CN210469849U - Free grounding film and circuit board - Google Patents
Free grounding film and circuit board Download PDFInfo
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- CN210469849U CN210469849U CN201920798141.0U CN201920798141U CN210469849U CN 210469849 U CN210469849 U CN 210469849U CN 201920798141 U CN201920798141 U CN 201920798141U CN 210469849 U CN210469849 U CN 210469849U
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Abstract
The utility model relates to the field of electronics, and discloses a free grounding film and a circuit board, when the free grounding film is used for grounding of a printed circuit board, a carrier layer is convenient to peel off by setting a peeling layer, and the carrier layer and a metal foil layer are prevented from being mutually diffused and bonded at high temperature by setting a barrier layer, so that the carrier layer can be stably peeled off from the metal foil layer, and the use stability of the free grounding film is effectively ensured; in addition, through setting up the glued membrane layer that contains conductive particle for when the free grounding membrane passes through the glued membrane layer and the electromagnetic shield membrane is laminated mutually, pierce glued membrane layer and insulating layer and electrically connect with the shielding layer through conductive particle and realize ground connection.
Description
Technical Field
The utility model relates to an electron field especially relates to a free grounding membrane and circuit board.
Background
At present, the circuit board is generally provided with an electromagnetic shielding film to reduce electromagnetic interference, while in the process of shielding electromagnetic waves, interference charges generated from the outside are accumulated on a shielding layer of the electromagnetic shielding film to affect signal transmission of the circuit board, and in order to lead out the interference charges, a free grounding film can be provided on the electromagnetic shielding film.
The existing free grounding film generally comprises a carrier layer, an anti-oxidation layer, a conductor layer and a glue film layer, wherein the carrier layer, the anti-oxidation layer, the conductor layer and the glue film layer are sequentially stacked, when the free grounding film is used, an electromagnetic shielding film is firstly pressed on a circuit board, then the free grounding film is pressed on the electromagnetic shielding film, and finally the carrier layer of the free grounding film is torn off, so that the anti-oxidation layer of the free grounding film is exposed and is contacted with a shell of equipment to realize the grounding of the electromagnetic shielding film. However, in the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: because free grounding membrane and electromagnetic shield membrane need be under the high temperature condition when carrying out the pressfitting, and under the high temperature, take place interdiffusion between carrier layer and the conductor layer easily to lead to taking place to bond between carrier layer and the conductor layer, make and be difficult to peel off between carrier layer and the conductor layer, and then influence the use of free grounding membrane.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a free grounding membrane and circuit board, its carrier layer that can avoid free grounding membrane and metal foil layer interdiffusion cause the bonding when the high temperature to make carrier layer and metal foil layer easily peel off.
In order to solve the technical problem, an embodiment of the present invention provides a free grounding film, including a composite metal foil and a glue film layer containing conductive particles, where the composite metal foil includes a carrier layer, a metal bonding layer, a barrier layer, a peeling layer and a metal foil layer, and the carrier layer, the metal bonding layer, the barrier layer, the peeling layer and the metal foil layer are sequentially stacked, or the carrier layer, the peeling layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked; the adhesive film layer is arranged on the metal foil layer; when the free grounding film is used for grounding a printed circuit board, an electromagnetic shielding film is arranged on the printed circuit board and comprises a shielding layer and an insulating layer, the insulating layer is arranged on the shielding layer, the free grounding film is pressed with the electromagnetic shielding film through the adhesive film layer, and the conductive particles penetrate through the adhesive film layer and the insulating layer and are electrically connected with the shielding layer.
Preferably, when the carrier layer, the metal adhesive layer, the barrier layer, the peeling layer, and the metal foil layer are sequentially stacked, a peel strength between the peeling layer and the metal foil layer is greater than or equal to a peel strength between the peeling layer and the barrier layer.
Preferably, the barrier layer is an organic high temperature resistant layer, or the barrier layer is made of any one of tungsten, chromium, zirconium, titanium, nickel, molybdenum, cobalt and graphite.
Preferably, the barrier layer is of a single-layer alloy structure; or the barrier layer is a multilayer structure consisting of a single material layer or a multilayer structure consisting of an alloy layer and a single material layer, wherein the single material layer is made of the same chemical element.
Preferably, the metal bonding layer is made of any one or more materials in a first metal;
or the metal bonding layer is made of any one material in a second metal;
wherein the second metal is a metal that is easily bonded to the barrier layer;
when the carrier layer, the metal bonding layer, the barrier layer, the peeling layer and the metal foil layer are sequentially stacked, the first metal is a metal which is easily bonded to the carrier layer;
when the carrier layer, the peeling layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked, the first metal is a metal which is easy to bond with the metal foil layer.
Preferably, the first metal is copper or zinc, and the second metal is nickel or iron or manganese.
Preferably, the metal bonding layer is a single metal layer made of the first metal or the second metal;
or, the metal bonding layer is a single-layer alloy structure made of the first metal and the second metal;
alternatively, the metal bonding layer comprises a single metal layer made of a first type of metal and connected to the carrier layer, and the metal bonding layer further comprises a single metal layer made of a second type of metal and connected to the barrier layer.
Or, the metal bonding layer comprises a multilayer structure consisting of an alloy layer and a single metal layer; wherein the alloy layer of the metal bonding layer is made of the first type of metal and the second type of metal, and the single metal layer of the metal bonding layer is made of the first type of metal or the second type of metal.
Preferably, the stripping layer is made of any one of nickel, silicon, molybdenum, graphite, titanium and niobium; or the stripping layer is made of an organic high molecular material.
Preferably, the thickness of the metal foil layer is 2-15 μm, and/or the thickness of the metal bonding layer is greater than or equal to 5 Å, and/or the thickness of the barrier layer is greater than or equal to 5 Å.
