CN201830544U - High-heat conductivity cover film and copper-clad plate using the same - Google Patents
High-heat conductivity cover film and copper-clad plate using the same Download PDFInfo
- Publication number
- CN201830544U CN201830544U CN2010202645060U CN201020264506U CN201830544U CN 201830544 U CN201830544 U CN 201830544U CN 2010202645060 U CN2010202645060 U CN 2010202645060U CN 201020264506 U CN201020264506 U CN 201020264506U CN 201830544 U CN201830544 U CN 201830544U
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- heat
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- coverlay
- copper foil
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Abstract
The utility model relates to a high-heat conductivity cover film and a copper-clad plate using the same; the high-heat conductivity cover film comprises a heat conductive insulating base film, a heat conductive insulating rubber layer which is coated on the heat conductive insulating base film, and release paper or a release film which is clad on the heat conductive insulating rubber layer. The copper-clad plate using the cover film comprises two single-sided copper-clad plates which are arranged in mirror symmetry; each single-sided copper-clad plate comprises a copper foil and the cover film which is coated on the copper foil; the cover film comprises the heat conductive insulating base film and the heat conductive insulating rubber layer which is covered on the heat conductive insulating base film; the cover film is covered on the copper foil along the heat conductive insulating rubber layer; and the two single-sided copper-clad plates are mutually jointed in mirror symmetry along the heat conductive insulating base film. The high-heat conductivity cover film has excellent high heat conductivity, so that a high-heat conductivity flexible printed circuit board can be prepared from the cover film.
Description
Technical field
The utility model relates to a kind of coverlay, relates in particular to a kind of high heat-conducting type coverlay and uses its copper-clad plate.
Background technology
Along with electronic product develops to light, thin, short, little, high density, multifunction, element packaging density and integrated level are more and more higher on the printed circuit board, power consumption is increasing, thermal diffusivity to substrate requires more and more higher, if the thermal diffusivity of substrate is not good, to cause the components and parts on the printed circuit board overheated, thereby whole aircraft reliability is descended.Be born under this background base materials of various high heat radiations comprise the Metal Substrate copper-clad plate (as CN 201436206 etc.), heat-conducting type glued membrane, heat-conducting type two-layer method flexibility coat copper plate (FCCL) of heat-conducting type etc.
Flexible printed-circuit board (FPC) is existing to be mainly used in fields such as military affairs, space flight and aviation in the past and to expand to product for civilian use industry, as mobile phone, hard disk drive (HDD) and flat panel display consumption electronic products such as (FPD), the FCCL of its upstream also keeps higher growth rate development.Continuous expansion along with high heat conducting base material market, the FCCL of the equal active development heat-conducting type of each producer, as JP2009096192 and WO2009110387 etc., prepare two layers of method FCCL of heat-conducting type by in polyamic acid solution, adding the higher filler of conductive coefficient, but the preparation of heat-conducting type three-layer process FCCL and coverlay does not appear in the newspapers, become thermal insulation layer because the conductive coefficient of common PI film is low, make the conductive coefficient of final products be difficult to improve.Be accompanied by the exploitation of upstream insulating basement membrane producer to the heat-conducting type film, the preparation as WO2009110387 discloses a kind of high heat-conducting type PI film simultaneously will make the preparation of heat-conducting type three-layer process FCCL and coverlay arise at the historic moment.
The utility model content
The purpose of this utility model is to provide a kind of high heat-conducting type coverlay, has excellent high-termal conductivity, thereby can be beneficial to the flexible printed wiring board that uses this coverlay to prepare high heat-conducting type.
Another purpose of the present utility model is to provide a kind of copper-clad plate of using above-mentioned high heat-conducting type coverlay, has high-termal conductivity.
For achieving the above object, the utility model provides a kind of high heat-conducting type coverlay, comprising: heat-conducting type insulating basement membrane and be coated on heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane also comprises the release liners or the release film that are laminated with on heat-conducting type insulation glue-line.
Described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m.
Described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m, preferred 5-20 μ m.
The thickness of described release liners or release film is 50-150 μ m.
Simultaneously, a kind of copper-clad plate is provided, this copper-clad plate is a single-side coated copper plate, comprise Copper Foil and be overlaid on coverlay on the Copper Foil, described coverlay comprises the heat-conducting type insulating basement membrane, is coated on the heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane, and coverlay is overlying on the Copper Foil along this heat-conducting type insulating cement lamination.
Described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
Another kind of copper-clad plate of the present invention, this copper-clad plate is a double face copper, it comprises symmetrically arranged two single-side coated copper plates of mirror image, this single-side coated copper plate comprises Copper Foil and is overlaid on coverlay on the Copper Foil, described coverlay comprises the heat-conducting type insulating basement membrane, is coated on the heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane, coverlay is overlying on the Copper Foil along this heat-conducting type insulating cement lamination, and two single-side coated copper plates are fitted mutually along this heat-conducting type insulating basement membrane and are mirror image and are symmetrical arranged.
