CN106413250A - Multilayer anisotropic conductive film containing nanowires - Google Patents
Multilayer anisotropic conductive film containing nanowires Download PDFInfo
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- CN106413250A CN106413250A CN201610889940.XA CN201610889940A CN106413250A CN 106413250 A CN106413250 A CN 106413250A CN 201610889940 A CN201610889940 A CN 201610889940A CN 106413250 A CN106413250 A CN 106413250A
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- nano wire
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- adhesive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
Abstract
The invention relates to a multilayer anisotropic conductive film containing nanowires. The multilayer anisotropic conductive film comprises a first nanowire conductive adhesive layer, a metal layer and a second nanowire conductive adhesive layer, wherein the first nanowire conductive adhesive layer and the second nanowire conductive adhesive layer add a silver nanowire and a copper nanowire in adhesive resin; through the big length-diameter effect of the silver nanowire and the copper nanowire, a product has excellent electrical conductivity and flexibility; and through reasonable proportioning of components of the adhesive resin, the product has good mechanical strength after hot pressing; the metal layer is a thin copper layer plated with gold or silver and has stronger conduction and lower resistivity; moreover, an adopted release film can effectively avoid the adherent phenomenon when the product is rolled. The multilayer anisotropic conductive film has simple product stacking and simple manufacturing method and is suitable for large-scale production. The multilayer anisotropic conductive film containing the nanowires has excellent performances, such as low resistivity, excellent electromagnetic wave shielding property, strong electrical conductivity and excellent flexibility.
Description
Technical field
A kind of the invention belongs to conductive adhesive film technical field, more particularly, it relates to multi-layer nano fiber conductive adhesive film.
Background technology
Anisotropic conductive film is to connect IC chip using conducting particles electrode between the two makes and leads with substrate
Logical, it is avoided that simultaneously again and turns on short circuit between adjacent two electrodes, and reach the only purpose in the conducting of z-axis direction, can solve
The microscopic wire connectivity problem that adapter cannot be processed in the past.
Wherein, for the mostly polyimide copper foil substrate of flexible printed wiring board, typically divide into single sided board or two-sided
Plate.Generally, problem in application for the polyimide copper foil substrate is limited to composition and its thickness of polyimide material.Small electrical
The wiring material of sub- product adopts the flexible printed wiring board (Flexible that design freedom is high, bendability is good mostly
Printed Circuit, hereinafter referred to as FPC), and formulated various while constantly to high speedization, high flexure development
Thickness, the countermeasure of workability.In this case, just the conductive adhesive film for this kind of flexible printed wiring board is proposed higher
Requirement, do not need only have good conduction, preferably electromagnetic wave shielding performance, also should have good flexibility and bending resistance
Folding endurance, only in this way could meet market higher and higher requirement to conductive adhesive film.
Content of the invention
For solving above-mentioned technical problem, it is an object of the invention to provide a kind of different side's conductive adhesive film of multilamellar containing nano wire,
Not only there is resistivity low, electromagnetic wave shielding performance is good to wait excellent properties by force with electric conductivity, and has preferably flexibility.
A kind of different side's conductive adhesive film of multilamellar containing nano wire of the present invention, including the first nano wire conductive adhesive layer, metal level,
Second nano wire conductive adhesive layer and release film layer, described second nano wire conductive adhesive layer is formed above described release film layer, institute
State metal level and be formed above described second nano wire conductive adhesive layer, described first nano wire conductive adhesive layer is formed at described metal
Above layer；Described first nano wire conductive adhesive layer and described second nano wire conductive adhesive layer are all including nano wire and adhesive resin
The material layer of layer；A diameter of 60-100 nanometer of described nano wire, the draw ratio of described nano wire is 200-300；
The thickness of described first nano wire conductive adhesive layer is 25-50 micron；
The thickness of described metal level is 4-8 micron；
The thickness of described second nano wire conductive adhesive layer is 30-60 micron.
Further say, described nano wire includes NANO CRYSTAL COPPER WIRE and nano-silver thread, described adhesive resin layer include ethylene glycol,
Tertiary butyl alcohol, ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent.
Further say, the parts by weight of described each component are as follows：
The number of described NANO CRYSTAL COPPER WIRE is 15-20 part；The number of described nano-silver thread is 20-35 part；Described ethylene glycol
Number is 30-40 part；The number of described tertiary butyl alcohol is 10-25 part；The number of described ethylene waxes is 5-8 part；Described polyaniline
Number be 10-20 part；The number of described butyl titanate is 3-5 part；The number of described acid anhydride type curing agent is 4-7 part.