Preferably, the carrier layer is any one of carrier copper, carrier aluminum, carrier titanium, carrier zinc, carrier nickel, carrier chromium and carrier molybdenum; and/or the presence of a gas in the gas,
when the carrier layer, the metal bonding layer, the barrier layer, the stripping layer and the metal foil layer are sequentially stacked, the metal foil layer is any one of copper foil, aluminum foil, zinc foil, silver foil and gold foil;
when the carrier layer, the stripping layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked, the metal foil layer is any one of copper foil, aluminum foil, titanium foil, zinc foil, nickel foil, chromium foil, silver foil, gold foil and molybdenum foil.
Preferably, a first anti-oxidation layer is arranged on one side, close to the metal bonding layer, of the carrier layer; and/or a second oxidation-resistant layer is arranged on one side of the metal foil layer, which is far away from the stripping layer; and/or, when the carrier layer the metal bonding layer the barrier layer the peel ply with when the metal foil layer stacks up the setting in proper order, the metal foil layer is close to be equipped with the third prevention oxide layer on one side of peel ply.
In order to solve the same technical problem, the embodiment of the utility model provides a still provide a circuit board, including electromagnetic shielding membrane, printed circuit board and free ground connection membrane, electromagnetic shielding membrane locates on the printed circuit board, electromagnetic shielding membrane includes shielding layer and insulating layer, the insulating layer is located on the shielding layer, free ground connection membrane passes through the rete with electromagnetic shielding membrane pressfitting mutually, conductive particle impales the rete with the insulating layer and with the shielding layer electricity is connected.
The embodiment of the utility model provides a free grounding membrane and circuit board, when free grounding membrane is used for the ground connection of printed wiring board, through setting up the peel ply, so that peel off the carrier layer, and through setting up the barrier layer, so as to prevent that carrier layer and metal foil layer from interdiffusing and taking place to bond when high temperature, thereby guaranteed that the carrier layer can be peeled off from the metal foil layer steadily, effectively guaranteed the stability in use of free grounding membrane; in addition, through setting up the glued membrane layer that contains conductive particle for when the free grounding membrane passes through the glued membrane layer and the electromagnetic shield membrane is laminated mutually, pierce glued membrane layer and insulating layer and electrically connect with the shielding layer through conductive particle and realize ground connection.
Drawings
Fig. 1 is a schematic structural view of a carrier layer, a metal bonding layer, a barrier layer and a metal foil layer sequentially stacked in one embodiment of the free grounding film of the present invention;
fig. 2 is a schematic structural diagram of the embodiment of the present invention in which the conductive particles themselves directly pierce the adhesive film layer;
fig. 3 is a schematic structural diagram of a free-grounding film in which conductive particles are agglomerated to form a plurality of large conductive particles according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a free grounding film comprising a first metal monolayer structure and a second metal monolayer structure according to an embodiment of the present invention;
fig. 5 is a schematic diagram of the peeling of the free grounding film in the embodiment of the present invention;
fig. 6 is another schematic illustration of the peeling of a free-grounding film in an embodiment of the invention;
fig. 7 is a schematic structural diagram of a circuit board in an embodiment of the present invention;
fig. 8 is a schematic structural view of a carrier layer, a peeling layer, a barrier layer, a metal bonding layer and a metal foil layer sequentially stacked in one embodiment of the free grounding film of the present invention;
fig. 9 is a schematic structural diagram of another embodiment of a circuit board in an embodiment of the present invention;
fig. 10 is a schematic flow chart of an embodiment of a method for preparing a free-grounding film provided by the present invention;
fig. 11 is a schematic flow chart of another embodiment of a method for preparing a free-grounding film according to the present invention;
wherein, 1, a carrier layer; 2. a metal bonding layer; 21. a first-type metal single-layer structure; 22. a second metal monolayer structure; 3. a barrier layer; 4. a peeling layer; 5. a metal foil layer; 6. a glue film layer; 61. conductive particles; 7. a printed wiring board; 8. an electromagnetic shielding film; 81. a shielding layer; 82. an insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 4 and 7, a free-grounding film according to a preferred embodiment of the present invention includes a composite metal foil and a film layer 6 containing conductive particles 61, wherein the composite metal foil includes a carrier layer 1, a metal bonding layer 2, a barrier layer 3, a peeling layer 4 and a metal foil layer 5, the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4 and the metal foil layer 5 are sequentially stacked, or, as shown in fig. 8, the carrier layer 1, the peeling layer 4, the barrier layer 3, the metal bonding layer 2 and the metal foil layer 5 are sequentially stacked; the adhesive film layer 6 is arranged on the metal foil layer 5; when the free grounding film is used for grounding the printed circuit board 7, the electromagnetic shielding film 8 is arranged on the printed circuit board 7, the electromagnetic shielding film 8 comprises a shielding layer 81 and an insulating layer 82, the insulating layer 82 is arranged on the shielding layer 81, the free grounding film is pressed with the electromagnetic shielding film 8 through the glue film layer 6, and the conductive particles 61 penetrate through the glue film layer 6 and the insulating layer 82 and are electrically connected with the shielding layer 81.
In the embodiment of the present invention, when the free grounding film is used for grounding the printed circuit board 7, by providing the peeling layer 4, the carrier layer 1 can be peeled off conveniently, and by providing the barrier layer 3, the carrier layer 1 and the metal foil layer 5 can be prevented from being mutually diffused at high temperature and being bonded, so that the carrier layer 1 can be stably peeled off from the metal foil layer 5, the stability of the free grounding film can be effectively ensured, and in addition, by providing the metal bonding layer 2 between the carrier layer 1 and the barrier layer 3, the barrier layer 3 can not be easily separated from the carrier layer 1, so that the peeling between the barrier layer 3 and the carrier layer 1 can be effectively prevented, and further, the carrier layer 1 can be stably peeled off from the metal foil layer 5; further, by providing the adhesive film layer 6 containing the conductive particles 61, when the free grounding film is laminated with the electromagnetic shielding film 8 through the adhesive film layer 6, grounding is achieved by the conductive particles 61 piercing the adhesive film layer 6 and the insulating layer 82 and electrically connecting with the shielding layer 81.