Described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
The beneficial effects of the utility model are: the high heat-conducting type coverlay of the utility model has excellent high-termal conductivity, thereby can be beneficial to the flexible printed wiring board that uses this coverlay to prepare high heat-conducting type; Use the copper-clad plate of this coverlay, have high-termal conductivity.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effects apparent by embodiment of the present utility model is described in detail.
In the accompanying drawing,
Fig. 1 is the structural representation of high heat-conducting type coverlay of the present utility model;
Fig. 2 is the structural representation of the utility model first embodiment copper-clad plate;
Fig. 3 is the structural representation of the utility model second embodiment copper-clad plate.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, high heat-conducting type coverlay of the present utility model comprises: heat-conducting type insulating basement membrane 1, be coated on the heat-conducting type insulation glue-line 2 on the heat-conducting type insulating basement membrane 1 and be laminated with release liners or release film 3 on heat-conducting type insulation glue-line 2.
Wherein, described heat-conducting type insulating basement membrane 1 is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m.Described heat-conducting type insulation glue-line 2 is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m, preferred 5-20 μ m.The thickness of described release liners or release film 3 is 50-150 μ m.
The concrete preparation process of high heat-conducting type coverlay of the present utility model is as follows:
(1) utilizing organic solvent to mix each required glue is the liquid dispersion that component forms glue-line, uses coating equipment that this dispersion single or double is coated on the heat-conducting type insulating basement membrane.
(2) make the online drying oven of insulating basement membrane process that is coated with dispersion,, remove organic solvent and dry compositions thus, contain the said composition layer of semi-solid preparation attitude with formation 80-160 ℃ of heating 1 to 8 minute.
(3) 80-100 ℃ down and release liners or release film compound, promptly obtain the coverlay of heat-conducting type.
The key property of this heat-conducting type coverlay reaches the relevant criterion requirement, and conductive coefficient is greater than common coverlay.
As shown in Figure 2, the first embodiment copper-clad plate of the above-mentioned high heat-conducting type coverlay preparation of use of the present utility model, be single-side coated copper plate, comprise Copper Foil 4 and be overlaid on coverlay on the Copper Foil 4, described coverlay comprises heat-conducting type insulating basement membrane 1, is coated on the heat-conducting type insulation glue-line 2 on the heat-conducting type insulating basement membrane 1, and coverlay is overlaid on the Copper Foil along this heat-conducting type insulation glue-line 2.
Described heat-conducting type insulating basement membrane 1 is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line 2 is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil 4 is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
As shown in Figure 3, the second embodiment copper-clad plate of the above-mentioned high heat-conducting type coverlay preparation of use of the present utility model, be double face copper, comprise symmetrically arranged two single-side coated copper plates of mirror image, this single-side coated copper plate comprises Copper Foil 4 and is overlaid on coverlay on the Copper Foil 4, described coverlay comprises heat-conducting type insulating basement membrane 1, is coated on the heat-conducting type insulation glue-line 2 on the heat-conducting type insulating basement membrane 1, coverlay is overlaid on the Copper Foil 4 along this heat-conducting type insulation glue-line 2, and two single-side coated copper plates are mirror image along this heat-conducting type insulating basement membrane 1 mutual applying and are symmetrical arranged.
Described heat-conducting type insulating basement membrane 1 is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line 2 is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil 4 is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
The preparation process of copper-clad plate of the present utility model: at first adopt above-mentioned high heat-conducting type coverlay and Copper Foil pressing to make single-side coated copper plate, it is peeled off release liners on the coverlay or release film earlier, again Copper Foil is pressed on its heat-conducting type insulation glue-line, thereby forms the single-side coated copper plate of high heat-conducting type; Get two prepared single-side coated copper plates and carry out pressing relatively, can make the double face copper of high heat-conducting type with the heat-conducting type insulating basement membrane on it.
In sum, the high heat-conducting type coverlay of the utility model has excellent high-termal conductivity, thereby can be beneficial to the flexible printed wiring board that uses this coverlay to prepare high heat-conducting type; Use the copper-clad plate of this coverlay, have high-termal conductivity.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection range of the utility model accompanying Claim.
Claims (10)
1. one kind high heat-conducting type coverlay is characterized in that, comprising: heat-conducting type insulating basement membrane and be coated on heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane.
2. high heat-conducting type coverlay as claimed in claim 1 is characterized in that, also comprises the release liners or the release film that are laminated with on heat-conducting type insulation glue-line.
3. high heat-conducting type coverlay as claimed in claim 1 is characterized in that, described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film.
4. high heat-conducting type coverlay as claimed in claim 1 is characterized in that, the thickness of described heat-conducting type insulating basement membrane is 10-100 μ m.
