CN209947455U - Conductive adhesive film and circuit board - Google Patents
Conductive adhesive film and circuit board Download PDFInfo
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- CN209947455U CN209947455U CN201821963163.XU CN201821963163U CN209947455U CN 209947455 U CN209947455 U CN 209947455U CN 201821963163 U CN201821963163 U CN 201821963163U CN 209947455 U CN209947455 U CN 209947455U
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Abstract
The utility model relates to the field of electronic technology, a conductive adhesive film and circuit board is disclosed, wherein, conductive adhesive film is through setting up the conductor layer, first conductor granule and second conductor granule, so that when the pressfitting of conductive adhesive film is used, first conductor granule pierces through first plastic film layer and contacts with a conductor, second conductor granule pierces through second plastic film layer and contacts with another conductor, thereby realize that conductive adhesive film contacts with the conductor and switches on, so as to avoid that the conductive adhesive film's conductive particles's of conductive adhesive film stack state changes among the prior art leads to conductive adhesive film's poor stability, thereby has improved conductive adhesive film's conductive stability effectively; in addition, through being equipped with the through-hole that runs through its upper and lower surface on the conductor layer to make first glued membrane layer and second glued membrane layer can pass through the through-hole in the conductor layer in close contact with, thereby make first glued membrane layer and second glued membrane layer can link together firmly.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a conductive adhesive film and circuit board.
Background
The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the conventional conductive adhesive film generally has only a single conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein; in practical application, the conductive adhesive film is adhered between the conductors, so that the conduction between the conductors is realized. However, in the process of implementing the invention, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect between the conductive adhesive film and the conductor is not ideal, and the conductive stability of the conductive adhesive film is poor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a conductive adhesive film and circuit board, it can improve conductive adhesive film's electrically conductive stability effectively.
In order to solve the technical problem, an embodiment of the present invention provides a conductive adhesive film, including a first adhesive film layer, a conductor layer and a second adhesive film layer, where the conductor layer is disposed between the first adhesive film layer and the second adhesive film layer, one side of the conductor layer, which is close to the first adhesive film layer, is a flat surface, and first conductor particles are disposed on the flat surface of the conductor layer, which is close to the first adhesive film layer, and the first conductor particles extend into the first adhesive film layer; second conductor particles are arranged on one surface, close to the second adhesive film layer, of the conductor layer, and the second conductor particles extend into the second adhesive film layer; the conductor layer is provided with a through hole penetrating through the upper surface and the lower surface of the conductor layer.
Preferably, one surface of the conductor layer, which is close to the second adhesive film layer, is a flat surface;
or, the conductor layer is close to the one side of second glued membrane layer is uneven surface, the conductor layer is close to uneven surface of second glued membrane layer includes a plurality of convex parts and a plurality of depressed part, and is a plurality of convex part and a plurality of the depressed part interval sets up, and is a plurality of the convex part stretches into the second glued membrane layer, second conductor granule concentrates the distribution on the convex part.
Preferably, the first conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape, and/or the second conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape.
Preferably, the number of the first conductor particles is multiple, and the multiple first conductor particles are regularly or irregularly distributed on one surface, close to the first adhesive film layer, of the conductor layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the first adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the multiple second conductor particles are regularly or irregularly distributed on one surface, close to the second adhesive film layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the second adhesive film layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
Preferably, the height of each of the first conductive particles and the second conductive particles is 0.1 μm to 30 μm.
Preferably, the first adhesive film layer comprises an adhesion layer containing conductive particles; or, the first adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the second adhesive film layer comprises an adhesive layer containing conductive particles; or the second adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the thickness of the conductor layer is 0.01 μm to 45 μm, the thickness of the first adhesive film layer is 0.1 μm to 45 μm, and the thickness of the second adhesive film layer is 0.1 μm to 45 μm.
Preferably, the conductive adhesive film further comprises a first peelable protective film layer and a second peelable protective film layer, the first peelable protective film layer is arranged on the surface, away from the conductor layer, of the first adhesive film layer, and the second peelable protective film layer is arranged on the surface, away from the conductor layer, of the second adhesive film layer.
Preferably, the area of the through hole is 0.1 μm2-1mm2(ii) a And/or the number of the through holes in the conductor layer per square centimeter is 10-1000.