In specific implementation, when the free grounding film is laminated with the electromagnetic shielding film 8, the free grounding film can be laminated by heating and pressing at the same time, or can be laminated by only pressing without heating, and only when the free grounding film is laminated with the electromagnetic shielding film 8 through the adhesive film layer 6, the adhesive film layer 6 and the insulating layer 82 can be pierced by the conductive particles 61 and electrically connected with the shielding layer 81 to realize grounding, which is not described in further detail herein.
Specifically, the grounding is achieved by the conductive particles 61 piercing the adhesive film layer 6 and the insulating layer 82 and electrically connecting with the shielding layer 81, which may be: as shown in fig. 2, the grounding is achieved by the conductive particles 61 themselves directly piercing the adhesive film layer 6 and the insulating layer 82 and electrically connecting with the shielding layer 81; it is also possible to form a plurality of large particle conductive particles 61 by agglomeration of the conductive particles 61 as shown in fig. 3, the plurality of large particle conductive particles 61 piercing the adhesive film layer 6 and the insulating layer 82 and electrically connecting with the shielding layer 81 to achieve grounding; the two ways of achieving grounding can also be combined as shown in fig. 1 and 4.
In addition, when the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4 and the metal foil layer 5 are sequentially stacked, the metal bonding layer 2 is arranged between the carrier layer 1 and the barrier layer 3 to increase the peeling strength between the carrier layer 1 and the barrier layer 3, so that the carrier layer 1 is not easy to fall off from the barrier layer 3 in the production process, the peeling between the carrier layer 1 and the barrier layer 3 is effectively prevented, and the carrier layer 1 is further ensured to be stably peeled off from the metal foil layer 5 when a free grounding film is used subsequently; when carrier layer 1 the peel off layer 4 the barrier layer 3 the metal tie coat 2 with when metal foil layer 5 stacks gradually the setting, through barrier layer 3 with set up metal tie coat 2 between the metal foil layer 5 for when using free grounding membrane, can increase barrier layer 3 with peel strength between the metal foil layer 5 makes peeling off carrier layer 1, barrier layer 3 can remain on the metal foil layer 5, and remains on the metal foil layer 5 barrier layer 3 can prevent metal foil layer 5 oxidation, thereby is favorable to improving the electrical properties of free grounding membrane, and then is favorable to deriving the interference electric charge in the electromagnetic shielding membrane, consequently is favorable to the integrality of signal transmission in the printed wiring board.
As shown in fig. 5, in the embodiment of the present invention, when the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4, and the metal foil layer 5 are sequentially stacked, the peel strength between the peeling layer 4 and the metal foil layer 5 is greater than or equal to the peel strength between the peeling layer 4 and the barrier layer 3. Since the peel strength between the peel layer 4 and the metal foil layer 5 is greater than or equal to the peel strength between the peel layer 4 and the barrier layer 3, the peel layer 4 can be partially or entirely left on the metal foil layer 5 when the free grounding film is peeled, so that the metal foil layer 5 can be prevented from being oxidized, thereby effectively protecting the metal foil layer 5. Of course, the peel strength between the peel layer 4 and the metal foil layer 5 may also be smaller than the peel strength between the peel layer 4 and the barrier layer 3, so that when the composite metal foil is peeled, the peel layer 4 can be partially or completely left on the barrier layer 3, and is peeled from the metal foil layer 5 along with the carrier layer 1 and the barrier layer 3, as shown in fig. 6, which is not described herein again.
Similarly, when the carrier layer 1, the peeling layer 4, the barrier layer 3, the metal bonding layer 2 and the metal foil layer 5 are sequentially stacked, the peeling layer 4 may be partially or entirely left on the barrier layer 3 to further increase the oxidation preventing effect of the metal foil layer 5. Of course, the release layer 4 may also be partially or completely left on the carrier layer 1 and simultaneously released from the metal foil layer 5 along with the carrier layer 1, which is not further described herein.
In an embodiment of the present invention, the metal foil layer 5 has a thickness of 2 to 15 μm, the metal bonding layer 2 has a thickness of 5 or more 5 Å, preferably the metal bonding layer 2 has a thickness of 5 to 500 Å, and the barrier layer 3 has a thickness of 5 or more 5 Å, preferably the barrier layer 3 has a thickness of 5 to 500, wherein the barrier layer 3 is an organic high temperature resistant layer, or the barrier layer 3 is made of any one or more of tungsten, chromium, zirconium, titanium, nickel, molybdenum, cobalt, and graphite, preferably the barrier layer 3 is a single layer alloy structure, or the barrier layer 3 is a multilayer structure of a single material layer or an alloy layer and a single material layer, wherein the single material layer is made of the same chemical element, specifically, the single layer alloy structure is a single layer structure of an alloy material, for example, a single layer structure of a tungsten-chromium alloy, and the barrier layer 3 is a multilayer structure of a single material layer or a multilayer structure of a single material layer and a single layer, for example, a multilayer structure of a tungsten layer and a multilayer structure of a metal layer or a multilayer structure of a tungsten layer and a chromium layer.
