CN103857175A - High-heat-conductive self-adhesive LED flexible circuit board - Google Patents
High-heat-conductive self-adhesive LED flexible circuit board Download PDFInfo
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- CN103857175A CN103857175A CN201410079252.8A CN201410079252A CN103857175A CN 103857175 A CN103857175 A CN 103857175A CN 201410079252 A CN201410079252 A CN 201410079252A CN 103857175 A CN103857175 A CN 103857175A
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Abstract
The invention discloses a high-heat-conductive self-adhesive LED flexible circuit board. The LED flexible circuit board comprises an upper layer, a lower layer, a middle layer, a first sandwich layer between the upper layer and the middle layer and a second sandwich layer between the lower layer and the middle layer, the upper layer and the lower layer are temperature-resistant layers, the middle layer is an electric-conducting layer, the first sandwich layer is an insulating layer, and the second sandwich layer is a self-adhesive layer. The temperature-resistant layers, the self-adhesive layer, the conducting layer and the insulating layer are laminated in sequence, PI films with excellent high and low temperature resistance are selected for the temperature-resistant layers, heat conducting double-faced adhesive tape high in heat conductivity coefficient and pressure resistance is selected for the self-adhesive layer and can be tightly combined with cooling fins, and convex-concave faces of the surfaces of the cooling fins can be filled with the heat conducting double-faced adhesive tape; electric-conducting and heat-conducting copper foil most frequently in use at present is selected for the electric-conducting layer, and high-temperature hot melt adhesive is selected for the insulating layer. The LED flexible circuit board is high in heat conductivity, wide in heat conduction range, good in insulating effect, resistant to high pressure and easy to manufacture, the LED flexible circuit board is an environment-friendly product, no chemical agent is needed for use in the whole manufacturing process, and the LED flexible circuit board is suitable for general products needing high heat conduction.
Description
Technical field
The present invention relates to circuit board, particularly a kind of high heat-conductive self-sticky LED flexible PCB.
Background technology
It is that base material is made that existing PCB circuit board normally adopts aluminium base, resin plate, copper base, adopt the circuit board of above-mentioned board making, its thickness is thicker, radiating effect is poor, can not be bending, can not be used for being directly mounted on the electronic-device radiator surface that caloric value is large, and in manufacturing process, need to use chemical solvent, quite large to environmental impact, and not environmental protection.
Summary of the invention
The object of the invention is to, for the above-mentioned defect of prior art, provide a kind of high heat-conductive self-sticky LED flexible PCB.
The present invention is achieved in that a kind of high heat-conductive self-sticky LED flexible PCB, comprise the second interlayer between the first interlayer and lower floor and the intermediate layer between upper strata, lower floor, intermediate layer, upper strata and intermediate layer, described the upper and lower are heat-resistant layer, described intermediate layer is conductive layer, described the first interlayer is insulating barrier, and described the second interlayer is from glutinous layer.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described heat-resistant layer is PI film member.PI film has good resistant of high or low temperature, electric insulating quality, caking property, radiation resistance, can in the temperature range of-40 ℃ ~ 280 ℃, use for a long time, and temperature when short-term is used can reach 400 ℃, and electric insulation endurance is up to 22KV/mm.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described conductive layer is Copper Foil member.Copper Foil is to use now the highest conductive heat conducting material, makes heat conduction scope of the present invention reach maximum area.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described insulating barrier is high temperature PUR member.Adopt high temperature PUR as of the present invention from glutinous layer, can effectively fit PI film and Copper Foil, to copper foil circuit gap-fill and increase the insulating properties of Copper Foil spacing.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described is double-sided adhesive members from glutinous layer.Because the conductive coefficient scope of double faced adhesive tape is at 1 ~ 6W/mk, insulate high pressure resistant up to 3 ~ 6KV, can normally work the scope of 40 ℃ ~ 180 ℃, can combine closely with fin, and can fill the male and fomale(M&F) of fin surface; Taking off the PI of lower floor release film part can directly stick on the fin above sticky radiator.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described PI film member thickness is selected in following scope: 0.03mm ~ 1mm.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described Copper Foil member thickness is selected in following scope: 0.03mm ~ 1mm.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described high temperature PUR member thickness is selected in following scope: 0.03mm ~ 1mm.
