CN204119636U - A kind of electromagnetic wave shielding coverlay - Google Patents
A kind of electromagnetic wave shielding coverlay Download PDFInfo
- Publication number
- CN204119636U CN204119636U CN201420105696.XU CN201420105696U CN204119636U CN 204119636 U CN204119636 U CN 204119636U CN 201420105696 U CN201420105696 U CN 201420105696U CN 204119636 U CN204119636 U CN 204119636U
- Authority
- CN
- China
- Prior art keywords
- binding agent
- electromagnetic wave
- wave shielding
- basement membrane
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims abstract description 24
- 210000002469 basement membrane Anatomy 0.000 claims abstract description 21
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims description 33
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 11
- 229920006395 saturated elastomer Polymers 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 238000005452 bending Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- -1 moisture Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a kind of coverlay for flexible printed wiring board, specifically a kind of electromagnetic wave shielding coverlay; It is characterized in that: comprise the coloured insulating basement membrane, conductive layer, adhesive layer and the protective layer that superpose successively.This structure comprises the coloured insulating basement membrane, conductive layer, adhesive layer and the protective layer that superpose successively, can significantly simplify flexible printed wiring board processing procedure, improves timeliness, cost-saving, has effect and the effect of electromagnetic shielding film and traditional coverlay completely.
Description
Technical field
The utility model relates to a kind of coverlay for flexible printed wiring board, specifically a kind of electromagnetic wave shielding coverlay.
Background technology
The continuous progress of information, communication industry has driven the high speed development of microelectronics industry, and flexible printed wiring board (FPCB) obtains at numerous areas such as cell phone, notebook computer, LCDs to be applied more widely.The difference of flexible printed wiring board and rigid printed circuit (PCB) is that the former adopts coverlay protection; not only there is welding resistance, prevent copper wire to be oxidized and make FPC not by effects such as dust, moisture, chemicals erosions; but also there is the impact reducing stress in BENDING PROCESS, improve the folding anti-flex performance of flexible printed wiring board.
Along with Communication Equipment is towards the development in the directions such as multi-functional, intelligent and high-frequency high-speed, the electromagnetic interference problem of inside and outside is become day by day highlight, the traditional method of current head it off is post electromagnetic shielding film again making the wiring board skin posting coverlay, but be only limitted to local electromagnetism interference, and cost is high.Therefore patent announcement number adopts the mode of evaporation at coverlay surface direct plating layer of metal or metal alloy for CN201571254U, and to reach the effect of electromagnetism interference, but the coating of this structure is directly outside exposed, anti-soil and the effect such as anti-oxidant poor.To be the Metal Substrate coverlay of CN201491371U be notification number sticks agent at the surface coating of metal forming and be then pressed together on that wiring board is outer replaces traditional coverlay with this, same anti-soil and folding anti-flex performance deviation.
To be CN202319177U and notification number be notification number that coloured insulating basement membrane that CN202764317U mentions can play well covers and photoextinction flexible printed wiring board, but not mentioned electromagnetic wave shielding function.
Utility model content
The utility model, for the deficiencies in the prior art, provides a kind of coverlay for flexible printed wiring board, specifically a kind of electromagnetic wave shielding coverlay.
In order to achieve the above object, a kind of electromagnetic wave shielding coverlay of the utility model, comprises the coloured insulating basement membrane, conductive layer, adhesive layer and the protective layer that superpose successively.
Described coloured insulating basement membrane refers to the coating with insulation function, described " coloured " refers to except containing conventional black and white two kinds of colors, also comprise the superposition of the colors such as red, orange, yellow, green, blue, blue, purple or two or more color, to reach effect of good color recognition.It is electrical that described conductive layer has conducting, it forms on the surface of coloured insulating basement membrane the conductive layer that one deck is even, stable, powered is excellent by one or more methods such as physical vapour deposition (PVD), silk-screen, spraying or coatings, and the conducting medium of this conductive layer comprises one or more alloys such as gold, silver, copper, Nie, Chrome, aluminium, titanium.Described adhesive layer, refers to epoxy resin binding agent, saturated polyester system binding agent, one or more compositions in esters of acrylic acid binding agent or the improved composition wherein with good peel strength, anti-flammability, insulating properties, thermal endurance and resistance to bending performance etc.And protective layer refers to the one in order to protect in the release film of adhesive layer and release liners.
Preferably, the thickness of described coloured insulating basement membrane is between 5 μm to 50 μm, to reach good shielding, bending resistance folding endurance and insulating properties.
As the further improvement of such scheme, the thickness of described coloured insulating basement membrane is between 8 μm to 25 μm, further to reach good shielding, bending resistance folding endurance and insulating properties.
Preferably, the thickness of described conductive layer is between 0.1 μm to 5 μm.
As the further improvement of such scheme, the thickness of described conductive layer is between 0.15 μm to 0.5 μm.
Preferably, described adhesive layer is the one in epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent, or the composition that epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent are mutual, or epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent improved composition.
Preferably, the thickness of described adhesive layer is between 5 μm to 35 μm.
As the further improvement of such scheme, the thickness of described adhesive layer is between 7 μm to 25 μm.
Preferably, described protective layer is the one in both release film and release liners.
This structure comprises the coloured insulating basement membrane, conductive layer, adhesive layer and the protective layer that superpose successively, can significantly simplify flexible printed wiring board processing procedure, improves timeliness, cost-saving, has effect and the effect of electromagnetic shielding film and traditional coverlay completely.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present utility model.
