CN108738284B - Graphene composite heat dissipation lamination structure and manufacturing method thereof - Google Patents
Graphene composite heat dissipation lamination structure and manufacturing method thereof Download PDFInfo
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- CN108738284B CN108738284B CN201810686766.8A CN201810686766A CN108738284B CN 108738284 B CN108738284 B CN 108738284B CN 201810686766 A CN201810686766 A CN 201810686766A CN 108738284 B CN108738284 B CN 108738284B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 239000002131 composite material Substances 0.000 title claims abstract description 34
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 24
- 229910021389 graphene Inorganic materials 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000003475 lamination Methods 0.000 title abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 151
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 239000011888 foil Substances 0.000 claims abstract description 47
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 28
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 230000000994 depressogenic effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 229910002056 binary alloy Inorganic materials 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 239000002238 carbon nanotube film Substances 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000004049 embossing Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 6
- 230000006378 damage Effects 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ROXNIEULHPKYMP-UHFFFAOYSA-N [Cu].[Bi].[In] Chemical compound [Cu].[Bi].[In] ROXNIEULHPKYMP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002113 nanodiamond Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a heat dissipation lamination structure which comprises at least two composite heat dissipation layers which are sequentially overlapped, wherein each composite heat dissipation layer comprises a back adhesive layer (11), a metal foil layer (12) and a nonmetal layer (13) which are sequentially overlapped. Preferably, the invention further comprises a liquid metal layer (14) formed between the metal foil layer (12) and the nonmetal layer (13), wherein a sunken groove or pit is formed on the surface of the metal foil layer (12) facing the nonmetal layer (13), and a capillary structure can be formed at the bottom and the side of the pit or the groove. The invention can obviously improve the heat radiation efficiency of the radiator and reduce the damage of heat to peripheral devices.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation technology adopting graphene.
Background
Conventional heat sink materials include silicone, highly thermally conductive metals, and the like. Among metals, copper and aluminum in particular are more common. Copper has a heat conductivity of 398W/mK, but has the defects of high density, easy oxidation and the like. Aluminum has a low thermal conductivity (237W/mK) and sometimes is difficult to meet the heat conduction and dissipation requirements of the existing products. The existing heat dissipation films made of natural graphite materials and artificially synthesized graphite materials have a certain improvement on the heat dissipation of electronic products, but the graphite heat dissipation films are mainly prepared by a method of directly calendaring after graphite treatment, a method of macromolecule carbonization, graphitization and the like, and the heat dissipation materials with graphite on the surfaces have low tensile strength, are fragile and have more particle dust, and are inconvenient to install and use.
Graphene (Graphene) is a planar film with hexagonal honeycomb lattice composed of carbon atoms in sp 2 hybridized orbits, and is a two-dimensional material with a thickness of only one carbon atom. Graphene is the thinnest nano material in the world and is also the hardest nano material, and the heat conductivity coefficient is as high as 5300W/m.K and higher than that of carbon nano tubes and diamond, so that the graphene material is a new focus in the field of heat dissipation materials. However, the heat conduction effect of graphene has anisotropy, the heat dissipation effect of the graphene is better only on a two-dimensional plane, the heat conduction performance of the graphene in the longitudinal direction is sharply folded, and the problem is not solved by the existing graphene heat dissipation film. In addition, the graphene heat dissipation films prepared by the prior art are all of a layer of heat dissipation structure, and the heat dissipation efficiency is still required to be further improved.
Disclosure of Invention
First, the technical problem to be solved
The invention aims to solve the defects of low heat dissipation efficiency, damage to peripheral devices caused by heat and the like of the existing heat dissipation structure.
(II) technical scheme
In order to solve the technical problems, the invention provides a heat dissipation lamination structure, which comprises at least two composite heat dissipation layers stacked in sequence, wherein each composite heat dissipation layer comprises a back adhesive layer, a metal foil layer and a nonmetal layer stacked in sequence.
According to a preferred embodiment of the present invention, the heat dissipation device further comprises a protection layer, wherein the protection layer is wrapped outside each composite heat dissipation layer.
According to a preferred embodiment of the present invention, the nonmetallic layer is a graphene-based material.
According to a preferred embodiment of the present invention, a liquid metal layer is further included, formed between the metal foil layer and the non-metal layer.
According to a preferred embodiment of the invention, the melting point of the liquid metal layer is between 40 and 150 degrees and the thickness is between 1 and 30 μm.
According to a preferred embodiment of the invention, the liquid metal layer is embedded on and flush with the surface of the metal foil layer facing the non-metal layer.
According to a preferred embodiment of the invention, the liquid metal layer is embedded in and embedded in a surface of the metal foil layer facing the non-metal layer.