5. high heat-conducting type coverlay as claimed in claim 1 is characterized in that, described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m.
6. high heat-conducting type coverlay as claimed in claim 2 is characterized in that, the thickness of described release liners or release film is 50-150 μ m.
7. copper-clad plate, it is characterized in that, this copper-clad plate is a single-side coated copper plate, comprise Copper Foil and be overlaid on coverlay on the Copper Foil, described coverlay comprises the heat-conducting type insulating basement membrane, is coated on the heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane, and coverlay is overlying on the Copper Foil along this heat-conducting type insulating cement lamination.
8. copper-clad plate as claimed in claim 7 is characterized in that, described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
9. copper-clad plate, it is characterized in that, this copper-clad plate is a double face copper, it comprises symmetrically arranged two single-side coated copper plates of mirror image, this single-side coated copper plate comprises Copper Foil and is overlaid on coverlay on the Copper Foil, described coverlay comprises the heat-conducting type insulating basement membrane, be coated on the heat-conducting type insulation glue-line on the heat-conducting type insulating basement membrane, and coverlay is overlying on the Copper Foil along this heat-conducting type insulating cement lamination, and two single-side coated copper plates are fitted mutually along this heat-conducting type insulating basement membrane and are mirror image and are symmetrical arranged.
10. copper-clad plate as claimed in claim 9 is characterized in that, described heat-conducting type insulating basement membrane is polyimide film, polyester film, poly-naphthalene ester film or liquid crystalline polymer film, and its thickness is 10-100 μ m; Described heat-conducting type insulation glue-line is epoxide-resin glue system, acrylate adhesive system, polyester glue system, polyurethane adhesive system or polyimides glue system, and its thickness is 5-45 μ m; Described Copper Foil is rolled copper foil or electrolytic copper foil, and thickness is 9-70 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202645060U CN201830544U (en) | 2010-07-16 | 2010-07-16 | High-heat conductivity cover film and copper-clad plate using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202645060U CN201830544U (en) | 2010-07-16 | 2010-07-16 | High-heat conductivity cover film and copper-clad plate using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201830544U true CN201830544U (en) | 2011-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202645060U Expired - Lifetime CN201830544U (en) | 2010-07-16 | 2010-07-16 | High-heat conductivity cover film and copper-clad plate using the same |
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| CN (1) | CN201830544U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102523691A (en) * | 2011-12-27 | 2012-06-27 | 厦门达尔电子有限公司 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
| CN102516896A (en) * | 2011-12-30 | 2012-06-27 | 常熟市富邦胶带有限责任公司 | Heat conductive coating-type polyimide film for copper cladding and preparation method thereof |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN102958269A (en) * | 2011-08-31 | 2013-03-06 | 冠品化学股份有限公司 | Heat-conducting flexible printing circuit board structure |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
| CN103702513A (en) * | 2014-01-17 | 2014-04-02 | 杨秀英 | Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof |
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN103857175A (en) * | 2014-03-06 | 2014-06-11 | 李迪 | High-heat-conductive self-adhesive LED flexible circuit board |
| CN109177382A (en) * | 2018-09-11 | 2019-01-11 | 陕西长石电子材料股份有限公司 | A kind of high thermal conductivity high-cooling property flexibility coat copper plate and preparation method thereof |
-
2010
- 2010-07-16 CN CN2010202645060U patent/CN201830544U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN102958269A (en) * | 2011-08-31 | 2013-03-06 | 冠品化学股份有限公司 | Heat-conducting flexible printing circuit board structure |
| CN103068151B (en) * | 2011-10-21 | 2015-09-09 | 松扬电子材料(昆山)有限公司 | Heat radiating material |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
| CN102523691A (en) * | 2011-12-27 | 2012-06-27 | 厦门达尔电子有限公司 | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces |
| CN102516896A (en) * | 2011-12-30 | 2012-06-27 | 常熟市富邦胶带有限责任公司 | Heat conductive coating-type polyimide film for copper cladding and preparation method thereof |
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN103702511B (en) * | 2013-12-31 | 2017-07-07 | 广东生益科技股份有限公司 | A kind of high-thermal conductive metal base plate and preparation method thereof |
| CN103702513A (en) * | 2014-01-17 | 2014-04-02 | 杨秀英 | Carrier film suitable for single-sided flexible circuit board, as well as preparation method and application thereof |
| CN103857175A (en) * | 2014-03-06 | 2014-06-11 | 李迪 | High-heat-conductive self-adhesive LED flexible circuit board |
| CN109177382A (en) * | 2018-09-11 | 2019-01-11 | 陕西长石电子材料股份有限公司 | A kind of high thermal conductivity high-cooling property flexibility coat copper plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110511 |
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| CX01 | Expiry of patent term |