Wherein, 1 is coloured insulating basement membrane, and 2 is conductive layer, and 3 is adhesive layer, and 4 is protective layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
With reference to Fig. 1, as can be seen from Figure 1, a kind of electromagnetic wave shielding coverlay of the utility model embodiment, comprises the coloured insulating basement membrane 1, conductive layer 2, adhesive layer 3 and the protective layer 4 that superpose successively.
Described coloured insulating basement membrane 1 refers to the coating with insulation function, described " coloured " refers to except containing conventional black and white two kinds of colors, also comprise the superposition of the colors such as red, orange, yellow, green, blue, blue, purple or two or more color, to reach effect of good color recognition.It is electrical that described conductive layer 2 has conducting, it forms on the surface of coloured insulating basement membrane 1 conductive layer 2 that one deck is even, stable, powered is excellent by one or more methods such as physical vapour deposition (PVD), silk-screen, spraying or coatings, and the conducting medium of this conductive layer 2 comprises one or more alloys such as gold, silver, copper, Nie, Chrome, aluminium, titanium.Described adhesive layer 3, refers to epoxy resin binding agent, saturated polyester system binding agent, one or more compositions in esters of acrylic acid binding agent or the improved composition wherein with good peel strength, anti-flammability, insulating properties, thermal endurance and resistance to bending performance etc.Protective layer 4 then refers to the one in order to protect in the release film of adhesive layer and release liners.
With reference to Fig. 1, in this embodiment, described coloured insulating basement membrane 1 is the black matte insulating basement membrane of 12.5 micron thickness, to reach good shielding, bending resistance folding endurance and insulating properties.Described conductive layer 2 is the uniform copper metal level of 0.2 micron, and described adhesive layer 3 is the epoxy adhesive of 15 microns.Certainly, also can be the one in epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent, or the composition that epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent are mutual, or epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent improved composition.Described protective layer 4 is the one in both release film and release liners.
In the process that conductive layer 2 makes, it is the vacuum magnetic-control sputtering method adopted on the surface of the coloured insulating basement membrane 1 of the black matte of 12.5 micron thickness in physical gas-phase deposite method, at the uniform copper metal level of coloured insulating basement membrane 1 surface deposition one deck 0.2 micron, this copper metal layer is conductive layer 2.And the making of adhesive layer 3 is after above step completes, there is in conductive layer 2 surface-coated the epoxy adhesive of insulating properties, with the speed of a motor vehicle of 12m/min by baking oven, and be the release film of 100g/25cm by fit 50 micron thickness, off-type force of press bonding roller, dry glue thickness is 15 microns.
This structure comprises the coloured insulating basement membrane 1, conductive layer 2, adhesive layer 3 and the protective layer 4 that superpose successively; can significantly simplify flexible printed wiring board processing procedure; improve timeliness, cost-saving, there is effect and the effect of electromagnetic shielding film and traditional coverlay completely.
Below the utility model is described in detail, but obviously, those skilled in the art can carry out various changes and improvements, and not deviate from the scope of the present utility model that appended claims limits.
Claims (8)
1. an electromagnetic wave shielding coverlay, is characterized in that: comprise the coloured insulating basement membrane, conductive layer, adhesive layer and the protective layer that superpose successively; The thickness of described coloured insulating basement membrane is between 5 μm to 50 μm.
2. a kind of electromagnetic wave shielding coverlay according to claim 1, is characterized in that: the thickness of described coloured insulating basement membrane is between 8 μm to 25 μm.
3. a kind of electromagnetic wave shielding coverlay according to claim 1, is characterized in that: the thickness of described conductive layer is between 0.1 μm to 5 μm.
4. a kind of electromagnetic wave shielding coverlay according to claim 3, is characterized in that: the thickness of described conductive layer is between 0.15 μm to 0.5 μm.
5. a kind of electromagnetic wave shielding coverlay according to claim 1, it is characterized in that: described adhesive layer is the one in epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent, or the composition that epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent are mutual, or epoxy resin binding agent, saturated polyester system binding agent, esters of acrylic acid binding agent improved composition.
6. a kind of electromagnetic wave shielding coverlay according to claim 1, is characterized in that: the thickness of described adhesive layer is between 5 μm to 35 μm.
7. a kind of electromagnetic wave shielding coverlay according to claim 6, is characterized in that: the thickness of described adhesive layer is between 7 μm to 25 μm.
8. a kind of electromagnetic wave shielding coverlay according to claim 1, is characterized in that: described protective layer is the one in both release film and release liners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420105696.XU CN204119636U (en) | 2014-03-10 | 2014-03-10 | A kind of electromagnetic wave shielding coverlay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420105696.XU CN204119636U (en) | 2014-03-10 | 2014-03-10 | A kind of electromagnetic wave shielding coverlay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204119636U true CN204119636U (en) | 2015-01-21 |
Family
ID=52336909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420105696.XU Expired - Lifetime CN204119636U (en) | 2014-03-10 | 2014-03-10 | A kind of electromagnetic wave shielding coverlay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204119636U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI634004B (en) * | 2017-01-10 | 2018-09-01 | 台虹科技股份有限公司 | Coverlay structure |
-
2014
- 2014-03-10 CN CN201420105696.XU patent/CN204119636U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI634004B (en) * | 2017-01-10 | 2018-09-01 | 台虹科技股份有限公司 | Coverlay structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170113 Address after: 343700 Ji'an city of Jiangxi Province Taihe County Industrial Park (North West Station) Patentee after: JIANGXI BANGLIDA TECHNOLOGY CO.,LTD. Address before: 523000 Guangdong city of Dongguan province Dongcheng District Niushan tin side venture industrial zone B floor Patentee before: DONGGUAN AOJU ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20150121 |
|
| CX01 | Expiry of patent term |