One as the high heat-conductive self-sticky LED of the present invention flexible PCB is improved, and described double-sided adhesive members thickness is selected in following scope: 0.03mm ~ 1mm.
Compared with prior art, the advantage of the high heat-conductive self-sticky LED of the present invention flexible PCB is: the present invention adopts heat-resistant layer, certainly glutinous layer, conductive layer and insulating barrier to stack gradually, heat-resistant layer is selected has good resistant of high or low temperature PI film, select and there is high thermal conductivity coefficient and high withstand voltage bond plies from glutinous layer, can combine closely with fin, and can fill the male and fomale(M&F) of fin surface; Conductive layer is selected the Copper Foil of the highest conductive and heat-conductive of use now, and insulating barrier is selected high temperature PUR, and can effectively fit PI film and Copper Foil, to copper foil circuit gap-fill and increase the insulating properties of Copper Foil spacing.Make that the present invention has high-termal conductivity, heat conduction scope is wide, insulation effect good, high pressure resistant, processing procedure easily, green product, full manufacturing process, without using any chemical agent, is applicable to the product of the high heat conduction of primary demand.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Reference numeral title: 1, upper strata 2, lower floor 3, intermediate layer 4, the first interlayer 5, the second interlayer.
Embodiment
Just with reference to the accompanying drawings the present invention is described in further detail below.
As shown in Figure 1, a kind of high heat-conductive self-sticky LED flexible PCB, comprise the second interlayer 5 between the first interlayer 4 and lower floor 2 and the intermediate layer 3 between upper strata 1, lower floor 2, intermediate layer 3, upper strata 1 and intermediate layer 3, described upper strata 1 and lower floor 2 are heat-resistant layer, described intermediate layer 3 is conductive layer, described the first interlayer 4 is insulating barrier, and described the second interlayer 5 is from glutinous layer.
Wherein, heat-resistant layer is selected PI film, PI film has good resistant of high or low temperature, electric insulating quality, caking property, radiation resistance, can in the temperature range of-40 ℃ ~ 280 ℃, use for a long time, and temperature when short-term is used can reach 400 ℃, and electric insulation endurance is up to 22KV/mm; PI film thickness is selected in following scope: 0.03mm ~ 1mm.
Conductive layer is selected Copper Foil.Copper Foil is to use now the highest conductive heat conducting material, makes heat conduction scope of the present invention reach maximum area; Copper thickness is selected in following scope: 0.03mm ~ 1mm.
Insulating barrier is selected high temperature PUR.Adopt high temperature PUR as of the present invention from glutinous layer, can effectively fit PI film and Copper Foil, to copper foil circuit gap-fill and increase the insulating properties of Copper Foil spacing; High temperature PUR thickness is selected in following scope: 0.03mm ~ 1mm.
Select double faced adhesive tape from glutinous layer.Because the conductive coefficient scope of double faced adhesive tape is at 1 ~ 6W/mk, insulate high pressure resistant up to 3 ~ 6KV, can normally work the scope of 40 ℃ ~ 180 ℃, can combine closely with fin, and can fill the male and fomale(M&F) of fin surface; Taking off the PI of lower floor release film part can directly stick on the fin above sticky radiator.Double faced adhesive tape thickness is selected in following scope: 0.03mm ~ 1mm.
The announcement of book and instruction according to the above description, those skilled in the art in the invention can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the present invention is not limited to embodiment disclosed and described above, also should fall in the protection range of claim of the present invention modifications and changes more of the present invention.In addition,, although used some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (10)
1. one kind high heat-conductive self-sticky LED flexible PCB, it is characterized in that, comprise the second interlayer between the first interlayer and lower floor and the intermediate layer between upper strata, lower floor, intermediate layer, upper strata and intermediate layer, described the upper and lower are heat-resistant layer, described intermediate layer is conductive layer, described the first interlayer is insulating barrier, and described the second interlayer is from glutinous layer.
2. high heat-conductive self-sticky LED flexible PCB according to claim 1, is characterized in that, described heat-resistant layer is PI film member.
