CN209947454U - Conductive adhesive film and circuit board - Google Patents
Conductive adhesive film and circuit board Download PDFInfo
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- CN209947454U CN209947454U CN201821963161.0U CN201821963161U CN209947454U CN 209947454 U CN209947454 U CN 209947454U CN 201821963161 U CN201821963161 U CN 201821963161U CN 209947454 U CN209947454 U CN 209947454U
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Abstract
The utility model relates to the field of electronic technology, a conductive adhesive film and circuit board is disclosed, wherein, the conductive adhesive film includes the glued membrane layer, the conductor layer and conductive adhesive layer, the conductor layer is located between glued membrane layer and the conductive adhesive layer, the one side that the conductor layer is close to the glued membrane layer is the smooth surface, the conductor layer is equipped with first conductor granule on the smooth surface that is close to the glued membrane layer, first conductor granule stretches into the glued membrane layer, the conductive adhesive film is when pressfitting is used, impale the glued membrane layer and contact with the stratum of printed wiring board and switch on through first conductor granule, the stratum contact of conductive adhesive film and printed wiring board is guaranteed to switch on, the ground connection stability of conductive adhesive film is effectively; in addition, through being equipped with the through-hole that runs through its upper and lower surface on the conductor layer to make glued membrane layer and conductive adhesive layer pass through-hole in close contact with, thereby increased the peel strength between glued membrane layer and the conductive adhesive layer.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a conductive adhesive film and circuit board.
Background
The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the conventional conductive adhesive film generally includes a conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein; in practical application, after the conductive adhesive film is subjected to hot pressing, the adhesive layer of the conductive adhesive film is melted and flows into the grounding hole of the printed circuit board, so that conductive particles in the conductive adhesive layer are in contact conduction with the ground layer of the printed circuit board through the grounding hole, and static charges accumulated on the printed circuit board are led out. However, in the process of implementing the invention, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect of the conductive adhesive film and the ground layer of the circuit board is not ideal, and the grounding stability of the conductive adhesive film is poor.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a conductive adhesive film and circuit board, it can improve conductive adhesive film's ground connection stability effectively.
In order to solve the technical problem, an embodiment of the present invention provides a conductive adhesive film, including a film layer, a conductor layer and a conductive adhesive layer, wherein the conductor layer is disposed between the film layer and the conductive adhesive layer, one side of the conductor layer close to the film layer is a flat surface, first conductor particles are disposed on the flat surface of the conductor layer close to the film layer, and the first conductor particles extend into the film layer; the conductor layer is provided with a through hole penetrating through the upper surface and the lower surface of the conductor layer.
Preferably, one surface of the conductor layer, which is close to the conductive adhesive layer, is a flat surface;
or, the conductor layer is close to conductive adhesive layer's one side is uneven surface, the conductor layer is close to conductive adhesive layer's uneven surface includes a plurality of convex parts and a plurality of depressed part, and is a plurality of convex part and a plurality of the depressed part interval sets up, and is a plurality of the convex part stretches into conductive adhesive layer.
Preferably, the first conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape, and/or the second conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape.
Preferably, the number of the first conductor particles is multiple, and the multiple first conductor particles are regularly or irregularly distributed on one surface, close to the adhesive film layer, of the conductor layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the second conductor particles are regularly or irregularly distributed on one surface, close to the conductive adhesive layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the conductive adhesive layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
Preferably, second conductor particles are arranged on one surface, close to the conductive adhesive layer, of the conductor layer, and the second conductor particles extend into the conductive adhesive layer.
Preferably, the height of each of the first conductive particles and the second conductive particles is 0.1 μm to 30 μm.
Preferably, the adhesive layer comprises an adhesive layer containing conductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the thickness of the conductor layer is 0.01-45 μm, the thickness of the adhesive layer is 0.1-45 μm, and the thickness of the conductive adhesive layer is 0.1-60 μm.
Preferably, the conductive adhesive film further comprises a first peelable protective film layer and a second peelable protective film layer, the first peelable protective film layer is arranged on the surface, away from the conductor layer, of the adhesive film layer, and the second peelable protective film layer is arranged on the surface, away from the conductor layer, of the conductive adhesive layer.
Preferably, the area of the through hole is 0.1 μm2-1mm2(ii) a And/or the number of the through holes in the conductor layer per square centimeter is 10-1000.
The embodiment of the utility model provides a conductive adhesive film, conductive adhesive film is when pressfitting is used, impales the rete and contacts with the stratum contact of printed circuit board through first conductor granule to avoid among the prior art conductive adhesive film's conductive particle's pile state to change and lead to conductive adhesive film's ground connection stability relatively poor, thereby has ensured conductive adhesive film and printed circuit board's stratum contact and has conducted, has improved conductive adhesive film's ground connection stability effectively; in addition, the conductive layer is arranged, so that most conductive particles in the conductive adhesive layer can be in contact with the conductive layer, the overlapping rate of the conductive particles is increased, the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, and the use of the conductive particles is reduced, so that the production cost of the conductive adhesive film is reduced; in addition, the through holes penetrating through the upper surface and the lower surface of the conductor layer are arranged on the conductor layer, so that the adhesive film layer and the conductive adhesive layer can be in close contact through the through holes on the conductor layer, the peeling strength between the adhesive film layer and the conductive adhesive layer is increased, and the adhesive film layer and the conductive adhesive layer can be firmly connected together; in addition, be equipped with the through-hole that runs through its upper and lower surface on the conductor layer, be favorable to when the high temperature volatile substance in glued membrane layer and the conductive adhesive layer to exhaust through-hole through the conductor layer to the volatile substance of glued membrane layer and conductive adhesive layer is difficult to discharge when avoiding the high temperature, thereby has avoided conductive adhesive film foaming layering to cause conductive adhesive film and conductor to take place to peel off, and then has improved the reliability that conductive adhesive film and conductor are connected.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board and the conductive adhesive film, where the conductive adhesive film is disposed on the printed circuit board, and the first conductor particles pierce through the adhesive film layer and are in contact with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer. The conductive film is arranged on the printed circuit board, so that electromagnetic wave interference is shielded for the printed circuit board, interference charges generated from the outside are accumulated on a conductor layer of the conductive film, and the first conductor particles penetrate through the film layer and are in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductor layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and interference charges accumulated on the conductor layer can be led out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film, and the electromagnetic shielding film is disposed on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, first conductor particles of the conductive adhesive film penetrate through the adhesive film layer and the insulating layer and are in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer. The conductive adhesive film is arranged on the electromagnetic shielding film which is arranged on the printed circuit board, so that the conductive adhesive film and the electromagnetic shielding film can shield electromagnetic wave interference for the printed circuit board, interference charges generated from the outside are accumulated on the conductive layer of the conductive adhesive film and the metal conductive layer of the electromagnetic shielding film, and the first conductor particles penetrate through the adhesive film layer and are in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductive layer and the metal conductive layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and interference charges accumulated on the conductor layer and the metal conducting layer can be led out through the steel sheet.
Drawings
Fig. 1 is a schematic structural diagram of a conductive adhesive film in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another angle of the conductive adhesive film in the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a conductive adhesive film containing first conductive particles and second conductive particles in an embodiment of the present invention;
fig. 4 is a schematic structural view of one-step molding of the first conductor particles, the second conductor particles, and the conductor layer in the embodiment of the present invention;
fig. 5 is a schematic structural diagram of a conductive adhesive film including a convex portion and a concave portion in an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another embodiment of a conductive adhesive film including a convex portion and a concave portion in an embodiment of the present invention;
fig. 7 is a schematic structural view of an adhesive conductive film comprising a first peelable protective film layer and a second peelable protective film layer according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a circuit board in an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another embodiment of a circuit board in an embodiment of the present invention;
fig. 10 is a schematic flow chart of a method for manufacturing a conductive adhesive film according to an embodiment of the present invention;
wherein, 1, a conductor layer; 11. a through hole; 12. a convex portion; 13. a recessed portion; 2. a glue film layer; 3. a conductive adhesive layer; 4. a first conductive particle; 5. a second conductive particle; 6. a first peelable protective film layer; 7. a second peelable protective film layer; 8. a printed wiring board; 81. a steel sheet; 82. an earth formation; 83. a first ground via; 84. a second ground via; 9. an electromagnetic shielding film; 91. an insulating layer; 92. a metal conductive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
With reference to fig. 1 to 3, a conductive adhesive film according to a preferred embodiment of the present invention includes an adhesive film layer 2, a conductor layer 1 and a conductive adhesive layer 3, wherein the conductor layer 1 is disposed between the adhesive film layer 2 and the conductive adhesive layer 3, one side of the conductor layer 1 close to the adhesive film layer 2 is a flat surface, first conductor particles 4 are disposed on the flat surface of the conductor layer 1 close to the adhesive film layer 2, and the first conductor particles 4 extend into the adhesive film layer 2; the conductor layer 1 is provided with a through hole 11 penetrating through the upper and lower surfaces thereof.
In the embodiment of the utility model, when the conductive adhesive film is used in a pressing mode, the first conductor particles 4 pierce the adhesive film layer 2 and are in contact conduction with the ground layer of the printed circuit board, so that the poor grounding stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art is avoided, the conductive adhesive film is ensured to be in contact conduction with the ground layer of the printed circuit board, and the grounding stability of the conductive adhesive film is effectively improved; in addition, by arranging the conductor layer 1, most of the conductive particles in the conductive adhesive layer 3 can be in contact with the conductor layer 1, so that the overlapping rate of the conductive particles is increased, the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, the use of the conductive particles is reduced, and the production cost of the conductive adhesive film is reduced; in addition, the through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is arranged, so that the adhesive film layer 2 and the conductive adhesive layer 3 can be in close contact through the through hole 11 on the conductor layer 1, the peeling strength between the adhesive film layer 2 and the conductive adhesive layer 3 is increased, and the adhesive film layer 2 and the conductive adhesive layer 3 can be firmly connected together; in addition, be equipped with the through-hole 11 that runs through its upper and lower surface on conductor layer 1, be favorable to when the high temperature volatile substance in glue film layer 2 and the conductive adhesive layer 3 to exhaust through-hole 11 of conductor layer 1 to the volatile substance of avoiding glue film layer 2 and conductive adhesive layer 3 is difficult to discharge when the high temperature, thereby has avoided conductive adhesive film foaming layering to cause conductive adhesive film and conductor to take place to peel off, and then has improved the reliability that conductive adhesive film and conductor are connected.
In the implementation shown in fig. 3 and 4, the conductive layer 1 may be formed first, and then the first conductive particles 4 may be formed on the conductive layer 1 by other processes. Of course, the conductor layer 1 and the first conductor particles 4 may also be a unitary structure formed by a one-shot molding process.
Combine fig. 1 and fig. 5 to show, conductor layer 1 is close to conductive adhesive layer 3's one side is for leveling the surface or not leveling the surface, works as conductor layer 1 is close to conductive adhesive layer 3's one side is when uneven the surface, the conductor layer is close to conductive adhesive layer 3's uneven surface includes a plurality of convex parts 12 and a plurality of depressed part 13, and is a plurality of convex part 12 and a plurality of depressed part 13 interval sets up, and is a plurality of convex part 12 stretches into conductive adhesive layer 3. When the conductive adhesive film is pressed for use, the plurality of convex parts 12 can pierce the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during pressing, the glue substances forming the conductive glue layer 3 are extruded to the concave part 13, so that the glue containing amount of the conductive glue film is increased, the phenomenon that the conductive glue film is peeled from the conductor is not easy to occur, the problem that the conductive glue film is peeled from the conductor due to insufficient glue containing amount of the existing conductive glue film is solved, and the connection reliability of the conductive glue film and the conductor is effectively ensured; in addition, when the conductive adhesive film is pressed and used, the convex part 12 on the conductor layer 1 can pierce the conductive adhesive layer 3 and is in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, the use of conductive particles is reduced, the conduction resistance is greatly reduced, and the cost is reduced.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 near the conductive adhesive layer 3 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the conductive adhesive layer 3 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the uneven surface of the conductor layer 1 close to the conductive adhesive layer 3 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude and/or the interval of the fluctuation on the uneven surface are different.
In the embodiment of the present invention, the plurality of protrusions 12 may have a certain distance from the outer surface of the conductive adhesive layer 3, and may also contact or extend from the outer surface of the conductive adhesive layer 3.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between the convex portion 12 and the adjacent concave portion 13 is the same in each embodiment. By setting the distance between each convex part 12 and the adjacent concave part 13 to be the same, the convex parts 12 can uniformly pierce through the conductive adhesive layer 3, thereby further ensuring that the conductor layer 1 is in contact with the conductor and improving the conduction efficiency. Preferably, each of the projections 12 is identical in shape; each of the recesses 13 has the same shape; wherein each convex part 12 is in an axisymmetric structure; each of the concave portions 13 is of an axisymmetric structure; of course, each of the protrusions 12 may also have a non-axisymmetric structure, and each of the recesses 13 may also have a non-axisymmetric structure. Because the distance between each convex part 12 and the adjacent concave part 13 is the same, the shape of each convex part 12 is the same, and the shape of each concave part 13 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
Preferably, the undulation degree of the conductor layer 1 close to the uneven surface of the conductive adhesive layer 3 (i.e. the distance between the highest point and the lowest point of the side of the conductor layer 1 close to the conductive adhesive layer 3) is 0.1 μm to 30 μm, and the undulation degree of the side of the conductor layer 1 close to the conductive adhesive layer 3 is set within the above range, so that the piercing function of the conductor layer 1 can be enhanced, thereby ensuring that the interference charges accumulated in the conductor layer 1 are smoothly led out, and further avoiding the accumulation of the interference charges to form an interference source.
In order to further ensure that the conductor layer 1 is in contact with the conductor, as shown in fig. 3 and 6, the surface of the conductor layer 1 close to the conductive adhesive layer 3 in this embodiment is provided with second conductor particles 5. The conductor layer 1 is further ensured to be in contact with the conductor by providing the second conductor particles 5 on the side of the conductor layer 1 close to the conductive adhesive layer 3 so as to pierce through the conductive adhesive layer 3. Preferably, when one surface of the conductor layer 1 close to the conductive adhesive layer 3 is a non-flat surface, the second conductor particles 5 are distributed on the convex portions 12 in a concentrated manner, so that the conductor layer 1 can pierce the conductive adhesive layer 3 more easily during the pressing process; in addition, when the conductive adhesive film is pressed and used, the first conductor particles 4 on the conductor layer 1 pierce the adhesive film layer 2 and are in contact conduction with one conductor, and the second conductor particles 5 pierce the conductive adhesive layer 3 and are in contact conduction with the other conductor, so that the conductive adhesive film is in contact conduction with the conductor, the use of conductive particles is greatly reduced, the conduction resistance of the conductive adhesive film is reduced, and the cost is greatly reduced.
In the implementation shown in fig. 3 and 4, the conductive layer 1 may be formed first, and then the second conductive particles 5 may be formed on the conductive layer 1 by other processes. Of course, the conductor layer 1 and the second conductor particles 5 may also be an integral structure formed by a one-time molding process.
As shown in fig. 6, the height h1 of the first conductive particles 4 is preferably 0.1 μm to 30 μm, the height h2 of the second conductive particles 5 is preferably 0.1 μm to 30 μm, the thickness of the adhesive layer 2 is preferably 0.1 μm to 45 μm, and the thickness of the conductive adhesive layer 3 is preferably 0.1 μm to 60 μm. By arranging the first conductor particles 4 and the second conductor particles 5 with the height of 0.1-30 μm, the thickness of the adhesive film layer 2 with the thickness of 0.1-45 μm and the thickness of the conductive adhesive layer 3 with the thickness of 0.1-60 μm, the conductive adhesive film is ensured to be capable of penetrating the adhesive film layer 2 by the first conductor particles 4 and penetrating the conductive adhesive layer 3 by the second conductor particles 5 when the conductive adhesive film is pressed for use, so that the conductive adhesive film is ensured to be capable of being in contact conduction with a conductor. Further, the thickness of the conductor layer 1 is preferably 0.01 μm to 45 μm to ensure that the conductor layer 1 is not easily broken and has good flexibility. When the conductor layer 1 and the surface close to the conductive adhesive layer 3 are uneven surfaces, the second conductor particles 5 are distributed in the concave portions 13 and the convex portions 12, and the sum of the height H of any convex portion 12 and the height H2 of the second conductor particles 5 on the convex portion 12 is also 1 to 30 μm. Of course, the height H2 of the second conductive particles 5 on the convex portion 12 may be 1 to 30 μm, and then the sum of the height H of the convex portion 12 and the height H2 of the second conductive particles 5 on the convex portion is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film.
The first conductor particles 4 may have a certain distance from the outer surface of the adhesive film layer 2, and may also contact with the outer surface of the adhesive film layer 2 or extend out of the outer surface of the adhesive film layer 2; the second conductive particles 5 may be spaced apart from the outer surface of the conductive adhesive layer 3, and may also be in contact with the outer surface of the conductive adhesive layer 3 or extend beyond the outer surface of the conductive adhesive layer 3. In addition, the outer surfaces of the adhesive layer 2 and the conductive adhesive layer 3 may be flat surfaces without undulation, or may be flat surfaces with gentle undulation.
In the embodiment of the present invention, the number of the first conductor particles 4 is plural, and the plural first conductor particles 4 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the adhesive film layer 2; a plurality of the first conductor particles 4 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the adhesive film layer 2; the shapes of the plurality of first conductor particles 4 are the same or different; the plurality of first conductor particles 4 may be the same or different in size; and/or the number of the second conductor particles 5 is multiple, and the multiple second conductor particles 5 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the conductive adhesive layer 3; a plurality of the second conductor particles 5 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the conductive adhesive layer 3; the shapes of the plurality of second conductor particles 5 are the same or different; the second conductor particles 5 may be the same or different in size. The plurality of first conductor particles 4 are regularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are periodically distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the second conductor particles 5 are regularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are periodically distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3; the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3.
It should be noted that the shapes of the first conductive particles 4 and the second conductive particles 5 in fig. 1 and fig. 3 to fig. 9 are merely exemplary, and due to differences in process means and parameters, the first conductive particles 4 and the second conductive particles 5 may also be in other shapes such as clusters, ice-hanging shapes, stalactite shapes, and dendrites. In addition, the first conductive particles 4 and the second conductive particles 5 in the embodiments of the present invention are not limited by the shapes shown in the drawings, and any first conductive particles 4 and second conductive particles 5 having piercing and conductive functions are within the scope of the present invention.
The conductor layer 1 of the present embodiment may have a single-layer structure or a multi-layer structure; when the conductor layer 1 is a multilayer, each layer of the conductor layer 1 near the glue film layer 2 can be provided with first conductor particles 4 on one side, and each layer of the conductor layer 1 near the conductive glue film layer 3 can be provided with second conductor particles 5 or not provided with second conductor particles 5 on one side. The adhesive layer 2 and the conductive adhesive layer 3 can be of a single-layer structure or a multi-layer structure; the conductor layer 1, the adhesive film layer 2, and the conductive adhesive layer 3 may be provided in plurality. Preferably, when the conductor layer 1, the glue film layer 2 and the conductive glue layer 3 are respectively a plurality of, the glue film layer 2, the conductor layer 1 and the conductive glue layer 3 are sequentially arranged at intervals, for example, when the conductor layer 1, the glue film layer 2 and the conductive glue layer 3 are respectively 2, the arrangement sequence may be: one of the adhesive film layers 2, one of the conductor layers 1, one of the conductive adhesive layers 3, the other of the adhesive film layers 2, the other of the conductor layers 1, and the other of the conductive adhesive layers 3, and so on, which will not be described herein again; or, only 1 glue film layer may be disposed between 2 conductor layers 1, for example, when the number of the conductor layers 1 and the number of the conductive glue layers 3 are 2 respectively, and the number of the glue film layers 2 is 1, the arrangement sequence may be: one adhesive film layer 2, one conductor layer 1, one conductive adhesive layer 3, another conductor layer 1, and another conductive adhesive layer 3, and so on, which will not be described herein. In addition, according to the actual production and application requirements, the conductor layer 1 of the present embodiment may be configured as a foamed shape, and the like, which is not described herein further.
In the embodiment of the present invention, in order to ensure that the conductor layer 1 has good conductivity, the conductor layer 1 includes one or more of a metal conductor layer, a carbon nanotube conductor layer, a ferrite conductor layer, and a graphene conductor layer. Wherein the metal conductor layer comprises a single metal conductor layer and/or an alloy conductor layer; the single metal conductor layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy conductor layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the embodiment of the present invention, the first conductor particles 4 include one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles 5 include one or more of metal particles, carbon nanotube particles, and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The first conductive particles 4 and the second conductive particles 5 may be made of the same material as the conductive layer 1, or may be different.
In the embodiment of the present invention, in order to further ensure the conductivity of the conductive adhesive film, the adhesive layer 2 in this embodiment includes an adhesion layer containing conductive particles, and the adhesive layer 2 includes an adhesion layer containing conductive particles to improve the conductivity of the adhesive layer 2, thereby further ensuring the conductivity of the conductive adhesive film; wherein, the shape of the conductive particles can be spherical or flake; when the conductive particles are spherical, the particle size of the conductive particles in the adhesive film layer 2 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the adhesive film layer 2 to the adhesive layer in the adhesive film layer 2 is 2% -80%. Certainly, the adhesive layer 2 may also include an adhesive layer that does not include conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board, and improving the flexibility of the circuit board.
In the embodiment of the present invention, it should be noted that the conductive adhesive layer 3 includes an adhesion layer containing conductive particles, wherein the conductive particles may be spherical or flaky; when the conductive particles are spherical, the particle size of the conductive particles in the conductive adhesive layer 3 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the conductive adhesive layer 3 to the adhesive layer in the conductive adhesive layer 3 is 2-80%.
Preferably, the materials used for the adhesion layer in the adhesive layer 2 and the adhesion layer in the conductive adhesive layer 3 are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, modified thermoplastic polyimides, polyurethanes, polyacrylates, and silicones.
Referring to fig. 7, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a surface of the adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a surface of the conductive adhesive layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is arranged on the side of the adhesive film layer 2 away from the conductor layer 1 to protect the outer surface of the adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is arranged on the side of the conductive adhesive layer 3 away from the conductor layer 1 to protect the outer surface of the conductive adhesive layer 3 from impurities such as external dust, wherein the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
In the embodiment of the present invention, the area of the through hole 11 is preferably 0.1 μm2-1mm2. By making the area of the through-hole 11 preferably 0.1 μm2-1mm2And the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 can be exhausted through the through hole 11 with a large enough value at high temperature, so that the situation that the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 are difficult to exhaust at high temperature is avoided, and the situation that the conductive adhesive film is peeled off from a conductor due to foaming and layering of the conductive adhesive film is avoided, and the conduction between the conductive adhesive film and the conductor is ensured.Further, if the number of the through holes 11 is too large, it is easy to cause discontinuity or even breakage of the conductor layer 1, thereby affecting the flow of the disturbance charge, and therefore, it is preferable that the number of the through holes 11 per square centimeter be 10 to 1000. The number of the through holes 11 in the conductor layer 1 per square centimeter is set to be 10-1000, so that volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 can be exhausted through enough through holes 11 at high temperature, the problem that the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 are difficult to exhaust at high temperature is avoided, peeling between the conductive adhesive film and the conductor caused by foaming and layering of the conductive adhesive film is avoided, conduction between the conductive adhesive film and the conductor is ensured, and meanwhile, the number of the through holes 11 cannot influence continuous flow of interference charges in the conductor layer 1. Of course, the area and the number of the through holes 11 are not limited to the above preferred range, and it is only necessary that the volatile matters generated by the adhesive layer 2 and the conductive adhesive layer 3 at a high temperature can be exhausted through the through holes 11, and the number of the through holes 11 does not affect the continuous flow and the conduction of the interference charges in the conductor layer 1, and further, the conductor layer 1 is not broken, which is not described herein any more.
In the embodiment of the present invention, the through holes 11 may be regularly or irregularly distributed on the conductor layer 1; wherein, the through holes 11 are regularly distributed on the conductor layer 1, which means that the through holes 11 have the same shape and are uniformly distributed on the conductor layer 1; the through holes 11 are irregularly distributed on the conductor layer 1, which means that the through holes 11 are irregularly and randomly distributed on the conductor layer 1. Preferably, the through holes 11 have the same shape, and the through holes 11 are uniformly distributed on the conductor layer 1. In addition, the through hole 11 may be a circular through hole 11, and may also be a through hole 11 of any other shape, the drawings of the present invention only illustrate that the through hole 11 is a circular through hole, but the through hole 11 of any other shape is within the protection scope of the present invention.
Referring to fig. 8, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8 and the conductive film, where the conductive film is disposed on the printed circuit board 8, and the first conductor particles 4 pierce through the film layer 2 and are in contact with the ground layer 82 of the printed circuit board 8 for conduction; the circuit board further comprises a steel sheet 81, wherein the steel sheet 81 is arranged on one surface of the conductive adhesive layer 3, which is far away from the adhesive film layer 2. The conductive film is arranged on the printed circuit board 8, so that electromagnetic wave interference is shielded for the printed circuit board 8, interference charges generated from the outside are accumulated on the conductor layer 1 of the conductive film, the first conductor particles 4 penetrate through the film layer 2 and are in contact conduction with the ground layer 82 of the printed circuit board 8, and the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8; in addition, the steel sheet 81 is used as a reinforcing structure, and the steel sheet 81 can also lead out interference charges accumulated on the conductor layer 1.
Referring to fig. 8, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a first grounding hole 83, and the first conductor particles 4 are connected with the ground layer 82 of the printed circuit board 8 through the first grounding hole 83, so that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8.
Referring to fig. 9, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8, an electromagnetic shielding film 9, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film 9, and the electromagnetic shielding film 9 is disposed on the printed circuit board 8; the electromagnetic shielding film 9 comprises an insulating layer 91 and a metal conducting layer 92, the first conductor particles 4 of the conductive adhesive film penetrate through the adhesive film layer 2 and the insulating layer 91 and are in contact conduction with the metal conducting layer 92, and the metal conducting layer 92 is in contact conduction with the ground layer 82 of the printed circuit board 8; the circuit board further comprises a steel sheet 81, wherein the steel sheet 81 is arranged on one surface of the conductive adhesive layer 3, which is far away from the adhesive film layer 2. The conductive adhesive film is arranged on the electromagnetic shielding film 9, the electromagnetic shielding film 9 is arranged on the printed circuit board 8, so that the conductive adhesive film and the electromagnetic shielding film 9 can shield the printed circuit board 8 from electromagnetic wave interference, interference charges generated from the outside are accumulated on the conductive layer 1 of the conductive adhesive film and the metal conductive layer 92 of the electromagnetic shielding film 9, the first conductor particles 4 penetrate through the adhesive film layer 2 and are in contact conduction with the stratum 82 of the printed circuit board 8, and the interference charges accumulated on the conductive layer 1 and the metal conductive layer 92 are led out through the stratum 82 of the printed circuit board 8; in addition, the steel sheet 81 is used as a reinforcing structure, and the steel sheet 81 can also lead out the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92.
Referring to fig. 9, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a second grounding hole 84, and the metal conductive layer 82 is connected with the ground layer 82 of the printed circuit board 8 through the second grounding hole 84, so that the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92 are led out through the ground layer 82 of the printed circuit board 8.
As shown in fig. 8 and 9, when the circuit board is applied to an electronic device, the steel sheet 81 can be in contact conduction with a housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 can be led out through the steel sheet 81, and the interference charges can be led out through the housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 of the conductive adhesive film can be led into the ground, and the interference sources caused by the accumulation of the interference charges are prevented from affecting the normal operation of the circuit board. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
In order to solve the same technical problem, the embodiment of the utility model provides a still provides a circuit board, including a plurality of printed wiring boards and a plurality of conductive adhesive film, conductive adhesive film locates adjacent two between the printed wiring board, conductive adhesive layer switches on with the stratum contact of one of them printed wiring board, first conductor granule impales the rete and with another the stratum contact of printed wiring board switches on to make adjacent two the stratum of printed wiring board switches on each other. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
Referring to fig. 10, in order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing a conductive adhesive film, including the following steps:
s11, forming a conductor layer 1; wherein, a through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is provided;
s12, forming first conductor particles 4 on one side of the conductor layer 1;
s13, forming an adhesive film layer 2 on the side of the conductor layer 1 on which the first conductor particles 4 are formed; one surface of the conductor layer 1, which is close to the adhesive film layer 2, is a flat surface, and the first conductor particles 4 extend into the adhesive film layer 2;
and S14, forming a conductive adhesive layer 3 on the other side of the conductor layer 1.
In the embodiment of the present invention, the area of the through hole 11 is preferably 0.1 μm2-1mm2. By making the area of the through-hole 11 preferably 0.1 μm2-1mm2And the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 can be exhausted through the through hole 11 with a large enough value at high temperature, so that the situation that the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 are difficult to exhaust at high temperature is avoided, and the situation that the conductive adhesive film is peeled off from a conductor due to foaming and layering of the conductive adhesive film is avoided, and the conduction between the conductive adhesive film and the conductor is ensured. Further, if the number of the through holes 11 is too large, it is easy to cause discontinuity or even breakage of the conductor layer 1, thereby affecting the flow of the disturbance charge, and therefore, it is preferable that the number of the through holes 11 per square centimeter be 10 to 1000. The number of the through holes 11 in the conductor layer 1 per square centimeter is set to be 10-1000, so that volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 can be exhausted through enough through holes 11 at high temperature, the problem that the volatile matters in the adhesive film layer 2 and the conductive adhesive layer 3 are difficult to exhaust at high temperature is avoided, peeling between the conductive adhesive film and the conductor caused by foaming and layering of the conductive adhesive film is avoided, conduction between the conductive adhesive film and the conductor is ensured, and meanwhile, the number of the through holes 11 cannot influence continuous flow of interference charges in the conductor layer 1. When in useHowever, the area and the number of the through holes 11 are not limited to the above preferred range, and it is only necessary that the volatile matters generated by the adhesive layer 2 and the conductive adhesive layer 3 at a high temperature can be exhausted through the through holes 11, and the number of the through holes 11 does not affect the interference of the continuous flow and the conduction of the charges in the conductor layer 1, and further, the conductor layer 1 is not broken, which is not described herein in further detail.
In the embodiment of the present invention, the through holes 11 may be regularly or irregularly distributed on the conductor layer 1; wherein, the through holes 11 are regularly distributed on the conductor layer 1, which means that the through holes 11 have the same shape and are uniformly distributed on the conductor layer 1; the through holes 11 are irregularly distributed on the conductor layer 1, which means that the through holes 11 are irregularly and randomly distributed on the conductor layer 1. Preferably, the through holes 11 have the same shape, and the through holes 11 are uniformly distributed on the conductor layer 1. In addition, the through hole 11 may be a circular through hole 11, and may also be a through hole 11 of any other shape, the drawings of the present invention only illustrate that the through hole 11 is a circular through hole, but the through hole 11 of any other shape is within the protection scope of the present invention.
In the embodiment of the present invention, step S11 specifically includes: forming a conductor layer 1 on the release film or the peelable metal carrier tape; wherein the conductor layer 1 may be formed on the release film or the peelable metal carrier tape by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In the embodiment of the present invention, the preparation method of the peelable metal carrier tape is as follows:
s21, carrying out surface treatment on the substrate of the metal foil to ensure that the surface tension of the substrate is 40-90 dynes;
s22, forming a vacuum plating layer on one side of the substrate;
and S23, performing brightening treatment on the surface of the vacuum plating layer to form a surface metal bright layer so as to obtain the strippable metal carrier tape.
In an embodiment of the present invention, step S12 specifically includes:
the first conductor particles 4 are formed on one side of the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In an embodiment of the present invention, step S13 specifically includes:
s31, coating the adhesive film layer 2 on the release film;
s32, transferring the adhesive film layer 2 onto the side of the conductor layer 1 where the first conductor particles 4 are formed; or the like, or, alternatively,
s41, a glue film layer 2 is coated on the side of the conductor layer 1 where the first conductor particles 4 are formed.
Combine fig. 1 and fig. 5 to show, conductor layer 1 is close to conductive adhesive layer 3's one side is for leveling the surface or not leveling the surface, works as conductor layer 1 is close to conductive adhesive layer 3's one side is when uneven the surface, the conductor layer is close to conductive adhesive layer 3's uneven surface includes a plurality of convex parts 12 and a plurality of depressed part 13, and is a plurality of convex part 12 and a plurality of depressed part 13 interval sets up, and is a plurality of convex part 12 stretches into conductive adhesive layer 3. When the conductive adhesive film is pressed for use, the plurality of convex parts 12 can pierce the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during pressing, the glue substances forming the conductive glue layer 3 are extruded to the concave part 13, so that the glue containing amount of the conductive glue film is increased, the phenomenon that the conductive glue film is peeled from the conductor is not easy to occur, the problem that the conductive glue film is peeled from the conductor due to insufficient glue containing amount of the existing conductive glue film is solved, and the connection reliability of the conductive glue film and the conductor is effectively ensured; in addition, when the conductive adhesive film is pressed and used, the convex part 12 on the conductor layer 1 can pierce the conductive adhesive layer 3 and is in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, the use of conductive particles is reduced, the conduction resistance is greatly reduced, and the cost is reduced.
In an embodiment of the present invention, step S14 specifically includes:
s141, forming second conductor particles 5 on the other side of the conductor layer 1;
s142, forming a conductive adhesive layer 3 on the side of the conductor layer 1 on which the second conductor particles 5 are formed; wherein the second conductor particles 5 extend into the layer of conductive glue 3. Preferably, when the surface of the conductor layer 1 close to the conductive adhesive layer 3 is a non-flat surface, the second conductor particles are distributed on the convex portions 12 in a concentrated manner.
In the embodiment of the present invention, step S141 specifically includes:
the second conductor particles 5 are formed on the other side of the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In the embodiment of the present invention, the conductive adhesive layer 3 is formed on one side of the conductive layer 1 on which the second conductor particles 5 are formed, and specifically includes:
s51, coating a conductive adhesive layer 3 on the release film;
s52, transferring the conductive adhesive layer 3 to one side of the conductor layer 1 with the second conductor particles 5 in a pressing mode; or the like, or, alternatively,
s61, a conductive adhesive layer 3 is coated on the side of the conductor layer 1 where the second conductor particles 5 are formed.
Referring to fig. 7, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a surface of the adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a surface of the conductive adhesive layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is arranged on the side of the adhesive film layer 2 away from the conductor layer 1 to protect the outer surface of the adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is arranged on the side of the conductive adhesive layer 3 away from the conductor layer 1 to protect the outer surface of the conductive adhesive layer 3 from impurities such as external dust, wherein the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
To sum up, the embodiment of the utility model provides a conductive adhesive film, circuit board and preparation method of conductive adhesive film, wherein, conductive adhesive film includes glued membrane layer 2, conductor layer 1 and conductive adhesive layer 3, conductor layer 1 locates between glued membrane layer 2 and conductive adhesive layer 3, the one side that conductor layer 1 is close to glued membrane layer 2 is the level surface, conductor layer 1 is close to being equipped with first conductor granule 4 on the level surface of glued membrane layer 2, first conductor granule 4 stretches into glued membrane layer 2; the conductor layer 1 is provided with a through hole 11 penetrating through the upper surface and the lower surface thereof; when the conductive adhesive film is pressed for use, the first conductor particles 4 penetrate through the adhesive film layer 2 and are in contact conduction with the ground layer of the printed circuit board, so that the poor grounding stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art is avoided, the contact conduction of the conductive adhesive film and the ground layer of the printed circuit board is ensured, and the grounding stability of the conductive adhesive film is effectively improved; in addition, by arranging the conductor layer 1, most of the conductive particles in the conductive adhesive layer 3 can be in contact with the conductor layer 1, so that the overlapping rate of the conductive particles is increased, the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, the use of the conductive particles is reduced, and the production cost of the conductive adhesive film is reduced; in addition, the through hole 11 penetrating through the upper and lower surfaces of the conductor layer 1 is arranged, so that the adhesive film layer 2 and the conductive adhesive layer 3 can be in close contact through the through hole 11 on the conductor layer 1, the peeling strength between the adhesive film layer 2 and the conductive adhesive layer 3 is increased, and the adhesive film layer 2 and the conductive adhesive layer 3 can be firmly connected together; in addition, be equipped with the through-hole 11 that runs through its upper and lower surface on conductor layer 1, be favorable to when the high temperature volatile substance in glue film layer 2 and the conductive adhesive layer 3 to exhaust through-hole 11 of conductor layer 1 to the volatile substance of avoiding glue film layer 2 and conductive adhesive layer 3 is difficult to discharge when the high temperature, thereby has avoided conductive adhesive film foaming layering to cause conductive adhesive film and conductor to take place to peel off, and then has improved the reliability that conductive adhesive film and conductor are connected.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (11)
1. A conductive adhesive film is characterized by comprising an adhesive film layer, a conductor layer and a conductive adhesive layer, wherein the conductor layer is arranged between the adhesive film layer and the conductive adhesive layer, one surface, close to the adhesive film layer, of the conductor layer is a flat surface, first conductor particles are arranged on the flat surface, close to the adhesive film layer, of the conductor layer, and the first conductor particles stretch into the adhesive film layer; the conductor layer is provided with a through hole penetrating through the upper surface and the lower surface of the conductor layer.
2. The conductive adhesive film of claim 1, wherein a surface of the conductive layer adjacent to the conductive adhesive layer is a flat surface.
3. The conductive adhesive film according to claim 1, wherein the first conductive particles have a cluster shape, an ice shape, a stalactite shape, or a dendritic shape.
4. The conductive adhesive film according to claim 1, wherein the number of the first conductive particles is plural, and the plural first conductive particles are regularly or irregularly distributed on one surface of the conductive layer close to the adhesive film layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; the first conductor particles may be the same or different in size.
5. The conductive adhesive film according to claim 1, wherein the height of the first conductive particles is 0.1 μm to 30 μm.
6. The electroconductive adhesive film according to any one of claims 1 to 5, wherein the adhesive film layer comprises an adhesive layer containing electroconductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
7. The conductive adhesive film according to any one of claims 1 to 5, wherein the conductive layer has a thickness of 0.01 μm to 45 μm, the adhesive film layer has a thickness of 0.1 μm to 45 μm, and the conductive adhesive layer has a thickness of 0.1 μm to 60 μm.
8. The adhesive conductive film of any one of claims 1-5, further comprising a first peelable protective film layer disposed on a side of the adhesive film layer away from the conductor layer and a second peelable protective film layer disposed on a side of the adhesive conductive film layer away from the conductor layer.
9. The electroconductive adhesive film according to any one of claims 1 to 5, wherein the area of said through-hole is 0.1 μm2-1mm2(ii) a And/or the number of the through holes in the conductor layer per square centimeter is 10-1000.
10. A circuit board comprising a printed circuit board and the conductive film according to any one of claims 1 to 9, wherein the conductive film is disposed on the printed circuit board, and the first conductive particles penetrate through the film layer and are in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer.
11. A circuit board comprising a printed circuit board, an electromagnetic shielding film and the conductive adhesive film according to any one of claims 1 to 9, wherein the conductive adhesive film is disposed on the electromagnetic shielding film, and the electromagnetic shielding film is disposed on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, first conductor particles of the conductive adhesive film penetrate through the adhesive film layer and the insulating layer and are in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer.
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| CN201821963161.0U CN209947454U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and circuit board |
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| CN201821963161.0U CN209947454U (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film and circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783014A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
| WO2023092509A1 (en) * | 2021-11-26 | 2023-06-01 | 京东方科技集团股份有限公司 | Conductive adhesive film and preparation method therefor, and electronic device and manufacturing method therefor |
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2018
- 2018-11-26 CN CN201821963161.0U patent/CN209947454U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110783014A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
| WO2023092509A1 (en) * | 2021-11-26 | 2023-06-01 | 京东方科技集团股份有限公司 | Conductive adhesive film and preparation method therefor, and electronic device and manufacturing method therefor |
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