TWM540741U - Multi-layer composite heat conduction structure - Google Patents

Description

Multi-layer composite heat conduction structure

The present invention relates to a multilayer composite heat conduction structure, and more particularly to a multilayer composite heat conduction structure having high-efficiency heat conduction in a three-dimensional direction.

According to the introduction, many electronic components, especially large integrated circuits, microprocessors, etc., are inevitably accompanied by high heat during operation. If this high heat cannot be eliminated in time, it will not only detract from the operational efficiency and service life of electronic components, but will also cause malfunction of electronic components and lose function. Especially in today's electronic products in order to meet the trend of thin and light, most of the related microprocessors gradually adopt a high degree of integration design method, so that the heat released per unit area of the components is doubled, so the cooling room is insufficient. The adverse effects or damages caused will also be serious.

Conventional means for promoting the heat dissipation performance of electrical products are generally provided by disposing a heat dissipating medium between a heat generating electrical component and a heat sink, such as a thermal conductive film, a thermal conductive paste, a thermally conductive double-sided tape, and a solid-state liquid heat conduction phase change. In order to effectively transfer the heat generated by the heat-generating electronic components to the heat sink for the purpose of cooling the electrical equipment.

However, the interface material of the heat dissipating medium focuses on transferring the heat of the electronic component vertically to the heat sink, and then dissipating heat through the heat sink. However, when the electronic and electrical equipment (housing) is not a good heat-dissipating material (such as plastic), or when other radiators cannot be used in a limited space and in a narrow confined space, it is impossible to effectively cool electronic components or electronic appliances. purpose.

In view of the above-mentioned problems of the prior art, one of the objects of the present invention is to provide a multi-layer composite heat-conducting structure, which mainly forms high-efficiency heat conduction in a three-dimensional direction, has high flexural characteristics, and can be constructed with an insulating structure, and is suitable for being disposed in Between the heat-generating surface of the electronic component and the heat sink, and the high deflection in the limited space or narrow confined space of the electronic and electrical mechanism, the three-dimensional directional conduction heat can be transferred to achieve comprehensive diffusion and rapid heat dissipation performance, so as to eliminate conduction. The high heat generated by electronic components is used to ensure the operational efficiency and service life of electronic components, and has industrial utilization value.

Therefore, in order to achieve the above object, the present invention proposes a multi-layer composite heat-conducting structure comprising: at least one flexible thermal conductive adhesive layer having uniformly distributed thermal conductive powder, wherein the flexible thermal conductive adhesive layer is disposed in contact with the electronic component And a surface of the at least one heat conduction layer formed by at least one of a metal layer and a non-metal layer, wherein the metal layer and the non-metal layer have a higher thermal conductivity than the flexible thermal conductive layer; wherein at least one flexible thermal conductive layer and at least A heat conducting thermal layer is stacked on top of each other.

Preferably, the colloid may be further included such that the metal layer and the non-metal layer are stacked on each other.

Preferably, the material of the metal layer may comprise copper foil, aluminum foil or tin foil, and the material of the non-metal layer may comprise graphite or graphite fibers.

Preferably, the thermally conductive structure may be formed by a plurality of flexible thermal conductive adhesive layers and a plurality of thermally conductive thermal layers interdigitated.

Preferably, the at least one heat conduction heat layer may be formed by a plurality of metal layers and a plurality of non-metal layers interdigitated.

Preferably, the heat conducting structure may be combined with a thermally conductive thermal layer by a two-phase flexible thermal conductive adhesive layer.

Preferably, the at least one thermally conductive layer may be bonded to the metal layer by a two-phase non-metallic layer.

Preferably, one of the at least one thermally conductive thermal layer away from the heat conductive thermal layer of the heat generating electronic component may be combined with another flexible thermal conductive adhesive layer.

Preferably, one of the at least one flexible thermally conductive adhesive layer away from the flexible thermal conductive layer of the heat-generating electronic component may be combined with another thermally conductive thermal layer.

Preferably, at least one flexible thermal conductive adhesive layer can be glued and fixed to at least one heat conductive thermal layer.

Preferably, at least one flexible thermal conductive adhesive layer can be applied to at least one thermally conductive thermal layer.

As stated above, it may have one or more of the following advantages in accordance with the present creation:

1. The heat conduction structure of the creation can form high-efficiency heat conduction in three-dimensional direction, and is suitable for three-dimensional directional conduction heat transfer between the heating surface of the electronic component and the heat sink, and achieves comprehensive diffusion and rapid heat dissipation performance, so as to be surely conducted. Eliminate the high heat generated by electronic components, to ensure the operating efficiency and service life of electronic components, and to have industrial value.

2. The heat-conducting structure of the creation has high flexural characteristics, and the high deflection is set in a limited space of the electronic and electrical mechanism or in a narrow confined space.