When the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4 and the metal foil layer 5 are sequentially stacked, the metal bonding layer 2 is made of any one or more materials of a first metal; alternatively, the metal bonding layer 2 is made of any one or more materials of a second metal; or, the metal bonding layer 2 is made of any one or more materials of a first metal and any one or more materials of a second metal; wherein the first type of metal is a metal that is easily bonded to the carrier layer 1, and the second type of metal is a metal that is easily bonded to the barrier layer 3, so as to prevent the carrier layer 1 from being peeled off from the barrier layer 3. Preferably, the first type of metal is copper or zinc and the second type of metal is nickel or iron or manganese. The metal bonding layer 2 is arranged so that the barrier layer 3 can be firmly connected with the carrier layer 1, thereby preventing the peeling between the barrier layer 3 and the carrier layer 1. Further, since the adhesion force between the first type metal and the carrier layer 1 is stronger and the adhesion force between the second type metal and the barrier layer 3 is stronger, the barrier layer 3 is not easily peeled from the carrier layer 1 by connecting the mono-metal layer made of the first type metal to the carrier layer 1 and simultaneously connecting the mono-metal layer made of the second type metal to the barrier layer 3.
When the carrier layer 1, the metal adhesive layer 2, the barrier layer 3, the release layer 4 and the metal foil layer 5 are sequentially stacked, the structure of the metal adhesive layer 2 may include, but is not limited to, the following cases: (1) the metal bonding layer 2 is a single metal layer made of the first metal; (2) the metal bonding layer 2 is a single metal layer made of the second metal; (3) the metal bonding layer 2 is a single-layer alloy structure made of the first metal and the second metal, for example, a single-layer alloy structure made of a copper-nickel alloy; (4) the metal bonding layer 2 comprises a single metal layer made of a first metal and connected to the carrier layer 1, the metal bonding layer 2 further comprises a single metal layer made of a second metal and connected to the barrier layer 3, for example, a multilayer structure of a copper metal layer and a nickel metal layer, and the copper metal layer is connected to the carrier layer 1 and the nickel metal layer is connected to the barrier layer 3; (5) the metal bonding layer 2 comprises a multilayer structure consisting of an alloy layer and a single metal layer; wherein the alloy layer of the metal bonding layer 2 is made of the first type of metal and the second type of metal, and the single metal layer of the metal bonding layer 2 is made of the first type of metal or the second type of metal; such as an alloy layer made of a copper-nickel alloy and a single metal layer made of manganese.
The structure of the metal bonding layer 2 is described in detail in the above case (4), and please refer to fig. 4, in this embodiment, the metal bonding layer 2 is made of a first metal single-layer structure 21 and a second metal single-layer structure 22, wherein the first metal single-layer structure 21 is a single metal layer made of a first metal and connected to the carrier layer 1, and the second metal single-layer structure 22 is a single metal layer made of a second metal and connected to the barrier layer 3.
In the embodiment of the present invention, a structure made of the single-layer structure of the first metal and/or the single-layer structure of the second metal may be further disposed between the single-layer structure of the first metal 21 and the single-layer structure of the second metal 22. By providing a structure made of a single-layer structure of the first type of metal and/or a single-layer structure of the second type of metal between the first type of metal single-layer structure 21 and the second type of metal single-layer structure 22, the connection between the barrier layer 3 and the carrier layer 1 is further secured, thereby further preventing peeling between the barrier layer 3 and the carrier layer 1.
Similarly, when carrier layer 1 the peel ply 4 the barrier layer 3 the metal tie coat 2 with metal foil layer 5 stacks gradually the setting, first type metal be easily with the metal that metal foil layer 5 bonded, second type metal be easily with the metal that barrier layer 3 bonded, in order to prevent metal foil layer 5 with barrier layer 3 peels off. Preferably, the first type of metal is copper or zinc and the second type of metal is nickel or iron or manganese. By providing the metal adhesive layer 2, the barrier layer 3 can be firmly connected to the metal foil layer 5, thereby preventing peeling between the barrier layer 3 and the metal foil layer 5. Further, since the adhesion force between the first type metal and the metal foil layer 5 is stronger and the adhesion force between the second type metal and the barrier layer 3 is stronger, the barrier layer 3 is not easily peeled from the metal foil layer 5 by connecting the mono-metal layer made of the first type metal with the carrier layer 1 and simultaneously connecting the mono-metal layer made of the second type metal with the barrier layer 3;
when the carrier layer 1, the release layer 4, the barrier layer 3, the metal bonding layer 2 and the metal foil layer 5 are sequentially stacked, the structure of the metal bonding layer 2 may include, but is not limited to, the following cases: (a) the metal bonding layer 2 is a single metal layer made of the first metal; (b) the metal bonding layer 2 is a single metal layer made of the second metal; (c) the metal bonding layer 2 is a single-layer alloy structure made of the first metal and the second metal, for example, a single-layer alloy structure made of a copper-nickel alloy; (d) the metal bonding layer 2 includes a single metal layer made of a first metal and connected to the metal foil layer 5, the metal bonding layer 2 further includes a single metal layer made of a second metal and connected to the barrier layer 3, for example, a multilayer structure of a copper metal layer and a nickel metal layer, and the copper metal layer is connected to the metal foil layer 5 and the nickel metal layer is connected to the barrier layer 3; (e) the metal bonding layer 2 comprises a multilayer structure consisting of an alloy layer and a single metal layer; wherein the alloy layer of the metal bonding layer 2 is made of the first type of metal and the second type of metal, and the single metal layer of the metal bonding layer 2 is made of the first type of metal or the second type of metal; such as an alloy layer made of a copper-nickel alloy and a single metal layer made of manganese.
As shown in fig. 8, the structure of the metal bonding layer 2 is described in detail in the above case (d), in this embodiment, the metal bonding layer 2 is made of a first metal single-layer structure 21 and a second metal single-layer structure 22, wherein the first metal single-layer structure 21 is a single metal layer made of a first metal and connected to the metal foil layer 5, and the second metal single-layer structure 22 is a single metal layer made of a second metal and connected to the barrier layer 3. In the embodiment of the present invention, a structure made of the single-layer structure of the first metal and/or the single-layer structure of the second metal may be further disposed between the single-layer structure of the first metal 21 and the single-layer structure of the second metal 22. By providing a structure made of a single-layer structure of the first type metal and/or a single-layer structure of the second type metal between the first type metal single-layer structure 21 and the second type metal single-layer structure 22, the connection between the barrier layer 3 and the metal foil layer 5 is further secured, thereby further preventing peeling between the barrier layer 3 and the metal foil layer 5.
