated have the metal electrode that forms above that and above that on the glass substrate of lamination polyimide film, and utilize high-pressure mercury lamp at 100mW/cm
2Illumination under from glass substrate side irradiation 30 seconds.After irradiation is accomplished 1 hour, peel off the solid state of polyimide film with the composition of observing the outward appearance that connects and the embodiment on the metal electrode.In the situation of the composition of Comparative Examples 1, said composition is uncured in shading place of metal electrode.
Table 1
* 1) bisphenol-A type epoxy resin, by Nippon Kayaku Co., the Ltd supply
* 2) cationic photoinitiator is supplied by Dow Chemical Co.
* 3) urethane-modified acrylic acid ester is supplied by Daicel-Cytec Company Ltd.
* 4) light trigger is by Ciba Specialty Chemicals supply, 2,2-dimethoxy-1,2-diphenylethane-1-ketone
* 5) light trigger is by Ciba Specialty Chemicals supply, 1-hydroxyl-cyclohexyl-phenyl-ketone
Multiple change possibly be feasible, only if break away from spirit of the present invention.Therefore, embodiment described herein is an example, and they do not limit the scope of the present invention described in the scope of claims.
Industrial applicability
According to the present invention, can the electrode of flat-panel monitor (like LCD) and flexible base, board etc. be connected through simple method, and reliability is excellent.
The numbering note
11 first electrodes
12 second electrodes
The resin of 13 curing
14 do not receive the resin of the light in the second rayed step
21 transparency carriers
22 flexible base, boards
Claims (8)
1. the method that is used for the bonding the first pontes and second coupling part; Wherein said the first pontes is included in first electrode that forms on the transparency carrier; Said second coupling part is included in second electrode that forms on the flexible base, board; Thus said first electrode is connected with said second electrode electricity, said method comprises:
With binding compsns coat in said the first pontes and said second coupling part one of at least on step; Said binding compsns comprises (a) curable resin Composition and causes component with (b) photocuring, and has through rayed and postpone the character of solidifying;
Said binding compsns is carried out light-struck first rayed step;
The second rayed step: before said binding compsns solidifies; After with said first electrode and said second electrode alignment; With said the first pontes and the pressing each other of said second coupling part, and carry out rayed said the first pontes and the maintenance pressing of said second coupling part simultaneously.
2. the method for claim 1, wherein said curable resin Composition (a) comprises epoxy resin.
3. the method for claim 1, wherein said photocuring cause component (b) and comprise cationic photoinitiator.
4. the method for claim 1, the wherein said first rayed step comprise that irradiation has and after at least 30 seconds time of delay, cause the light that said binding compsns solidifies required energy range.
5. the method for claim 1, the wherein said first rayed step comprise that irradiation has and after 30 seconds-120 minutes time of delay, cause the light that said binding compsns solidifies required energy range.
6. the method for claim 1, the wherein said second rayed step comprise the light that irradiation has is enough to cause immediately the energy that said binding compsns solidifies.
7. like each described method among the claim 1-6, also be included in the step that the assembly that makes gained after the said second rayed step leaves standstill at ambient temperature.
8. the binding compsns that is used for each described method of claim 1-7, wherein said binding compsns comprises:
(a) curable resin Composition; With
(b) cationic photoinitiator;
Wherein said binding compsns have after the said first rayed step 30 seconds or the longer time the delay curing properties and in the said second rayed step, solidify.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-173085 | 2009-07-24 | ||
| JP2009173085 | 2009-07-24 | ||
| PCT/JP2010/062346 WO2011010692A1 (en) | 2009-07-24 | 2010-07-22 | Method for connecting electrodes and connection composition used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102550135A true CN102550135A (en) | 2012-07-04 |
| CN102550135B CN102550135B (en) | 2015-06-17 |
Family
ID=43499164
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080037908.XA Expired - Fee Related CN102550135B (en) | 2009-07-24 | 2010-07-22 | Method for connecting electrodes and connection composition used therefor |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5571083B2 (en) |
| KR (1) | KR101393857B1 (en) |
| CN (1) | CN102550135B (en) |
| TW (1) | TWI483658B (en) |
| WO (1) | WO2011010692A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190042A (en) * | 2019-06-26 | 2019-08-30 | 云谷（固安）科技有限公司 | Bind structure, binding method, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPWO2020240968A1 (en) * | 2019-05-24 | 2021-11-11 | 三菱電機株式会社 | Camera module manufacturing method and manufacturing equipment, and optical module manufacturing method |
| JP7302460B2 (en) | 2019-12-02 | 2023-07-04 | 三浦工業株式会社 | air compression system |
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| JP2002275446A (en) * | 2001-03-21 | 2002-09-25 | Showa Denko Kk | Adhesive composition for surface implementation |
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| JP2006173100A (en) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | Method for connecting electrode |
| JP2008305580A (en) * | 2007-06-05 | 2008-12-18 | Sekisui Chem Co Ltd | Post-light curing composition, sealant for organic electroluminescent element, manufacturing method of organic electroluminescent display, and organic electroluminescent display |
-
2010
- 2010-07-22 JP JP2011523683A patent/JP5571083B2/en not_active Expired - Fee Related
- 2010-07-22 WO PCT/JP2010/062346 patent/WO2011010692A1/en active Application Filing
- 2010-07-22 CN CN201080037908.XA patent/CN102550135B/en not_active Expired - Fee Related
- 2010-07-22 KR KR1020127004682A patent/KR101393857B1/en not_active IP Right Cessation
- 2010-07-23 TW TW099124410A patent/TWI483658B/en not_active IP Right Cessation
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| JP2002175446A (en) * | 2000-12-07 | 2002-06-21 | Nec Corp | Electronic commerce system and its method and storage medium with program for performing the same method recorded |
| CN1894047A (en) * | 2003-10-27 | 2007-01-10 | 粘合剂研究公司 | Poly (alkylene oxide) polymer-based pressure sensitive adhesive and tapes formed therefrom |
| CN1773687A (en) * | 2004-11-09 | 2006-05-17 | 富士通株式会社 | Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same |
| CN101176033A (en) * | 2005-05-09 | 2008-05-07 | 积水化学工业株式会社 | Sealing material for liquid crystal dropping method, vertically conducting material, and liquid crystal display element |
| JP2007246855A (en) * | 2006-03-20 | 2007-09-27 | Fujitsu Ltd | Epoxy resin composition and manufacturing method for semiconductor apparatus using same |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011010692A1 (en) | 2013-01-07 |
| KR20120034244A (en) | 2012-04-10 |
| JP5571083B2 (en) | 2014-08-13 |
| TWI483658B (en) | 2015-05-01 |
| TW201127243A (en) | 2011-08-01 |
| KR101393857B1 (en) | 2014-05-12 |
| WO2011010692A1 (en) | 2011-01-27 |
| CN102550135B (en) | 2015-06-17 |
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