CN110783018A - Conductive adhesive film, circuit board and preparation method of conductive adhesive film - Google Patents
Conductive adhesive film, circuit board and preparation method of conductive adhesive film Download PDFInfo
- Publication number
- CN110783018A CN110783018A CN201811423989.1A CN201811423989A CN110783018A CN 110783018 A CN110783018 A CN 110783018A CN 201811423989 A CN201811423989 A CN 201811423989A CN 110783018 A CN110783018 A CN 110783018A
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- adhesive film
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 241
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000010410 layer Substances 0.000 claims abstract description 450
- 239000004020 conductor Substances 0.000 claims abstract description 315
- 239000002245 particle Substances 0.000 claims abstract description 186
- 239000012790 adhesive layer Substances 0.000 claims abstract description 142
- 239000003292 glue Substances 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910000831 Steel Inorganic materials 0.000 claims description 23
- 239000010959 steel Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000002923 metal particle Substances 0.000 claims description 15
- 230000000994 depressogenic effect Effects 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000002041 carbon nanotube Substances 0.000 claims description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 7
- 229910000859 α-Fe Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Abstract
The invention relates to the technical field of electronics, and discloses a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film, wherein the conductive adhesive film comprises an adhesive film layer, a conductor layer and a conductive adhesive layer, the conductor layer is arranged between the adhesive film layer and the conductive adhesive layer, the surface of the conductor layer, which is close to the adhesive film layer, comprises a plurality of first convex parts and a plurality of first concave parts, the plurality of first convex parts and the plurality of first concave parts are arranged at intervals, the plurality of first convex parts extend into the adhesive film layer, and the conductive adhesive film is penetrated through the adhesive film layer by the first convex parts and is in contact conduction with the stratum of the printed circuit board when in lamination use, so that the conductive adhesive film is ensured to be in contact conduction with the stratum of the printed circuit board; in addition, through setting up the conductor layer for most conductive particle in the conductive adhesive layer can contact with the conductor layer, thereby increases conductive particle's overlap ratio, has reduced conductive adhesive film's resistance.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film.
Background
The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the conventional conductive adhesive film generally includes a conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein; in practical application, after the conductive adhesive film is subjected to hot pressing, the adhesive layer of the conductive adhesive film is melted and flows into the grounding hole of the printed circuit board, so that conductive particles in the conductive adhesive layer are in contact conduction with the ground layer of the printed circuit board through the grounding hole, and static charges accumulated on the printed circuit board are led out. However, in the process of implementing the invention, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect of the conductive adhesive film and the ground layer of the circuit board is not ideal, and the grounding stability of the conductive adhesive film is poor.
Disclosure of Invention
The embodiment of the invention aims to provide a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film, which can effectively improve the grounding stability of the conductive adhesive film.
In order to solve the above technical problem, an embodiment of the present invention provides a conductive adhesive film, including an adhesive film layer, a conductor layer and a conductive adhesive layer, where the conductor layer is disposed between the adhesive film layer and the conductive adhesive layer, one surface of the conductor layer close to the adhesive film layer is a non-flat surface, the non-flat surface of the conductor layer close to the adhesive film layer includes a plurality of first protrusions and a plurality of first recesses, the plurality of first protrusions and the plurality of first recesses are disposed at intervals, and the plurality of first protrusions extend into the adhesive film layer.
Preferably, the conductor layer is provided with first conductor particles on a non-flat surface close to the adhesive film layer, and the first conductor particles are distributed on the first convex portions in a concentrated manner.
Preferably, one surface of the conductor layer, which is close to the conductive adhesive layer, is a flat surface;
or, the conductor layer is close to conductive adhesive layer's one side is uneven surface, the conductor layer is close to conductive adhesive layer's uneven surface includes a plurality of second convex parts and a plurality of second depressed part, and is a plurality of second convex part and a plurality of second depressed part interval sets up, and is a plurality of the second convex part stretches into conductive adhesive layer.
Preferably, second conductor particles are arranged on one surface, close to the conductive adhesive layer, of the conductor layer.
Preferably, the first conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape, and/or the second conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape.
Preferably, the number of the first conductor particles is multiple, and the multiple first conductor particles are regularly or irregularly distributed on one surface, close to the adhesive film layer, of the conductor layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the second conductor particles are regularly or irregularly distributed on one surface, close to the conductive adhesive layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the conductive adhesive layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
Preferably, the first conductor particles include one or more of metal particles, carbon nanotube particles and ferrite particles, and the second conductor particles include one or more of metal particles, carbon nanotube particles and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
Preferably, the adhesive layer comprises an adhesive layer containing conductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the thickness of the conductor layer is 0.01-45 μm, the thickness of the adhesive layer is 0.1-45 μm, and the thickness of the conductive adhesive layer is 0.1-60 μm.
Preferably, the conductive adhesive film further comprises a first peelable protective film layer and a second peelable protective film layer, the first peelable protective film layer is arranged on the surface, away from the conductor layer, of the adhesive film layer, and the second peelable protective film layer is arranged on the surface, away from the conductor layer, of the conductive adhesive layer.