In an embodiment of the present invention, the peeling layer 4 is made of any one or more materials selected from nickel, silicon, molybdenum, graphite, titanium and niobium, or the peeling layer 4 is made of an organic polymer material, wherein the peeling layer 4 preferably has a thickness of 10 to 500 Å. when the carrier layer, the metal bonding layer, the barrier layer, the peeling layer and the metal foil layer are sequentially stacked, since it is difficult to form a uniform metal foil layer 5 when the peeling layer 4 is excessively thick, it is easy to cause a large number of pinholes to be generated in the metal foil layer 5 (when the metal foil layer 5 contains a large number of pinholes, it is difficult to peel the peeling layer 1 well by allowing a glue in the glue layer 6 to penetrate the pinholes in the metal foil layer 5 during lamination), if the peeling layer 4 is excessively thin, it is easy to cause peeling between the peeling layer 4 and the metal foil layer 5, and therefore, by preferably having a thickness of 10 to 500 Å the peeling layer 4, it is ensured that a uniform metal foil layer 5 can be formed, it is easy to peel off the peeling layer 4 or the carrier layer 4 and the carrier layer 3 is easy to peel off when the peeling layer 4 and the carrier layer 4 are sequentially stacked, it is easy to peel off by allowing the peeling layer 3 or the peeling layer 4 and the carrier layer 3 to be easily formed.
In the embodiment of the present invention, in order to prevent the carrier layer 1 from being oxidized, a first oxidation preventing layer is disposed on a side of the carrier layer 1 close to the metal bonding layer 2; the carrier layer 1 is protected by providing a first oxidation preventing layer on the side of the carrier layer 1 close to the metal bonding layer 2 to prevent the carrier layer 1 from being oxidized. In order to prevent the metal foil layer 5 from being oxidized, a second oxidation preventing layer is arranged on one side, away from the peeling layer 4, of the metal foil layer 5, and the second oxidation preventing layer is arranged on one side, away from the peeling layer 4, of the metal foil layer 5, so that when the adhesive film layer 6 is not formed, the metal foil layer 5 can be prevented from being oxidized, the metal foil layer 5 is protected, and the electrical performance of the free grounding film is improved. Work as carrier layer 1 the metal bonding layer 2 the barrier layer 3 the peel ply 4 with when metal foil layer 5 stacks gradually the setting, in order to prevent metal foil layer 5 oxidation, metal foil layer 5 is close to be equipped with the third prevention oxide layer on one side of peel ply 4, through metal foil layer 5 is close to be equipped with the third prevention oxide layer on one side of peel ply 4, in order to prevent to work as carrier layer 1 the metal bonding layer 2 the barrier layer 3 with the peel ply 4 is followed cause when peeling off on the composite metal foil layer 5 oxidation of metal foil layer, thereby protection metal foil layer 5, and then be favorable to improving the electrical properties of free grounding membrane is favorable to deriving the interference charge consequently.
In the embodiment of the present invention, the thickness of the adhesive film layer 6 containing the conductive particles 61 is preferably 0.1 μm to 45 μm, and the shape of the conductive particles 61 may be spherical or flaky; when the conductive particles 61 are spherical, the particle size of the conductive particles 61 in the adhesive film layer 6 is preferably 0.1-15 μm, and the volume ratio of the conductive particles 61 to the adhesive film layer 6 is 2% -80%. Preferably, the material used for the adhesive film layer 6 is selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, modified thermoplastic polyimides, polyurethanes, polyacrylates, and silicones.
Referring to fig. 7 and 9, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including an electromagnetic shielding film 8, a printed circuit board 7, and the free grounding film, where the electromagnetic shielding film 8 is disposed on the printed circuit board 7, the electromagnetic shielding film 8 includes a shielding layer 81 and an insulating layer 82, the insulating layer 82 is disposed on the shielding layer 81, the free grounding film is pressed with the electromagnetic shielding film 8 through the glue film layer 6, and the conductive particles 61 pierce the glue film layer 6 and the insulating layer 82 and are electrically connected to the shielding layer 81.
In the embodiment of the present invention, the free grounding film is pressed to the electromagnetic shielding film 8 through the adhesive film layer 6, and the conductive particles 61 pierce the adhesive film layer 6 and the insulating layer 82 and are electrically connected to the shielding layer 81; when the circuit board is applied to electronic equipment, the free grounding film can be electrically connected with the shell of the electronic equipment, so that interference charges of the electromagnetic shielding film 8 can be led out through the free grounding film, interference charges can be led out through the shell of the electronic equipment, interference charges in the shielding layer 81 of the electromagnetic shielding film 8 are led into the ground, and interference charges are prevented from accumulating to form an interference source to influence the normal operation of the circuit board. In addition, the shielding layer 81 can also be conducted through contact with the ground layer of the printed wiring board 7, so that the accumulated interference charges can be conducted out through the ground layer of the printed wiring board 7.
