CN105517423B - A kind of high heat conduction graphene heat radiating metal foil - Google Patents

A kind of high heat conduction graphene heat radiating metal foil Download PDF

Info

Publication number
CN105517423B
CN105517423B CN201610046919.3A CN201610046919A CN105517423B CN 105517423 B CN105517423 B CN 105517423B CN 201610046919 A CN201610046919 A CN 201610046919A CN 105517423 B CN105517423 B CN 105517423B
Authority
CN
China
Prior art keywords
graphene
heat
thin
ultra
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610046919.3A
Other languages
Chinese (zh)
Other versions
CN105517423A (en
Inventor
刘文亮
谢金沛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HENGSHAN COUNTY JIACHENG NEW MATERIAL Co Ltd
Original Assignee
HENGSHAN COUNTY JIACHENG NEW MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HENGSHAN COUNTY JIACHENG NEW MATERIAL Co Ltd filed Critical HENGSHAN COUNTY JIACHENG NEW MATERIAL Co Ltd
Priority to CN201610046919.3A priority Critical patent/CN105517423B/en
Publication of CN105517423A publication Critical patent/CN105517423A/en
Application granted granted Critical
Publication of CN105517423B publication Critical patent/CN105517423B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a kind of high heat conduction graphene heat radiating metal foils, and including super thin metal paper tinsel base material, one layer graphene of surface forming of the metallic foil substrates, the surface recombination of the graphene has the ultra-thin one-faced tapes of heat loss through radiation；The another side of the metallic foil substrates coats one layer of ultra-thin heat-conducting glue layer, and the surface of the ultra-thin heat-conducting glue layer is pasted with separated type material；The graphene is the graphene film that the graphene layer of the structural integrity grown under high temperature environment using chemical vapour deposition technique in copper foil surface or high temperature sintering are formed.The functions such as the collecting and distributing heat shielding of present invention energy, heat conductive insulating are in one, with good heat conductivility and heat dissipation performance, shield effectiveness is good simultaneously, existing synthetic graphite and the compound material of metal foil can be replaced, and surmounted artificial synthesized graphite in terms of heat conduction, heat dissipation performance, available for electronic product radiating and shielding field.