The embodiment of the utility model provides a conductive adhesive film, which is formed by arranging a conductive layer, first conductive particles and second conductive particles, so that when the conductive adhesive film is pressed for use, the first conductor particles pierce the first adhesive film layer and are in contact conduction with one conductor, the second conductor particles pierce the second adhesive film layer and are in contact conduction with the other conductor, thereby realizing the contact conduction between the conductive adhesive film and the conductor, avoiding the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art, thereby effectively improving the conductive stability of the conductive adhesive film, and simultaneously avoiding the lower overlapping rate of conductive particles caused by adopting a separate conductive adhesive layer in the prior art, thereby reducing the resistance of the conductive adhesive film, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor is improved; in addition, as the conductive particles are not needed, the production cost of the conductive adhesive film is greatly reduced; in addition, the through holes penetrating through the upper surface and the lower surface of the conductor layer are arranged on the conductor layer, so that the first adhesive film layer and the second adhesive film layer can be in close contact through the through holes on the conductor layer, the peeling strength between the first adhesive film layer and the second adhesive film layer is increased, and the first adhesive film layer and the second adhesive film layer can be firmly connected together; in addition, be equipped with the through-hole that runs through its upper and lower surface on the conductor layer, be favorable to when the high temperature volatile substance in first glued membrane layer and the second glued membrane layer to exhaust through-hole of conductor layer to the volatile substance of avoiding first glued membrane layer and second glued membrane layer is difficult to discharge when the high temperature, thereby has avoided the conductive adhesive film to bubble the layering and has caused conductive adhesive film and conductor to take place to peel off, and then has improved the reliability that conductive adhesive film and conductor are connected.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board and the conductive adhesive film, where the conductive adhesive film is disposed on the printed circuit board, and the first conductor particles pierce through the first adhesive film layer and are in contact with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the first glue film layer, of the second glue film layer, and the second conductor particles penetrate through the second glue film layer and are in contact conduction with the steel sheet. The conductive film is arranged on the printed circuit board, so that electromagnetic wave interference is shielded for the printed circuit board, interference charges generated from the outside are accumulated on a conductor layer of the conductive film, and the first conductor particles pierce through the first film layer and are in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductor layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and the second conductor particles pierce the second adhesive film layer and are in contact conduction with the steel sheet, so that interference charges accumulated on the conductor layer can be conducted out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film, and the electromagnetic shielding film is disposed on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, first conductor particles of the conductive adhesive film penetrate through the first adhesive film layer and the insulating layer and are in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the first glue film layer, of the second glue film layer, and the second conductor particles penetrate through the second glue film layer and are in contact conduction with the steel sheet. The conductive adhesive film is arranged on the electromagnetic shielding film which is arranged on the printed circuit board, so that the conductive adhesive film and the electromagnetic shielding film can shield electromagnetic wave interference for the printed circuit board, interference charges generated from the outside are accumulated on the conductive layer of the conductive adhesive film and the metal conductive layer of the electromagnetic shielding film, and the first conductive particles pierce the first adhesive film layer and are in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductive layer and the metal conductive layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and the second conductor particles pierce the second adhesive film layer and are in contact conduction with the steel sheet, so that interference charges accumulated on the conductor layer and the metal conducting layer can be conducted out through the steel sheet.
Drawings
Fig. 1 is a schematic structural diagram of a conductive adhesive film in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another angle of the conductive adhesive film in the embodiment of the present invention;
fig. 3 is a schematic structural view of one-step molding of the first conductor particles, the second conductor particles and the conductor layer in the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a conductive adhesive film including a convex portion and a concave portion in an embodiment of the present invention;
fig. 5 is a schematic structural view of an adhesive conductive film comprising a first peelable protective film layer and a second peelable protective film layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a circuit board in an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another embodiment of the circuit board in the embodiment of the present invention;
fig. 8 is a schematic flow chart of a method for manufacturing a conductive adhesive film according to an embodiment of the present invention;
wherein, 1, a conductor layer; 11. a through hole; 12. a convex portion; 13. a recessed portion; 2. a first adhesive film layer; 3. a second adhesive film layer; 4. a first conductive particle; 5. a second conductive particle; 6. a first peelable protective film layer; 7. a second peelable protective film layer; 8. a printed wiring board; 81. a steel sheet; 82. an earth formation; 83. a first ground via; 84. A second ground via; 9. an electromagnetic shielding film; 91. an insulating layer; 92. a metal conductive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 and fig. 2, a conductive adhesive film according to a preferred embodiment of the present invention includes a first adhesive film layer 2, a conductor layer 1 and a second adhesive film layer 3, wherein the conductor layer 1 is disposed between the first adhesive film layer 2 and the second adhesive film layer 3, one surface of the conductor layer 1 close to the first adhesive film layer 2 is a flat surface, first conductor particles 4 are disposed on the flat surface of the conductor layer 1 close to the first adhesive film layer 2, and the first conductor particles 4 extend into the first adhesive film layer 2; second conductor particles 5 are arranged on one surface, close to the second adhesive film layer 3, of the conductor layer 1, and the second conductor particles 5 extend into the second adhesive film layer 3; the conductor layer 1 is provided with a through hole 11 penetrating through the upper and lower surfaces thereof.
In the embodiment of the present invention, by providing the conductor layer 1, the first conductor particles 4 and the second conductor particles 5, so that when the conductive adhesive film is pressed for use, the first conductor particles 4 pierce through the first adhesive film layer 2 and are in contact conduction with one conductor, the second conductor particles 5 pierce through the second adhesive film layer 3 and are in contact conduction with the other conductor, thereby realizing the contact conduction between the conductive adhesive film and the conductor, avoiding the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art, thereby effectively improving the conductive stability of the conductive adhesive film, and simultaneously avoiding the lower overlapping rate of conductive particles caused by adopting a separate conductive adhesive layer in the prior art, thereby reducing the resistance of the conductive adhesive film, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor is improved; in addition, as the conductive particles are not needed, the production cost of the conductive adhesive film is greatly reduced; in addition, the through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is arranged, so that the first adhesive film layer 2 and the second adhesive film layer 3 can be in close contact through the through hole 11 on the conductor layer 1, the peeling strength between the first adhesive film layer 2 and the second adhesive film layer 3 is increased, and the first adhesive film layer 2 and the second adhesive film layer 3 can be firmly connected together; in addition, be equipped with the through-hole 11 that runs through its upper and lower surface on conductor layer 1, be favorable to when the high temperature volatile substance in first glued membrane layer 2 and the second glued membrane layer 3 to exhaust through-hole 11 of conductor layer 1 to the volatile substance of avoiding first glued membrane layer 2 and second glued membrane layer 3 is difficult to discharge when the high temperature, thereby has avoided the conductive adhesive membrane layer that bubbles to cause conductive adhesive membrane and conductor to take place to peel off, and then has improved the reliability that conductive adhesive membrane and conductor are connected.
