CN112210306A - Ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and preparation method thereof - Google Patents

Ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and preparation method thereof Download PDF

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CN112210306A
CN112210306A CN202011216692.5A CN202011216692A CN112210306A CN 112210306 A CN112210306 A CN 112210306A CN 202011216692 A CN202011216692 A CN 202011216692A CN 112210306 A CN112210306 A CN 112210306A
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layer
heat dissipation
adhesive film
shielding
film
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李林军
梁超云
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Shenzhen Jinhui Technology Co ltd
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Shenzhen Jinhui Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C08J2323/12—Polypropene
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09J2423/00—Presence of polyolefin
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    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
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    • C09J2479/08—Presence of polyamine or polyimide polyimide
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  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention provides an ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions, which comprises a graphene heat dissipation layer, a base material layer, a first metal layer and a colloid layer which are sequentially laminated; the thickness of the graphene heat dissipation layer is 0.2-0.5 mu m, the thickness of the base material layer is 2-15 mu m, the thickness of the first metal layer is 0.3-3 mu m, and the thickness of the colloid layer is 3-5 mu m. The composite adhesive film is high temperature resistant and low temperature resistant, and the applicable temperature range is-60 ℃ to 260 ℃; the shielding effect is 70-80 dB; acid and alkali resistance; the heat conduction performance is excellent, and the heat conduction coefficient is 600-; the conductive static performance is excellent, and the surface resistivity is less than 0.02 omega; low resistance, firm combination and strong adhesive force.