Further say, described metal level is two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
Further say, the thickness of described release film layer is 30-80 micron.
Further say, described release film layer moulds mould release membrance, PET silicate-containing oil mould release membrance, PET Asia light mould release membrance for PET fluorine
Or PE mould release membrance.
Further say, a diameter of 75-100 nanometer of described nano wire, the draw ratio of described nano wire is 250-300.
Further say, a diameter of 90-100 nanometer of described nano wire, the draw ratio of described nano wire is 280-300.
Further say, a kind of manufacture method of the described different side's conductive adhesive film of multilamellar containing nano wire, according to following steps
Suddenly carry out：
Step one：Described NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol are added three roller batch mixings by weight
Machine, three 80-100 rev/min of roller batch mixer rotating speeds, time 30-40 minute, then standing 1-1.5 hour is so as to mix homogeneously,
Obtain mixture A；
Step 2：Ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three rollers by weight mix
The mixture A that material machine is obtained with step one mixes, three 60-80 rev/min of roller batch mixer rotating speeds, and time 60-90 minute is so as to mix
Close uniformly, then stand 36-48 hour, obtain mixture B；
Step 3：The mixture B that application step two is obtained on release film layer is the second nano wire conductive adhesive layer, adopts
180-220 DEG C of low-temperature setting molding；
Step 4：Using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, obtain metal level；
Step 5：The metal level that step 4 is obtained fits on the second nano wire conductive adhesive layer surface；
Step 6：With coating or transfer printing, the rapid two mixture B being obtained are that the first nano wire conductive adhesive layer is formed at gold
Belong in layer surface, using 80-180 DEG C of low-temperature setting molding, obtain the multilamellar different side conductive adhesive film containing nano wire.
The invention has the beneficial effects as follows：The present invention includes the first nano wire conductive adhesive layer, metal level and the second nano wire and leads
Nano-silver thread is increased in adhesive resin layer contained by electric glue-line, the first nano wire conductive adhesive layer and the second nano wire conductive adhesive layer
And NANO CRYSTAL COPPER WIRE, the big major diameter effect of nano-silver thread and NANO CRYSTAL COPPER WIRE so that the product of the present invention have excellent electric conductivity and
Flexibility, the proportioning of adhesive resin reasonable composition is so that the product of the present invention has good mechanical strength after hot pressing；Gold
Belonging to layer is gold-plated or silver-plated thin copper layer, has higher conduction and lower resistivity；It will be further appreciated that, employing
Mould release membrance can be prevented effectively from product and adherent phenomenon in winding.Multilamellar containing the nano wire different side conducting film of the present invention has
Resistivity is low, the excellent properties such as electromagnetic wave shielding performance is good, electric conductivity is strong and flexibility is good.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, it is described in detail with presently preferred embodiments of the present invention below.
Brief description
Fig. 1 is the structural representation of the present invention；
Fig. 2 is structural representation after peeling off release film layer for the present invention；
The reference of in figure each several part is as follows：
First nano wire conductive adhesive layer 1, metal level 2, the second nano wire conductive adhesive layer 3 and mould release membrance 4.
Specific embodiment
With reference to embodiment, the specific embodiment of the present invention is described in further detail.Following examples are used for
The present invention is described, but is not limited to the scope of the present invention.
Referring to Fig. 1, a kind of different side's conductive adhesive film of the multilamellar containing nano wire of the present invention, conductive including the first nano wire
Glue-line 1, metal level 2, the second nano wire conductive adhesive layer 3 and release film layer 4, described second nano wire conductive adhesive layer 3 is formed at institute
State above release film layer 4, described metal level 2 is formed above described second nano wire conductive adhesive layer 3, and described first nano wire is led
Electric glue-line 1 is formed above described metal level 2；Described first nano wire conductive adhesive layer 1 and described second nano wire conductive adhesive layer 3
It is all the material layer including nano wire and adhesive resin layer；A diameter of 60-100 nanometer of described nano wire, described nano wire
Draw ratio is 200-300.Preferably, a diameter of 75-100 nanometer of described nano wire, the draw ratio of described nano wire is 250-
300.Most preferably, a diameter of 90-100 nanometer of described nano wire, the draw ratio of described nano wire is 280-300；
The thickness of described first nano wire conductive adhesive layer 1 is 25-50 micron；
The thickness of described metal level 2 is 4-8 micron；
The thickness of described second nano wire conductive adhesive layer 3 is 30-60 micron.
Described metal level 2 is two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
The thickness of described release film layer 4 is 30-80 micron.