In the implementation shown in fig. 1 and fig. 3, the conductive layer 1 may be formed first, and then the first conductive particles 4 and the second conductive particles 5 may be formed on the conductive layer 1 by other processes. Of course, the conductor layer 1, the first conductor particles 4, and the second conductor particles 5 may also be an integral structure formed by a one-time molding process.
As shown in fig. 1 and fig. 4, the one surface of the conductor layer 1 close to the second adhesive film layer 3 is a flat surface or a non-flat surface, when the one surface of the conductor layer 1 close to the second adhesive film layer 3 is a non-flat surface, the conductor layer close to the non-flat surface of the second adhesive film layer 3 includes a plurality of protrusions 12 and a plurality of recesses 13, the plurality of protrusions 12 and the plurality of recesses 13 are arranged at intervals, the plurality of protrusions 12 extend into the second adhesive film layer 3, and the second conductor particles 5 are distributed on the protrusions 12 in a concentrated manner. When the conductive adhesive film is pressed for use, the plurality of convex parts 12 can pierce the second adhesive film layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during pressing, the glue substances forming the second glue film layer 3 are extruded to the concave part 13, so that the glue containing amount of the conductive glue film is increased, the phenomenon that the conductive glue film is stripped from a conductor is not easy to occur, the problem that the conductive glue film is stripped from the conductor due to insufficient glue containing amount of the existing conductive glue film is solved, and the connection reliability of the conductive glue film and the conductor is effectively ensured; in addition, when the conductive adhesive film is pressed and used, the convex part 12 on the conductor layer 1 and the second conductor particles 5 can pierce the second adhesive film layer 3 together and are in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, the use of conductive particles is reduced, the conduction resistance is greatly reduced, and the cost is reduced.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 near the second adhesive film layer 3 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the second adhesive film layer 3 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the uneven surface of the conductor layer 1 close to the second adhesive film layer 3 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude and/or interval of the fluctuation on the uneven surface are different.
In the embodiment of the present invention, the plurality of protrusions 12 may have a certain distance from the outer surface of the second adhesive film layer 3, and may also contact or extend from the outer surface of the second adhesive film layer 3.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between the convex portion 12 and the adjacent concave portion 13 is the same in each embodiment. By setting the distance between each convex portion 12 and the adjacent concave portion 13 to be the same, the convex portions 12 can uniformly pierce the second adhesive film layer 3, thereby further ensuring that the conductor layer 1 is in contact with the conductor and improving the conduction efficiency. Preferably, each of the projections 12 is identical in shape; each of the recesses 13 has the same shape; wherein each convex part 12 is in an axisymmetric structure; each of the concave portions 13 is of an axisymmetric structure; of course, each of the protrusions 12 may also have a non-axisymmetric structure, and each of the recesses 13 may also have a non-axisymmetric structure. Because the distance between each convex part 12 and the adjacent concave part 13 is the same, the shape of each convex part 12 is the same, and the shape of each concave part 13 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
Preferably, the undulation degree of the conductor layer 1 close to the uneven surface of the second adhesive film layer 3 (i.e. the distance between the highest point and the lowest point of the side of the conductor layer 1 close to the second adhesive film layer 3) is 0.1 μm to 30 μm, and the undulation degree of the side of the conductor layer 1 close to the second adhesive film layer 3 is set within the above range, so that the piercing function of the conductor layer 1 can be enhanced, thereby ensuring that the interference charges accumulated in the conductor layer 1 are smoothly discharged, and further avoiding the accumulation of the interference charges to form an interference source.
As shown in fig. 4, the height h1 of the first conductive particle 4 is preferably 0.1 μm to 30 μm, the height h2 of the second conductive particle 5 is preferably 0.1 μm to 30 μm, and the thickness of each of the first adhesive film layer 2 and the second adhesive film layer 3 is preferably 0.1 μm to 45 μm. By setting the heights of the first conductor particles 4 and the second conductor particles 5 to be 0.1-30 μm, and the thicknesses of the first adhesive film layer 2 and the second adhesive film layer 3 to be 0.1-45 μm, it is ensured that the first conductor particles 4 can pierce the first adhesive film layer 2 and the second conductor particles 5 can pierce the second adhesive film layer 3 when the conductive adhesive film is used for lamination, so that the conductive adhesive film can be in contact conduction with a conductor. Further, the thickness of the conductor layer 1 is preferably 0.01 μm to 45 μm to ensure that the conductor layer 1 is not easily broken and has good flexibility. When the conductor layer 1 and the surface close to the second adhesive film layer 3 are uneven surfaces, the second conductor particles 5 are distributed in the concave portions 13 and the convex portions 12, and the sum of the height H of any convex portion 12 and the height H2 of the second conductor particle 5 on the convex portion 12 is also 1 to 30 μm. Of course, the height H2 of the second conductive particles 5 on the convex portion 12 may be 1 to 30 μm, and then the sum of the height H of the convex portion 12 and the height H2 of the second conductive particles 5 on the convex portion is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film.