Description

Ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and preparation method thereof
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to an ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and a preparation method thereof.
Background
With the increasingly portable electronic products, the components used to manufacture the electronic products are increasingly lighter and thinner — the integration level is higher and higher, the volume is smaller and smaller, and the power is stronger, so that the problems of component heat dissipation, signal interference between components, static electricity removal and the like need to be considered during component assembly, and therefore, auxiliary functional components such as radiators, shielding films and the like need to be introduced during the component assembly of the electronic products. The introduction of auxiliary functional components hinders the development of thinner electronic products. The existing shielding film has single function and larger thickness, and increases the assembly space of electronic products during application.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding is designed, so that the problems of heat dissipation, signal interference, static electricity, shading and the like in the process of assembling an electronic product can be solved simultaneously when the ultrathin composite adhesive film is applied, and the space of the electronic product is basically not occupied.
In order to solve the technical problems, the invention adopts the technical scheme that:
an ultrathin composite adhesive film with heat dissipation, conduction and shielding functions comprises a graphene heat dissipation layer, a base material layer, a first metal layer and a colloid layer which are sequentially stacked; the thickness of the graphene heat dissipation layer is 0.2-0.5 mu m, the thickness of the base material layer is 2-15 mu m, the thickness of the first metal layer is 0.3-3 mu m, and the thickness of the colloid layer is 3-5 mu m.
Further, the graphene heat dissipation layer comprises a second metal layer with the thickness of 0.3-3 μm, and the second metal layer is located between the graphene heat dissipation layer and the base material layer.
Further, the second metal layer is one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer and a titanium layer.
Further, still include the release layer that is used for protecting the colloid layer, the release layer with first metal level is separated in colloid layer both sides.
Further, the first metal layer is one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer and a titanium layer.
Further, the substrate layer is one of a PET film, a PI film, a PETF film and a PP film.
Furthermore, the colloid layer is one of an acrylic acid conductive pressure-sensitive adhesive layer, an epoxy thermosetting conductive adhesive layer and a PU hot-melt conductive adhesive layer.
A preparation method of an ultrathin composite adhesive film with heat dissipation, conduction and shielding functions comprises the following steps: respectively carrying out vacuum plating on two side surfaces of the base material to sequentially form a laminated graphene heat dissipation layer, a base material layer and a first metal layer; and coating the colloid on the side surface of the first metal layer far away from the base material layer to form a colloid layer.
Further, before the graphene heat dissipation layer is formed, vacuum plating is performed on the side surface, far away from the first metal layer, of the base material layer to form a second metal layer, and then vacuum plating is performed on the second metal layer to form the graphene heat dissipation layer.
Further, attaching a high-transmittance/matte PET release film on the colloid layer to form a release layer; the substrate is subjected to plasma treatment before vacuum plating.
The invention has the beneficial effects that: the thickness of the composite adhesive film is 5.5-23.5 μm; high temperature resistance and low temperature resistance, and the applicable temperature range is-60 ℃ to 260 ℃; the shielding effect is 70-80 dB; acid and alkali resistance; the heat conduction performance is excellent, and the heat conduction coefficient is 600-; the conductive static performance is excellent, and the surface resistivity is less than 0.02 omega; low resistance, firm combination and strong adhesive force.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is a schematic structural diagram of an embodiment 1 of an ultrathin composite adhesive film with heat dissipation, electrical conduction and shielding functions according to the present invention;
FIG. 2 is a schematic structural diagram of an embodiment 2 of an ultrathin composite adhesive film with heat dissipation, electrical conduction, and shielding functions according to the present invention;
the heat dissipation structure comprises a 1-graphene heat dissipation layer, a 2-substrate layer, a 3-first metal layer, a 4-colloid layer, a 5-release layer and a 6-second metal layer.
Detailed Description
The present invention will be further described with reference to the accompanying drawings in accordance with the embodiments of the present invention.
Example 1
Referring to fig. 1, a thickness of the ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions is 5.5-23.5 μm, preferably 5.5-15 μm, and more preferably 5.5-10 μm. The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding comprises a graphene heat dissipation layer 1, a base material layer 2, a first metal layer 3 and a colloid layer 4 which are sequentially laminated; the thickness of the graphene heat dissipation layer 1 is 0.2-0.5 μm, the thickness of the substrate layer 2 is 2-15 μm, the thickness of the first metal layer 3 is 0.3-3 μm, and the thickness of the colloid layer 4 is 3-5 μm.
The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding further comprises a release layer 5 for protecting the adhesive layer, wherein the release layer 5 and the first metal layer 3 are separated on two sides of the adhesive layer 4. When in use, the release layer 5 is removed, and the high-transparency/matte PET release film can be used for preparing the film.
The first metal layer 3 is a metal layer or a metal oxide layer containing one or more elements of Al, Sn, Fe, Cu, Ag, Au, Mn, Mg, Cr, Zn, and Ti, and is preferably one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer, and a titanium layer.
The substrate layer 2 is one of a PET film, a PI film, a PETF film and a PP film, and plays a role in bearing the ultrathin graphene heat dissipation layer 1 and the first metal layer 3, and if the substrate layer 2 is not provided, the thickness of the graphene heat dissipation layer 1 cannot reach 0.2 mu m, and the thickness of the first metal layer 3 cannot reach 0.3 mu m. In addition, films lacking a substrate layer are highly susceptible to breakage.
The colloid layer 4 is one of an acrylic acid conductive pressure-sensitive adhesive layer, an epoxy thermosetting conductive adhesive layer and a PU hot-melt conductive adhesive layer.
The preparation method of the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding comprises the following steps: firstly, carrying out plasma treatment on a base material, and then respectively carrying out vacuum plating on two side surfaces of the base material to sequentially form a laminated graphene heat dissipation layer 1, a base material layer 2 and a first metal layer 3; coating colloid on the side surface of the first metal layer 3 far away from the base material layer 2 to form a colloid layer 4; and (3) attaching the high-transparency/matte PET release film on the colloid layer 4 to form a release layer 5.
The test was carried out on sets of samples of the 5.5 μm thick PI substrate containing a copper layer, which all had the following effect: high temperature resistance and low temperature resistance, and the applicable temperature range is-60 ℃ to 260 ℃; the shielding effect is 70-80 dB; acid and alkali resistance; the heat conduction performance is excellent, and the heat conduction coefficient is 600-; the conductive static performance is excellent, and the surface resistivity is less than 0.02 omega; low resistance, firm combination and strong adhesive force.
The graphene heat dissipation layer 1 in this embodiment is a conductive graphene layer formed by vacuum plating.