Described release film layer 4 moulds mould release membrance, PET silicate-containing oil mould release membrance, PET Asia light mould release membrance or PE mould release membrance for PET fluorine.
Embodiment 1 all contains identical structure to embodiment 6, and difference is as follows：
Embodiment 1：A diameter of 60 nanometers of described nano wire, the draw ratio of described nano wire is 280.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 15 parts；The number of described nano-silver thread is 23 parts；The number of described ethylene glycol is 35 parts；The number of described tertiary butyl alcohol
For 12 parts；The number of described ethylene waxes is 6 parts；The number of described polyaniline is 10 parts；The number of described butyl titanate is 3
Part；The number of described acid anhydride type curing agent is 6 parts.
Embodiment 2：A diameter of 70 nanometers of described nano wire, the draw ratio of described nano wire is 300.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 20 parts；The number of described nano-silver thread is 35 parts；The number of described ethylene glycol is 30 parts；The number of described tertiary butyl alcohol
For 23 parts；The number of described ethylene waxes is 5 parts；The number of described polyaniline is 20 parts；The number of described butyl titanate is 5
Part；The number of described acid anhydride type curing agent is 4 parts.
Embodiment 3：A diameter of 75 nanometers of described nano wire, the draw ratio of described nano wire is 250.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 18 parts；The number of described nano-silver thread is 20 parts；The number of described ethylene glycol is 40 parts；The number of described tertiary butyl alcohol
For 25 parts；The number of described ethylene waxes is 8 parts；The number of described polyaniline is 15 parts；The number of described butyl titanate is 4
Part；The number of described acid anhydride type curing agent is 5 parts.
Embodiment 4：A diameter of 60 nanometers of described nano wire, the draw ratio of described nano wire is 200.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 19 parts；The number of described nano-silver thread is 21 parts；The number of described ethylene glycol is 32 parts；The number of described tertiary butyl alcohol
For 10 parts；The number of described ethylene waxes is 7 parts；The number of described polyaniline is 18 parts；The number of described butyl titanate is 5
Part；The number of described acid anhydride type curing agent is 7 parts.
Embodiment 5：A diameter of 100 nanometers of described nano wire, the draw ratio of described nano wire is 290.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 18 parts；The number of described nano-silver thread is 28 parts；The number of described ethylene glycol is 36 parts；The number of described tertiary butyl alcohol
For 15 parts；The number of described ethylene waxes is 6 parts；The number of described polyaniline is 17 parts；The number of described butyl titanate is 4
Part；The number of described acid anhydride type curing agent is 5 parts.
Embodiment 6：A diameter of 95 nanometers of described nano wire, the draw ratio of described nano wire is 260.
Described nano wire includes nano-silver thread and NANO CRYSTAL COPPER WIRE, and described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, second
Alkene wax, polyaniline, butyl titanate and acid anhydride type curing agent.The parts by weight of described each component are as follows：Described NANO CRYSTAL COPPER WIRE
Number is 17 parts；The number of described nano-silver thread is 32 parts；The number of described ethylene glycol is 36 parts；The number of described tertiary butyl alcohol
For 21 parts；The number of described ethylene waxes is 7 parts；The number of described polyaniline is 12 parts；The number of described butyl titanate is 5
Part；The number of described acid anhydride type curing agent is 6 parts.
Embodiment 1 arrives embodiment 6, a kind of manufacture method of the described different side's conductive adhesive film of multilamellar containing nano wire, according to
Following step is carried out：
Step one：Described NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol are added three roller batch mixings by weight
Machine, three 80-100 rev/min of roller batch mixer rotating speeds, time 30-40 minute, then standing 1-1.5 hour is so as to mix homogeneously,
Obtain mixture A；
Step 2：Ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three rollers by weight mix
The mixture A that material machine is obtained with step one mixes, three 60-80 rev/min of roller batch mixer rotating speeds, and time 60-90 minute is so as to mix
Close uniformly, then stand 36-48 hour, obtain mixture B；
Step 3：The mixture B that application step two is obtained on release film layer is the second nano wire conductive adhesive layer, adopts
180-220 DEG C of low-temperature setting molding；
Step 4：Using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, obtain metal level；
Step 5：The metal level that step 4 is obtained fits on the second nano wire conductive adhesive layer surface；
Step 6：With coating or transfer printing, the rapid two mixture B being obtained are that the first nano wire conductive adhesive layer is formed at gold
Belong in layer surface, using 80-180 DEG C of low-temperature setting molding, obtain the multilamellar different side conductive adhesive film containing nano wire.