The invention provides a conductive adhesive film, wherein when the conductive adhesive film is pressed and used, the first convex part pierces through the adhesive film layer and is in contact conduction with the ground layer of a printed circuit board, so that the poor grounding stability of the conductive adhesive film caused by the change of the stacking state of conductive particles of the conductive adhesive film in the prior art is avoided, the contact conduction of the conductive adhesive film and the ground layer of the printed circuit board is ensured, and the grounding stability of the conductive adhesive film is effectively improved; in addition, through setting up the conductor layer to make most conductive particle in the conductive adhesive layer can contact with the conductor layer, thereby increased conductive particle's overlap ratio, reduced conductive adhesive film's resistance, and then be favorable to improving conductive adhesive film's electric conductivity, reduced conductive particle's use simultaneously, thereby reduce conductive adhesive film's manufacturing cost.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board and the conductive film, where the conductive film is disposed on the printed circuit board, and the first protrusion pierces through the film layer and is in contact with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer. The conductive film is arranged on the printed circuit board, so that electromagnetic wave interference is shielded for the printed circuit board, interference charges generated from the outside are accumulated on a conductor layer of the conductive film, and the first convex part pierces through the film layer and is in contact conduction with a stratum of the printed circuit board, so that the interference charges accumulated on the conductor layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and interference charges accumulated on the conductor layer can be led out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film, and the electromagnetic shielding film is disposed on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, the first convex part of the conductive adhesive film pierces through the adhesive film layer and the insulating layer and is in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with the ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer. The conductive adhesive film is arranged on the electromagnetic shielding film which is arranged on the printed circuit board, so that the conductive adhesive film and the electromagnetic shielding film can shield electromagnetic wave interference for the printed circuit board, interference charges generated from the outside are accumulated on the conductive layer of the conductive adhesive film and the metal conductive layer of the electromagnetic shielding film, and the first convex part pierces the adhesive film layer and is in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductive layer and the metal conductive layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and interference charges accumulated on the conductor layer and the metal conducting layer can be led out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing a conductive adhesive film, including the following steps:
forming a conductor layer;
forming a glue film layer on one side of the conductor layer;
forming a conductive adhesive layer on the other side of the conductor layer; the conductor layer is close to one side of the adhesive film layer is a non-flat surface, the conductor layer is close to the non-flat surface of the adhesive film layer and comprises a plurality of first convex parts and a plurality of first concave parts, the first convex parts and the first concave parts are arranged at intervals, and the first convex parts stretch into the adhesive film layer.
As a preferred scheme, forming a glue film layer on one side of the conductor layer specifically includes:
forming first conductor particles on one side of the conductor layer; wherein the first conductor particles are distributed on the first convex portions in a concentrated manner;
and forming a film adhesive layer on one side of the conductor layer on which the first conductor particles are formed.
As a preferred scheme, forming a conductive adhesive layer on the other side of the conductor layer specifically includes:
forming second conductor particles on the other side of the conductor layer;
and forming a conductive adhesive layer on one side of the conductor layer on which the second conductor particles are formed.
The invention provides a method for preparing a conductive adhesive film, which comprises forming a conductor layer, forming an adhesive film layer on one side of the conductor layer, forming a conductive adhesive layer on the other side of the conductor layer, wherein, one surface of the conductor layer close to the adhesive film layer is a non-flat surface, the non-flat surface of the conductor layer close to the adhesive film layer comprises a plurality of first convex parts and a plurality of first concave parts, the plurality of first convex parts and the plurality of first concave parts are arranged at intervals, the plurality of first convex parts extend into the adhesive film layer, when the conductive adhesive film is pressed for use, the first convex part pierces the rubber film layer and is in contact conduction with the ground layer of the printed circuit board, so as to avoid poor grounding stability of the conductive rubber film caused by the change of the stacking state of the conductive particles of the conductive rubber film in the prior art, thereby ensuring the conductive adhesive film to be in contact conduction with the ground layer of the printed circuit board and effectively improving the grounding stability of the conductive adhesive film; in addition, through setting up the conductor layer to make most conductive particle in the conductive adhesive layer can contact with the conductor layer, thereby increased conductive particle's overlap ratio, reduced conductive adhesive film's resistance, and then be favorable to improving conductive adhesive film's electric conductivity, reduced conductive particle's use simultaneously, thereby reduce conductive adhesive film's manufacturing cost.
Drawings
FIG. 1 is a schematic structural diagram of a conductive adhesive film according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a conductive adhesive film including first conductive particles according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a conductive adhesive film containing second conductive particles according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a conductive adhesive film including first conductive particles and second conductive particles;
fig. 5 is a schematic structural view of one-time molding of the first conductor particles, the second conductor particles, and the conductor layer in the embodiment of the invention;
FIG. 6 is a schematic structural diagram of a conductive adhesive film including a second protrusion and a second recess according to an embodiment of the invention;
FIG. 7 is a schematic structural diagram of a conductive adhesive film including first conductive particles, second protrusions, and second recesses according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a conductive adhesive film including first conductive particles, second protrusions, and second recesses according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a conductive adhesive film including a first peelable protective film layer and a second peelable protective film layer in an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of a wiring board in an embodiment of the present invention;
FIG. 11 is a schematic structural view of another embodiment of a wiring board in an example of the present invention;
FIG. 12 is a schematic flow chart of a method for manufacturing an electro-conductive adhesive film according to an embodiment of the present disclosure;
wherein, 1, a conductor layer; 11. a first convex portion; 12. a first recess; 13. a second convex portion; 14. a second recess; 2. a glue film layer; 3. a conductive adhesive layer; 4. a first conductive particle; 5. a second conductive particle; 6. a first peelable protective film layer; 7. a second peelable protective film layer; 8. a printed wiring board; 81. a steel sheet; 82. an earth formation; 83. a first ground via; 84. a second ground via; 9. an electromagnetic shielding film; 91. an insulating layer; 92. a metal conductive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a conductive adhesive film according to a preferred embodiment of the present invention includes an adhesive film layer 2, a conductor layer 1 and a conductive adhesive layer 3, wherein the conductor layer 1 is disposed between the adhesive film layer 2 and the conductive adhesive layer 3, one surface of the conductor layer 1 close to the adhesive film layer 2 is a non-flat surface, the non-flat surface of the conductor layer 1 close to the adhesive film layer 2 includes a plurality of first protrusions 11 and a plurality of first recesses 12, the plurality of first protrusions 11 and the plurality of first recesses 12 are disposed at intervals, and the plurality of first protrusions 11 extend into the adhesive film layer 2.