3. high heat-conductive self-sticky LED flexible PCB according to claim 1, is characterized in that, described conductive layer is Copper Foil member.
4. high heat-conductive self-sticky LED flexible PCB according to claim 1, is characterized in that, described insulating barrier is high temperature PUR member.
5. high heat-conductive self-sticky LED flexible PCB according to claim 1, is characterized in that, described is double-sided adhesive members from glutinous layer.
6. high heat-conductive self-sticky LED flexible PCB according to claim 2, is characterized in that, described PI film member thickness is selected in following scope: 0.03mm ~ 1mm.
7. high heat-conductive self-sticky LED flexible PCB according to claim 3, is characterized in that, described Copper Foil member thickness is selected in following scope: 0.03mm ~ 1mm.
8. high heat-conductive self-sticky LED flexible PCB according to claim 4, is characterized in that, described high temperature PUR member thickness is selected in following scope: 0.03mm ~ 1mm.
9. high heat-conductive self-sticky LED flexible PCB according to claim 5, is characterized in that, described double-sided adhesive members thickness is selected in following scope: 0.03mm ~ 1mm.
10. high heat-conductive self-sticky LED flexible PCB according to claim 1, is characterized in that, the flexible or bending of described high heat-conductive self-sticky LED flexible PCB, and can directly stick on the fin being bonded at above radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079252.8A CN103857175A (en) | 2014-03-06 | 2014-03-06 | High-heat-conductive self-adhesive LED flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410079252.8A CN103857175A (en) | 2014-03-06 | 2014-03-06 | High-heat-conductive self-adhesive LED flexible circuit board |
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| Publication Number | Publication Date |
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| CN103857175A true CN103857175A (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410079252.8A Pending CN103857175A (en) | 2014-03-06 | 2014-03-06 | High-heat-conductive self-adhesive LED flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276397A (en) * | 2014-07-11 | 2016-01-27 | 晋挥电子有限公司 | Full-periphery-luminosity LED lamp |
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|---|---|---|---|---|
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| CN201898657U (en) * | 2010-09-15 | 2011-07-13 | 惠州志能达光电科技有限公司 | flexible circuit board with high heat conduction |
| CN202911225U (en) * | 2012-08-13 | 2013-05-01 | 广东生益科技股份有限公司 | Graphite composite heat conduction adhesive film and graphite composite metal-based copper-clad plate |
| CN203210782U (en) * | 2013-04-26 | 2013-09-25 | 昆山明讯电子科技有限公司 | Heat conductive copper foil |
| CN203339222U (en) * | 2013-04-03 | 2013-12-11 | 东莞市天禧光电科技有限公司 | Heat-conduction flexible LED wire plate |
| CN203840631U (en) * | 2014-03-06 | 2014-09-17 | 李迪 | High-heat-conductivity self-adhesive LED flexible circuit board |
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2014
- 2014-03-06 CN CN201410079252.8A patent/CN103857175A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201830544U (en) * | 2010-07-16 | 2011-05-11 | 广东生益科技股份有限公司 | High-heat conductivity cover film and copper-clad plate using the same |
| CN201898657U (en) * | 2010-09-15 | 2011-07-13 | 惠州志能达光电科技有限公司 | flexible circuit board with high heat conduction |
| CN202911225U (en) * | 2012-08-13 | 2013-05-01 | 广东生益科技股份有限公司 | Graphite composite heat conduction adhesive film and graphite composite metal-based copper-clad plate |
| CN203339222U (en) * | 2013-04-03 | 2013-12-11 | 东莞市天禧光电科技有限公司 | Heat-conduction flexible LED wire plate |
| CN203210782U (en) * | 2013-04-26 | 2013-09-25 | 昆山明讯电子科技有限公司 | Heat conductive copper foil |
| CN203840631U (en) * | 2014-03-06 | 2014-09-17 | 李迪 | High-heat-conductivity self-adhesive LED flexible circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276397A (en) * | 2014-07-11 | 2016-01-27 | 晋挥电子有限公司 | Full-periphery-luminosity LED lamp |
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Application publication date: 20140611 |