According to a preferred embodiment of the invention, the metal foil layer is provided with depressed grooves or pits on its surface facing the non-metal layer, said grooves or pits being regularly arranged in a plane direction perpendicular to the heat transfer direction.
According to a preferred embodiment of the present invention, the surface of the metal foil layer facing the nonmetallic layer is provided with depressed grooves or pits, and capillary structures are formed at the bottoms and sides of the pits or grooves.
The invention also provides a method for manufacturing the heat dissipation laminated structure and a corresponding heat radiator.
(III) beneficial effects
The invention can obviously improve the heat radiation efficiency of the radiator and reduce the damage of heat to peripheral devices.
Drawings
FIG. 1 is a schematic view of a first embodiment of a heat dissipating laminate structure of the present invention;
FIG. 2 is a schematic diagram of a heat dissipating laminate structure according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a third embodiment of a heat dissipating laminate structure of the present invention;
FIG. 4 is a schematic view of a fourth embodiment of a heat dissipating laminate structure of the present invention;
FIG. 5 is a schematic view of a fifth embodiment of a heat dissipating laminate structure of the present invention;
FIG. 6 is a schematic view of a sixth embodiment of a heat dissipating laminate structure of the present invention;
FIG. 7 is a schematic view of a seventh embodiment of a heat dissipating laminate structure of the present invention;
fig. 8 is a schematic structural view of an eighth embodiment of the heat dissipation lamination structure of the present invention.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
Fig. 1 is a schematic structural view of a first embodiment of a heat dissipation lamination structure of the present invention. As shown in fig. 1, the heat dissipation laminated structure of the present invention includes a backing layer 11, a metal foil layer 12 and a non-metal layer 13 from bottom to top (the direction shown in the figure is not limited in the stacking direction in practical application). The backing adhesive layer 11 may be a heat conductive adhesive with a high heat conductivity coefficient, such as silica gel. The metal foil layer 12 can be of various room temperature solid state metals including copper, aluminum, tin, and the like. In the present invention, the nonmetallic layer 13 is preferably a graphene-based material, although a carbon nanotube film, a graphite fiber, or the like may be used.
According to a preferred embodiment of the present invention, the heat dissipation laminated structure of this embodiment may further be coated with a protective layer (not shown in the figure), which may be a metal foil layer or a PET layer, or a composite protective layer formed by combining a metal foil layer and a PET layer, and the metal foil layer is, for example, an aluminum foil layer.
According to the present invention, the thickness of the backing layer 11 is preferably 5 μm to 80 μm, the thickness of the metal foil layer 12 is between 10 μm to 100 μm, and the thickness of the non-metal layer 13 is between 5 μm to 80 μm.
In preparing the above heat dissipating laminate structure, a backing layer 11 may be applied on a substrate by coating, spraying, or the like, and then a metal foil layer 12 may be adhered on the backing layer. Finally, a non-metallic layer 13 is applied to the metal foil layer.
Fig. 2 is a schematic structural diagram of a second embodiment of the heat dissipation lamination structure of the present invention. As shown in fig. 2, the heat dissipation laminated structure of this embodiment is a composite structure, i.e. the backing adhesive layer 11, the metal foil layer 12 and the nonmetal layer 13 of the first embodiment are used as a composite heat dissipation layer. Thus, the composite heat sink stack of the embodiment comprises a first composite heat sink layer 1 and a second composite heat sink layer 2. The backing adhesive layer of the second composite heat dissipation layer 2 is superposed on the nonmetallic layer of the first composite heat dissipation layer 1.
The steps for preparing the heat dissipating laminate described above are similar to the first embodiment, except that the previous steps are repeated after the first composite heat dissipating layer is completed.
Compared with the first embodiment, the heat dissipation laminated structure of the second embodiment increases the distance between the bottom layer (bottom end of the heat dissipation laminated structure) for receiving heat and the air interface (top end of the heat dissipation laminated structure) for dissipating heat due to the increase of the number of layers, thereby facilitating the rapid transfer of heat away from the heat generating device, improving the heat dissipation efficiency and protecting the peripheral devices of the heat generating device.
The metal foil layers of the first composite heat dissipation layer 1 and the second composite heat dissipation layer 2 may be the same or different. For example, the metal foil layer of the first composite heat dissipation layer 1 is copper foil, and the metal foil layer of the second composite heat dissipation layer 2 is aluminum foil.
Fig. 3 is a schematic structural view of a third embodiment of the heat dissipation lamination structure of the present invention. As shown in fig. 3, this embodiment is a further extension of the second embodiment. The heat dissipation lamination structure comprises more than two composite heat dissipation layers, namely a first composite heat dissipation layer 1, a second composite heat dissipation layer 2, … … and an Nth composite heat dissipation layer N. N is a natural number and not less than 2.