In the embodiment of the invention, when the conductive adhesive film is used in a pressing mode, the first convex part 11 pierces the adhesive film layer 2 and is in contact conduction with the ground layer of the printed circuit board, so that the poor grounding stability of the conductive adhesive film caused by the change of the stacking state of conductive particles of the conductive adhesive film in the prior art is avoided, the contact conduction of the conductive adhesive film and the ground layer of the printed circuit board is ensured, and the grounding stability of the conductive adhesive film is effectively improved; in addition, through setting up conductor layer 1 to make most conductive particle in the conductive adhesive layer 3 can contact with conductor layer 1, thereby increased conductive particle's overlap ratio, reduced conductive adhesive film's resistance, and then be favorable to improving conductive adhesive film's electric conductivity, reduced conductive particle's use simultaneously, thereby reduce conductive adhesive film's manufacturing cost.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 close to the adhesive film layer 2 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the adhesive film layer 2 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the uneven surface of the conductor layer 1 close to the adhesive film layer 2 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude and/or interval of the fluctuation on the uneven surface are different.
In the embodiment of the present invention, the plurality of first protrusions 11 may have a certain distance from the outer surface of the adhesive film layer 2, and may also contact with the outer surface of the adhesive film layer 2 or extend out of the outer surface of the adhesive film layer 2.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each first protrusion 11 and the adjacent first recess 12 is the same. By setting the distance between each first convex part 11 and the adjacent first concave part 12 to be the same, the first convex parts 11 can uniformly pierce the adhesive film layer 2, thereby further ensuring that the conductor layer 1 is in contact with the conductor and improving the conduction efficiency. Preferably, each of the first protrusions 11 has the same shape; each of the first recesses 12 has the same shape; wherein each first convex part 11 is in an axisymmetric structure; each first concave part 12 is in an axisymmetric structure; of course, each of the first protrusions 11 may also have a non-axisymmetrical structure, and each of the first recesses 12 may also have a non-axisymmetrical structure. Because the distance between each first convex part 11 and the adjacent first concave part 12 is the same, the shape of each first convex part 11 is the same, and the shape of each first concave part 12 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
As shown in fig. 2, fig. 4, fig. 5, fig. 7 and fig. 8, in order to further ensure that the conductor layer 1 is in contact with a conductor, the conductor layer 1 in this embodiment is provided with first conductor particles 4 on the non-flat surface close to the adhesive film layer 2. By providing the conductor layer 1 with first conductor particles 4 on the non-flat surface close to the glue film layer 2, so as to pierce the glue film layer 2, it is further ensured that the conductor layer 1 is in contact with the conductor. Preferably, the first conductive particles 4 are distributed on the first protrusions 11 in a concentrated manner, so that the conductive layer 1 can more easily pierce the adhesive film layer 2 during the lamination process.
In the implementation shown in fig. 4 and 5, the conductive layer 1 may be formed first, and then the first conductive particles 4 may be formed on the conductive layer 1 by other processes. Of course, the conductor layer 1 and the first conductor particles 4 may also be a unitary structure formed by a one-shot molding process.
Combine fig. 1 and fig. 6 to show, conductor layer 1 is close to the one side of conductive adhesive layer 3 is for leveling the surface or not leveling the surface, works as conductor layer 1 is close to when the one side of conductive adhesive layer 3 is for uneven the surface, conductor layer 1 is close to conductive adhesive layer 3's uneven surface includes a plurality of second convex parts 13 and a plurality of second depressed part 14, and is a plurality of second convex parts 13 and a plurality of second depressed part 14 interval sets up, and is a plurality of second convex parts 13 stretches into conductive adhesive layer 3. When the conductive adhesive film is pressed for use, the plurality of second convex parts 13 can pierce the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during pressing, the glue substances forming the conductive glue layer 3 are extruded onto the second concave part 14, so that the glue containing amount of the conductive glue film is increased, the phenomenon that the conductive glue film is peeled from the conductor is not easy to occur, the problem that the conductive glue film is peeled from the conductor due to insufficient glue containing amount of the existing conductive glue film is solved, and the connection reliability of the conductive glue film and the conductor is effectively ensured; in addition, when the conductive adhesive film is pressed and used, the first convex part 11 and the second convex part 13 on the conductor layer 1 can respectively pierce the adhesive film layer 2 and the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, and therefore the conductive adhesive film can be in contact conduction with the conductor without arranging conductive particles in the adhesive film layer 2 and the conductive adhesive layer 3, the conduction resistance is greatly reduced, and the cost is greatly reduced.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 near the conductive adhesive layer 3 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the conductive adhesive layer 3 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the conductor layer 1 is close to the non-flat surface of the conductive adhesive layer 3, the non-flat surface is a non-periodic fluctuation structure, and the amplitude and/or the interval of the fluctuation on the non-flat surface are different.