The first conductor particles 4 may have a certain distance from the outer surface of the first adhesive film layer 2, and may also contact the outer surface of the first adhesive film layer 2 or extend out of the outer surface of the first adhesive film layer 2; the second conductor particles 5 may have a certain distance from the outer surface of the second adhesive film layer 3, and may also contact the outer surface of the second adhesive film layer 3 or extend out of the outer surface of the second adhesive film layer 3. In addition, the outer surfaces of the first adhesive film layer 2 and the second adhesive film layer 3 may be flat surfaces without undulation, or may be uneven surfaces with gentle undulation.
In the embodiment of the present invention, the number of the first conductor particles 4 is plural, and the plural first conductor particles 4 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the first adhesive film layer 2; a plurality of the first conductor particles 4 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the first adhesive film layer 2; the shapes of the plurality of first conductor particles 4 are the same or different; the plurality of first conductor particles 4 may be the same or different in size; and/or the number of the second conductor particles 5 is multiple, and the multiple second conductor particles 5 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the second adhesive film layer 3; a plurality of the second conductor particles 5 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the second adhesive film layer 3; the shapes of the plurality of second conductor particles 5 are the same or different; the second conductor particles 5 may be the same or different in size. It should be noted that, the fact that the plurality of first conductor particles 4 are regularly distributed on the surface of the conductor layer 1 close to the first adhesive film layer 2 means that the plurality of first conductor particles 4 are periodically distributed on the surface of the conductor layer 1 close to the first adhesive film layer 2; the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the first adhesive film layer 2, that is, the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the first adhesive film layer 2; the second conductor particles 5 are regularly distributed on the surface of the conductor layer 1 close to the second adhesive film layer 3, that is, the second conductor particles 5 are periodically distributed on the surface of the conductor layer 1 close to the second adhesive film layer 3; the plurality of second conductor particles 5 irregularly distributed on the surface of the conductor layer 1 close to the second adhesive film layer 3 means that the plurality of second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the second adhesive film layer 3.
It should be noted that the shapes of the first conductive particles 4 and the second conductive particles 5 in fig. 1 and fig. 3 to fig. 7 are merely exemplary, and due to differences in process means and parameters, the first conductive particles 4 and the second conductive particles 5 may also be in other shapes such as clusters, ice-hanging shapes, stalactite shapes, and dendrites. In addition, the first conductive particles 4 and the second conductive particles 5 in the embodiments of the present invention are not limited by the shapes shown in the drawings, and any first conductive particles 4 and second conductive particles 5 having piercing and conductive functions are within the scope of the present invention.
The conductor layer 1 of the present embodiment may have a single-layer structure or a multi-layer structure; when the conductor layer 1 is a plurality of layers, one surface of each conductor layer 1, which is close to the first adhesive film layer 2, may be provided with first conductor particles 4, and one surface of each conductor layer 1, which is close to the second adhesive film layer 3, may be provided with second conductor particles 5. The first adhesive film layer 2 and the second adhesive film layer 3 may be of a single-layer structure or a multi-layer structure; the conductor layer 1, the first adhesive film layer 2, and the second adhesive film layer 3 may be provided in plurality. Preferably, when the conductor layer 1, the first adhesive film layer 2 and the second adhesive film layer 3 are respectively a plurality of, the first adhesive film layer 2, the conductor layer 1 and the second adhesive film layer 3 are sequentially arranged at intervals, for example, when the conductor layer 1, the first adhesive film layer 2 and the second adhesive film layer 3 are respectively 2, the arrangement sequence may be: one first adhesive film layer 2, one conductor layer 1, one second adhesive film layer 3, another first adhesive film layer 2, another conductor layer 1 and another second adhesive film layer 3, and so on, which will not be described herein; or, 2 only 1 first adhesive film layer 2 may be disposed between the conductor layers 1, for example, when the conductor layers 1 and the second adhesive film layers 3 are 2, and the first adhesive film layers 2 are 1, the arrangement sequence may be: one first adhesive film layer 2, one conductor layer 1, one second adhesive film layer 3, another conductor layer 1, and another second adhesive film layer 3, and so on, which will not be described herein. In addition, according to the actual production and application requirements, the conductor layer 1 of the present embodiment may be configured as a foamed shape, and the like, which is not described herein further.
In the embodiment of the present invention, in order to ensure that the conductor layer 1 has good conductivity, the conductor layer 1 includes one or more of a metal conductor layer, a carbon nanotube conductor layer, a ferrite conductor layer, and a graphene conductor layer. Wherein the metal conductor layer comprises a single metal conductor layer and/or an alloy conductor layer; the single metal conductor layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy conductor layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the embodiment of the present invention, the first conductor particles 4 include one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles 5 include one or more of metal particles, carbon nanotube particles, and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The first conductive particles 4 and the second conductive particles 5 may be made of the same material as the conductive layer 1, or may be different.