10,11,12,13‧‧‧Flexible thermal adhesive layer

20, 21, 22‧‧‧ Thermal Conductive Thermal Layer

201, 204, 211, 214, 221‧‧‧ non-metallic layers

202, 205, 212, 222‧‧‧ metal layers

203, 213, 223‧‧ ‧ colloid

30‧‧‧Electronic components

40‧‧‧heatsink

50‧‧‧Electronic and electrical institutions

1 is an enlarged cross-sectional view showing a composite heat-conducting structure of a first embodiment of the present invention; and FIG. 2 is an enlarged cross-sectional view showing a second embodiment of the present invention; 3 is a structural diagram of a third embodiment of the present creation; FIG. 4 is a use state diagram of the fourth embodiment of the present creation; FIG. 5 is a state diagram of use of the fifth embodiment of the present creation; The use state diagram of the sixth embodiment; and the seventh diagram is a use state diagram of the seventh embodiment of the present creation.

The advantages, features, and technical methods of the present invention will be more readily understood by referring to the exemplary embodiments and the accompanying drawings, and the present invention can be implemented in various forms and should not be construed as being limited to The stated embodiments, to the contrary, the embodiments of the present invention will provide a more thorough and complete and complete disclosure of the scope of the present invention, and the present invention will only be attached. The scope of the patent application is defined.

One or more embodiments of the present invention disclose a multilayer composite heat-conducting structure, and the following description is as follows: First, referring to Figures 1 to 3, the multilayer composite heat-conducting structure of the present invention has three-dimensional solid heat conduction performance. In the embodiment of the thermally conductive structure shown in the figure, at least one flexible thermal conductive adhesive layer 10 and a heat conductive thermal layer 20 are included, and the flexible thermal conductive adhesive layer 10 can be selected from a thermal conductive film, a thermal conductive colloid, or a solid-state liquid. The thermally conductive layer 20 of the phase change polymer material is thermally conductive, and the heat conducting layer 20 is formed by at least one metal layer 202 and a non-metal layer 201 laminated by a colloid 203. The metal layer 201 is optional. A metal material with high thermal conductivity and high thermal conductivity in the vertical direction, such as copper foil, aluminum foil or tin foil material, instead of metal layer 201, non-metallic materials with high thermal conductivity and good thermal conductivity in the planar direction, such as graphite or graphite fiber materials. Wait. In this embodiment, the thickness of the flexible thermal conductive adhesive layer 10 and the heat conductive thermal layer 20 can be selected from 0.01 mm to 15 mm, so that the material layers are superposed on each other to form a multilayer composite heat conducting structure.

In the preferred embodiment shown in FIGS. 1 to 3, a single flexible thermal conductive adhesive layer 10 or a plurality of flexible thermal conductive adhesive layers 10, 11, 12 may be combined with a single thermally conductive thermal layer 20 or a plurality of thermally conductive thermal layers. 20, 21, which are alternately laminated with each other to form a multilayer composite material, together with the heat conductive thermal layers 20, 21, may be selected as a single non-metal layer 201 or a plurality of non-metal layers 201, 204, 211, 214 with a single metal a layer 202 or a plurality of metal layers 202, 205, 212, which are alternately laminated with each other with colloids 203, 213 to form a thermally conductive thermal layer 20, 21, to obtain a composite structure having three-dimensional heat conduction efficiency; The material has a texture-flexible and flexible material property, and thus can be adhered to the electronic component 30 that generates a heat source to efficiently transfer the heat of the electronic component 30 to the heat sink 40 or to the electronic device. The (outer case) 50 avoids accumulation of heat on the electronic component 30, causing malfunction; thereby solving the heat dissipation problem when the electronic (electrical) component 30 operates.

The flexible thermal conductive adhesive layer 10 and the colloids 203 and 213 in the above multilayer composite material comprise a heat conductive powder, and a rubber material for combining the heat conductive powder fine particles, and the heat conductive powder is uniformly distributed by a mixed chain process. In the glue, it is then fixed. Wherein, the heat conductive powder may be selected from the group consisting of alumina, aluminum nitride, boron nitride, graphite, aluminum powder, copper powder, copper oxide, zinc oxide, etc., and the heat conductive powder may be the foregoing material. One of them is a mixture of two or more materials. The heat conductive powder material is irregular particles, and a suitable average particle size is selected from about 0.1 μm to 100 μm.

The glue can be selected, for example, epoxy resin, acrylic resin, phenolic resin, polyester resin, polyvinyl acetate resin (PVAC), silicone or synthetic rubber, etc. The glue may be one of the foregoing materials or a mixture of two or more materials.

