CN202435714U - Glue-free single-sided copper foil coated substrate with bonding function - Google Patents

Glue-free single-sided copper foil coated substrate with bonding function Download PDF

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Publication number
CN202435714U
CN202435714U CN2012200017899U CN201220001789U CN202435714U CN 202435714 U CN202435714 U CN 202435714U CN 2012200017899 U CN2012200017899 U CN 2012200017899U CN 201220001789 U CN201220001789 U CN 201220001789U CN 202435714 U CN202435714 U CN 202435714U
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CN
China
Prior art keywords
glue
layer
copper foil
substrate
free
Prior art date
Application number
CN2012200017899U
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Chinese (zh)
Inventor
陈晓强
徐玮鸿
周文贤
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松扬电子材料(昆山)有限公司
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Priority to CN2012200017899U priority Critical patent/CN202435714U/en
Application granted granted Critical
Publication of CN202435714U publication Critical patent/CN202435714U/en

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Abstract

The utility model discloses a glue-free single-sided copper foil coated substrate with a bonding function, and provides the glue-free single-sided copper foil coated substrate which is convenient and quick, and has the bonding function by forming an insulating bonding glue layer on the glue-free single-sided copper foil coated substrate. The glue-free single-sided copper foil coated substrate and the insulating bonding glue layer are integrally molded, so that the glue-free single-sided copper foil coated substrate is convenient to use and high in size stability, bonding and operation of customers are simplified, production processes are simplified, and labor hour of customers are saved; and the insulating bonding glue layer is integrally molded with the glue-free single-sided copper foil coated substrate by coating and baking, so that bubbles or poor appearance easily produced in the process of adhering pure glue by the traditional method is avoided, production yield is improved, and production cost is reduced. The glue-free single-sided copper foil coated substrate with the bonding function is applicable to a production technology for multi-layer boards and flexible printed circuits (FPC) which are required to be bonded to each other by the glue-free substrate and the pure glue.

Description

No glue single face copper clad foil substrate with paste functionality

Technical field

The utility model belongs to art of printed circuit boards, is specifically related to a kind of no glue formula single face copper clad foil substrate.

Background technology

Printed circuit board (PCB) (Printed Circuit Board; PCB) and pliability copper clad foil substrate (Flexible Copper Clad Laminate; FCCL) as the important base material of making telecommunications, and as the basic material of electronic interconnection need thin, gently reach characteristics such as structure is flexible.Along with the development of electronic product towards miniaturization and multifunction; Miniaturization demand for the circuit spacing grows with each passing day, and similarly is folding cell phone, digital camera, DV, automobile direction positioner, LCD TV, notebook computer, IC substrate etc.Stressing under the slim demand of high function, high-speed transfer and light weight that required base material is also towards more precisionization, high density and multifunctional direction development.In addition, because market competition is white-hot, therefore need further to reduce the base material cost.

No glue copper clad foil substrate is meant the copper clad foil substrate that does not have glue-line directly to follow between copper foil layer and the insulating substrate; No glue double-sided copper-clad foil substrate that uses at present and no glue single face copper clad foil substrate are because complex manufacturing; Equipment requirements is high; What therefore production cost was more traditional has the glue copper clad foil substrate more often than higher, and the yield of producing is also on the low side.But do not have the glue copper clad foil substrate its distinctive properties of product advantage is arranged, irreplaceable effect is arranged aspect some in production application.Therefore at present be badly in need of a kind of can mass production, convenient for production, lower-cost product with no glue copper clad foil substrate characteristic.The traditional multi-layer sheet or the production technology of FPC are carried out hot pressing combination for the no glue copper clad foil substrate pure glued membrane of fitting; This kind technology is easily because produce the bad of bubble or outward appearance in the process of pure glued membrane of fitting; Cause yield on the low side, and the price of pure glued membrane is also than higher.

The utility model content

In order to overcome above-mentioned defective; The utility model provides a kind of no glue single face copper clad foil substrate with paste functionality, and feasible no glue single face copper clad foil substrate of the no glue single face copper clad foil substrate with paste functionality of the utility model and insulation adhesive glue-line are one-body molded, have not only made things convenient for the client to fit and operation; Client's production process and man-hour have been practiced thrift; And improved the production yield, reduced production cost, and dimensional stability is good.