Description

A kind of high heat conduction graphene heat radiating metal foil
Technical field
The present invention relates to electronic application adhesive tape area, specially a kind of novel high heat conduction graphene heat radiating metal foil.
Background technology
With universal, major LED displays electronic product of electronic product, such as mobile phone, computer, television set, tablet are in reality During existing ultra-thin lightweight, existing heat sink material such as electrographite, native graphite etc. can not meet the demand of all big enterprises.Stone Black alkene theory thermal conductivity factor 5000W/mk is the heat dissipation product that heat dissipation effect is best instantly.But in process, there are stratiforms Structure is destroyed, and causes volume production graphene thermal conductivity factor relatively low, close with artificial synthesized graphite, in 1200-1700W/mk or so.
Invention content
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, provide a kind of collecting and distributing heat shielding of energy, heat conduction The functions such as insulation have good heat conductivility and a heat dissipation performance in one, while the good high heat conduction graphene of shield effectiveness dissipates Thermometal foil.
In order to solve the above technical problems, technical solution proposed by the present invention is：
A kind of high heat conduction graphene heat radiating metal foil, including super thin metal paper tinsel base material, the one of the super thin metal paper tinsel base material A one layer graphene of surface forming, the surface recombination of the graphene have the ultra-thin one-faced tapes of heat loss through radiation；The super thin metal The another side of paper tinsel base material coats one layer of ultra-thin heat-conducting glue layer, and the surface of the ultra-thin heat-conducting glue layer is pasted with separated type material；It is described Graphene be by chemical vapour deposition technique or high-temperature sintering process in the metallic substrates with molten carbon amounts substrate, by by carbon original Sub- pyrolytic, then using chase after by force the method for cooling metallic substrates and body surface formed the conduction of structural integrity, heat conduction, The graphene film or graphene film of heat dissipation.
Or：A kind of high heat conduction graphene heat radiating metal foil, including super thin metal paper tinsel base material, the super thin metal paper tinsel base material One one layer graphene of surface forming, the outer surface of the graphene are compounded with one layer of ultra-thin heat-conducting double-sided adhesive tape/ultra-thin heat conduction Glue-line, and separated type material is attached in the outer layer of ultra-thin heat-conducting double-sided adhesive tape/ultra-thin heat-conducting glue layer, the super thin metal paper tinsel base material Another side coats one layer of heat loss through radiation insulating coating；The graphene is that having by chemical vapour deposition technique or high-temperature sintering process There is substrate in the metallic substrates of molten carbon amounts, by the way that by carbon atom pyrolytic, then use chases after by force the method for cooling in Metal Substrate The conduction of bottom and body surface formation structural integrity, heat conduction, the graphene film or graphene film to radiate.
It is further improved as to above-mentioned technical proposal：
Preferably, the ultra-thin one-faced tapes of the heat loss through radiation include ultra-thin PET base material, a table of the ultra-thin PET base material Ultra-thin heat-conducting glue is coated on face and graphene attaching is compound, coating is doped with radiation on another surface of ultra-thin PET base material The heat loss through radiation coating of the oxide of materials A g.
Preferably, the ultra-thin heat-conducting glue is the propylene doped with conduction powder aluminium nitride, graphite powder or graphene powder Sour glue, thermal conductivity factor >=3W/mk.
Preferably, the thickness of the high heat conduction graphene heat radiating metal foil be 0.02 ~ 0.1mm, the thickness of metallic foil substrates For 8-35um, the thickness of graphene layer is 3-25um, and the thickness of one-faced tapes is 3-10um, ultra-thin heat-conducting double-sided adhesive tape/ultra-thin The thickness of heat-conducting glue is 5-20um.
Preferably, the metallic foil substrates include nickel foil, copper foil or goldleaf.
Compared with prior art, the advantage of the invention is that：
The high heat conduction graphene heat radiating metal foil of the present invention, using the CVD chemical vapour deposition techniques based on metal foil, The graphene film that the surface growth graphene layer or high temperature sintering of metal foil form, ensure that its layer structure Completely, heat conductivility is greatly improved, and thermal conductivity factor coats one layer of ultra-thin high-heat-conductivity glue up to 3000W/mk, another surface of metal foil Layer attaches heat source, while on graphene surface one layer of ultra-thin one-faced tapes of attaching or double faced adhesive tape, ultra-thin one-faced tapes One layer of heat loss through radiation coating is coated, auxiliary carries out heat loss through radiation and insulation processing.The collecting and distributing heat shielding of present invention energy, heat conductive insulating etc. Function has good heat conductivility and heat dissipation performance, while shield effectiveness is good, can replace existing synthetic graphite in one The compound material with metal foil, and surmounted artificial synthesized graphite in terms of heat conduction, heat dissipation performance, available for electronic product radiating With shielding field.
Description of the drawings
Fig. 1 is the structure diagram of the embodiment of the present invention 1.
Fig. 2 is the structure diagram of the embodiment of the present invention 2.
Marginal data：
1st, heat loss through radiation coating；2nd, ultra-thin PET base material；3rd, ultra-thin heat-conducting glue；4th, graphene；5th, metal foil；6th, ultra-thin height Heat-conducting glue layer；7th, separated type material；8th, ultra-thin bond plies/ultra-thin heat-conducting glue layer；9th, heat loss through radiation insulating coating.
Specific embodiment
For the ease of understanding the present invention, the present invention is made below in conjunction with Figure of description and preferred embodiment more complete Face meticulously describes, but the protection scope of the present invention is not limited to the following specific embodiments.
Embodiment 1
As shown in Figure 1, the high heat conduction graphene heat radiating metal foil of present invention a kind of, including the super thin metal foil as base material 5, metallic foil substrates include nickel foil, copper foil or goldleaf.The thickness of metal foil 5 is 0.02 ~ 0.1mm, and the one side of metal foil 5 is molded one Layer graphene 4, the surface recombination of graphene 4 have the ultra-thin one-faced tapes of heat loss through radiation, and the another side of metal foil 5 coats ultra-thin heat conduction Glue-line 6 is simultaneously pasted with separated type material 7.Graphene 4 is with molten carbon amounts by chemical vapour deposition technique or high-temperature sintering process Substrate in metallic substrates, by the way that by carbon atom pyrolytic, then use chases after by force the method for cooling in metallic substrates and body table The conduction of face formation structural integrity, heat conduction, the graphene film or graphene film to radiate.The present invention is using based on metal foil CVD chemical vapour deposition techniques grow graphene layer or high temperature sintering on a surface of the metal foil with molten carbon amounts The graphene film formed ensure that its layer structure is complete, and heat conductivility is greatly improved, and thermal conductivity factor is up to 3000W/mk. Another surface of metal foil coats one layer of ultra-thin high heat conduction glue-line, attaches heat source, while attach one layer of ultra-thin list in graphene surface Face adhesive tape when ensureing product insulation, while improves the heat loss through radiation coefficient of product, has good heat loss through radiation performance. The functions such as the collecting and distributing heat shielding of present invention energy, heat conductive insulating have good heat conductivility and heat dissipation performance, shield simultaneously in one Effect is good.
In the present embodiment, the ultra-thin one-faced tapes of heat loss through radiation include ultra-thin PET base material 2, a surface of ultra-thin PET base material 2 The ultra-thin heat-conducting glue 3 of upper coating is simultaneously compound with graphene 4, and coating is doped with radiative material Ag on another surface of ultra-thin PET base material 2 Oxide heat loss through radiation coating 1.It can assist carrying out heat loss through radiation and insulation processing.
In the present embodiment, ultra-thin heat-conducting glue layer 6 is doped with the third of conduction powder aluminium nitride, graphite powder or graphene powder Olefin(e) acid glue, thermal conductivity factor >=3W/mk.
In the present embodiment, the thickness of high heat conduction graphene heat radiating metal foil is 0.02 ~ 0.1mm, wherein metallic foil substrates Thickness is 8-35um, and the thickness of graphene layer is 3-25um, and the thickness of one-faced tapes is 3-10um.
Embodiment 2
As shown in Fig. 2, the high heat conduction graphene heat radiating metal foil of present invention a kind of, including the super thin metal foil as base material 5, one layer graphene 4 of a surface forming of super thin metal foil 5, the outer surface of graphene 4 is compounded with one layer of ultra-thin heat-conducting double-sided Adhesive tape/ultra-thin heat-conducting glue layer 8, and separated type material 7 is attached in the outer layer of ultra-thin heat-conducting double-sided adhesive tape/ultra-thin heat-conducting glue layer 8, it is ultra-thin The another side of metal foil 5 coats one layer of heat loss through radiation insulating coating 9；Graphene 4 is burnt by chemical vapour deposition technique or high temperature Connection substrate in the metallic substrates with molten carbon amounts, by by carbon atom pyrolytic, then using the method for chasing after cooling by force In the conduction of metallic substrates and body surface formation structural integrity, heat conduction, the graphene film or graphene film to radiate.
In the present embodiment, metallic foil substrates include nickel foil, copper foil or goldleaf.The entirety of high heat conduction graphene heat radiating metal foil Thickness is 0.02 ~ 0.1mm, and the wherein thickness of metallic foil substrates is 8-35um, and the thickness of graphene layer is 3-25um, ultra-thin heat conduction The thickness of double faced adhesive tape/ultra-thin heat-conducting glue is 5-20um.
Basic principle, main feature and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its Equivalent thereof.