The above epoxy resin, acrylic resin, phenolic resin, polyester resin, polyvinyl acetate resin (PVAC), silicone or synthetic rubber, etc., are all high molecular weight materials, but each Different rubber materials (resins), etc., have the most suitable dissolution and dilution (SP) agent (low molecular weight) decomposition, coating, fusion, and obtain the lowest conjugate glass of (low molecular weight) control rubber (high molecular weight) Softening point, so that the molecular weight of the molecular weight of 1000~1000000 can be obtained, and the temperature of the rubber will be different due to the molecular weight. Under the degree of solid-liquid phase change, there will be no change in gas phase or carbonization at the softening point of the glass. This kind of rubber is called low-temperature phase-change colloid, and the low-temperature phase-change colloid is from 35 °C to 105 °C.

The flexible thermal conductive adhesive layer 10 is usually formed into a surface shape or a sheet shape having a thickness of 0.02 to 15 mm, and since the material of the flexible thermal conductive adhesive layer 10 is flexible and has flexibility and plastic deformation characteristics, it can be tightly and closely The conformation is disposed on the surface of the heat-generating electronic component 30 to reduce the contact thermal resistance of the interface, thereby quickly eliminating heat conduction generated by the electronic component 30.

Furthermore, the flexible thermally conductive adhesive layer 10 and the colloids 203, 213 can be mixed by different ratios of the rubber and the thermally conductive powder to obtain desired heat transfer properties and other material properties: general principle, when mixed materials The higher the proportion of the heat-conducting powder, the better the heat transfer performance, but the physical properties such as flexibility and plasticity of the material are poor. On the contrary, the more the proportion of the rubber material is occupied, the heat transfer performance is poor, and the physical properties such as flexibility and plasticity of the material are better. Usually, 10%~70% of the rubber material is used in combination with 90%~30% of the heat conductive powder, so that the flexible thermal conductive adhesive layer 10 and the colloids 203, 213 can obtain about 0.5 W/mk~12 W/mk. Heat transfer coefficient. In addition, when a high-resistance powder such as aluminum nitride, aluminum oxide or boron nitride is used, the flexible thermal conductive adhesive layer 10 and the colloids 203 and 213 have high electrical resistance (10 ⁶ to 10 ¹⁹ Ω.cm).

The mixed material of the flexible thermal conductive adhesive layer 10 of the present embodiment can be formed into a sheet shape by hot press forming, and is subjected to surface treatment, and is then adhered to the opposite of the metal layer 202 or the non-metal layer 201 of the heat conductive heat layer 20. On the surface. In addition, coating (spraying or doctor coating, etc.) or screen printing may be applied to the surface of the metal layer 202 or the non-metal layer 201 of the heat conductive layer 20 to a thickness of about 0.02 to 0.3 mm. The flexible thermally conductive adhesive layer 10 is bonded to the uniformly distributed thermally conductive powder by the molecular structure of the rubber. Similarly, the mixed material of the colloid 203 can also be formed into a sheet shape by hot press forming, and applied as a surface treatment, and glued to the opposite surface of the metal layer 202 or the non-metal layer 201 of the heat conductive layer 20. In addition, a coating body (such as a spray coating or a doctor coating method) or a screen printing method may be used to apply a colloid 203 having a thickness of about 0.01 mm to the surface of the metal layer 202 or the non-metal layer 201 of the heat conductive layer 20 . The metal layer 202 and the non-metal layer 201 are stacked one on another.

The flexible thermal conductive adhesive layer 10 shown in FIG. 1 is adhered to the heat generating surface of the electronic component 30, and can effectively transfer the heat transferred to the metal layer 202 and the non-metal layer 201 of the heat conductive heat layer 20 for overall diffusion. The heat is dissipated while the heat is efficiently discharged to the heat sink 40. In addition, as shown in FIG. 2, the metal layer 202 and the non-metal layer 201 of the heat conductive layer 20 are fully diffused and transferred to another relatively flexible thermal conductive adhesive layer 11, and are inductively transferred to Electronic and electrical mechanism (housing) 50.

In the present embodiment, the flexible thermally conductive adhesive layer 10 and the metal layer 202, the non-metallic layer 201, and the colloid 203 of the thermally conductive thermal layer 20 have flexible properties, so that they can be flexed as shown in FIGS. 4 and 5. The music is used to transfer the heat source into a three-dimensional directional conduction to a proper position for thermal diffusion and temperature uniformity.