Preferably, the printed circuit board 7 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
Referring to fig. 10 and 11, in order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing the free grounding film, including the following steps:
s11, forming a carrier layer 1;
s12, forming a metal adhesive layer 2 on one side of the carrier layer 1;
s13, forming a barrier layer 3 on the metal adhesive layer 2;
s14, forming a release layer 4 on the barrier layer 3;
s15, forming a metal foil layer 5 on the peeling layer 4 to obtain a composite metal foil;
s16, forming an adhesive film layer 6 containing conductive particles 61 on the metal foil layer 5 to obtain a free grounding film;
or,
s21, forming a carrier layer 1;
s22, forming a peeling layer 4 on one side of the carrier layer 1;
s23, forming a barrier layer 3 on the peeling layer 4;
s24, forming a metal bonding layer 2 on the barrier layer 3;
s25, forming a metal foil layer 5 on the metal bonding layer 2 to obtain a composite metal foil;
s26, forming an adhesive film layer 6 containing conductive particles 61 on the metal foil layer 5 to obtain a free grounding film;
when the free grounding film is used for grounding the printed circuit board 7, the electromagnetic shielding film 8 is arranged on the printed circuit board 7, the electromagnetic shielding film 8 comprises a shielding layer 81 and an insulating layer 82, the insulating layer 82 is arranged on the shielding layer 81, the free grounding film is pressed with the electromagnetic shielding film 8 through the glue film layer 6, and the conductive particles 61 penetrate through the glue film layer 6 and the insulating layer 82 and are electrically connected with the shielding layer 81.
In the embodiment of the present invention, the second metal is a metal that is easily bonded to the barrier layer 3, and when the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4, and the metal foil layer 5 are sequentially stacked, the first metal is a metal that is easily bonded to the carrier layer 1, so that the carrier layer 1 is prevented from being peeled from the barrier layer 3; when the carrier layer 1, the peeling layer 4, the barrier layer 3, the metal bonding layer 2 and the metal foil layer 5 are sequentially stacked, the first metal is a metal that is easily bonded to the metal foil layer 5, so as to prevent peeling from between the metal foil layer 5 and the metal bonding layer 2, and preferably, the first metal is copper or zinc, and the second metal is nickel or iron or manganese.
Since the roughness of the metal adhesion layer 2, the barrier layer 3 and the peeling layer 4 is easily affected by the current during electroplating by adopting the electroplating method, the surface roughness of the metal adhesion layer 2, the barrier layer 3 and the peeling layer 4 is formed very non-uniformly, so that the surface roughness of the metal foil layer 5 formed subsequently is not uniform, and the formation of excellent peeling stability and the number of pinholes is not facilitated. Based on this, in the embodiment of the present invention, the step S12, the step S13, the step S14, the step S22, the step S23 and the step S24 preferably adopt a sputtering method, the current of the sputtering method preferably adopts 6-12A, and the voltage preferably adopts 300-. The metal bonding layer 2 and the barrier layer 3 are formed by sputtering to ensure that the metal bonding layer 2 and the barrier layer 3 are uniformly and densely formed, and the uniform and dense stripping layer 4 is formed by sputtering, so that the stripping stability of the composite metal foil is improved, and the number of pinholes can be effectively reduced; in addition, the metal foil layer 5 is preferably formed by electroplating, and before the metal foil layer 5 is formed, the metal bonding layer 2, the barrier layer 3 and the peeling layer 4 which are uniformly and densely formed are formed by sputtering, so that the metal foil layer 5 is uniformly electroplated, the surface roughness of the formed metal foil layer 5 is uniform, pinholes are prevented from being formed on the metal foil layer 5, and the carrier layer 1 can be stably peeled.
In the embodiment of the present invention, the metal bonding layer 2 formed on one side of the carrier layer 1 is specifically: forming a single metal layer on one side of the carrier layer 1; wherein the single metal layer formed on one side of the carrier layer 1 is made of a first type of metal or a second type of metal.
In the embodiment of the present invention, the metal bonding layer 2 formed on one side of the carrier layer 1 may be: forming a single layer alloy structure on one side of the carrier layer 1; wherein the single-layer alloy structure formed on one side of the carrier layer 1 is made of a first type of metal and a second type of metal.
In the embodiment of the present invention, the metal bonding layer 2 formed on one side of the carrier layer 1 may be: forming a multilayer structure on one side of the carrier layer 1; wherein the multilayer structure formed on one side of the carrier layer 1 comprises a single metal layer made of a first type of metal and connected to the carrier layer 1, and the multilayer structure formed on one side of the carrier layer 1 further comprises a single metal layer made of a second type of metal and connected to the barrier layer 3.
In the embodiment of the present invention, the metal bonding layer 2 formed on one side of the carrier layer 1 may be: forming a multilayer structure on one side of the carrier layer 1; wherein the multilayer structure formed on one side of the carrier layer 1 includes an alloy layer made of a first type of metal and a second type of metal and a single metal layer made of a first type of metal or a second type of metal.
The barrier layer 3 is an organic high-temperature resistant layer; alternatively, the barrier layer 3 is made of any one or more materials of tungsten, chromium, zirconium, titanium, nickel, molybdenum, cobalt, and graphite. Preferably, the barrier layer 3 is a single layer alloy structure; or, the barrier layer 3 is a multi-layer structure composed of a single material layer or a multi-layer structure composed of an alloy layer and a single material layer, wherein the single material layer is made of the same chemical element. Specifically, the single-layer alloy structure is a single-layer structure made of an alloy material, for example, a single-layer structure made of a tungsten-chromium alloy; the barrier layer 3 is a multilayer structure composed of a single material layer or a multilayer structure composed of an alloy layer and a single material layer, for example, a multilayer structure composed of a tungsten metal layer and a chromium metal layer, or a multilayer structure composed of a tungsten-chromium alloy layer and a zirconium metal layer.