The utility model for the technical scheme that solves its technical problem and adopt is:

A kind of no glue single face copper clad foil substrate with paste functionality; Comprise insulating substrate and copper foil layer; Said insulating substrate is formed at said copper foil layer lower surface, and said insulating substrate lower surface is formed with the insulation adhesive glue-line, and said insulation adhesive glue-line lower surface is covered with release layer.

Wherein, said insulation adhesive glue-line is the moving semi-cured state (B-stage) of semi-fluid.

Wherein, said insulating substrate is polyimides (PI) film, PETG (PET) film, gather a kind of in naphthalene ester (PEN) film and liquid crystal polymer (LCP) film, preferably polyimides (PI) film.The thickness of said insulating substrate is 7~100um.

Wherein, a kind of in calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high (HD) Copper Foil that extends of said copper foil layer, the thickness of said copper foil layer is 5~100um.

Wherein, said insulation adhesive glue-line is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line is 5~50um.

Wherein, said release layer is a kind of in mould release membrance and the release liners, and the thickness of said release layer is 30~200um.

The beneficial effect of the utility model is: the utility model is through after forming the insulation adhesive glue-line on the no glue single face copper clad foil substrate; A kind of no glue single face copper clad foil substrate that conveniently has paste functionality is provided; Make no glue single face copper clad foil substrate and insulation adhesive glue-line one-body molded, make things convenient for the client to use, simplified client's applying and operation; Practiced thrift client's production process and man-hour, and dimensional stability is good; And the insulation adhesive glue-line is shaped in no glue single face copper clad foil substrate through coating baking, and the bubble or the bad order that have been easy to generate when having avoided the pure glue of traditional applying have improved the production yield, have reduced production cost.The no glue single face copper clad foil substrate with paste functionality of the utility model is applicable to multi-layer sheet production technology and some other FPC substrate that need close through no gum base materials and pure gluing.

Description of drawings

Fig. 1 is the no glue single face copper clad foil substrate sketch map with paste functionality of the utility model.

Embodiment

Embodiment: the preferred embodiment of the utility model is set forth in detail below in conjunction with accompanying drawing; Thereby the protection range of the utility model is made more explicit defining so that advantage of the utility model and characteristic can be easier to it will be appreciated by those skilled in the art that.

A kind of no glue single face copper clad foil substrate with paste functionality; Comprise insulating substrate 2 and copper foil layer 1; Said insulating substrate 2 is formed at said copper foil layer 1 lower surface, and said insulating substrate 2 lower surfaces are formed with insulation adhesive glue-line 3, and said insulation adhesive glue-line 3 lower surfaces are covered with release layer 4.

Wherein, said insulation adhesive glue-line 3 is the moving semi-cured state (B-stage) of semi-fluid.

Wherein, said insulating substrate 2 is polyimides (PI) film, PETG (PET) film, gather a kind of in naphthalene ester (PEN) film and liquid crystal polymer (LCP) film, preferably polyimides (PI) film.The thickness of said insulating substrate 2 is 7~100um.

Wherein, a kind of in calendering (RA) Copper Foil, electrolysis (ED) Copper Foil and high (HD) Copper Foil that extends of said copper foil layer 1, the thickness of said copper foil layer 1 is 5~100um.

Wherein, said insulation adhesive glue-line 3 is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line 3 is 5~50um.

Wherein, said release layer 4 is a kind of in mould release membrance and the release liners, and the thickness of said release layer 4 is 30~200um.

The manufacturing approach of above-mentioned no glue single face copper clad foil substrate with paste functionality is following:

One, the no glue single face copper clad foil substrate of preparation:

Utilize organic solvent to come each required component of mixed dissolution; Form the liquid dispersion of insulating substrate, use the coating production equipment that the liquid dispersion of this insulating substrate is coated on the copper foil layer, through online drying oven; Remove the organic solvent that includes and reach curing; In order to avoid when rolling, adhere to each other, and reach composition reaction curing through follow-up baking process, form no glue single face copper clad foil substrate;

Two, preparation the utlity model has the no glue single face copper clad foil substrate of paste functionality:

Utilize organic solvent to mix each required component; Form the liquid dispersion of insulation adhesive glue-line; Use the coating production equipment to be coated on the insulating substrate surface liquid dispersion of this insulation adhesive glue-line; Through the baking of online drying oven, remove the organic solvent that includes, and make the liquid dispersion of said insulation adhesive glue-line reach the moving semi-cured state formation of semi-fluid insulation adhesive glue-line; On the insulation adhesive glue-line, paste release layer at last, make said no glue single face copper clad foil substrate with paste functionality.