Claims (4)

1. a kind of high heat conduction graphene heat radiating metal foil that electronic product is shown for LED, special including super thin metal paper tinsel base material Sign is：One one layer graphene of surface forming of the super thin metal paper tinsel base material, the outer surface of the graphene is compounded with one Ultra-thin heat-conducting double-sided adhesive tape/ultra-thin the heat-conducting glue layer of layer, and ultra-thin heat-conducting double-sided adhesive tape/ultra-thin heat-conducting glue layer outer layer attach from Section bar material, the another side of the super thin metal paper tinsel base material coat one layer of heat loss through radiation insulating coating；The graphene is passing through Vapour deposition process or the high-temperature sintering process substrate in the metallic substrates with molten carbon amounts are learned, by by carbon atom pyrolytic, so The method for chasing after cooling by force is used afterwards in the conduction of metallic substrates and body surface formation structural integrity, heat conduction, the graphene to radiate Piece or graphene film；The thermal conductivity factor of the graphene film or graphene film reaches 3000W/mk；The metallic foil substrates Thickness is 8-35um, and the thickness of graphene layer is 3-25um.
2. high heat conduction graphene heat radiating metal foil according to claim 1, it is characterised in that：The ultra-thin heat-conducting glue is mixes The miscellaneous acrylic acid glue for having conduction powder aluminium nitride, graphite powder or graphene powder, thermal conductivity factor >=3W/mk.
3. high heat conduction graphene heat radiating metal foil according to claim 2, it is characterised in that：The high heat conduction graphene dissipates The integral thickness of thermometal foil is 0.02 ~ 0.1mm, wherein, the thickness of one-faced tapes is 3-10um, ultra-thin bond plies The thickness of band/ultra-thin heat-conducting glue is 5-20um.
4. high heat conduction graphene heat radiating metal foil according to claim 3, it is characterised in that：The metallic foil substrates include Nickel foil, copper foil or goldleaf.
CN201610046919.3A 2016-01-25 2016-01-25 A kind of high heat conduction graphene heat radiating metal foil Active CN105517423B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610046919.3A CN105517423B (en) 2016-01-25 2016-01-25 A kind of high heat conduction graphene heat radiating metal foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610046919.3A CN105517423B (en) 2016-01-25 2016-01-25 A kind of high heat conduction graphene heat radiating metal foil