The method for preparing the heat dissipation lamination structure of the embodiment can also be repeatedly performed with reference to the second embodiment, so that the description is omitted.
Through applying a plurality of compound heat dissipation layers, can make the thickness of heat dissipation lamination structure increase by a large margin, can be like this with heat transfer to the place of keeping away from the heating device fast, improve radiating efficiency greatly, also can reduce the harm of heat to peripheral device minimum.
Fig. 4 is a schematic structural view of a fourth embodiment of the heat dissipation lamination structure of the present invention. This embodiment differs from the third embodiment in that the metal foil layers employed in adjacent composite heat sink layers are of different metals.
As can be seen from the third embodiment and the fourth embodiment, the metal foil layers in each of the multiple composite heat dissipation layers of the present invention may be the same or different. The selection of different metal foil layers can make the variation of the temperature gradient across the heat dissipation path special, whereby a targeted design can be made according to different device requirements to balance the heat dissipation efficiency with the degree of thermal damage to the peripheral devices.
Fig. 5 is a schematic structural view of a fifth embodiment of the heat dissipation lamination structure of the present invention. As shown in fig. 5, in order to further reduce the problem of high thermal resistance between the metal foil layer 12 and the non-metal layer 13 due to process or material compatibility, this embodiment adds a liquid metal layer 14 between the metal foil layer 12 and the non-metal layer 13. By liquid metal is meant herein a metal or alloy that is liquid at temperatures slightly above room temperature, including gallium-based binary alloys, gallium-based multi-component alloys, indium-based alloys, or bismuth-based alloys. Such as gallium indium alloy, gallium lead alloy, gallium indium tin alloy, indium bismuth copper alloy, and the like. Since the liquid metal layer 14 can have good compatibility with both the metal foil layer 12 and the non-metal layer 13 after melting (the melting point is between 40 and 150 degrees), the liquid metal layer and the non-metal layer can be closely contacted, the thermal resistance is reduced, and the heat dissipation efficiency is improved.
The liquid metal layer 14 of this embodiment can be formed by electroplating, powder spraying, deposition, etc. after the formation of the metal foil layer 12 structure, and then spraying a non-metallic material, such as graphene, onto the liquid metal layer 14. The thickness of the liquid metal layer 14 may be 1 μm to 30 μm.
It should be noted that the fifth embodiment of the present invention may be extended to a structure of two or more composite heat dissipation layers, that is, it may be applied to the second to fourth embodiments as a new implementation.
Fig. 6 is a schematic structural view of a sixth embodiment of the heat dissipation lamination structure of the present invention. Unlike the fifth embodiment, the liquid metal layer 14 of this embodiment is embedded on and flush with the surface of the metal foil layer 12 facing the non-metal layer 13. As shown in fig. 6, it can be considered that a depressed groove or pit is provided on the surface of the metal foil layer 12 facing the non-metal layer 13. A layer of liquid metal 14 fills the grooves or pits. The grooves or pits may be regularly arranged in a plane direction perpendicular to the heat transfer direction, or may be irregularly arranged, and the present invention is not limited thereto. However, for uniformity of heat conduction in all directions, the present invention is preferably arranged regularly.
The metal foil layer 12 having the liquid metal layer 14 embedded therein may be prepared by pressing or the like in advance, or the liquid metal layer 14 may be formed by electroplating, spraying or the like on the metal foil layer 12.
The sixth embodiment has an advantage over the fifth embodiment in that the liquid metal layer 14 is confined inside the heat dissipating structure and is not easily flown out to cause device damage.
Fig. 7 is a schematic structural view of a seventh embodiment of the heat dissipation lamination structure of the present invention. Unlike the sixth embodiment, the liquid metal layer 14 embedded in the metal foil layer 12 is not flush with the surface of the metal foil layer 12 facing the non-metal layer 13, but is embedded in the surface of the metal foil layer 12 facing the non-metal layer 13. This embodiment can use a smaller amount of liquid metal, reduce the cost of materials, and make the liquid metal layer 14 less likely to flow out or ooze out, and safer than the sixth embodiment.
Fig. 8 is a schematic structural view of an eighth embodiment of the heat dissipation lamination structure of the present invention. This embodiment is similar to the sixth and seventh embodiments, but does not have a liquid metal layer 14. Specifically, this embodiment is also provided with depressed grooves or dimples on the surface of the metal foil layer 12 facing the non-metal layer 13, and capillary structures are formed at the bottoms and sides of the dimples or grooves. The wicking structure may be formed by stamping, by forming the wicking structure such that non-metallic materials, such as graphene, have a larger contact surface after being sprayed onto the metal foil layer 12, and the contact of the two materials is also more dense, thereby effectively increasing thermal conductivity.
The heat dissipation laminated structure can be applied to various radiators, and the radiators adopting the heat dissipation laminated structure are all within the protection scope of the invention.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the invention thereto, but to limit the invention thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the invention.
Claims (9)
1. A heat dissipating laminate structure, comprising:
At least two composite heat dissipation layers stacked in sequence;
Each composite heat dissipation layer comprises: a back adhesive layer (11), a metal foil layer (12) and a nonmetal layer (13) which comprises graphene materials are sequentially overlapped; and a liquid metal layer (14) having a melting point of 40-150 ℃ and a thickness of 1-30 [ mu ] m and having good compatibility with both the metal foil layer (12) and the nonmetal layer (13), wherein the liquid metal layer (14) is formed by electroplating, powder spraying and deposition after the metal foil layer (12) structure is formed, and then a nonmetal material is sprayed on the liquid metal layer (14) to form the nonmetal layer (13); the liquid metal layer (14) is embedded on and flush with the surface of the metal foil layer (12) facing the non-metal layer (13), or the liquid metal layer (14) is embedded on and embedded in the surface of the metal foil layer (12) facing the non-metal layer (13);
Wherein, the back glue layer of one compound heat dissipation layer of two adjacent compound heat dissipation layers in at least two compound heat dissipation layers which are overlapped in turn is overlapped on the nonmetallic layer (13) of the other compound heat dissipation layer;
wherein the metal foil layers (12) of adjacent two of the at least two composite heat dissipation layers are of different metals.
2. The heat dissipating laminate structure of claim 1, further comprising a protective layer that is wrapped around the exterior of each of the composite heat dissipating layers.
3. The heat dissipating laminate structure of claim 1, wherein the graphene-based material employs: carbon nanotube film, graphite fiber.
4. A heat dissipating laminate structure as claimed in any one of claims 1 to 3, wherein the liquid metal is an alloy.
5. The heat dissipating laminate structure of claim 4, wherein the liquid metal is a gallium-based binary alloy, a gallium-based multiple alloy, an indium-based alloy, or a bismuth-based alloy.
6. A heat dissipating laminate structure according to any one of claims 1 to 3, characterized in that the surface of the metal foil layer (12) facing the non-metal layer (13) is provided with depressed grooves or pits, which grooves or pits are regularly arranged in a plane direction perpendicular to the heat transfer direction.
7. A heat dissipating laminate structure according to any of claims 1-3, characterized in that the surface of the metal foil layer (12) facing the non-metal layer (13) is provided with depressed grooves or pits and that capillary structures are formed by embossing at the bottom and sides of the pits or grooves.
8. A method of manufacturing a heat dissipating laminate structure, characterized in that the heat dissipating laminate structure is a heat dissipating laminate structure according to any one of claims 1 to 7, and that, in the preparation, at least two composite heat dissipating layers are laminated on a non-metallic layer of one composite heat dissipating layer by a backing layer of the other composite heat dissipating layer, and the previous process is continued.
9. A heat sink comprising the heat dissipating laminate structure of any one of claims 1 to 7.
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| CN201810686766.8A CN108738284B (en) | 2018-06-28 | 2018-06-28 | Graphene composite heat dissipation lamination structure and manufacturing method thereof |
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| CN201810686766.8A CN108738284B (en) | 2018-06-28 | 2018-06-28 | Graphene composite heat dissipation lamination structure and manufacturing method thereof |
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| TWI686309B (en) * | 2019-01-09 | 2020-03-01 | 可成科技股份有限公司 | Heat-dissipating structure and manufacturing method thereof |
| CN113488442A (en) * | 2021-07-06 | 2021-10-08 | 德州宇航派蒙石墨烯科技有限责任公司 | Ultrathin radiating fin and preparation method thereof |
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| TWM536452U (en) * | 2016-08-17 | 2017-02-01 | Dongguan Justape Advanced Material Co Ltd | Composite function tape |
| CN106384730A (en) * | 2016-12-06 | 2017-02-08 | 江苏悦达新材料科技有限公司 | High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film |
| JP3216215U (en) * | 2016-12-16 | 2018-05-24 | 旭立科技股▲ふん▼有限公司 | Multi-layer composite heat conduction structure |
| CN208798298U (en) * | 2018-06-28 | 2019-04-26 | 深圳中讯源科技有限公司 | A kind of heat dissipation laminated construction and radiator |
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