Adjustment through insulation adhesive glue-line prescription reached insulating substrate and the approaching thermal coefficient of expansion of insulation adhesive glue-line, thereby forms a kind of globality, the FPC material of high dimensional stability.

The no glue single face copper clad foil substrate with paste functionality of the utility model is applicable to multi-layer sheet production technology and some other FPC substrate that need close through no gum base materials and pure gluing.

The dimensional stability test result of the no glue single face copper clad foil substrate with paste functionality of the utility model is following:

Sample 1 Sample 2 Sample 3 Sample 4 Copper foil layer RA copper ED copper RA copper RA copper Insulating substrate Polyimides Polyimides Polyimides Polyimides The insulation adhesive glue-line Transparent Transparent The pure glue of traditional handicraft Do not have Dimensional stability ?0.12% ?0.15% 0.2% ?0.1% The scolding tin thermal endurance ?288℃?10S ?288℃?10S 288℃?10S ?288℃?10S Reflectivity ?95% ?85% 82% ?83% Cover power Opaque Opaque Opaque Opaque The number of times of anti-the bending >10 ten thousand times >5 ten thousand times >7 ten thousand times >12 ten thousand times

In the last table, sample 1 and 2 is the no glue single face copper clad foil substrate with paste functionality of the utility model; Sample 3 does not have glue single face copper clad foil substrate for traditional handicraft and pastes pure glue; Sample 4 is no glue single face copper clad foil substrate.

Claims (7)

1. no glue single face copper clad foil substrate with paste functionality; Comprise insulating substrate (2) and copper foil layer (1); Said insulating substrate (2) is formed at said copper foil layer (1) lower surface; It is characterized in that: said insulating substrate (2) lower surface is formed with insulation adhesive glue-line (3), and said insulation adhesive glue-line (3) lower surface is covered with release layer (4).
2. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 1 is characterized in that: said insulation adhesive glue-line (3) is the moving semi-cured state of semi-fluid.
3. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 1; It is characterized in that: said insulating substrate (2) is polyimide film, PETG film, gather a kind of in naphthalene ester film and the liquid crystalline polymer film, and the thickness of said insulating substrate (2) is 7~100um.
4. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 3 is characterized in that: said insulating substrate (2) is polyimides (PI) film.
5. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 1 is characterized in that: a kind of in rolled copper foil, electrolytic copper foil and the high extension Copper Foil of said copper foil layer (1), the thickness of said copper foil layer (1) is 5~100um.
6. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 1; It is characterized in that: said insulation adhesive glue-line (3) is a kind of in epoxide-resin glue system layer, SGA system layer, PETG glue system layer, polyurethane adhesive system layer and the polyimides glue system layer, and the thickness of said insulation adhesive glue-line (3) is 5~50um.
7. the no glue single face copper clad foil substrate with paste functionality as claimed in claim 1 is characterized in that: a kind of in mould release membrance and the release liners of said release layer (4), the thickness of said release layer (4) is 30~200um.
CN2012200017899U 2012-01-05 2012-01-05 Glue-free single-sided copper foil coated substrate with bonding function CN202435714U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200017899U CN202435714U (en) 2012-01-05 2012-01-05 Glue-free single-sided copper foil coated substrate with bonding function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200017899U CN202435714U (en) 2012-01-05 2012-01-05 Glue-free single-sided copper foil coated substrate with bonding function

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CN202435714U true CN202435714U (en) 2012-09-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof
CN103200771A (en) * 2012-01-05 2013-07-10 松扬电子材料(昆山)有限公司 Non-glue single face copper clad laminate with bonding function and manufacturing method thereof
CN103847195A (en) * 2012-12-05 2014-06-11 昆山雅森电子材料科技有限公司 Resin coated copper foil for printed circuit board and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200771A (en) * 2012-01-05 2013-07-10 松扬电子材料(昆山)有限公司 Non-glue single face copper clad laminate with bonding function and manufacturing method thereof
CN103200771B (en) * 2012-01-05 2016-12-14 松扬电子材料(昆山)有限公司 There is glue-free single sided copper clad substrate and the manufacture method thereof of paste functionality
CN103847195A (en) * 2012-12-05 2014-06-11 昆山雅森电子材料科技有限公司 Resin coated copper foil for printed circuit board and manufacturing method thereof
CN103144377A (en) * 2013-03-15 2013-06-12 松扬电子材料(昆山)有限公司 Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof

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