In the embodiment of the present invention, the method further includes the following steps after forming the carrier layer 1:
s111, roughening the carrier layer 1 to obtain a roughened carrier layer 1;
s112, forming a first anti-oxidation layer on the roughened carrier layer 1;
wherein, the carrier layer 1 can be any one of carrier copper, carrier aluminum, carrier titanium, carrier zinc, carrier nickel, carrier chromium and carrier molybdenum. The support layer 1 may be formed by electroplating, and a plating solution forming the support layer 1 may include a copper sulfate solution, wherein the copper content of the plating solution forming the support layer 1 is: 15-25g/L, and the PH value is 6-9; the plating solution for forming the carrier layer 1 further comprises additives, wherein the additives comprise brightener sodium sulfonate, leveling agent thiourea and wetting agent polyethylene glycol, the mass fraction of the brightener sodium sulfonate is preferably 0.1-2g/L, the mass fraction of the leveling agent thiourea is preferably 0.01-1g/L, and the mass fraction of the wetting agent polyethylene glycol is preferably 0.1-5 g/L. The carrier layer 1 is roughened by means of acid electroplating, wherein the plating solution for acid copper plating can comprise a copper sulfate solution, the copper content of the plating solution for acid copper plating is 10-15g/L, the acid content is 90-100g/L, and the molybdenum content is 600-800 PPM. Wherein, the first oxidation prevention layer can be formed in a zinc-nickel alloy plating mode; after the first oxidation preventing layer is formed on the roughened carrier layer 1, the first oxidation preventing layer may be plasma cleaned (plasma), wherein the voltage for plasma cleaning is preferably 1500-.
In the embodiment of the present invention, in order to further prevent the adhesion between the carrier layer 1 and the metal foil layer 5, the carrier layer 1 is formed and then the carrier layer further includes:
s113, annealing the carrier layer 1 under the heat treatment condition; wherein the heat treatment conditions are as follows: the heat treatment temperature is 200-300 ℃, and the heating time is 30-300 minutes. Preferably, the heating time is 1 hour. The carrier layer 1 is annealed under heat treatment conditions to suppress crystal growth of the carrier layer 1 in the heating process, thereby delaying diffusion of the carrier layer 1 in the heating process and further preventing adhesion between the carrier layer 1 and the metal foil layer 5.
In the embodiment of the present invention, the peeling layer 4 may be made of any one or more materials of nickel, silicon, molybdenum, graphite, titanium, and niobium.
In the embodiment of the present invention, when the carrier layer 1, the metal bonding layer 2, the barrier layer 3, the peeling layer 4 and the metal foil layer 5 are sequentially stacked, the metal foil layer 5 may be any one of a copper foil, an aluminum foil, a zinc foil, a silver foil and a gold foil; when the carrier layer 1, the peeling layer 4, the barrier layer 3, the metal bonding layer 2 and the metal foil layer 5 are sequentially stacked, the metal foil layer 5 is any one of a copper foil, an aluminum foil, a titanium foil, a zinc foil, a nickel foil, a chromium foil, a silver foil, a gold foil and a molybdenum foil. The metal foil layer 5 may be formed by electroplating, and a plating solution for forming the metal foil layer 5 may include a copper sulfate solution, wherein the copper content of the plating solution for forming the metal foil layer 5 is: 15-25g/L, and the PH value is 6-9; the plating solution for forming the metal foil layer 5 comprises additives, wherein the additives comprise brightener sodium sulfonate, leveling agent thiourea and wetting agent polyethylene glycol, the mass fraction of the brightener sodium sulfonate is preferably 0.1-2g/L, the mass fraction of the leveling agent thiourea is preferably 0.01-1g/L, and the mass fraction of the wetting agent polyethylene glycol is preferably 0.1-5 g/L. In the embodiment of the present invention, in order to avoid the warpage of the composite metal foil, the plating solution of the carrier layer 1 and the metal foil layer 5 is set to be the same in this embodiment, so that the stress action and the tension action of the carrier layer 1 and the metal foil layer 5 are the same, thereby making the carrier layer 1 and the degree of bending of the metal foil layer 5 are the same, and further avoiding the warpage of the composite metal foil.
In the embodiment of the present invention, before forming the metal foil layer 5 on the peeling layer 4, the method further includes the steps of: a third oxidation prevention layer is arranged on the stripping layer 4; wherein, the third oxidation prevention layer can be formed in a zinc-nickel alloy plating mode.
In an embodiment of the present invention, the method for preparing the free grounding film further includes:
s31, roughening the side of the metal foil layer 5 away from the carrier layer 1;
and S32, forming a second oxidation prevention layer on one surface of the roughened metal foil layer 5, which is far away from the carrier layer 1.
Wherein, the surface of the metal foil layer 5 far away from the carrier layer 1 is roughened by an acid electroplating mode, wherein, the plating solution for acid copper plating can comprise a copper sulfate solution, the copper content of the plating solution for acid copper plating is 10-15g/L, the acid content is 90-100g/L, and the molybdenum content is 600-800 PPM; wherein, the second oxidation prevention layer can be formed in a zinc-nickel alloy plating mode; after the second oxidation preventing layer is formed, plasma cleaning (plasma) may be performed on the second oxidation preventing layer, wherein the voltage during plasma cleaning is preferably 1500-.
In the embodiment of the present invention, the adhesive film layer 6 containing the conductive particles 61 is formed on the metal foil layer 5, and specifically includes:
s1611, coating an adhesive film layer 6 containing conductive particles 61 on a release film;
s1612, transferring the adhesive film layer 6 containing the conductive particles 61 onto one side of the metal foil layer 5 by pressing; or,
s1621, a film 6 containing conductive particles 61 is coated on the metal foil layer 5.