In the embodiment shown in FIGS. 4 and 5, the flexible thermal conductive adhesive layer 10 is adhered to the heat generating surface of the electronic component 30, and the metal layer 202, the non-metal layer 201 and the colloid 203 of the heat conductive thermal layer 20 are laminated on the flexible surface. The thermal conductive adhesive layer 10 can be flexed into a C-shape (as shown in FIG. 4) or an S-shape (as shown in FIG. 5), and the extension of the thermally conductive thermal layer 20 away from the electronic component 30 combines another flexible thermal conduction. The glue layer 13 transfers the heat source to the appropriate position for three-dimensional directional conduction for thermal diffusion and temperature uniformity. In addition, as shown in FIGS. 6 and 7, the flexible thermal conductive adhesive layer 10 is adhered to the heat generating surface of the electronic component 30, and the thermally conductive thermal layer 20 is laminated on the flexible thermal conductive adhesive layer 10, and then thermally conductive. The flexible thermal conductive adhesive layer 11 is laminated on the thermal layer 20, and the flexible thermal conductive adhesive layer 11 can be flexed into a C-shape (as shown in FIG. 6) or an S-shape (as shown in FIG. 7) while being flexible away from the electronic component 30. The protruding portion of the thermal conductive adhesive layer 11 is combined with the metal layer 222 of the other heat conductive layer 22, the non-metal layer 221, and the colloid 223. Therefore, the flexible thermal conductive adhesive layer and the heat conductive thermal layer of the present invention can be highly flexed and disposed in a limited space or a narrow confined space of the electronic and electrical mechanism, and can perform three-dimensional directional conduction transfer heat to achieve comprehensive diffusion and rapid heat dissipation performance.

The multi-layer composite heat conduction structure of the present invention mainly forms high-efficiency heat conduction in a three-dimensional direction, has high flexural characteristics, and can be insulated, and is suitable for being disposed on a heating surface of an electronic component. Between the heat sink and the high-deflection deflection in the limited space or narrow confined space of the electronic and electrical mechanism, the three-dimensional directional conduction heat can be transferred to achieve comprehensive diffusion and rapid heat dissipation performance, so as to accurately conduct and exclude electronic components. The high heat is used to ensure the operational efficiency and service life of electronic components, and has the industrial use value.

The above embodiments are only used to facilitate the description of the present invention, and are not intended to be limiting, and all kinds of simple changes and modifications that can be made by those skilled in the art without departing from the spirit of the present invention should still be included in the following patent applications. In the scope.

10‧‧‧Flexible thermal adhesive layer

20‧‧‧thermal conduction thermal layer

201‧‧‧Non-metal layer

202‧‧‧metal layer

203‧‧‧colloid

30‧‧‧Electronic components

40‧‧‧heatsink

Claims (11)

A multi-layer composite heat-conducting structure comprising: at least one flexible thermal conductive adhesive layer having a uniformly distributed thermal conductive powder, wherein a flexible thermal conductive adhesive layer is disposed to contact a surface of an electronic component; and at least one The heat conductive layer is composed of at least one metal layer and a non-metal layer, wherein the metal layer and the non-metal layer have a higher thermal conductivity than the flexible thermal conductive layer; wherein the at least one flexible thermal conductive layer and the At least one thermally conductive layer of heat is bonded to each other. The multi-layer composite heat-conducting structure according to claim 1, further comprising a colloid such that the metal layer and the non-metal layer are stacked on each other. The multilayer composite heat conducting structure according to claim 1, wherein the material of the metal layer comprises copper foil, aluminum foil or tin foil, and the material of the non-metal layer comprises graphite or graphite fiber. The multi-layer composite heat-conducting structure according to claim 1, wherein the heat-conducting structural system is composed of a plurality of flexible thermal conductive adhesive layers and a plurality of thermally conductive thermal layers interlaced and stacked. The multi-layer composite heat conduction structure according to claim 1, wherein the at least one heat conduction heat layer is formed by a plurality of metal layers and a plurality of non-metal layers interdigitated. The multi-layer composite heat-conducting structure according to claim 1, wherein the heat-conducting structural system is combined with a thermally conductive thermal layer by a two-phase flexible thermal conductive adhesive layer. The multilayer composite heat conducting structure of claim 1, wherein the at least one thermally conductive layer is bonded to the metal layer by a two-phase non-metallic layer. The multi-layer composite thermally conductive structure of claim 1, wherein one of the at least one thermally conductive thermal layer is away from the thermally conductive thermal layer of the electronic component in combination with another flexible thermally conductive adhesive layer. The multilayer composite heat conducting structure of claim 1, wherein one of the at least one flexible thermally conductive adhesive layer is away from the flexible thermally conductive adhesive layer of the electronic component and the other thermally conductive thermal layer. The multi-layer composite heat-conducting structure according to claim 1, wherein the at least one flexible thermal conductive adhesive layer is glued and fixed to the at least one heat conductive thermal layer. The multilayer composite heat conducting structure of claim 1, wherein the at least one flexible thermally conductive adhesive layer is applied to the at least one thermally conductive thermal layer.