It should be noted that, when the conductive adhesive film in the prior art adopts a single conductive adhesive layer (composed of an insulating matrix and conductive particles), the conductive particles and the conductive particles can form a conductive path through a tunnel effect to realize electrical connection between the component and the circuit board, however, in the using process, under the influence of stress, weather and the like, the volume or shape of the insulating matrix is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive layer is easy to change (that is, the thickness of the insulating matrix between the conductive particles and the conductive particles is easy to change), and since the conductive path formed between the conductive particles through the tunnel effect is mainly influenced by the thickness of the insulating matrix between the conductive particles, the conductive path of the prior conductive adhesive film is easy to fail due to the thickness change of the insulating matrix between the conductive particles in the using process, thereby making the electrical performance of the existing conductive adhesive film unstable. And in the embodiment of the utility model provides an in, first rete 2 with second rete 3 need not to set up conductive particle and can form the electrically conductive route, has solved current conductive adhesive film and has easily become invalid because of the electrically conductive route that forms through tunnel effect between the conductive particle problem, has improved conductive adhesive film's electrically conductive stability effectively.
Certainly, the first adhesive film layer 2 in this embodiment may also include an adhesive layer containing conductive particles, and the first adhesive film layer 2 includes the adhesive layer containing conductive particles to improve the conductive capability of the first adhesive film layer 2, so as to further ensure the conductivity of the conductive adhesive film; wherein, the shape of the conductive particles can be spherical or flake; when the conductive particles are spherical, the particle size of the conductive particles in the first adhesive film layer 2 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the first adhesive film layer 2 to the adhesive layer in the first adhesive film layer 2 is 2% -80%. Certainly, the first adhesive film layer 2 may also include an adhesive layer containing no conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board, and improving the flexibility of the circuit board.
Similarly, the second adhesive film layer 3 in this embodiment may also include an adhesive layer containing conductive particles, and the second adhesive film layer 3 includes the adhesive layer containing conductive particles to improve the conductive capability of the second adhesive film layer 3, so as to further ensure the conductivity of the conductive adhesive film; wherein, the shape of the conductive particles can be spherical or flake; when the conductive particles are spherical, the particle size of the conductive particles in the second adhesive film layer 3 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the second adhesive film layer 3 to the adhesive layer in the second adhesive film layer 3 is 2% -80%. Certainly, the second adhesive film layer 3 may also include an adhesive layer containing no conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board and improving the flexibility of the circuit board.
Preferably, the materials used for the adhesion layer of the first adhesive film layer 2 and the adhesion layer of the second adhesive film layer 3 are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, modified thermoplastic polyimides, polyurethanes, polyacrylates, and silicones.
Referring to fig. 5, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a side of the first adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a side of the second adhesive film layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is disposed on a surface of the first adhesive film layer 2 away from the conductor layer 1 to protect an outer surface of the first adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is disposed on a surface of the second adhesive film layer 3 away from the conductor layer 1 to protect an outer surface of the second adhesive film layer 3 from impurities such as external dust, and the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
In the embodiment of the present invention, the area of the through hole 11 is preferably 0.1 μm2-1mm2. By making the area of the through-hole 11 preferably 0.1 μm2-1mm2And the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 can be exhausted through the through hole 11 which is large enough at high temperature, so that the problem that the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 are difficult to exhaust at high temperature is avoided, and stripping between the conductive adhesive film and a conductor caused by foaming and layering of the conductive adhesive film is avoided, and conduction between the conductive adhesive film and the conductor is ensured. Further, if the number of the through holes 11 is too large, it is easy to cause discontinuity or even breakage of the conductor layer 1, thereby affecting the flow of the disturbance charge, and therefore, it is preferable that the number of the through holes 11 per square centimeter be 10 to 1000. The number of the through holes 11 in the conductor layer 1 is set to be 10-1000 per square centimeter, so that volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 can be exhausted through enough through holes 11 at high temperature, and the problem that the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 are difficult to exhaust at high temperature is avoidedSo as to discharge, thereby avoiding the conductive adhesive film from peeling off from the conductor due to foaming and delamination of the conductive adhesive film, so as to ensure conduction between the conductive adhesive film and the conductor, and simultaneously, the number of the through holes 11 does not influence the continuous flow of interference charges in the conductor layer 1. Certainly, the area and the number of the through holes 11 are not limited to the above preferred range, and it is only required that volatile matters generated by the first adhesive film layer 2 and the second adhesive film layer 3 at a high temperature can be exhausted through the through holes 11, and the number of the through holes 11 does not affect the continuous flow and the conduction of interference charges in the conductor layer 1, and further does not cause the conductor layer 1 to break, which is not described herein any more.
In the embodiment of the present invention, the through holes 11 may be regularly or irregularly distributed on the conductor layer 1; wherein, the through holes 11 are regularly distributed on the conductor layer 1, which means that the through holes 11 have the same shape and are uniformly distributed on the conductor layer 1; the through holes 11 are irregularly distributed on the conductor layer 1, which means that the through holes 11 are irregularly and randomly distributed on the conductor layer 1. Preferably, the through holes 11 have the same shape, and the through holes 11 are uniformly distributed on the conductor layer 1. In addition, the through hole 11 may be a circular through hole 11, and may also be a through hole 11 of any other shape, the drawings of the present invention only illustrate that the through hole 11 is a circular through hole, but the through hole 11 of any other shape is within the protection scope of the present invention.