In the embodiment of the present invention, the second protrusions 13 may have a certain distance from the outer surface of the conductive adhesive layer 3, and may also contact with the outer surface of the conductive adhesive layer 3 or extend out of the outer surface of the conductive adhesive layer 3.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each second protrusion 13 and the adjacent second recess 14 in the embodiment is the same. By setting the distance between each second convex portion 13 and the adjacent second concave portion 14 to be the same, the second convex portions 13 can uniformly pierce through the conductive adhesive layer 3, thereby further ensuring that the conductor layer 1 is in contact with the conductor and improving the conduction efficiency. Preferably, each of the second protrusions 13 has the same shape; each of the second recesses 14 has the same shape; wherein each of the second protrusions 13 is of an axisymmetric structure; each of the second recessed portions 14 is of an axisymmetric structure; of course, each of the second protrusions 13 may also have a non-axisymmetrical structure, and each of the second recesses 14 may also have a non-axisymmetrical structure. Because the distance between each second convex part 13 and the adjacent second concave part 14 is the same, the shape of each second convex part 13 is the same, and the shape of each second concave part 14 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
Preferably, the undulation degree of the conductor layer 1 near the uneven surface of the adhesive film layer 2 (i.e. the distance between the highest point and the lowest point of the conductor layer 1 near the side of the adhesive film layer 2) is 0.1 μm-30 μm, and the undulation degree of the conductor layer 1 close to the uneven surface of the conductive adhesive layer 3 (i.e. the distance between the highest point and the lowest point of the side of the conductor layer 1 close to the conductive adhesive layer 3) is 0.1 μm to 30 μm, and the undulation degree of the side of the conductor layer 1 close to the adhesive layer 2 and the undulation degree of the side of the conductor layer 1 close to the conductive adhesive layer 3 are set within the above range, so that the piercing function of the conductor layer 1 can be enhanced, therefore, the interference charges accumulated in the conductor layer 1 are smoothly led out, and the interference source caused by the accumulation of the interference charges is avoided.
As shown in fig. 3 to 5 and fig. 8, in order to further ensure that the conductor layer 1 is in contact with a conductor, second conductor particles 5 are disposed on one surface of the conductor layer 1 close to the conductive adhesive layer 3 in this embodiment. The conductor layer 1 is further ensured to be in contact with the conductor by providing the second conductor particles 5 on the side of the conductor layer 1 close to the conductive adhesive layer 3 so as to pierce through the conductive adhesive layer 3. Preferably, when one surface of the conductor layer 1 close to the conductive adhesive layer 3 is a non-flat surface, the second conductive particles 5 are distributed on the second protrusions 13 in a concentrated manner, so that the conductor layer 1 can pierce the conductive adhesive layer 3 more easily during the pressing process.
In the implementation shown in fig. 4 and fig. 5, the conductive layer 1 may be formed first, and then the second conductive particles 5 may be formed on the conductive layer 1 by another process. Of course, the conductor layer 1 and the second conductor particles 5 may also be an integral structure formed by a one-time molding process.
In the embodiment of the present invention, the height h1 of the first conductive particles 4 is preferably 0.1 μm to 30 μm, the height h2 of the second conductive particles 5 is preferably 0.1 μm to 30 μm, the thickness of the adhesive layer 2 is preferably 0.1 μm to 45 μm, and the thickness of the conductive adhesive layer 3 is preferably 0.1 μm to 60 μm. By arranging the first conductor particles 4 and the second conductor particles 5 with the height of 0.1-30 μm, the thickness of the adhesive film layer 2 with the thickness of 0.1-45 μm and the thickness of the conductive adhesive layer 3 with the thickness of 0.1-60 μm, the conductive adhesive film is ensured to be capable of penetrating the adhesive film layer 2 by the first conductor particles 4 and penetrating the conductive adhesive layer 3 by the second conductor particles 5 when the conductive adhesive film is pressed for use, so that the conductive adhesive film is ensured to be capable of being in contact conduction with a conductor. Further, the thickness of the conductor layer 1 is preferably 0.01 μm to 45 μm to ensure that the conductor layer 1 is not easily broken and has good flexibility.
As shown in fig. 4 and 8, the first conductive particles 4 are distributed in both the first concave portion 12 and the first convex portion 11, and the sum of the height H1 of any first convex portion 11 and the height H1 of the first conductive particles 4 located on the first convex portion 11 is also 1 to 30 μm. Of course, the self height H1 of the first conductive particles 4 disposed on the first protrusions 11 may be 1 to 30 μm, and then the sum of the height H1 of the first protrusions 11 and the self height H1 of the first conductive particles 4 disposed on the first protrusions 11 is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film; in addition, when the conductor layer 1 and the surface close to the conductive adhesive layer 3 are uneven surfaces, the second conductive particles 5 are distributed in both the second concave portions 13 and the second convex portions 14, and the sum of the height H2 of any one second convex portion 14 and the height H2 of the second conductive particles 5 on the second convex portion 14 is also 1 to 30 μm. Of course, the self height H2 of the second conductive particles 5 disposed on the second protrusions 14 may be 1 to 30 μm, and then the sum of the height H2 of the second protrusions 14 and the self height H2 of the second conductive particles 5 disposed on the second protrusions 14 is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film.
The first conductor particles 4 may have a certain distance from the outer surface of the adhesive film layer 2, and may also contact with the outer surface of the adhesive film layer 2 or extend out of the outer surface of the adhesive film layer 2; the second conductive particles 5 may be spaced apart from the outer surface of the conductive adhesive layer 3, and may also be in contact with the outer surface of the conductive adhesive layer 3 or extend beyond the outer surface of the conductive adhesive layer 3. In addition, the outer surfaces of the adhesive layer 2 and the conductive adhesive layer 3 may be flat surfaces without undulation, or may be flat surfaces with gentle undulation.
In the embodiment of the present invention, the number of the first conductor particles 4 is plural, and the plural first conductor particles 4 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the adhesive film layer 2; a plurality of the first conductor particles 4 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the adhesive film layer 2; the shapes of the plurality of first conductor particles 4 are the same or different; the plurality of first conductor particles 4 may be the same or different in size; and/or the number of the second conductor particles 5 is multiple, and the multiple second conductor particles 5 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the conductive adhesive layer 3; a plurality of the second conductor particles 5 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the conductive adhesive layer 3; the shapes of the plurality of second conductor particles 5 are the same or different; the second conductor particles 5 may be the same or different in size. The plurality of first conductor particles 4 are regularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are periodically distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the second conductor particles 5 are regularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are periodically distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3; the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3.
It should be noted that the shapes of the first conductive particles 4 and the second conductive particles 5 in fig. 2 to 5 and fig. 7 and 8 are merely exemplary, and due to differences in process means and parameters, the first conductive particles 4 and the second conductive particles 5 may also be in other shapes such as clusters, ice-hanging shapes, stalactite shapes, and dendrites. In addition, the first conductive particles 4 and the second conductive particles 5 in the embodiment of the present invention are not limited to the shapes shown in the drawings and described above, and any first conductive particles 4 and second conductive particles 5 having piercing and conductive functions are within the scope of the present invention.
The conductor layer 1 of the present embodiment may have a single-layer structure or a multi-layer structure; when the conductor layer 1 is a multilayer, each layer of the conductor layer 1 near the glue film layer 2 can be provided with first conductor particles 4 on one side, and each layer of the conductor layer 1 near the conductive glue film layer 3 can be provided with second conductor particles 5 or not provided with second conductor particles 5 on one side. The adhesive layer 2 and the conductive adhesive layer 3 can be of a single-layer structure or a multi-layer structure; the conductor layer 1, the adhesive film layer 2, and the conductive adhesive layer 3 may be provided in plurality. Preferably, when the conductor layer 1, the glue film layer 2 and the conductive glue layer 3 are respectively a plurality of, the glue film layer 2, the conductor layer 1 and the conductive glue layer 3 are sequentially arranged at intervals, for example, when the conductor layer 1, the glue film layer 2 and the conductive glue layer 3 are respectively 2, the arrangement sequence may be: one of the adhesive film layers 2, one of the conductor layers 1, one of the conductive adhesive layers 3, the other of the adhesive film layers 2, the other of the conductor layers 1, and the other of the conductive adhesive layers 3, and so on, which will not be described herein again; or, only 1 glue film layer may be disposed between 2 conductor layers 1, for example, when the number of the conductor layers 1 and the number of the conductive glue layers 3 are 2 respectively, and the number of the glue film layers 2 is 1, the arrangement sequence may be: one adhesive film layer 2, one conductor layer 1, one conductive adhesive layer 3, another conductor layer 1, and another conductive adhesive layer 3, and so on, which will not be described herein. In addition, according to the actual production and application requirements, the conductor layer 1 of the present embodiment may be configured as a foamed shape, and the like, which is not described herein further.
Preferably, the thickness of the glue film layer 2 and the sum of the undulation degree of the conductor layer 1 close to the uneven surface of the glue film layer 2 and the height of the first conductor particles 4 satisfy a proportional relationship of 0.5-2, so as to ensure sufficient piercing strength and glue capacity, which is specifically embodied as follows: on one hand, the phenomenon that the conductive adhesive film and the conductor are stripped due to the fact that the glue containing amount is insufficient due to the fact that the fluctuation degree of the thickness of the adhesive film layer 2 is smaller than the fluctuation degree of the surface, close to the adhesive film layer 2, of the conductor layer 1 and the height of the first conductor particles 4 are too small is prevented, and on the other hand, the phenomenon that the conductive adhesive film and the conductor are not conducted due to the fact that the piercing strength is insufficient due to the fact that the fluctuation degree of the surface, close to the adhesive film layer 2, of the conductor layer 1 and the thickness of the first conductor.
Preferably, the thickness of the conductive adhesive layer 3 and the sum of the undulation degree of the conductor layer 1 close to the uneven surface of the conductive adhesive layer 3 and the height of the second conductor particles 5 satisfy a proportional relationship of 0.5-2, so as to ensure sufficient piercing strength and glue holding amount, which is specifically embodied as: on the one hand, the phenomenon that the conductive adhesive film and the conductor are peeled off due to insufficient glue capacity caused by the fact that the thickness of the conductive adhesive layer 3 is smaller than the fluctuation degree of one surface, close to the conductive adhesive layer 3, of the conductor layer 1 and the sum of the heights of the second conductor particles 5 is too small is prevented, and on the other hand, the phenomenon that the conductive adhesive film and the conductor cannot be conducted due to insufficient piercing strength caused by the fact that the fluctuation degree of one surface, close to the conductive adhesive layer 3, of the conductor layer 1 and the sum of the heights of the second conductor particles 5 is too small is prevented.
In the embodiment of the present invention, in order to ensure that the conductor layer 1 has good conductivity, the conductor layer 1 includes one or more of a metal conductor layer, a carbon nanotube conductor layer, a ferrite conductor layer, and a graphene conductor layer. Wherein the metal conductor layer comprises a single metal conductor layer and/or an alloy conductor layer; the single metal conductor layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy conductor layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the embodiment of the present invention, the first conductor particles 4 include one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles 5 include one or more of metal particles, carbon nanotube particles, and ferrite particles, respectively; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The first conductive particles 4 and the second conductive particles 5 may be made of the same material as the conductive layer 1, or may be different.
In the embodiment of the present invention, in order to further ensure the conductivity of the conductive adhesive film, the adhesive layer 2 in this embodiment includes an adhesion layer containing conductive particles, and the adhesive layer 2 includes the adhesion layer containing conductive particles, so as to improve the conductivity of the adhesive layer 2, thereby further ensuring the conductivity of the conductive adhesive film; wherein, the shape of the conductive particles can be spherical or flake; when the conductive particles are spherical, the particle size of the conductive particles in the adhesive film layer 2 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the adhesive film layer 2 to the adhesive layer in the adhesive film layer 2 is 2% -80%. Certainly, the adhesive layer 2 may also include an adhesive layer that does not include conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board, and improving the flexibility of the circuit board.
In the embodiment of the present invention, it should be noted that the conductive adhesive layer 3 includes an adhesive layer containing conductive particles, wherein the conductive particles may be in a spherical shape or a sheet shape; when the conductive particles are spherical, the particle size of the conductive particles in the conductive adhesive layer 3 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the conductive adhesive layer 3 to the adhesive layer in the conductive adhesive layer 3 is 2-80%.
Preferably, the materials used for the adhesion layer in the adhesive layer 2 and the adhesion layer in the conductive adhesive layer 3 are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, modified thermoplastic polyimides, polyurethanes, polyacrylates, and silicones.
Referring to fig. 9, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a surface of the adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a surface of the conductive adhesive layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is arranged on the side of the adhesive film layer 2 away from the conductor layer 1 to protect the outer surface of the adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is arranged on the side of the conductive adhesive layer 3 away from the conductor layer 1 to protect the outer surface of the conductive adhesive layer 3 from impurities such as external dust, wherein the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
Referring to fig. 10, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8 and the conductive film, where the conductive film is disposed on the printed circuit board 8, and the first protrusion 11 pierces through the film layer 2 and is in contact with a ground layer 82 of the printed circuit board 8 for conduction; the circuit board further comprises a steel sheet 81, wherein the steel sheet 81 is arranged on one surface of the conductive adhesive layer 3, which is far away from the adhesive film layer 2. The conductive film is arranged on the printed circuit board 8, so that electromagnetic wave interference is shielded for the printed circuit board 8, interference charges generated from the outside are accumulated on the conductor layer 1 of the conductive film, the first convex part 11 pierces the film layer 2 and is in contact conduction with the ground layer 82 of the printed circuit board 8, and the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8; in addition, the steel sheet 81 is used as a reinforcing structure, and the steel sheet 81 can also lead out interference charges accumulated on the conductor layer 1.
Referring to fig. 10, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed wiring board 8, the printed wiring board 8 in this embodiment is provided with a first grounding hole 83, and the first protrusion 11 is connected with the ground layer 82 of the printed wiring board 8 through the first grounding hole 83, so that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed wiring board 8.
Referring to fig. 11, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8, an electromagnetic shielding film 9, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film 9, and the electromagnetic shielding film 9 is disposed on the printed circuit board 8; the electromagnetic shielding film 9 comprises an insulating layer 91 and a metal conductive layer 92, the first convex part 11 of the conductive adhesive film pierces through the adhesive film layer 2 and the insulating layer 91 and is in contact conduction with the metal conductive layer 92, and the metal conductive layer 92 is in contact conduction with the ground layer 82 of the printed circuit board 8; the circuit board further comprises a steel sheet 81, wherein the steel sheet 81 is arranged on one surface of the conductive adhesive layer 3, which is far away from the adhesive film layer 2. The conductive adhesive film is arranged on the electromagnetic shielding film 9, the electromagnetic shielding film 9 is arranged on the printed circuit board 8, so that the conductive adhesive film and the electromagnetic shielding film 9 can shield the printed circuit board 8 from electromagnetic wave interference, interference charges generated from the outside are accumulated on the conductive layer 1 of the conductive adhesive film and the metal conductive layer 92 of the electromagnetic shielding film 9, the first convex part 11 pierces through the adhesive film layer 2 and is in contact conduction with the stratum 82 of the printed circuit board 8, and the interference charges accumulated on the conductive layer 1 and the metal conductive layer 92 are led out through the stratum 82 of the printed circuit board 8; in addition, the steel sheet 81 is used as a reinforcing structure, and the steel sheet 81 can also lead out the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92.
Referring to fig. 11, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a second grounding hole 84, and the metal conductive layer 92 is connected with the ground layer 82 of the printed circuit board 8 through the second grounding hole 84, so that the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92 are led out through the ground layer 82 of the printed circuit board 8.
As shown in fig. 10 and 11, when the circuit board is applied to an electronic device, the steel sheet 81 can be in contact conduction with a housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 can be led out through the steel sheet 81, and the interference charges are led out through the housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 of the conductive adhesive film are led into the ground, and the interference sources caused by the accumulation of the interference charges are prevented from affecting the normal operation of the circuit board. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a plurality of printed circuit boards and a plurality of conductive adhesive films, where the conductive adhesive films are disposed between two adjacent printed circuit boards, the conductive adhesive layers are in contact conduction with a ground layer of one of the printed circuit boards, and the first protruding portion 11 pierces through the adhesive film layer and is in contact conduction with a ground layer of the other printed circuit board, so as to make the two adjacent printed circuit boards in contact conduction. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
Referring to fig. 12, in order to solve the same technical problem, an embodiment of the present invention further provides a method for manufacturing a conductive adhesive film, including the following steps:
s11, forming a conductor layer 1;
s12, forming a glue film layer 2 on one side of the conductor layer 1;
s13, forming a conductive adhesive layer 3 on the other side of the conductor layer 1; wherein, the conductor layer 1 is close to the one side of glued membrane layer 2 is uneven surface, the conductor layer 1 is close to glued membrane layer 2's uneven surface includes a plurality of first convex parts 11 and a plurality of first depressed part 12, and is a plurality of first convex parts 11 and a plurality of first depressed part 12 interval sets up, and is a plurality of first convex part 11 stretches into glued membrane layer 2.
In this embodiment of the present invention, the step S11 specifically includes: forming a conductor layer 1 on the release film or the peelable metal carrier tape; wherein the conductor layer 1 may be formed on the release film or the peelable metal carrier tape by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In the embodiment of the invention, the preparation method of the strippable metal carrier tape comprises the following steps:
s21, carrying out surface treatment on the substrate of the metal foil to ensure that the surface tension of the substrate is 40-90 dynes;
s22, forming a vacuum plating layer on one side of the substrate;
and S23, performing brightening treatment on the surface of the vacuum plating layer to form a surface metal bright layer so as to obtain the strippable metal carrier tape.
In this embodiment of the present invention, the step S12 specifically includes:
s121, forming first conductor particles 4 on one side of the conductor layer 1; wherein the first conductor particles 4 are distributed on the first protrusions 11 in a concentrated manner; specifically, the first conductor particles 4 may be formed on the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
S122, forming a glue film layer 2 on the side of the conductor layer 1 where the first conductor particles 4 are formed.
Combine fig. 1 and fig. 7 to show, conductor layer 1 is close to conductive adhesive layer 3's one side is for leveling the surface or not leveling the surface, works as conductor layer 1 is close to conductive adhesive layer 3's one side is when uneven the surface, conductor layer 1 is close to conductive adhesive layer 3's uneven surface includes a plurality of second convex parts 13 and a plurality of second depressed part 14, and is a plurality of second convex parts 13 and a plurality of second depressed part 14 interval sets up, and is a plurality of second convex parts 13 stretches into conductive adhesive layer 3. When the conductive adhesive film is pressed for use, the plurality of second convex parts 13 can pierce the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conduction of the conductive adhesive film is effectively improved, and the connection reliability of the conductive adhesive film and the conductor is further improved; in addition, during the pressfitting, the gluey class material that constitutes conductive adhesive layer 3 is extruded on second depressed part 14 to increased conductive adhesive film's the appearance of glue volume, thereby be difficult to appear conductive adhesive film and conductor and peel off the phenomenon, avoided current conductive adhesive film because the appearance of glue volume is not enough to lead to conductive adhesive film and conductor to peel off the problem, and then guaranteed conductive adhesive film and conductor connection's reliability effectively. In addition, when the conductive adhesive film is pressed and used, the first convex part 11 and the second convex part 13 on the conductor layer 1 can respectively pierce the adhesive film layer 2 and the conductive adhesive layer 3 and are in contact conduction with the conductor, so that the conductive adhesive film is in contact conduction with the conductor, and therefore the conductive adhesive film can be in contact conduction with the conductor without arranging conductive particles in the adhesive film layer 2 and the conductive adhesive layer 3, the conduction resistance is greatly reduced, and the cost is greatly reduced.
In this embodiment of the present invention, the step S13 specifically includes:
s131, forming second conductor particles 5 on the other side of the conductor layer 1; wherein the second conductive particles 5 are distributed on the second protrusions 13 in a concentrated manner; specifically, the second conductor particles 5 may be formed on the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating;
s132, forming a conductive adhesive layer 3 on the side of the conductive layer 1 where the second conductive particles 5 are formed.
Preferably, the step S12 is specifically:
s21, coating the adhesive film layer 2 on the release film;
s22, pressing and transferring the adhesive film layer 2 to one side of the conductor layer 1; or the like, or, alternatively,
s31, coating a glue film layer 2 on one side of the conductor layer 1.
Preferably, the step S13 is specifically:
s31, coating a conductive adhesive layer 3 on the release film;
s32, pressing and transferring the conductive adhesive layer 3 to the other side of the conductor layer 1; or the like, or, alternatively,
and S41, coating a conductive adhesive layer 3 on the other side of the conductor layer 1.
Referring to fig. 9, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a surface of the adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a surface of the conductive adhesive layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is arranged on the side of the adhesive film layer 2 away from the conductor layer 1 to protect the outer surface of the adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is arranged on the side of the conductive adhesive layer 3 away from the conductor layer 1 to protect the outer surface of the conductive adhesive layer 3 from impurities such as external dust, wherein the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
To sum up, the embodiment of the invention provides a conductive adhesive film, a circuit board and a method for manufacturing the conductive adhesive film, wherein the conductive adhesive film includes an adhesive film layer 2, a conductor layer 1 and a conductive adhesive layer 3, the conductor layer 1 is disposed between the adhesive film layer 2 and the conductive adhesive layer 3, one surface of the conductor layer 1 close to the adhesive film layer 2 is a non-flat surface, the non-flat surface of the conductor layer 1 close to the adhesive film layer 2 includes a plurality of first convex portions 11 and a plurality of first concave portions 12, the plurality of first convex portions 11 and the plurality of first concave portions 12 are disposed at intervals, and the plurality of first convex portions 11 extend into the adhesive film layer 2. When the conductive adhesive film is pressed for use, the first convex part 11 pierces through the adhesive film layer 2 and is in contact conduction with the ground layer of the printed circuit board, so that the poor grounding stability of the conductive adhesive film caused by the change of the stacking state of conductive particles of the conductive adhesive film in the prior art is avoided, the contact conduction of the conductive adhesive film and the ground layer of the printed circuit board is ensured, and the grounding stability of the conductive adhesive film is effectively improved; in addition, through setting up conductor layer 1 to make most conductive particle in the conductive adhesive layer 3 can contact with conductor layer 1, thereby increased conductive particle's overlap ratio, reduced conductive adhesive film's resistance, and then be favorable to improving conductive adhesive film's electric conductivity, reduced conductive particle's use simultaneously, thereby reduce conductive adhesive film's manufacturing cost.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (15)
1. The utility model provides a conductive adhesive film, its characterized in that, includes glued membrane layer, conductor layer and conductive adhesive layer, the conductor layer is located glued membrane layer with between the conductive adhesive layer, the conductor layer is close to the one side of glued membrane layer is uneven surface, the conductor layer is close to the uneven surface of glued membrane layer includes a plurality of first convex parts and a plurality of first depressed part, and is a plurality of first convex part and a plurality of first depressed part interval sets up, and is a plurality of first convex part stretches into glued membrane layer.
2. The conductive adhesive film of claim 1, wherein the conductor layer has first conductive particles disposed on the non-flat surface of the adhesive film layer, and the first conductive particles are distributed on the first protrusions.
3. The conductive adhesive film of claim 1, wherein a surface of the conductive layer adjacent to the conductive adhesive layer is a flat surface;
or, the conductor layer is close to conductive adhesive layer's one side is uneven surface, the conductor layer is close to conductive adhesive layer's uneven surface includes a plurality of second convex parts and a plurality of second depressed part, and is a plurality of second convex part and a plurality of second depressed part interval sets up, and is a plurality of the second convex part stretches into conductive adhesive layer.
4. The conductive adhesive film as claimed in claim 2, wherein second conductive particles are disposed on a surface of the conductive layer adjacent to the conductive adhesive layer, and the second conductive particles extend into the conductive adhesive layer.
5. The conductive adhesive film according to claim 4, wherein the first conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape, and/or the second conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape.
6. The conductive adhesive film according to claim 4, wherein the number of the first conductive particles is plural, and the plural first conductive particles are regularly or irregularly distributed on one surface of the conductive layer close to the adhesive film layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the second conductor particles are regularly or irregularly distributed on one surface, close to the conductive adhesive layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the conductive adhesive layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
7. The conductive adhesive film of claim 4, wherein the first conductor particles comprise one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles comprise one or more of metal particles, carbon nanotube particles, and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
8. The electroconductive adhesive film according to any one of claims 1 to 7, wherein the adhesive film layer comprises an adhesive layer containing electroconductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
9. The conductive adhesive film according to any one of claims 1 to 7, wherein the conductive layer has a thickness of 0.01 μm to 45 μm, the adhesive film layer has a thickness of 0.1 μm to 45 μm, and the conductive adhesive layer has a thickness of 0.1 μm to 60 μm.
10. The adhesive conductive film of any one of claims 1-7, further comprising a first peelable protective film layer disposed on a side of the adhesive film layer away from the conductor layer and a second peelable protective film layer disposed on a side of the adhesive conductive film layer away from the conductor layer.
11. A circuit board, comprising a printed circuit board and the conductive film of any one of claims 1 to 10, wherein the conductive film is disposed on the printed circuit board, and the first protrusion pierces through the film layer and is in contact with a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer.
12. A circuit board comprising a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film according to any one of claims 1 to 10, wherein the conductive adhesive film is provided on the electromagnetic shielding film, and the electromagnetic shielding film is provided on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, the first convex part of the conductive adhesive film pierces through the adhesive film layer and the insulating layer and is in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with the ground layer of the printed circuit board; the circuit board further comprises a steel sheet, and the steel sheet is arranged on one surface, far away from the adhesive film layer, of the conductive adhesive layer.
13. The preparation method of the conductive adhesive film is characterized by comprising the following steps:
forming a conductor layer;
forming a glue film layer on one side of the conductor layer;
forming a conductive adhesive layer on the other side of the conductor layer; the conductor layer is close to one side of the adhesive film layer is a non-flat surface, the conductor layer is close to the non-flat surface of the adhesive film layer and comprises a plurality of first convex parts and a plurality of first concave parts, the first convex parts and the first concave parts are arranged at intervals, and the first convex parts stretch into the adhesive film layer.
14. The method of claim 13, wherein forming the adhesive film layer on the one side of the conductor layer specifically comprises:
forming first conductor particles on one side of the conductor layer; wherein the first conductor particles are distributed on the first convex portions in a concentrated manner;
and forming a film adhesive layer on one side of the conductor layer on which the first conductor particles are formed.
15. The method of claim 13 or 14, wherein forming a conductive adhesive layer on the other side of the conductor layer specifically comprises:
forming second conductor particles on the other side of the conductor layer;
and forming a conductive adhesive layer on one side of the conductor layer on which the second conductor particles are formed.
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| CN201811423989.1A CN110783018A (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811423989.1A CN110783018A (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150030878A1 (en) * | 2012-06-21 | 2015-01-29 | Guangzhou Fang Bang Electronics Co., Ltd. | Ultrathin shielding film of high shielding effectiveness and manufacturing method thereof |
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| CN108323145A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
| CN209461170U (en) * | 2018-11-26 | 2019-10-01 | 广州方邦电子股份有限公司 | Conductive adhesive film and wiring board |
-
2018
- 2018-11-26 CN CN201811423989.1A patent/CN110783018A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150030878A1 (en) * | 2012-06-21 | 2015-01-29 | Guangzhou Fang Bang Electronics Co., Ltd. | Ultrathin shielding film of high shielding effectiveness and manufacturing method thereof |
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| CN108323145A (en) * | 2018-03-14 | 2018-07-24 | 广州方邦电子股份有限公司 | The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film |
| CN209461170U (en) * | 2018-11-26 | 2019-10-01 | 广州方邦电子股份有限公司 | Conductive adhesive film and wiring board |
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