Publications (2)

Publication Number Publication Date
CN105517423A CN105517423A (en) 2016-04-20
CN105517423B true CN105517423B (en) 2018-06-19

Family

ID=55724938

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610046919.3A Active CN105517423B (en) 2016-01-25 2016-01-25 A kind of high heat conduction graphene heat radiating metal foil

Country Status (1)

Country Link
CN (1) CN105517423B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211731A (en) * 2016-08-29 2016-12-07 辽宁点石技术开发有限公司 A kind of composite electromagnetic screen heat radiation thin film and preparation method thereof
CN106626583B (en) * 2016-11-16 2021-11-12 广州宏庆电子有限公司 Ultrathin heat dissipation film and manufacturing method thereof
CN106531902B (en) * 2016-11-16 2020-12-29 广州宏庆电子有限公司 Ultrathin flexible heat dissipation film and manufacturing method thereof
CN106384730A (en) * 2016-12-06 2017-02-08 江苏悦达新材料科技有限公司 High heat conduction metal foil layer/graphene metal mixed layer composite heat radiation film
CN107081954B (en) * 2017-05-21 2019-10-11 昆山佑威光电材料有限公司 A kind of fit body for thermally conductive foam item
CN107221266A (en) * 2017-07-05 2017-09-29 佛山杰致信息科技有限公司 A kind of New LED advertising lamp box
CN107270240A (en) * 2017-07-05 2017-10-20 佛山杰致信息科技有限公司 A kind of LED heat radiation lampshades
CN108738284B (en) * 2018-06-28 2024-06-07 深圳中讯源科技有限公司 Graphene composite heat dissipation lamination structure and manufacturing method thereof
CN109536069A (en) * 2018-12-05 2019-03-29 苏州环明电子科技有限公司 Ultra-thin even backing of one kind and preparation method thereof
TWI685422B (en) * 2019-01-29 2020-02-21 兆科科技有限公司 Heat dissipation label with high contrast color difference forming identification mark
CN110112263A (en) * 2019-05-13 2019-08-09 电子科技大学中山学院 Substrate for high-power LED packaging, substrate manufacturing method and packaging structure
CN110484154A (en) * 2019-07-26 2019-11-22 新纶科技（常州）有限公司 A kind of multi-functional composite heat-conducting adhesive tape
CN112391128B (en) * 2019-08-13 2023-01-10 上海优梯熙光学材料有限公司 High-thermal-conductivity graphene heat dissipation material and preparation process thereof
CN111234721A (en) * 2020-01-17 2020-06-05 新纶科技（常州）有限公司 Heat dissipation buffer film
CN112210306A (en) * 2020-11-04 2021-01-12 深圳市金晖科技有限公司 Ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and preparation method thereof
CN112638041B (en) * 2020-12-25 2022-03-08 深圳光韵达激光应用技术有限公司 Manufacturing process of heat dissipation substrate
CN115674803B (en) * 2022-10-27 2024-02-23 常州富烯科技股份有限公司 Substrate, graphene metal composite heat dissipation material and preparation method
CN115682810A (en) * 2022-10-27 2023-02-03 常州富烯科技股份有限公司 Graphene metal composite radiating fin, radiator and preparation method
CN116887574B (en) * 2023-07-21 2024-04-19 苏州安洁科技股份有限公司 Folding mobile phone graphene heat dissipation structure and corresponding heat dissipation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102514297A (en) * 2011-12-15 2012-06-27 烟台德邦科技有限公司 Metal-clad graphite heat radiation composite material and preparation method thereof
CN202374617U (en) * 2011-11-02 2012-08-08 杜明亮 Ultrathin heat radiation film having electromagnetic shielding function
CN203027654U (en) * 2012-12-27 2013-06-26 刘新利 Graphite radiating fin
CN103738022A (en) * 2014-01-16 2014-04-23 柯瑞林 Heat-conducting insulating composite material and preparation method thereof
CN203590666U (en) * 2013-11-26 2014-05-07 昆山汉品电子有限公司 High-efficiency composite heat dissipation film
CN204340308U (en) * 2014-10-17 2015-05-20 合肥傲琪电子科技有限公司 A kind of miniature graphite copper radiating rib
CN204801156U (en) * 2015-07-03 2015-11-25 苏州环明电子科技有限公司 Thermal film of low heat conduction of high even heat
CN205510635U (en) * 2016-01-25 2016-08-24 衡山县佳诚新材料有限公司 High heat conduction graphite alkene heat dissipation metal forming
TW201700285A (en) * 2015-06-22 2017-01-01 中原大學 Metallic foil and composite heat dissipation sheet thereof which has high thermal conductivity and high radiation heat absorption capable of conducting heat away from the heat source in heat conduction or heat radiation manner