Example 2
Referring to fig. 2, a thickness of the ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions is 5.8-23.5 μm, preferably 5.8-15 μm; more preferably 5.8 to 10 μm. The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding comprises a graphene heat dissipation layer 1, a second metal layer 6, a base material layer 2, a first metal layer 3 and a colloid layer 4 which are sequentially laminated; the thickness of the graphene heat dissipation layer 1 is 0.2-0.5 μm, the thickness of the substrate layer 2 is 2-15 μm, the thickness of the first metal layer 3 is 0.3-3 μm, the thickness of the second metal layer 6 is 0.3-3 μm, and the thickness of the colloid layer 4 is 3-5 μm.
The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding further comprises a release layer 5 for protecting the adhesive layer, wherein the release layer 5 and the first metal layer 3 are separated on two sides of the adhesive layer 4. When in use, the release layer 5 is removed, and the high-transparency/matte PET release film can be used for preparing the film.
The first metal layer 3 is a metal layer or a metal oxide layer containing one or more elements of Al, Sn, Fe, Cu, Ag, Au, Mn, Mg, Cr, Zn, and Ti, and is preferably one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer, and a titanium layer.
The second metal layer 6 is a metal layer or a metal oxide layer containing one or more elements of Al, Sn, Fe, Cu, Ag, Au, Mn, Mg, Cr, Zn, and Ti, and is preferably one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer, and a titanium layer.
The substrate layer 2 is one of a PET film, a PI film, a PETF film and a PP film, and plays a role in bearing the ultrathin graphene heat dissipation layer 1, the first metal layer 3 and the second metal layer 6, and if the substrate layer 2 is not provided, the graphene heat dissipation layer 1 cannot reach the thickness of 0.2 mu m, the first metal layer 3 cannot reach the thickness of 0.3 mu m, and the second metal layer 6 cannot reach the thickness of 0.3 mu m. In addition, a film lacking the base material layer 2 is highly likely to be damaged.
The colloid layer 4 is one of an acrylic acid conductive pressure-sensitive adhesive layer, an epoxy thermosetting conductive adhesive layer and a PU hot-melt conductive adhesive layer.
The preparation method of the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding comprises the following steps: firstly, carrying out plasma treatment on a base material, and then respectively carrying out vacuum plating on two side surfaces of the base material to respectively form a first metal layer 3 and a second metal layer 6; continuing to perform vacuum electroplating on the side surface, far away from the base material layer 2, of the second metal layer 6 to form a graphene heat dissipation layer 1; coating colloid on the side surface of the first metal layer 3 far away from the base material layer 2 to form a colloid layer 4; and (3) attaching the high-transparency/matte PET release film on the colloid layer 4 to form a release layer 5. The release layer 5 is removed at the time of use.
The test was carried out on sets of samples of the 5.8 μm thick, copper-containing layer of the PI substrate of this example, which all had the following effects: high temperature resistance and low temperature resistance, and the applicable temperature range is-60 ℃ to 260 ℃; the shielding effect is 70-80 dB; acid and alkali resistance; the heat conduction performance is excellent, and the heat conduction coefficient is 600-; the conductive static performance is excellent, and the surface resistivity is less than 0.02 omega; low resistance, firm combination and strong adhesive force.
The graphene heat dissipation layer 1 in this embodiment is a conductive graphene layer formed by vacuum plating.
The ultrathin composite adhesive film prepared in the two embodiments has the functions of heat dissipation, static conduction, shielding and shading, and can be used for edge covering of screens, edge covering of modules, battery wrapping, CPU (central processing unit) and circuit boards.
In conclusion, according to the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding and the preparation method thereof, the thickness of the prepared composite adhesive film is 5.5-23.5 micrometers; high temperature resistance and low temperature resistance, and the applicable temperature range is-60 ℃ to 260 ℃; the shielding effect is 70-80 dB; acid and alkali resistance; the heat conduction performance is excellent, and the heat conduction coefficient is 600-; the conductive static performance is excellent, and the surface resistivity is less than 0.02 omega; low resistance, firm combination and strong adhesive force.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. An ultrathin composite adhesive film with heat dissipation, conduction and shielding functions is characterized by comprising a graphene heat dissipation layer, a base material layer, a first metal layer and a colloid layer which are sequentially laminated; the thickness of the graphene heat dissipation layer is 0.2-0.5 mu m, the thickness of the base material layer is 2-15 mu m, the thickness of the first metal layer is 0.3-3 mu m, and the thickness of the colloid layer is 3-5 mu m.
2. The ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions as claimed in claim 1, further comprising a second metal layer with a thickness of 0.3-3 μm, wherein the second metal layer is located between the graphene heat dissipation layer and the substrate layer.
3. The ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions as claimed in claim 2, wherein the second metal layer is one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer and a titanium layer.
4. The ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions as claimed in any one of claims 1 to 3, further comprising a release layer for protecting the adhesive layer, wherein the release layer and the first metal layer are separated at two sides of the adhesive layer.
5. The ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions as claimed in claim 4, wherein the first metal layer is one of an aluminum layer, a tin layer, an iron layer, a copper layer, a gold layer, a silver layer, a manganese layer, a magnesium layer, a chromium layer, a zinc layer and a titanium layer.
6. The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding as claimed in claim 4, wherein the substrate layer is one of a PET film, a PI film, a PETF film and a PP film.
7. The ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding as claimed in claim 4, wherein the adhesive layer is one of an acrylic conductive pressure sensitive adhesive layer, an epoxy thermosetting conductive adhesive layer and a PU hot-melt conductive adhesive layer.
8. The method for preparing the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding as claimed in any one of claims 1 to 7 is characterized by comprising the following steps:
respectively carrying out vacuum plating on two side surfaces of the base material to sequentially form a laminated graphene heat dissipation layer, a base material layer and a first metal layer; and coating the colloid on the side surface of the first metal layer far away from the base material layer to form a colloid layer.
9. The method for preparing the ultra-thin composite adhesive film with heat dissipation, electrical conduction and shielding functions as claimed in claim 8, wherein before the graphene heat dissipation layer is formed, vacuum plating is performed on a side surface of the substrate layer away from the first metal layer to form a second metal layer, and then vacuum plating is performed on the second metal layer to form the graphene heat dissipation layer.
10. The method for preparing the ultrathin composite adhesive film with the functions of heat dissipation, electric conduction and shielding as claimed in any one of claims 8 or 9, wherein a high-transparency/matte PET release film is attached to the adhesive layer to form a release layer; the substrate is subjected to plasma treatment before vacuum plating.
CN202011216692.5A 2020-11-04 2020-11-04 Ultrathin composite adhesive film with heat dissipation, electric conduction and shielding functions and preparation method thereof Pending CN112210306A (en)

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