To sum up, the embodiment of the present invention provides a free grounding film, a circuit board and a method for manufacturing the free grounding film, when the free grounding film is used for grounding a printed circuit board 7, the peeling layer 4 is arranged to peel off the carrier layer 1, and the barrier layer 3 is arranged to prevent the carrier layer 1 and the metal foil layer 5 from being mutually diffused at high temperature to cause bonding, so that the carrier layer 1 can be stably peeled off from the metal foil layer 5, and the use stability of the free grounding film is effectively ensured; further, by providing the adhesive film layer 6 containing the conductive particles 61, when the free grounding film is laminated with the electromagnetic shielding film 8 through the adhesive film layer 6, grounding is achieved by the conductive particles 61 piercing the adhesive film layer 6 and the insulating layer 82 and electrically connecting with the shielding layer 81.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (13)
1. A free grounding film is characterized by comprising a composite metal foil and a film adhesive layer containing conductive particles, wherein the composite metal foil comprises a carrier layer, a metal bonding layer, a barrier layer, a stripping layer and a metal foil layer, the carrier layer, the metal bonding layer, the barrier layer, the stripping layer and the metal foil layer are sequentially stacked, or the carrier layer, the stripping layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked; the adhesive film layer is arranged on the metal foil layer; when the free grounding film is used for grounding a printed circuit board, an electromagnetic shielding film is arranged on the printed circuit board and comprises a shielding layer and an insulating layer, the insulating layer is arranged on the shielding layer, the free grounding film is pressed with the electromagnetic shielding film through the adhesive film layer, and the conductive particles penetrate through the adhesive film layer and the insulating layer and are electrically connected with the shielding layer.
2. The free grounding film of claim 1, wherein when the carrier layer, the metal adhesive layer, the barrier layer, the release layer, and the metal foil layer are sequentially stacked, a peel strength between the release layer and the metal foil layer is greater than or equal to a peel strength between the release layer and the barrier layer.
3. The free grounding film of claim 1, wherein the barrier layer is an organic high temperature resistant layer or is made of any one of tungsten, chromium, zirconium, titanium, nickel, molybdenum, cobalt and graphite.
4. The free grounding film of claim 1, wherein the barrier layer is a monolayer alloy structure; or the barrier layer is a multilayer structure consisting of a single material layer or a multilayer structure consisting of an alloy layer and a single material layer, wherein the single material layer is made of the same chemical element.
5. The free grounding film of claim 1, wherein the metal adhesion layer is made of any one of a first class of metals;
or the metal bonding layer is made of any one material in a second metal;
wherein the second metal is a metal that is easily bonded to the barrier layer;
when the carrier layer, the metal bonding layer, the barrier layer, the peeling layer and the metal foil layer are sequentially stacked, the first metal is a metal which is easily bonded to the carrier layer;
when the carrier layer, the peeling layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked, the first metal is a metal which is easy to bond with the metal foil layer.
6. The free grounding film of claim 5, wherein the first type of metal is copper or zinc and the second type of metal is nickel or iron or manganese.
7. The free grounding film of claim 5, wherein the metal adhesion layer is a single metal layer made of the first type of metal or the second type of metal;
or, the metal bonding layer is a single-layer alloy structure made of the first metal and the second metal;
or, the metal bonding layer comprises a single metal layer made of a first metal and connected with the carrier layer, and the metal bonding layer further comprises a single metal layer made of a second metal and connected with the barrier layer;
or, the metal bonding layer comprises a multilayer structure consisting of an alloy layer and a single metal layer; wherein the alloy layer of the metal bonding layer is made of the first type of metal and the second type of metal, and the single metal layer of the metal bonding layer is made of the first type of metal or the second type of metal.
8. The free grounding film of any of claims 1 to 7, wherein the peeling layer is made of any of nickel, silicon, molybdenum, graphite, titanium and niobium; or the stripping layer is made of an organic high molecular material.
9. A free grounding film as claimed in any one of claims 1 to 7, wherein the metal foil layer has a thickness of 2 to 15 μm, and/or the metal adhesive layer has a thickness of greater than or equal to 5 Å, and/or the barrier layer has a thickness of greater than or equal to 5 Å.
10. A free grounding film as claimed in any one of claims 1 to 7 wherein the support layer is any one of copper support, aluminium support, titanium support, zinc support, nickel support, chromium support, molybdenum support; and/or the presence of a gas in the gas,
when the carrier layer, the metal bonding layer, the barrier layer, the stripping layer and the metal foil layer are sequentially stacked, the metal foil layer is any one of copper foil, aluminum foil, zinc foil, silver foil and gold foil;
when the carrier layer, the stripping layer, the barrier layer, the metal bonding layer and the metal foil layer are sequentially stacked, the metal foil layer is any one of copper foil, aluminum foil, titanium foil, zinc foil, nickel foil, chromium foil, silver foil, gold foil and molybdenum foil.
11. A free grounding film as claimed in any one of claims 1 to 7, wherein a first oxidation preventing layer is provided on a side of the carrier layer adjacent to the metal adhesive layer; and/or a second oxidation-resistant layer is arranged on one side of the metal foil layer, which is far away from the stripping layer; and/or, when the carrier layer the metal bonding layer the barrier layer the peel ply with when the metal foil layer stacks up the setting in proper order, the metal foil layer is close to be equipped with the third prevention oxide layer on one side of peel ply.
12. The free grounding film of any one of claims 1 to 7, wherein the electrically conductive particles piercing the glue film layer and the insulating layer and electrically connecting to the shielding layer specifically comprises:
the conductive particles directly penetrate the adhesive film layer and the insulating layer and are electrically connected with the shielding layer;
and/or the conductive particles are agglomerated to form a plurality of large particle conductive particles which pierce the glue film layer and the insulating layer and are electrically connected with the shielding layer.
13. A circuit board comprising an electromagnetic shielding film, a printed circuit board, and the free grounding film of any one of claims 1 to 12, wherein the electromagnetic shielding film is disposed on the printed circuit board, the electromagnetic shielding film comprises a shielding layer and an insulating layer, the insulating layer is disposed on the shielding layer, the free grounding film is laminated to the electromagnetic shielding film through the adhesive film layer, and the conductive particles penetrate the adhesive film layer and the insulating layer and are electrically connected to the shielding layer.
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