CN205124112U - Novel thermoset conductive film - Google Patents
Novel thermoset conductive film Download PDFInfo
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- CN205124112U CN205124112U CN201520832730.8U CN201520832730U CN205124112U CN 205124112 U CN205124112 U CN 205124112U CN 201520832730 U CN201520832730 U CN 201520832730U CN 205124112 U CN205124112 U CN 205124112U
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Abstract
The utility model discloses a novel thermoset conductive film, include last electrically conductive adhesion agent layer, thin copper foil layer, lower electrically conductive adhesion agent layer and leave the type layer, the thin copper foil layer is the copper foil layer that thickness is the 1 -12 micron, the thin copper foil level in go up electrically conductive adhesion agent layer with down between the electrically conductive adhesion agent layer, down electrically conductive adhesion agent level in thin copper foil layer and from the type layer between. This novel thermoset conductive film has splendid electrical characteristics, mechanical characteristic and electromagnetic shield effect, production simple process, and easily low reaches FPC factory processing operation.
Description
Technical field
The utility model belongs to Copper Powder Fiued Conductive Coating Used in Printed Circut Board technical field, particularly a kind of thermosetting conductive adhesive film with high electromagnetic wave shielding function, high connductivity degree, high Bonding strength.
Background technology
Miniaturized to electronic building brick, the microminiaturized and printed circuit board (PCB) densification of developing rapidly of electronics and information industry, highly integrated requirement are more and more higher, functionally, then need signal transmission at a high speed from strength to strength.The raising of line density and work bandwidth, in addition in practical operation, configuration is not good enough, electromagnetic interference (ElectromagneticInterference in electron trade, EMI) problem is more and more serious, therefore develops a kind ofly effectively to avoid electromagnetic interference and ensure the material of normal signal transmission effect or components and parts highly significant.Be proposed the screen for film-type flexible printed wiring board (FPC) in the market, be widely adopted in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera.Given this, a kind of electronic material possessing high-adhesive-strength, high conduction, high shielding of novelty is urgently developed.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of novel hot setting conductive adhesive film, have high-adhesive-strength, high conduction and high electromagnetic wave shielding, and manufacture method is simple, easy to implement.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of novel hot setting conductive adhesive film, comprise conductive adhesive layer, thin copper foil layer, lower conductive adhesive layer and release layer, the copper foil layer of described thin copper foil layer to be thickness be 1-12 micron, described thin copper foil layer is on described between conductive adhesive layer and described lower conductive adhesive layer, and described lower conductive adhesive layer is between described thin copper foil layer and release layer.
The utility model in order to the further technical scheme solving its technical problem and adopt is:
Say further, the thickness of described upper conductive adhesive layer and described lower conductive adhesive layer is 8-28 micron separately.
Say further, the thickness of described release layer is 25-50 micron.
Say further, described upper conductive adhesive layer and described lower conductive adhesive layer are epoxy resin layer, acrylic resin layer, amido formate resin, silicon rubber resin, poly-to ring dimethylbenzene resin, bismaleimides resin or polyimide resin layer separately.
Say further, described upper conductive adhesive layer and described lower conductive adhesive layer are thermosetting glue-line separately.
Say further, described thin copper foil layer is carrier copper foil, rolled copper foil or electrolytic copper foil.
Say further, described release layer is that PET fluorine moulds release film, PET silicate-containing oil release film, the sub-light release film of PET or PE release film.
Say further, described release layer is single-sided parting film or two-sided release film, preferably two-sided release film.
The beneficial effects of the utility model are: novel hot setting conductive adhesive film of the present utility model is owing to having upper conductive adhesive layer, thin copper foil layer and lower conductive adhesive layer, and to state thin copper foil layer be thickness is the copper foil layer of 1-12 micron, thin copper foil layer is between upper conductive adhesive layer and lower conductive adhesive layer, therefore, this novel hot setting conductive adhesive film has splendid conduction, high peeling force and effectiveness, production technology is simple, and is easy to the processing of downstream FPC factory.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of novel hot setting conductive adhesive film of the present utility model after peeling off release layer.
Embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, not deviating under the category that the utility model discloses, can give different modifications and change.
Embodiment: a kind of novel hot setting conductive adhesive film, as shown in Figure 1, be made up of upper conductive adhesive layer 101, thin copper foil layer 102, lower conductive adhesive layer 103 and release layer 104, described thin copper foil layer 102 is between upper conductive adhesive layer 101 and lower conductive adhesive layer 103, and described lower conductive adhesive layer 103 is between thin copper foil layer 102 and release layer 104.
Upper conductive adhesive layer in the utility model 101 and lower conductive adhesive layer 103 clearly facilitate used for describing, and both there is no substantive difference on material.
Described upper conductive adhesive layer 101 and lower conductive adhesive layer 103 thickness range are 8 microns to 28 microns separately.
The thickness range of described thin copper foil layer 102 is 1 micron to 12 microns.
The thickness range of described release layer 104 is 25 microns to 50 microns.
The binder materials of described upper conductive adhesive layer 101 and lower conductive adhesive layer 103 is selected from epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, gathers one or more in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.
Electric conducting material in described upper conductive adhesive layer 101 and lower conductive adhesive layer 103 be selected from silver powder, copper powder, zinc powder, nickel powder, aluminium powder, golden copper-clad powder, golden nickel coat powder, silver-coated copper powder, silver coated nickel powder and alloy powder at least one in the conductive compound such as at least one or graphite forming group and composition thereof.
In described upper conductive adhesive layer 101 and lower conductive adhesive layer 103, electric conducting material proportion is 20%-75%, and sticker proportion is 25%-80%.
Described upper conductive adhesive layer 101 and lower conductive adhesive layer 103 are the one of thermosetting cement.
Described thin copper foil layer 102 is carrier copper foil, rolled copper foil or electrolytic copper foil.If select carrier copper foil (being divided into carrier part, peel ply and thin copper layer part), coating after adopt certain way stripping carrier part and peel ply after this thin copper foil layer 102.
Described release layer 104 moulds release film, PET silicate-containing oil release film, the sub-light release film of PET or PE release film for PET fluorine, for keeping the stickiness of conductive adhesive layer, is beneficial to follow-uply be bonding on circuit board or use is made in other pressing.
Described release layer 104 is single or double release film, preferentially selects two-sided release film, and color is pure white, milky or Transparent color, preferentially selects pure white or milky.Two-sided release film is selected can effectively to avoid product to occur adherent phenomenon when rolling, and pure white or milky release film areflexia optical issue, when using numerically controlled automatic equipment engraving circuit, infrared induction can be located by fast accurate, have recognition reaction concurrently simultaneously, during processing operation, can effectively prevent artificial leakage from tearing.
Novel hot setting conductive adhesive film of the present utility model obtains by following methods: at thin copper foil layer rubbing method, conductive adhesive layer is formed at copper foil layer on the surface, and make conductive adhesive layer be in B-stage (being partly polymerized semi-harden) state, with rubbing method, conductive adhesive layer is formed at thin copper foil layer another side on the surface again, namely release film of finally fitting forms described novel hot setting conductive adhesive film.
Conduction analytical test is carried out to the novel hot setting conductive adhesive film (as shown in Figure 2) after peeling off two-sided release film: carry out conduction analytical test with high bridge tester, after at adhesive film upper and lower surface, nickel plating steel disc and FPC are pasted in vacation respectively, pressing is solidified test sample respectively and is crossed conduction resistance data before and after Reflow Soldering, will to the utility model test as embodiment, the conduction result recorded, as comparative example, is embedded in table 1 by the electric conductivity in kind testing common product.
Peeling force analytical test is carried out to the novel hot setting conductive adhesive film (as shown in Figure 2) after peeling off two-sided release film: carry out peeling force analytical test with tensilon, after on upper and lower conductive adhesive layer two sides, nickel plating steel disc and one side CCL are pasted in vacation respectively, test Peel value is taken out in pressing solidification, will to the utility model test as embodiment, the conduction result recorded, as comparative example, is embedded in table 1 by the peeling force of in kind testing its conducting resinl.
Table 1:
As seen from the above table, novel hot setting conductive adhesive film of the present utility model really has good conductive effect and electromagnetic wave shielding performance and has good mechanical strength.
Above-mentioned specification and embodiment are only exemplary illustration principle of the present utility model and effect thereof, are not to restriction of the present utility model.Any creation fallen in the utility model right all belongs to the scope that the utility model is protected.
Claims (9)
1. a novel hot setting conductive adhesive film, it is characterized in that: comprise conductive adhesive layer, thin copper foil layer, lower conductive adhesive layer and release layer, the copper foil layer of described thin copper foil layer to be thickness be 1-12 micron, described thin copper foil layer is on described between conductive adhesive layer and described lower conductive adhesive layer, and described lower conductive adhesive layer is between described thin copper foil layer and release layer.
2. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: the thickness of described upper conductive adhesive layer and described lower conductive adhesive layer is 8-28 micron separately.
3. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: the thickness of described release layer is 25-50 micron.
4. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: described upper conductive adhesive layer and described lower conductive adhesive layer are epoxy resin layer, acrylic resin layer, amido formate resin, silicon rubber resin, poly-to ring dimethylbenzene resin, bismaleimides resin or polyimide resin layer separately.
5. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: described upper conductive adhesive layer and described lower conductive adhesive layer are thermosetting glue-line separately.
6. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: described thin copper foil layer is carrier copper foil, rolled copper foil or electrolytic copper foil.
7. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: described release layer is that PET fluorine moulds release film, PET silicate-containing oil release film, the sub-light release film of PET or PE release film.
8. novel hot setting conductive adhesive film as claimed in claim 1, is characterized in that: described release layer is single-sided parting film or two-sided release film.
9. novel hot setting conductive adhesive film as claimed in claim 8, is characterized in that: described release layer is two-sided release film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520832730.8U CN205124112U (en) | 2015-10-26 | 2015-10-26 | Novel thermoset conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520832730.8U CN205124112U (en) | 2015-10-26 | 2015-10-26 | Novel thermoset conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205124112U true CN205124112U (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520832730.8U Active CN205124112U (en) | 2015-10-26 | 2015-10-26 | Novel thermoset conductive film |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413250A (en) * | 2016-10-12 | 2017-02-15 | 昆山翰辉电子科技有限公司 | Multilayer anisotropic conductive film containing nanowires |
| CN106634668A (en) * | 2016-10-12 | 2017-05-10 | 昆山翰辉电子科技有限公司 | Nano multilayer composite conductive adhesive film and manufacturing method thereof |
| CN106888550A (en) * | 2016-10-12 | 2017-06-23 | 柏弥兰金属化研究股份有限公司 | Metallization flexible base plate and the multilayer circuit board fabrication method using the substrate |
| CN107053776A (en) * | 2017-04-14 | 2017-08-18 | 东莞捷邦实业有限公司 | Mobile phone productses assembling copper-foil conducting electricity component and its production technology, production equipment |
| CN112888097A (en) * | 2021-01-12 | 2021-06-01 | 中国科学院宁波材料技术与工程研究所 | Heating film and preparation method thereof |
| TWI746005B (en) * | 2020-06-11 | 2021-11-11 | 瑋鋒科技股份有限公司 | Manufacturing method of continuous anisotropic conductive adhesive |
-
2015
- 2015-10-26 CN CN201520832730.8U patent/CN205124112U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413250A (en) * | 2016-10-12 | 2017-02-15 | 昆山翰辉电子科技有限公司 | Multilayer anisotropic conductive film containing nanowires |
| CN106634668A (en) * | 2016-10-12 | 2017-05-10 | 昆山翰辉电子科技有限公司 | Nano multilayer composite conductive adhesive film and manufacturing method thereof |
| CN106888550A (en) * | 2016-10-12 | 2017-06-23 | 柏弥兰金属化研究股份有限公司 | Metallization flexible base plate and the multilayer circuit board fabrication method using the substrate |
| CN107053776A (en) * | 2017-04-14 | 2017-08-18 | 东莞捷邦实业有限公司 | Mobile phone productses assembling copper-foil conducting electricity component and its production technology, production equipment |
| CN107053776B (en) * | 2017-04-14 | 2023-08-01 | 捷邦精密科技股份有限公司 | Conductive copper foil assembly for assembling mobile phone product and production process and production equipment thereof |
| TWI746005B (en) * | 2020-06-11 | 2021-11-11 | 瑋鋒科技股份有限公司 | Manufacturing method of continuous anisotropic conductive adhesive |
| CN112888097A (en) * | 2021-01-12 | 2021-06-01 | 中国科学院宁波材料技术与工程研究所 | Heating film and preparation method thereof |
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