Referring to fig. 6, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8 and the conductive film, where the conductive film is disposed on the printed circuit board 8, and the first conductor particles 4 pierce through the first film layer 2 and are in contact with the ground layer 82 of the printed circuit board 8 for conduction; the circuit board further comprises a steel sheet 81, the steel sheet 81 is arranged on the surface, away from the first glue film layer 2, of the second glue film layer 3, and the second conductor particles 5 penetrate through the second glue film layer 3 and are in contact conduction with the steel sheet 81. The conductive film is arranged on the printed circuit board 8, so that electromagnetic wave interference is shielded for the printed circuit board 8, interference charges generated from the outside are accumulated on the conductor layer 1 of the conductive film, the first conductor particles 4 pierce through the first film layer and are in contact conduction with the ground layer 82 of the printed circuit board 8, and the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8; in addition, the steel sheet 81 serves as a reinforcing structure, and the second conductive particles 5 pierce the second adhesive film layer 3 and are in contact conduction with the steel sheet 81, so that the interference charges accumulated on the conductor layer 1 can be conducted out through the steel sheet 81.
Referring to fig. 6, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a first grounding hole 83, and the first conductor particles 4 are connected with the ground layer 82 of the printed circuit board 8 through the first grounding hole 83, so that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8.
Referring to fig. 7, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8, an electromagnetic shielding film 9, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film 9, and the electromagnetic shielding film 9 is disposed on the printed circuit board 8; the electromagnetic shielding film 9 comprises an insulating layer 91 and a metal conducting layer 92, the first conductor particles 4 of the conductive adhesive film penetrate through the first adhesive film layer 2 and the insulating layer 91 and are in contact conduction with the metal conducting layer 92, and the metal conducting layer 92 is in contact conduction with the ground layer 82 of the printed circuit board 8; the circuit board further comprises a steel sheet 81, the steel sheet 81 is arranged on the surface, away from the first glue film layer 2, of the second glue film layer 3, and the second conductor particles 5 penetrate through the second glue film layer 3 and are in contact conduction with the steel sheet 81. The conductive adhesive film is arranged on the electromagnetic shielding film 9, the electromagnetic shielding film 9 is arranged on the printed circuit board 8, so that the conductive adhesive film and the electromagnetic shielding film 9 can shield the printed circuit board 8 from electromagnetic wave interference, interference charges generated from the outside are accumulated on the conductive layer 1 of the conductive adhesive film and the metal conductive layer 92 of the electromagnetic shielding film 9, the first conductive particles 4 pierce through the first adhesive film layer 2 and are in contact conduction with the stratum 82 of the printed circuit board 8, and the interference charges accumulated on the conductive layer 1 and the metal conductive layer 92 are led out through the stratum 82 of the printed circuit board 8; in addition, the steel sheet 81 serves as a reinforcing structure, and the second conductive particles 5 pierce the second adhesive film layer 3 and are in contact conduction with the steel sheet 81, so that the interference charges accumulated on the conductive layer 1 and the metal conductive layer 92 can be conducted out through the steel sheet 81.
Referring to fig. 7, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a second grounding hole 84, and the metal conductive layer 92 is connected with the ground layer 82 of the printed circuit board 8 through the second grounding hole 84, so that the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92 are led out through the ground layer 82 of the printed circuit board 8.
As shown in fig. 6 and 7, when the circuit board is applied to an electronic device, the steel sheet 81 can be in contact conduction with a housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 can be led out through the steel sheet 81, and the interference charges are led out through the housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 of the conductive adhesive film are led into the ground, and the interference sources caused by the accumulation of the interference charges are prevented from affecting the normal operation of the circuit board. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
In order to solve the same technical problem, the embodiment of the utility model provides a still provide a circuit board, including a plurality of printed wiring boards and a plurality of conductive adhesive film, conductive adhesive film locates adjacent two between the printed wiring board to make adjacent two the stratum of printed wiring board switches on each other. Specifically, in the conductive adhesive film arranged between two adjacent printed circuit boards, the first conductor particles 4 pierce through the first adhesive film layer 2 and are in contact conduction with the ground layer of one of the printed circuit boards, and the second conductor particles 5 pierce through the second adhesive film layer 3 and are in contact conduction with the ground layer of the other printed circuit board, so that the ground layers of the two adjacent printed circuit boards are in mutual conduction. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
Referring to fig. 8, in order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing a conductive adhesive film, including the following steps:
s11, forming a conductor layer 1; wherein, a through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is provided;
s12, forming first conductor particles 4 on one side of the conductor layer 1;
s13, forming second conductor particles 5 on the other side of the conductor layer 1;
s14, forming a first adhesive film layer 2 on the side of the conductor layer 1 on which the first conductor particles 4 are formed; one surface of the conductor layer 1, which is close to the first adhesive film layer 2, is a flat surface, and the first conductor particles 4 extend into the first adhesive film layer 2;
s15, forming a second adhesive film layer 3 on the side of the conductor layer 1 on which the second conductor particles 5 are formed; wherein the second conductor particles 5 extend into the second glue film layer 3.
In the embodiment of the present invention, the area of the through hole 11 is preferably 0.1 μm2-1mm2. By making the area of the through-hole 11 preferably 0.1 μm2-1mm2And the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 can be exhausted through the through hole 11 which is large enough at high temperature, so that the problem that the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 are difficult to exhaust at high temperature is avoided, and stripping between the conductive adhesive film and a conductor caused by foaming and layering of the conductive adhesive film is avoided, and conduction between the conductive adhesive film and the conductor is ensured. Further, if the number of the through holes 11 is too large, it is easy to cause discontinuity or even breakage of the conductor layer 1, thereby affecting the flow of the disturbance charge, and therefore, it is preferable that the number of the through holes 11 per square centimeter be 10 to 1000. The number of the through holes 11 in the conductor layer 1 is set to be 10-1000 per square centimeter, so that the volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 can be ensured to pass through enough volatile matters at high temperatureThe through holes 11 are used for exhausting air so as to avoid the situation that volatile matters in the first adhesive film layer 2 and the second adhesive film layer 3 are difficult to exhaust at high temperature, so that the situation that the conductive adhesive film is peeled off from the conductor due to foaming and layering of the conductive adhesive film is avoided, the conduction between the conductive adhesive film and the conductor is ensured, and meanwhile, the number of the through holes 11 cannot influence interference charges to continuously flow in the conductor layer 1. Certainly, the area and the number of the through holes 11 are not limited to the above preferred range, and it is only required that volatile matters generated by the first adhesive film layer 2 and the second adhesive film layer 3 at a high temperature can be exhausted through the through holes 11, and the number of the through holes 11 does not affect the continuous flow and the conduction of interference charges in the conductor layer 1, and further does not cause the conductor layer 1 to break, which is not described herein any more.
In the embodiment of the present invention, the through holes 11 may be regularly or irregularly distributed on the conductor layer 1; wherein, the through holes 11 are regularly distributed on the conductor layer 1, which means that the through holes 11 have the same shape and are uniformly distributed on the conductor layer 1; the through holes 11 are irregularly distributed on the conductor layer 1, which means that the through holes 11 are irregularly and randomly distributed on the conductor layer 1. Preferably, the through holes 11 have the same shape, and the through holes 11 are uniformly distributed on the conductor layer 1. In addition, the through hole 11 may be a circular through hole 11, and may also be a through hole 11 of any other shape, the drawings of the present invention only illustrate that the through hole 11 is a circular through hole, but the through hole 11 of any other shape is within the protection scope of the present invention.
In the embodiment of the present invention, step S11 specifically includes: forming a conductor layer 1 on the release film or the peelable metal carrier tape; wherein the conductor layer 1 may be formed on the release film or the peelable metal carrier tape by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In the embodiment of the present invention, the preparation method of the peelable metal carrier tape is as follows:
s21, carrying out surface treatment on the substrate of the metal foil to ensure that the surface tension of the substrate is 40-90 dynes;
s22, forming a vacuum plating layer on one side of the substrate;
and S23, performing brightening treatment on the surface of the vacuum plating layer to form a surface metal bright layer so as to obtain the strippable metal carrier tape.
In an embodiment of the present invention, step S12 specifically includes:
the first conductor particles 4 are formed on one side of the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In an embodiment of the present invention, step S13 specifically includes:
the second conductor particles 5 are formed on the other side of the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In an embodiment of the present invention, step S14 specifically includes:
s31, coating a first adhesive film layer 2 on the release film;
s32, transferring the first adhesive film layer 2 onto the side of the conductor layer 1 where the first conductor particles 4 are formed; or the like, or, alternatively,
s41, coating the first adhesive film layer 2 on the side of the conductor layer 1 where the first conductor particles 4 are formed.
As shown in fig. 1 and fig. 4, the one surface of the conductor layer 1 close to the second adhesive film layer 3 is a flat surface or a non-flat surface, when the one surface of the conductor layer 1 close to the second adhesive film layer 3 is a non-flat surface, the conductor layer close to the non-flat surface of the second adhesive film layer 3 includes a plurality of protrusions 12 and a plurality of recesses 13, the plurality of protrusions 12 and the plurality of recesses 13 are arranged at intervals, the plurality of protrusions 12 extend into the second adhesive film layer 3, and the second conductor particles 5 are distributed on the protrusions 12 in a concentrated manner. When the conductive adhesive film is pressed for use, the plurality of convex parts 12 can pierce the second adhesive film layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during pressing, the glue substances forming the second glue film layer 3 are extruded to the concave part 13, so that the glue containing amount of the conductive glue film is increased, the phenomenon that the conductive glue film is stripped from a conductor is not easy to occur, the problem that the conductive glue film is stripped from the conductor due to insufficient glue containing amount of the existing conductive glue film is solved, and the connection reliability of the conductive glue film and the conductor is effectively ensured; in addition, when the conductive adhesive film is pressed and used, the convex part 12 on the conductor layer 1 and the second conductor particles 5 can pierce the second adhesive film layer 3 together and are in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, the use of conductive particles is reduced, the conduction resistance is greatly reduced, and the cost is reduced.
In an embodiment of the present invention, step S15 specifically includes:
s51, coating a second adhesive film layer 3 on the release film;
s52, transferring the second adhesive film layer 3 onto the side of the conductor layer 1 where the second conductor particles 5 are formed; or the like, or, alternatively,
s61, coating a second adhesive film layer 3 on the side of the conductor layer 1 where the second conductor particles 5 are formed.