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2893646C (en) * 2012-12-05 2020-08-11 Cytec Industries Inc. Conductive surfacing material for composite structures
CN104377252B (en) * 2014-11-24 2017-03-22 中南大学 Flexible copper-based chalcogenide semiconductor thin-film solar cell window layer structure

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202374617U (en) * 2011-11-02 2012-08-08 杜明亮 Ultrathin heat radiation film having electromagnetic shielding function
CN102514297A (en) * 2011-12-15 2012-06-27 烟台德邦科技有限公司 Metal-clad graphite heat radiation composite material and preparation method thereof
CN203027654U (en) * 2012-12-27 2013-06-26 刘新利 Graphite radiating fin
CN203590666U (en) * 2013-11-26 2014-05-07 昆山汉品电子有限公司 High-efficiency composite heat dissipation film
CN103738022A (en) * 2014-01-16 2014-04-23 柯瑞林 Heat-conducting insulating composite material and preparation method thereof
CN204340308U (en) * 2014-10-17 2015-05-20 合肥傲琪电子科技有限公司 A kind of miniature graphite copper radiating rib
TW201700285A (en) * 2015-06-22 2017-01-01 中原大學 Metallic foil and composite heat dissipation sheet thereof which has high thermal conductivity and high radiation heat absorption capable of conducting heat away from the heat source in heat conduction or heat radiation manner
CN204801156U (en) * 2015-07-03 2015-11-25 苏州环明电子科技有限公司 Thermal film of low heat conduction of high even heat
CN205510635U (en) * 2016-01-25 2016-08-24 衡山县佳诚新材料有限公司 High heat conduction graphite alkene heat dissipation metal forming

Also Published As

Publication number Publication date
CN105517423A (en) 2016-04-20

Similar Documents

Publication Publication Date Title
CN105517423B (en) A kind of high heat conduction graphene heat radiating metal foil
CN103626172B (en) A kind of preparation method of high conductive graphite paper
CN203353019U (en) Graphene metal cooling fin and electronic product cooling structure
CN204981729U (en) High -efficient thermal film who contains thermal conductive adhesive
CN204466141U (en) A kind of Graphene composite radiating film
CN105848882A (en) Metal packaging material having good heat resistance, method of manufacturing same, and flexible electronic device packaged in said metal packaging material
CN106847767A (en) A kind of graphite Copper Foil heat sink compound
CN103625029A (en) Graphene heat-conducting device
CN204340308U (en) A kind of miniature graphite copper radiating rib
CN106113731A (en) Graphene heat conduction and heat radiation film
CN205510635U (en) High heat conduction graphite alkene heat dissipation metal forming
CN207869492U (en) Graphene heat-radiating substrate
CN206217267U (en) A kind of Graphene Copper Foil diaphragm
CN204897813U (en) Heat dissipation sticky tape
CN212864650U (en) Combined type graphite alkene heat dissipation membrane
CN209178289U (en) A kind of conductive and heat-conductive metallic shield double faced adhesive tape based on graphene
CN103213973A (en) Method for preparing flexible highly oriented graphite heat conduction material
CN206030662U (en) No substrate graphite alkene heat conduction membrane
CN208216163U (en) A kind of multiple field composite graphite cooling fin
CN210607231U (en) Novel composite heat dissipation material
CN210011437U (en) Heat-conducting silica gel heat-dissipation composite film
CN108738284B (en) Graphene composite heat dissipation lamination structure and manufacturing method thereof
CN105153960A (en) Ultrathin heat dissipation adhesive tape
CN210381699U (en) PI conducting strip
CN210725882U (en) Electromagnetic shielding film with heat dissipation function

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant