CN110783016A - Conductive adhesive film, circuit board and preparation method of conductive adhesive film - Google Patents
Conductive adhesive film, circuit board and preparation method of conductive adhesive film Download PDFInfo
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- CN110783016A CN110783016A CN201811423718.6A CN201811423718A CN110783016A CN 110783016 A CN110783016 A CN 110783016A CN 201811423718 A CN201811423718 A CN 201811423718A CN 110783016 A CN110783016 A CN 110783016A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000010410 layer Substances 0.000 claims abstract description 545
- 239000004020 conductor Substances 0.000 claims abstract description 314
- 239000002245 particle Substances 0.000 claims abstract description 194
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims description 41
- 229910000831 Steel Inorganic materials 0.000 claims description 33
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- 238000000034 method Methods 0.000 claims description 17
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- 239000002923 metal particle Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 13
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- 230000000994 depressogenic effect Effects 0.000 claims description 10
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
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- 239000010941 cobalt Substances 0.000 claims description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Abstract
The invention relates to the technical field of electronics, and discloses a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film, wherein the conductive adhesive film is provided with a conductor layer, a first convex part and a second convex part, so that when the conductive adhesive film is pressed and used, the first convex part pierces through the first adhesive film layer and is in contact conduction with a conductor, and the second convex part pierces through the second adhesive film layer and is in contact conduction with another conductor, so that the conductive adhesive film is in contact conduction with the conductor, and poor conductive stability of the conductive adhesive film caused by the change of the stacking state of conductive particles of the conductive adhesive film in the prior art is avoided, so that the conductive stability of the conductive adhesive film is effectively improved; meanwhile, the condition that the overlapping rate of the conductive particles is low due to the fact that an independent conductive adhesive layer is adopted in the prior art is avoided, so that the resistance of the conductive adhesive film is reduced, and the improvement of the conductivity of the conductive adhesive film is facilitated.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film.
Background
The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the conventional conductive adhesive film generally has only a single conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein; in practical application, the conductive adhesive film is adhered between the conductors, so that the conduction between the conductors is realized. However, in the process of implementing the invention, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect between the conductive adhesive film and the conductor is not ideal, and the conductive stability of the conductive adhesive film is poor.
Disclosure of Invention
The embodiment of the invention aims to provide a conductive adhesive film, a circuit board and a preparation method of the conductive adhesive film, which can effectively improve the conductive stability of the conductive adhesive film.
In order to solve the above technical problem, the present invention provides a conductive adhesive film, including a first adhesive film layer, a conductor layer and a second adhesive film layer, where the conductor layer is disposed between the first adhesive film layer and the second adhesive film layer, one surface of the conductor layer close to the first adhesive film layer is a non-flat surface, the non-flat surface of the conductor layer close to the first adhesive film layer includes a plurality of first protrusions and a plurality of first recesses, the plurality of first protrusions and the plurality of first recesses are disposed at intervals, and the plurality of first protrusions extend into the first adhesive film layer; the conductor layer is close to the one side of second glued membrane layer is uneven surface, the conductor layer is close to uneven surface of second glued membrane layer includes a plurality of second convex parts and a plurality of second depressed part, and is a plurality of second convex part and a plurality of second depressed part interval sets up, and is a plurality of the second convex part stretches into the second glued membrane layer.
Preferably, the conductor layer is provided with first conductor particles on a non-flat surface close to the first adhesive film layer, and the first conductor particles are distributed on the first convex portions in a concentrated manner.
Preferably, second conductor particles are arranged on the uneven surface, close to the second adhesive film layer, of the conductor layer, and the second conductor particles are distributed on the second convex portions in a concentrated mode.
Preferably, the first conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape, and/or the second conductive particles have a cluster shape, an ice-hanging shape, a stalactite shape, or a dendritic shape.
Preferably, the number of the first conductor particles is multiple, and the multiple first conductor particles are regularly or irregularly distributed on one surface, close to the adhesive film layer, of the conductor layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the second conductor particles are regularly or irregularly distributed on one surface, close to the conductive adhesive layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the conductive adhesive layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
Preferably, the first conductor particles include one or more of metal particles, carbon nanotube particles and ferrite particles, and the second conductor particles include one or more of metal particles, carbon nanotube particles and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
Preferably, the first adhesive film layer comprises an adhesion layer containing conductive particles; or, the first adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the second adhesive film layer comprises an adhesive layer containing conductive particles; or the second adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the thickness of the conductor layer is 0.01 μm to 45 μm, the thickness of the first adhesive film layer is 0.1 μm to 45 μm, and the thickness of the second adhesive film layer is 0.1 μm to 45 μm.
Preferably, the conductive adhesive film further comprises a first peelable protective film layer and a second peelable protective film layer, the first peelable protective film layer is arranged on the surface, away from the conductor layer, of the first adhesive film layer, and the second peelable protective film layer is arranged on the surface, away from the conductor layer, of the second adhesive film layer.
The embodiment of the invention provides a conductive adhesive film, which is characterized in that a conductive layer, a first convex part and a second convex part are arranged, so that when the conductive adhesive film is pressed and used, the first convex part pierces through a first adhesive film layer and is in contact conduction with a conductor, and the second convex part pierces through a second adhesive film layer and is in contact conduction with another conductor, so that the conductive adhesive film is in contact conduction with the conductor, the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of conductive particles of the conductive adhesive film in the prior art is avoided, the conductive stability of the conductive adhesive film is effectively improved, the lower overlapping rate of the conductive particles caused by the adoption of a single conductive adhesive layer in the prior art is avoided, the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor is improved; in addition, as the conductive particles are not needed, the production cost of the conductive adhesive film is greatly reduced; in addition, when the conductive adhesive film is pressed, the adhesive substances forming the first adhesive film layer are extruded to the first concave part, and the adhesive substances forming the second adhesive film layer are extruded to the second concave part, so that the adhesive capacity of the conductive adhesive film is increased, the conductive adhesive film and the conductor are not easily peeled, the problem that the conductive adhesive film and the conductor are peeled off due to insufficient adhesive capacity of the conventional conductive adhesive film is avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board and the conductive film, where the conductive film is disposed on the printed circuit board, and the first protruding portion pierces through the first film layer and is electrically connected to a ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the glue film layer, of the conductive glue layer, and the second protruding portion pierces the second glue film layer and is in contact conduction with the steel sheet. The conductive film is arranged on the printed circuit board, so that electromagnetic wave interference is shielded for the printed circuit board, interference charges generated from the outside are accumulated on a conductor layer of the conductive film, and the first convex part pierces through the film layer and is in contact conduction with a stratum of the printed circuit board, so that the interference charges accumulated on the conductor layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and the second convex part pierces through the second adhesive film layer and is in contact conduction with the steel sheet, so that interference charges accumulated on the conductor layer can be led out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film, and the electromagnetic shielding film is disposed on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, the first convex part of the conductive adhesive film pierces through the adhesive film layer and the insulating layer and is in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with the ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the glue film layer, of the conductive glue layer, and the second protruding portion pierces the second glue film layer and is in contact conduction with the steel sheet. The conductive adhesive film is arranged on the electromagnetic shielding film which is arranged on the printed circuit board, so that the conductive adhesive film and the electromagnetic shielding film can shield electromagnetic wave interference for the printed circuit board, interference charges generated from the outside are accumulated on the conductive layer of the conductive adhesive film and the metal conductive layer of the electromagnetic shielding film, and the first convex part pierces the adhesive film layer and is in contact conduction with the stratum of the printed circuit board, so that the interference charges accumulated on the conductive layer and the metal conductive layer are led out through the stratum of the printed circuit board; in addition, the steel sheet is used as a reinforcing structure, and the second convex part pierces through the second adhesive film layer and is in contact conduction with the steel sheet, so that interference charges accumulated on the conductor layer and the metal conducting layer can be led out through the steel sheet.
In order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing a conductive adhesive film, including the following steps:
forming a conductor layer;
forming a first glue film layer on one side of the conductor layer;
forming a second glue film layer on the other side of the conductor layer; the conductor layer is close to one side of the first adhesive film layer and is a non-flat surface, the conductor layer is close to the non-flat surface of the first adhesive film layer and comprises a plurality of first convex parts and a plurality of first concave parts, the first convex parts and the first concave parts are arranged at intervals, and the first convex parts stretch into the first adhesive film layer.
As a preferred scheme, forming a first glue film layer on one side of the conductor layer specifically includes:
forming first conductor particles on one side of the conductor layer; wherein the first conductor particles are distributed on the first convex portions in a concentrated manner;
and forming a first adhesive film layer on one side of the conductor layer on which the first conductor particles are formed.
Preferably, one surface of the conductor layer, which is close to the second adhesive film layer, is a non-flat surface, the non-flat surface of the conductor layer, which is close to the second adhesive film layer, includes a plurality of second protrusions and a plurality of second recesses, the plurality of second protrusions and the plurality of second recesses are arranged at intervals, and the plurality of second protrusions extend into the second adhesive film layer.
As a preferred scheme, forming a second glue film layer on the other side of the conductor layer specifically includes:
forming second conductor particles on the other side of the conductor layer; wherein the second conductive particles are distributed on the second convex portions in a concentrated manner;
and forming a second adhesive film layer on one side of the conductor layer on which the second conductor particles are formed.
The embodiment of the invention provides a preparation method of a conductive adhesive film, which comprises the following steps of firstly, forming a conductor layer, forming a first adhesive film layer on one side of the conductor layer, and forming a second adhesive film layer on the other side of the conductor layer, wherein one surface, close to the first adhesive film layer, of the conductor layer is a non-flat surface, the non-flat surface, close to the first adhesive film layer, of the conductor layer comprises a plurality of first convex parts and a plurality of first concave parts, the plurality of first convex parts and the plurality of first concave parts are arranged at intervals, and the plurality of first convex parts extend into the first adhesive film layer; the surface of the conductor layer close to the second adhesive film layer is an uneven surface, the uneven surface of the conductor layer close to the second adhesive film layer comprises a plurality of second convex parts and a plurality of second concave parts, the plurality of second convex parts and the plurality of second concave parts are arranged at intervals, the plurality of second convex parts extend into the second adhesive film layer, and the conductor layer, the first convex parts and the second convex parts are arranged, so that when the conductive adhesive film is pressed and used, the first convex parts pierce through the first adhesive film layer and are in contact conduction with one conductor, and the second convex parts pierce through the second adhesive film layer and are in contact conduction with the other conductor, thereby realizing that the conductive adhesive film is in contact conduction with the conductor, avoiding the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art, effectively improving the conductive stability of the conductive adhesive film, and simultaneously avoiding the low overlapping rate of the conductive particles caused by adopting an independent conductive adhesive layer in the, therefore, the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor is improved; in addition, as the conductive particles are not needed, the production cost of the conductive adhesive film is greatly reduced.
Drawings
FIG. 1 is a schematic structural diagram of a conductive adhesive film according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a conductive adhesive film including first conductive particles according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a conductive adhesive film including first conductive particles and second conductive particles;
fig. 4 is a schematic structural view of one-time molding of the first conductor particles, the second conductor particles, and the conductor layer in the embodiment of the invention;
fig. 5 is a schematic structural view of a conductive adhesive film including a first peelable protective film layer and a second peelable protective film layer in an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a wiring board in an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of another embodiment of a wiring board in an example of the present invention;
FIG. 8 is a schematic flow chart of a method for manufacturing an electro-conductive adhesive film according to an embodiment of the present disclosure;
wherein, 1, a conductor layer; 11. a first convex portion; 12. a first recess; 13. a second convex portion; 14. a second recess; 2. a first adhesive film layer; 3. a second adhesive film layer; 4. a first conductive particle; 5. a second conductive particle; 6. a first peelable protective film layer; 7. a second peelable protective film layer; 8. a printed wiring board; 81. a steel sheet; 82. an earth formation; 83. a first ground via; 84. a second ground via; 9. an electromagnetic shielding film; 91. an insulating layer; 92. a metal conductive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a conductive adhesive film according to a preferred embodiment of the present invention includes a first adhesive film layer 2, a conductor layer 1 and a second adhesive film layer 3, where the conductor layer 1 is disposed between the first adhesive film layer 2 and the second adhesive film layer 3, one surface of the conductor layer 1 close to the first adhesive film layer 2 is a non-flat surface, the non-flat surface of the conductor layer 1 close to the first adhesive film layer 2 includes a plurality of first protrusions 11 and a plurality of first recesses 12, the plurality of first protrusions 11 and the plurality of first recesses 12 are disposed at intervals, and the plurality of first protrusions 11 extend into the first adhesive film layer 2; the conductor layer 1 is close to the non-flat surface of second glued membrane layer 3 includes a plurality of second convex parts 13 and a plurality of second depressed part 14, and is a plurality of second convex parts 13 and a plurality of second depressed part 14 interval sets up, and is a plurality of second convex parts 13 stretches into second glued membrane layer 3.
In the embodiment of the invention, the conductive layer 1, the first convex part 11 and the second convex part 13 are arranged, so that when the conductive adhesive film is pressed and used, the first convex part 11 pierces through the first adhesive film layer 2 and is in contact conduction with a conductor, and the second convex part 13 pierces through the second adhesive film layer 3 and is in contact conduction with another conductor, so that the conductive adhesive film is in contact conduction with the conductor, and the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art is avoided, so that the conductive stability of the conductive adhesive film is effectively improved, and the low overlapping rate of the conductive particles caused by the adoption of a single conductive adhesive layer in the prior art is avoided, so that the resistance of the conductive adhesive film is reduced, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor; in addition, as the conductive particles are not needed, the production cost of the conductive adhesive film is greatly reduced; in addition, when the conductive adhesive film is pressed, the adhesive substances forming the first adhesive film layer 2 are extruded to the first concave part 12, and the adhesive substances forming the second adhesive film layer 3 are extruded to the second concave part 14, so that the adhesive capacity of the conductive adhesive film is increased, the peeling phenomenon of the conductive adhesive film and a conductor is not easy to occur, the problem that the conductive adhesive film and the conductor are peeled off due to insufficient adhesive capacity of the conventional conductive adhesive film is avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 close to the first adhesive film layer 2 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the first adhesive film layer 2 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the uneven surface of the conductor layer 1 close to the first adhesive film layer 2 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude and/or interval of the fluctuation on the uneven surface are different.
In the embodiment of the present invention, the plurality of first protrusions 11 may have a certain distance from the outer surface of the first adhesive film layer 2, and may also contact with the outer surface of the first adhesive film layer 2 or extend out of the outer surface of the first adhesive film layer 2.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each first protrusion 11 and the adjacent first recess 12 is the same. By setting the distance between each first convex part 11 and the adjacent first concave part 12 to be the same, the first convex parts 11 can uniformly pierce through the first adhesive film layer 2, thereby further ensuring that the conductor layer 1 is in contact with the conductor and improving the conduction efficiency. Preferably, each of the first protrusions 11 has the same shape; each of the first recesses 12 has the same shape; wherein each first convex part 11 is in an axisymmetric structure; each first concave part 12 is in an axisymmetric structure; of course, each of the first protrusions 11 may also have a non-axisymmetrical structure, and each of the first recesses 12 may also have a non-axisymmetrical structure. Because the distance between each first convex part 11 and the adjacent first concave part 12 is the same, the shape of each first convex part 11 is the same, and the shape of each first concave part 12 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
In the embodiment of the present invention, the uneven surface of the conductor layer 1 close to the second adhesive film layer 3 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the conductor layer 1 close to the second adhesive film layer 3 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation on the uneven surface and the interval of the fluctuation are the same; when the uneven surface of the conductor layer 1 close to the second adhesive film layer 3 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude and/or interval of the fluctuation on the uneven surface are different.
In the embodiment of the present invention, the plurality of second protrusions 13 may have a certain distance from the outer surface of the second adhesive film layer 3, and may also contact with the outer surface of the second adhesive film layer 3 or extend out of the outer surface of the second adhesive film layer 3.
In the embodiment of the present invention, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each second protrusion 13 and the adjacent second recess 14 in the embodiment is the same. By setting the distance between each second convex portion 13 and the adjacent second concave portion 14 to be the same, the second convex portions 13 can uniformly pierce through the second adhesive film layer 3, so that the conductor layer 1 is further ensured to be in contact with the conductor, and the conduction efficiency is improved. Preferably, each of the second protrusions 13 has the same shape; each of the second recesses 14 has the same shape; wherein each of the second protrusions 13 is of an axisymmetric structure; each of the second recessed portions 14 is of an axisymmetric structure; of course, each of the second protrusions 13 may also have a non-axisymmetrical structure, and each of the second recesses 14 may also have a non-axisymmetrical structure. Because the distance between each second convex part 13 and the adjacent second concave part 14 is the same, the shape of each second convex part 13 is the same, and the shape of each second concave part 14 is the same, the glue capacity of the surface of the conductor layer 1 is uniform, the problem that the existing conductive adhesive film is stripped from the conductor due to insufficient glue capacity is further avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
Preferably, the undulation degree of the conductor layer 1 near the uneven surface of the first adhesive film layer 2 (i.e. the distance between the highest point and the lowest point of the side of the conductor layer 1 near the first adhesive film layer 2) is 0.1 μm-30 μm, and the undulation degree of the conductor layer 1 near the uneven surface of the second adhesive film layer 3 (i.e. the distance between the highest point and the lowest point of the side of the conductor layer 1 near the second adhesive film layer 3) is 0.1 μm to 30 μm, and the undulation degree of the side of the conductor layer 1 near the first adhesive film layer 2 and the undulation degree of the side of the conductor layer 1 near the second adhesive film layer 3 are set within the above range, so that the piercing function of the conductor layer 1 can be enhanced, therefore, the interference charges accumulated in the conductor layer 1 are smoothly led out, and the interference source caused by the accumulation of the interference charges is avoided.
As shown in fig. 2 to 4, in order to further ensure that the conductor layer 1 is in contact with a conductor, the conductor layer 1 of the present embodiment is provided with first conductor particles 4 on the non-flat surface close to the first adhesive film layer 2. By providing the conductor layer 1 with first conductor particles 4 on the non-flat surface close to the first adhesive film layer 2, the first adhesive film layer 2 is pierced, thereby further ensuring that the conductor layer 1 is in contact with a conductor. Preferably, the first conductive particles 4 are distributed on the first protrusions 11 in a concentrated manner, so that the conductive layer 1 can more easily pierce through the first adhesive film layer 2 during the lamination process.
In order to further ensure that the conductor layer 1 is in contact with a conductor, as shown in fig. 3 and 4, the conductor layer 1 of the present embodiment is provided with second conductor particles 5 on the non-flat surface close to the second adhesive film layer 3. By providing the conductor layer 1 with second conductor particles 5 on the non-flat surface close to the second adhesive film layer 3, the second adhesive film layer 3 is pierced, thereby further ensuring that the conductor layer 1 is in contact with the conductor. Preferably, the second conductive particles 5 are distributed on the second protrusions 13 in a concentrated manner, so that the conductive layer 1 can more easily pierce through the second adhesive film layer 3 during the lamination process.
In the implementation shown in fig. 3 and 4, the conductive layer 1 may be formed first, and then the first conductive particles 4 and the second conductive particles 5 may be formed on the conductive layer 1 by another process. Of course, the conductor layer 1, the first conductor particles 4, and the second conductor particles 5 may also be an integral structure formed by a one-time molding process.
As shown in fig. 2 and 3, the height h1 of the first conductive particle 4 is preferably 0.1 μm to 30 μm, the height h2 of the second conductive particle 5 is preferably 0.1 μm to 30 μm, and the thickness of each of the first adhesive film layer 2 and the second adhesive film layer 3 is preferably 0.1 μm to 80 μm. By setting the heights of the first conductor particles 4 and the second conductor particles 5 to be 0.1-30 μm, and the thicknesses of the first adhesive film layer 2 and the second adhesive film layer 3 to be 0.1-80 μm, it is ensured that the first conductor particles 4 can pierce the first adhesive film layer 2 and the second conductor particles 5 can pierce the second adhesive film layer 3 when the conductive adhesive film is used for lamination, so that the conductive adhesive film can be in contact conduction with a conductor. Further, the thickness of the conductor layer 1 is preferably 0.01 μm to 45 μm to ensure that the conductor layer 1 is not easily broken and has good flexibility.
As shown in fig. 2 and 3, the first conductive particles 4 are distributed in both the first concave portion 12 and the first convex portion 11, and the sum of the height H1 of any first convex portion 11 and the height H1 of the first conductive particles 4 located on the first convex portion 11 is also 1 to 30 μm. Of course, the self height H1 of the first conductive particles 4 disposed on the first protrusions 11 may be 1 to 30 μm, and then the sum of the height H1 of the first protrusions 11 and the self height H1 of the first conductive particles 4 disposed on the first protrusions 11 is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film; in addition, the second conductive particles 5 are distributed in both the second concave portions 13 and the second convex portions 14, and the sum of the height H2 of any one second convex portion 14 and the height H2 of the second conductive particle 5 located on the second convex portion 14 is also 1 to 30 μm. Of course, the self height H2 of the second conductive particles 5 disposed on the second protrusions 14 may be 1 to 30 μm, and then the sum of the height H2 of the second protrusions 14 and the self height H2 of the second conductive particles 5 disposed on the second protrusions 14 is greater than 1 to 30 μm, so as to further enhance the electrical connection performance of the conductive adhesive film.
The first conductor particles 4 may have a certain distance from the outer surface of the first adhesive film layer 2, and may also contact the outer surface of the first adhesive film layer 2 or extend out of the outer surface of the first adhesive film layer 2; the second conductor particles 5 may have a certain distance from the outer surface of the second adhesive film layer 3, and may also contact the outer surface of the second adhesive film layer 3 or extend out of the outer surface of the second adhesive film layer 3. In addition, the outer surfaces of the first adhesive film layer 2 and the second adhesive film layer 3 may be flat surfaces without undulation, or may be uneven surfaces with gentle undulation.
In the embodiment of the present invention, the number of the first conductor particles 4 is plural, and the plural first conductor particles 4 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the adhesive film layer 2; a plurality of the first conductor particles 4 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the adhesive film layer 2; the shapes of the plurality of first conductor particles 4 are the same or different; the plurality of first conductor particles 4 may be the same or different in size; and/or the number of the second conductor particles 5 is multiple, and the multiple second conductor particles 5 are regularly or irregularly distributed on one surface of the conductor layer 1 close to the conductive adhesive layer 3; a plurality of the second conductor particles 5 are continuously or discontinuously distributed on one side of the conductor layer 1 close to the conductive adhesive layer 3; the shapes of the plurality of second conductor particles 5 are the same or different; the second conductor particles 5 may be the same or different in size. The plurality of first conductor particles 4 are regularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are periodically distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2, that is, the plurality of first conductor particles 4 are irregularly distributed on the surface of the conductor layer 1 close to the adhesive film layer 2; the second conductor particles 5 are regularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are periodically distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3; the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3, which means that the second conductor particles 5 are irregularly distributed on the surface of the conductor layer 1 close to the conductive adhesive layer 3.
It should be noted that the shapes of the first conductive particles 4 and the second conductive particles 5 in fig. 2 to 4 are merely exemplary, and due to differences in process means and parameters, the first conductive particles 4 and the second conductive particles 5 may also have other shapes such as clusters, ice-hanging shapes, stalactites, and dendrites. In addition, the first conductive particles 4 and the second conductive particles 5 in the embodiment of the present invention are not limited to the shapes shown in the drawings and described above, and any first conductive particles 4 and second conductive particles 5 having piercing and conductive functions are within the scope of the present invention.
The conductor layer 1 of the present embodiment may have a single-layer structure or a multi-layer structure; when the conductor layer 1 is a plurality of layers, one surface of each conductor layer 1, which is close to the first adhesive film layer 2, may be provided with first conductor particles 4, and one surface of each conductor layer 1, which is close to the second adhesive film layer 3, may be provided with second conductor particles 5 or may not be provided with second conductor particles 5. The first adhesive film layer 2 and the second adhesive film layer 3 may be of a single-layer structure or a multi-layer structure; the conductor layer 1, the first adhesive film layer 2, and the second adhesive film layer 3 may be provided in plurality. Preferably, when the conductor layer 1, the first adhesive film layer 2 and the second adhesive film layer 3 are respectively a plurality of, the first adhesive film layer 2, the conductor layer 1 and the second adhesive film layer 3 are sequentially arranged at intervals, for example, when the conductor layer 1, the first adhesive film layer 2 and the second adhesive film layer 3 are respectively 2, the arrangement sequence may be: one first adhesive film layer 2, one conductor layer 1, one second adhesive film layer 3, another first adhesive film layer 2, another conductor layer 1 and another second adhesive film layer 3, and so on, which will not be described herein; or, 2 only 1 glue film layer may be disposed between the conductor layers 1, for example, when the conductor layers 1 and the second glue film layers 3 are 2 respectively, and the first glue film layers 2 are 1, the arrangement sequence may be: one first adhesive film layer 2, one conductor layer 1, one second adhesive film layer 3, another conductor layer 1, and another second adhesive film layer 3, and so on, which will not be described herein. In addition, according to the actual production and application requirements, the conductor layer 1 of the present embodiment may be configured as a foamed shape, and the like, which is not described herein further.
Preferably, the thickness of the first adhesive film layer 2 and the sum of the undulation degree of the conductor layer 1 close to the non-flat surface of the first adhesive film layer 2 and the height of the first conductor particles 4 satisfy a proportional relationship of 0.5-2, so as to ensure sufficient piercing strength and glue holding capacity, which is specifically embodied as follows: on one hand, the phenomenon that the conductive adhesive film and the conductor are stripped due to the fact that the glue containing amount is insufficient due to the fact that the thickness of the first adhesive film layer 2 is smaller than the sum of the undulation degree of the surface, close to the first adhesive film layer 2, of the conductor layer 1 and the height of the first conductor particles 4 is too small is prevented, and on the other hand, the phenomenon that the conductive adhesive film and the conductor cannot be conducted due to the fact that the piercing strength is insufficient due to the fact that the sum of the undulation degree of the surface, close to the first adhesive film layer 2, of the conductor layer 1 and the sum of the height of the.
Preferably, the sum of the thickness of the second adhesive film layer 3 and the undulation degree of the conductor layer 1 close to the non-flat surface of the second adhesive film layer 3 and the height of the second conductor particles 5 satisfies a proportional relationship of 0.5-2, so as to ensure sufficient piercing strength and glue holding capacity, which is specifically embodied as follows: on one hand, the phenomenon that the conductive adhesive film and the conductor are stripped due to the fact that the glue containing amount is insufficient due to the fact that the fluctuation degree of the thickness of the second adhesive film layer 3 is smaller than the fluctuation degree of the surface, close to the second adhesive film layer 3, of the conductor layer 1 and the height of the second conductor particles 5 are too small is prevented, and on the other hand, the phenomenon that the conductive adhesive film and the conductor cannot be conducted due to the fact that the piercing strength is insufficient due to the fact that the fluctuation degree of the surface, close to the second adhesive film layer 3, of the conductor layer 1 and the height of the second conductor particles 5 are too small.
In the embodiment of the present invention, in order to ensure that the conductor layer 1 has good conductivity, the conductor layer 1 includes one or more of a metal conductor layer, a carbon nanotube conductor layer, a ferrite conductor layer, and a graphene conductor layer. Wherein the metal conductor layer comprises a single metal conductor layer and/or an alloy conductor layer; the single metal conductor layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy conductor layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the embodiment of the present invention, the first conductor particles 4 include one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles 5 include one or more of metal particles, carbon nanotube particles, and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The first conductive particles 4 and the second conductive particles 5 may be made of the same material as the conductive layer 1, or may be different.
It should be noted that, when the conductive adhesive film in the prior art adopts a single conductive adhesive layer (composed of an insulating matrix and conductive particles), the conductive particles and the conductive particles can form a conductive path through a tunnel effect to realize electrical connection between the component and the circuit board, however, in the using process, under the influence of stress, weather and the like, the volume or shape of the insulating matrix is easy to change gradually or suddenly, so that the stacking state of the conductive particles inside the conductive adhesive layer is easy to change (that is, the thickness of the insulating matrix between the conductive particles and the conductive particles is easy to change), and since the conductive path formed between the conductive particles through the tunnel effect is mainly influenced by the thickness of the insulating matrix between the conductive particles, the conductive path of the prior conductive adhesive film is easy to fail due to the thickness change of the insulating matrix between the conductive particles in the using process, thereby making the electrical performance of the existing conductive adhesive film unstable. In the embodiment of the invention, the first adhesive film layer 2 and the second adhesive film layer 3 can form the conductive path without arranging conductive particles, so that the problem that the conductive path formed by the conductive particles in the conventional conductive adhesive film is easy to lose efficacy is solved, and the conductive stability of the conductive adhesive film is effectively improved.
Certainly, the first adhesive film layer 2 in this embodiment may also include an adhesive layer containing conductive particles, and the first adhesive film layer 2 includes the adhesive layer containing conductive particles to improve the conductive capability of the first adhesive film layer 2, so as to further ensure the conductivity of the conductive adhesive film; the particle size of the conductive particles in the first adhesive film layer 2 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the first adhesive film layer 2 to the adhesive layer in the first adhesive film layer 2 is 2% -80%. Certainly, the first adhesive film layer 2 may also include an adhesive layer containing no conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board, and improving the flexibility of the circuit board.
Similarly, the second adhesive film layer 3 in this embodiment may also include an adhesive layer containing conductive particles, and the second adhesive film layer 3 includes the adhesive layer containing conductive particles to improve the conductive capability of the second adhesive film layer 3, so as to further ensure the conductivity of the conductive adhesive film; the particle size of the conductive particles in the second adhesive film layer 3 is preferably 0.1-15 μm, and the volume ratio of the conductive particles in the second adhesive film layer 3 to the adhesive layer in the second adhesive film layer 3 is 2% -80%. Certainly, the second adhesive film layer 3 may also include an adhesive layer containing no conductive particles, so that on the premise of ensuring the conductivity of the conductive adhesive film, when the conductive adhesive film is used for being connected with a circuit board, the eddy current loss of the circuit board can be reduced, thereby ensuring the transmission integrity of the circuit board and improving the flexibility of the circuit board.
Preferably, the materials used for the first adhesive film layer 2 and the second adhesive film layer 3 are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, modified thermoplastic polyimides, polyurethanes, polyacrylates, and silicones.
Referring to fig. 5, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a side of the first adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a side of the second adhesive film layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is disposed on a surface of the first adhesive film layer 2 away from the conductor layer 1 to protect an outer surface of the first adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is disposed on a surface of the second adhesive film layer 3 away from the conductor layer 1 to protect an outer surface of the second adhesive film layer 3 from impurities such as external dust, and the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
Referring to fig. 6, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8 and the conductive film, where the conductive film is disposed on the printed circuit board 8, and the first protrusion 11 pierces through the first film layer 2 and is in contact with a ground layer 82 of the printed circuit board 8 for conduction; the circuit board further comprises a steel sheet 81, the steel sheet 81 is arranged on the surface, away from the first glue film layer 2, of the second glue film layer 3, and the second convex part 13 penetrates through the second glue film layer 3 and is in contact conduction with the steel sheet 81. The conductive film is arranged on the printed circuit board 8, so that electromagnetic wave interference is shielded for the printed circuit board 8, interference charges generated from the outside are accumulated on the conductor layer 1 of the conductive film, the first convex part 11 pierces through the first film layer 2 and is in contact conduction with the ground layer 82 of the printed circuit board 8, and the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8; in addition, the steel sheet 81 is used as a reinforcing structure, and the second convex part 13 pierces through the second adhesive film layer 3 and is in contact conduction with the steel sheet 81, so that the interference charges accumulated on the conductor layer 1 can be led out through the steel sheet 81.
Referring to fig. 6, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed wiring board 8, the printed wiring board 8 in this embodiment is provided with a first grounding hole 83, and the first protrusion 11 is connected with the ground layer 82 of the printed wiring board 8 through the first grounding hole 83, so that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed wiring board 8.
Referring to fig. 7, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a printed circuit board 8, an electromagnetic shielding film 9, and the conductive adhesive film, where the conductive adhesive film is disposed on the electromagnetic shielding film 9, and the electromagnetic shielding film 9 is disposed on the printed circuit board 8; the electromagnetic shielding film 9 comprises an insulating layer 91 and a metal conducting layer 92, the first convex part 11 of the conductive adhesive film pierces through the first adhesive film layer 2 and the insulating layer 91 and is in contact conduction with the metal conducting layer 92, and the metal conducting layer 92 is in contact conduction with the ground layer 82 of the printed circuit board 8; the circuit board further comprises a steel sheet 81, the steel sheet 81 is arranged on the surface, away from the first glue film layer 2, of the second glue film layer 3, and the second convex part 13 penetrates through the second glue film layer 3 and is in contact conduction with the steel sheet 81. The conductive adhesive film is arranged on the electromagnetic shielding film 9, the electromagnetic shielding film 9 is arranged on the printed circuit board 8, so that the conductive adhesive film and the electromagnetic shielding film 9 can shield the printed circuit board 8 from electromagnetic wave interference, interference charges generated from the outside are accumulated on the conductive layer 1 of the conductive adhesive film and the metal conductive layer 92 of the electromagnetic shielding film 9, the first convex part 11 pierces through the first adhesive film layer 2 and is in contact conduction with the ground layer 82 of the printed circuit board 8, and the interference charges accumulated on the conductive layer 1 and the metal conductive layer 92 are led out through the ground layer 82 of the printed circuit board 8; in addition, the steel sheet 81 serves as a reinforcing structure, and the second convex part 13 pierces through the second adhesive film layer 3 and is in contact conduction with the steel sheet 81, so that the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92 can be conducted out through the steel sheet 81.
Referring to fig. 7, in order to realize that the interference charges accumulated on the conductor layer 1 are led out through the ground layer 82 of the printed circuit board 8, the printed circuit board 8 in this embodiment is provided with a second grounding hole 84, and the metal conductive layer 92 is connected with the ground layer 82 of the printed circuit board 8 through the second grounding hole 84, so that the interference charges accumulated on the conductor layer 1 and the metal conductive layer 92 are led out through the ground layer 82 of the printed circuit board 8.
As shown in fig. 6 and 7, when the circuit board is applied to an electronic device, the steel sheet 81 can be in contact conduction with a housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 can be led out through the steel sheet 81, and the interference charges are led out through the housing of the electronic device, so that the interference charges accumulated on the conductor layer 1 of the conductive adhesive film are led into the ground, and the interference sources caused by the accumulation of the interference charges are prevented from affecting the normal operation of the circuit board. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a plurality of printed circuit boards and a plurality of conductive films, where the conductive films are disposed between two adjacent printed circuit boards, so as to conduct the ground layers of the two adjacent printed circuit boards with each other. Specifically, in the conductive adhesive film disposed between two adjacent printed circuit boards, the first protrusion 11 pierces through the first adhesive film layer 2 and is in contact conduction with the ground layer of one of the printed circuit boards, and the second protrusion 13 pierces through the second adhesive film layer 3 and is in contact conduction with the ground layer of the other printed circuit board, so that the ground layers of two adjacent printed circuit boards are in conduction with each other. Preferably, the printed circuit board 8 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board, and a rigid-flex printed board.
Referring to fig. 8, in order to solve the same technical problem, an embodiment of the present invention further provides a method for manufacturing a conductive adhesive film, including the following steps:
s11, forming a conductor layer 1;
s12, forming a first glue film layer 2 on one side of the conductor layer 1;
s13, forming a second glue film layer 3 on the other side of the conductor layer 1; one surface of the conductor layer 1, which is close to the first adhesive film layer 2, is an uneven surface, the uneven surface of the conductor layer 1, which is close to the first adhesive film layer 2, includes a plurality of first convex portions 11 and a plurality of first concave portions 12, the plurality of first convex portions 11 and the plurality of first concave portions 12 are arranged at intervals, and the plurality of first convex portions 11 extend into the first adhesive film layer 2; the conductor layer 1 is close to the non-flat surface of second glued membrane layer 3 includes a plurality of second convex parts 13 and a plurality of second depressed part 14, and is a plurality of second convex parts 13 and a plurality of second depressed part 14 interval sets up, and is a plurality of second convex parts 13 stretches into second glued membrane layer 3.
In this embodiment of the present invention, the step S11 specifically includes: forming a conductor layer 1 on the release film or the peelable metal carrier tape; wherein the conductor layer 1 may be formed on the release film or the peelable metal carrier tape by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
In the embodiment of the invention, the preparation method of the strippable metal carrier tape comprises the following steps:
s21, carrying out surface treatment on the substrate of the metal foil to ensure that the surface tension of the substrate is 40-90 dynes;
s22, forming a vacuum plating layer on one side of the substrate;
and S23, performing brightening treatment on the surface of the vacuum plating layer to form a surface metal bright layer so as to obtain the strippable metal carrier tape.
In this embodiment of the present invention, the step S12 specifically includes:
s121, forming first conductor particles 4 on one side of the conductor layer 1; wherein the first conductor particles 4 are distributed on the first protrusions 11 in a concentrated manner; specifically, the first conductor particles 4 may be formed on the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating.
S122, forming a first glue film layer 2 on the side of the conductor layer 1 where the first conductor particles 4 are formed.
In this embodiment of the present invention, the step S13 specifically includes:
s131, forming second conductor particles 5 on the other side of the conductor layer 1; wherein the second conductive particles 5 are distributed on the second protrusions 13 in a concentrated manner; specifically, the second conductor particles 5 may be formed on the conductor layer 1 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating;
s132, forming a second adhesive film layer 3 on the side of the conductor layer 1 where the second conductor particles 5 are formed.
Preferably, the step S12 is specifically:
s21, coating a first adhesive film layer 2 on the release film;
s22, pressing and transferring the first adhesive film layer 2 to one side of the conductor layer 1; or the like, or, alternatively,
s31, coating a first glue film layer 2 on one side of the conductor layer 1.
Preferably, the step S13 is specifically:
s31, coating a second adhesive film layer 3 on the release film;
s32, pressing and transferring the second adhesive film layer 3 to the other side of the conductor layer 1; or the like, or, alternatively,
and S41, coating a second adhesive film layer 3 on the other side of the conductor layer 1.
Referring to fig. 5, in order to protect the conductive adhesive film, the conductive adhesive film in this embodiment further includes a first peelable protective film layer 6 and a second peelable protective film layer 7, where the first peelable protective film layer 6 is disposed on a side of the first adhesive film layer 2 away from the conductor layer 1, and the second peelable protective film layer 7 is disposed on a side of the second adhesive film layer 3 away from the conductor layer 1. The first peelable protective film layer 6 is disposed on a surface of the first adhesive film layer 2 away from the conductor layer 1 to protect an outer surface of the first adhesive film layer 2 from impurities such as external dust, and the second peelable protective film layer 7 is disposed on a surface of the second adhesive film layer 3 away from the conductor layer 1 to protect an outer surface of the second adhesive film layer 3 from impurities such as external dust, and the first peelable protective film layer 6 and the second peelable protective film layer 7 are preferably release films, and the first peelable protective film layer 6 and the second peelable protective film layer 7 can be peeled off in use.
In summary, the embodiment of the invention provides a conductive adhesive film, a circuit board and a method for preparing the conductive adhesive film, wherein, the conductive adhesive film is provided with the conductive layer 1, the first convex part 11 and the second convex part 13, so that when the conductive adhesive film is pressed and used, the first convex part 11 pierces through the first glue film 2 and is in contact conduction with a conductor, the second convex part 13 pierces through the second glue film 3 and is in contact conduction with another conductor, thereby realizing the contact conduction between the conductive adhesive film and the conductor, avoiding the poor conductive stability of the conductive adhesive film caused by the change of the stacking state of the conductive particles of the conductive adhesive film in the prior art, thereby effectively improving the conductive stability of the conductive adhesive film, and simultaneously avoiding the lower overlapping rate of conductive particles caused by adopting a separate conductive adhesive layer in the prior art, thereby reducing the resistance of the conductive adhesive film, the conductivity of the conductive adhesive film is improved, and the conduction reliability between the conductive adhesive film and the conductor is improved; in addition, in an embodiment provided by the invention, since the first adhesive film layer 2 and the second adhesive film layer 3 can form a conductive path without arranging conductive particles, the problem that the conductive path formed by the conductive particles in the conventional conductive adhesive film through a tunnel effect is easy to lose efficacy is solved, the conductive stability of the conductive adhesive film is effectively improved, and the production cost of the conductive adhesive film is greatly reduced because a large amount of conductive particles are not required; in addition, when the conductive adhesive film is pressed, the adhesive substances forming the first adhesive film layer 2 are extruded to the first concave part 12, and the adhesive substances forming the second adhesive film layer 3 are extruded to the second concave part 14, so that the adhesive capacity of the conductive adhesive film is increased, the peeling phenomenon of the conductive adhesive film and a conductor is not easy to occur, the problem that the conductive adhesive film and the conductor are peeled off due to insufficient adhesive capacity of the conventional conductive adhesive film is avoided, and the connection reliability of the conductive adhesive film and the conductor is effectively ensured.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (15)
1. A conductive adhesive film is characterized by comprising a first adhesive film layer, a conductor layer and a second adhesive film layer, wherein the conductor layer is arranged between the first adhesive film layer and the second adhesive film layer, one surface, close to the first adhesive film layer, of the conductor layer is a non-flat surface, the non-flat surface, close to the first adhesive film layer, of the conductor layer comprises a plurality of first convex parts and a plurality of first concave parts, the plurality of first convex parts and the plurality of first concave parts are arranged at intervals, and the plurality of first convex parts extend into the first adhesive film layer; the conductor layer is close to the one side of second glued membrane layer is uneven surface, the conductor layer is close to uneven surface of second glued membrane layer includes a plurality of second convex parts and a plurality of second depressed part, and is a plurality of second convex part and a plurality of second depressed part interval sets up, and is a plurality of the second convex part stretches into the second glued membrane layer.
2. The conductive adhesive film of claim 1, wherein the conductor layer has first conductive particles disposed on the non-flat surface thereof adjacent to the first adhesive film layer, and the first conductive particles are distributed on the first protrusions.
3. The conductive adhesive film of claim 2, wherein the conductor layer has second conductive particles disposed on the non-flat surface thereof adjacent to the second adhesive film layer, and the second conductive particles are distributed on the second protrusions.
4. The conductive adhesive film according to claim 3, wherein the first conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape, and/or the second conductive particles have a cluster-like or ice-hanging-like or stalactite-like or dendritic shape.
5. The conductive adhesive film according to claim 3, wherein the number of the first conductive particles is plural, and the plural first conductive particles are regularly or irregularly distributed on one surface of the conductive layer close to the adhesive film layer; a plurality of first conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the adhesive film layer; the shapes of a plurality of the first conductor particles are the same or different; a plurality of the first conductor particles are the same or different in size; and/or the presence of a gas in the gas,
the number of the second conductor particles is multiple, and the second conductor particles are regularly or irregularly distributed on one surface, close to the conductive adhesive layer, of the conductor layer; a plurality of second conductor particles are continuously or discontinuously distributed on one side of the conductor layer close to the conductive adhesive layer; the shapes of a plurality of the second conductor particles are the same or different; the second conductor particles may be the same or different in size.
6. The conductive adhesive film of claim 3, wherein the first conductor particles comprise one or more of metal particles, carbon nanotube particles, and ferrite particles, and the second conductor particles comprise one or more of metal particles, carbon nanotube particles, and ferrite particles; the metal particles comprise single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
7. The electroconductive adhesive film according to any one of claims 1 to 6, wherein the first adhesive film layer comprises an adhesive layer containing electroconductive particles; or, the first adhesive film layer comprises an adhesion layer without conductive particles.
8. The electroconductive adhesive film according to any one of claims 1 to 6, wherein the second adhesive film layer comprises an adhesive layer containing electroconductive particles; or the second adhesive film layer comprises an adhesion layer without conductive particles.
9. The conductive adhesive film according to any one of claims 1 to 6, wherein the conductive layer has a thickness of 0.01 μm to 45 μm, the first adhesive film layer has a thickness of 0.1 μm to 45 μm, and the second adhesive film layer has a thickness of 0.1 μm to 45 μm.
10. The adhesive conductive film of any one of claims 1-6, further comprising a first peelable protective film layer disposed on a side of the first adhesive film layer remote from the conductor layer and a second peelable protective film layer disposed on a side of the second adhesive film layer remote from the conductor layer.
11. A wiring board comprising a printed wiring board and the conductive adhesive film according to any one of claims 1 to 10, wherein the conductive adhesive film is provided on the printed wiring board, and the first convex portion pierces the first adhesive film layer and is electrically connected to a ground layer of the printed wiring board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the glue film layer, of the conductive glue layer, and the second protruding portion pierces the second glue film layer and is in contact conduction with the steel sheet.
12. A circuit board comprising a printed circuit board, an electromagnetic shielding film, and the conductive adhesive film according to any one of claims 1 to 10, wherein the conductive adhesive film is provided on the electromagnetic shielding film, and the electromagnetic shielding film is provided on the printed circuit board; the electromagnetic shielding film comprises an insulating layer and a metal conducting layer, the first convex part of the conductive adhesive film pierces through the adhesive film layer and the insulating layer and is in contact conduction with the metal conducting layer, and the metal conducting layer is in contact conduction with the ground layer of the printed circuit board; the circuit board further comprises a steel sheet, the steel sheet is arranged on one surface, away from the glue film layer, of the conductive glue layer, and the second protruding portion pierces the second glue film layer and is in contact conduction with the steel sheet.
13. The preparation method of the conductive adhesive film is characterized by comprising the following steps:
forming a conductor layer;
forming a first glue film layer on one side of the conductor layer;
forming a second glue film layer on the other side of the conductor layer;
one surface, close to the first adhesive film layer, of the conductor layer is a non-flat surface, the non-flat surface, close to the first adhesive film layer, of the conductor layer comprises a plurality of first convex portions and a plurality of first concave portions, the plurality of first convex portions and the plurality of first concave portions are arranged at intervals, and the plurality of first convex portions extend into the first adhesive film layer; the conductor layer is close to the one side of second glued membrane layer is uneven surface, the conductor layer is close to uneven surface of second glued membrane layer includes a plurality of second convex parts and a plurality of second depressed part, and is a plurality of second convex part and a plurality of second depressed part interval sets up, and is a plurality of the second convex part stretches into the second glued membrane layer.
14. The method of claim 13, wherein forming the first adhesive film layer on the one side of the conductor layer specifically comprises:
forming first conductor particles on one side of the conductor layer; wherein the first conductor particles are distributed on the first convex portions in a concentrated manner;
and forming a first adhesive film layer on one side of the conductor layer on which the first conductor particles are formed.
15. The method of claim 13 or 14, wherein forming a second adhesive film layer on the other side of the conductor layer specifically comprises:
forming second conductor particles on the other side of the conductor layer; wherein the second conductive particles are distributed on the second convex portions in a concentrated manner;
and forming a second adhesive film layer on one side of the conductor layer on which the second conductor particles are formed.
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| CN201811423718.6A CN110783016A (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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| CN201811423718.6A CN110783016A (en) | 2018-11-26 | 2018-11-26 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
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| CN110783016A true CN110783016A (en) | 2020-02-11 |
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