Referring to fig. 5, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a side of the first adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a side of the second adhesive film layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is disposed on a surface of the first adhesive film layer 2 away from the conductor layer 1 to protect an outer surface of the first adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is disposed on a surface of the second adhesive film layer 3 away from the conductor layer 1 to protect an outer surface of the second adhesive film layer 3 from impurities such as external dust, and the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
To sum up, the embodiment of the present invention provides a conductive adhesive film, a circuit board and a method for manufacturing the conductive adhesive film, wherein the conductive adhesive film is provided with a conductive layer 1, first conductive particles 4 and second conductive particles 5, so that when the conductive adhesive film is used in a pressing manner, the first conductive particles 4 pierce through the first adhesive film layer 2 and are in contact conduction with a conductor, and the second conductive particles 5 pierce through the second adhesive film layer 3 and are in contact conduction with another conductor, thereby realizing that the conductive adhesive film is in contact conduction with the conductor, so as to avoid the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art, thereby effectively improving the conductive stability of the conductive adhesive film, and simultaneously avoiding the low overlapping rate of the conductive particles caused by the adoption of an independent conductive adhesive layer in the prior art, thereby reducing the resistance of the conductive adhesive film, and further facilitating the improvement of the conductivity of the, the conduction reliability between the conductive adhesive film and the conductor is further improved; furthermore, in an embodiment of the present invention, since the first adhesive film layer 2 and the second adhesive film layer 3 can form a conductive path without providing conductive particles, the problem that the conductive path formed by the conductive particles in the conventional conductive adhesive film through the tunnel effect is prone to fail is solved, the conductive stability of the conductive adhesive film is effectively improved, and the production cost of the conductive adhesive film is greatly reduced since a large number of conductive particles are not required; in addition, the through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is arranged, so that the first adhesive film layer 2 and the second adhesive film layer 3 can be in close contact through the through hole 11 on the conductor layer 1, the peeling strength between the first adhesive film layer 2 and the second adhesive film layer 3 is increased, and the first adhesive film layer 2 and the second adhesive film layer 3 can be firmly connected together; in addition, be equipped with the through-hole 11 that runs through its upper and lower surface on conductor layer 1, be favorable to when the high temperature volatile substance in first glued membrane layer 2 and the second glued membrane layer 3 to exhaust through-hole 11 of conductor layer 1 to the volatile substance of avoiding first glued membrane layer 2 and second glued membrane layer 3 is difficult to discharge when the high temperature, thereby has avoided the conductive adhesive membrane layer that bubbles to cause conductive adhesive membrane and conductor to take place to peel off, and then has improved the reliability that conductive adhesive membrane and conductor are connected.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (12)
1. A conductive adhesive film is characterized by comprising a first adhesive film layer, a conductor layer and a second adhesive film layer, wherein the conductor layer is arranged between the first adhesive film layer and the second adhesive film layer, one surface, close to the first adhesive film layer, of the conductor layer is a flat surface, first conductor particles are arranged on the flat surface, close to the first adhesive film layer, of the conductor layer, and the first conductor particles stretch into the first adhesive film layer; second conductor particles are arranged on one surface, close to the second adhesive film layer, of the conductor layer, and the second conductor particles extend into the second adhesive film layer; the conductor layer is provided with a through hole penetrating through the upper surface and the lower surface of the conductor layer.
2. The conductive adhesive film of claim 1, wherein a surface of the conductive layer adjacent to the second adhesive film layer is a flat surface.
3. The conductive adhesive film according to claim 1, wherein the first conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape, and/or the second conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape.
4. The conductive adhesive film according to claim 1, wherein the number of the first conductive particles is plural, and the plural first conductive particles are regularly or irregularly distributed on one surface of the conductive layer close to the first adhesive film layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the first adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the multiple second conductor particles are regularly or irregularly distributed on one surface, close to the second adhesive film layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the second adhesive film layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
5. The conductive adhesive film according to claim 1, wherein the first conductive particles and the second conductive particles each have a height of 0.1 μm to 30 μm.
6. The electroconductive adhesive film according to any one of claims 1 to 5, wherein the first adhesive film layer comprises an adhesive layer containing electroconductive particles; or, the first adhesive film layer comprises an adhesion layer without conductive particles.
7. The electroconductive adhesive film according to any one of claims 1 to 5, wherein the second adhesive film layer comprises an adhesive layer containing electroconductive particles; or the second adhesive film layer comprises an adhesion layer without conductive particles.
8. The conductive adhesive film according to any one of claims 1 to 5, wherein the conductive layer has a thickness of 0.01 μm to 45 μm, the first adhesive film layer has a thickness of 0.1 μm to 45 μm, and the second adhesive film layer has a thickness of 0.1 μm to 45 μm.
9. The adhesive conductive film of any one of claims 1-5, further comprising a first peelable protective film layer disposed on a side of the first adhesive film layer remote from the conductor layer and a second peelable protective film layer disposed on a side of the second adhesive film layer remote from the conductor layer.
10. The electroconductive adhesive film according to any one of claims 1 to 5, wherein the area of said through-hole is 0.1 μm2-1mm2(ii) a And/or the number of the through holes in the conductor layer per square centimeter is 10-1000.
11. A circuit board comprising a printed circuit board and the conductive film according to any one of claims 1 to 10, wherein the conductive film is disposed on the printed circuit board, and the first conductive particles penetrate through the first film layer and are in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the first glue film layer, of the second glue film layer, and the second conductor particles penetrate through the second glue film layer and are in contact conduction with the steel sheet.
12. A circuit board comprising a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film according to any one of claims 1 to 10, wherein the conductive adhesive film is provided on the electromagnetic shielding film, and the electromagnetic shielding film is provided on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, first conductor particles of the conductive adhesive film penetrate through the first adhesive film layer and the insulating layer and are in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the first glue film layer, of the second glue film layer, and the second conductor particles penetrate through the second glue film layer and are in contact conduction with the steel sheet.
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| CN201821963163.XU CN209947455U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and circuit board |
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| CN201821963163.XU CN209947455U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110783024A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110783024A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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