Conduction analysis is carried out to different side conductive adhesive film of the multilamellar containing nanometer (as shown in Figure 2) peeled off after two-sided mould release membrance
Test：Carry out conduction analysis test with high bridge tester, in the false patch plating respectively of first and second nano wire conductive adhesive layer upper and lower surface
After nickel steel piece and FPC, test sample crosses conduction resistance data before and after Reflow Soldering respectively for pressing solidification, and the present invention will be surveyed
Study as embodiment, in kind the electric conductivity of test common product, as comparative example, the conduction recording result is remembered
Record in table 1.
The different side conductive adhesive film of the multilamellar containing nanometer peeled off after two-sided mould release membrance is carried out with peeling force analysis test：With omnipotent
Puller system carries out peeling force analysis test, in first and second nano wire conductive adhesive layer two sides false patch nickel plating steel disc and Copper Foil base respectively
After plate, pressing solidification is taken out test and is peeled off force value, will test as embodiment to the present invention, and in kind test it and lead
The peeling force of electric glue, as comparative example, the conduction recording result is reported in Table 1 below.
Flexibility test is carried out to the novel nano multilamellar different side conductive adhesive film peeled off after two-sided mould release membrance：Will be using slide unit
Tester is carried out.Test condition：Using voltage：AC220V, tests R angle：0.8mm, frequency：30 beats/min, shift motion：
32mm；To the present invention be tested as embodiment, the flexibility in kind testing its conducting resinl, will used as comparative example
The flexibility result recording is reported in Table 1 below.
Table 1
The different side's conductive adhesive film of a kind of multilamellar containing nano wire that the present invention provides, toasted after, resistance is low and stable, not only
There is good conductive effect and electromagnetic wave shielding performance also has good flexibility and mechanical strength.
The above is only the preferred embodiment of the present invention, is not limited to the present invention it is noted that for this skill
For the those of ordinary skill in art field, on the premise of without departing from the technology of the present invention principle, can also make some improve and
Modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of different side's conductive adhesive film of the multilamellar containing nano wire it is characterised in that：Including the first nano wire conductive adhesive layer, metal
Layer, the second nano wire conductive adhesive layer and release film layer, described second nano wire conductive adhesive layer is formed above described release film layer,
Described metal level is formed above described second nano wire conductive adhesive layer, and described first nano wire conductive adhesive layer is formed at described gold
Belong to above layer；Described first nano wire conductive adhesive layer and described second nano wire conductive adhesive layer are all including nano wire and viscose glue tree
The material layer of lipid layer；A diameter of 60-100 nanometer of described nano wire, the draw ratio of described nano wire is 200-300.
The thickness of described first nano wire conductive adhesive layer is 25-50 micron；
The thickness of described metal level is 4-8 micron；
The thickness of described second nano wire conductive adhesive layer is 30-60 micron.
2. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described nano wire
Including NANO CRYSTAL COPPER WIRE and nano-silver thread, described adhesive resin layer includes ethylene glycol, tertiary butyl alcohol, ethylene waxes, polyaniline, metatitanic acid four
Butyl ester and acid anhydride type curing agent.
3. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 2 it is characterised in that：Described each component
Parts by weight as follows：
The number of described NANO CRYSTAL COPPER WIRE is 15-20 part；The number of described nano-silver thread is 20-35 part；The number of described ethylene glycol
For 30-40 part；The number of described tertiary butyl alcohol is 10-25 part；The number of described ethylene waxes is 5-8 part；Part of described polyaniline
Number is 10-20 part；The number of described butyl titanate is 3-5 part；The number of described acid anhydride type curing agent is 4-7 part.
4. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described metal level
For two-sided gold-plated thin copper layer or two-sided silver-plated thin copper layer.
5. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described mould release membrance
The thickness of layer is 30-80 micron.
6. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described mould release membrance
Layer moulds mould release membrance, PET silicate-containing oil mould release membrance, PET Asia light mould release membrance or PE mould release membrance for PET fluorine.
7. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described nano wire
A diameter of 75-100 nanometer, the draw ratio of described nano wire is 250-300.
8. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 it is characterised in that：Described nano wire
A diameter of 90-100 nanometer, the draw ratio of described nano wire is 280-300.
9. a kind of different side's conductive adhesive film of multilamellar containing nano wire according to claim 1 manufacture method it is characterised in that：
Carry out as steps described below：
Step one：Described NANO CRYSTAL COPPER WIRE, nano-silver thread, ethylene glycol and tertiary butyl alcohol are added three roller batch mixers by weight,
Three 80-100 rev/min of roller batch mixer rotating speeds, time 30-40 minute, then stand 1-1.5 hour so as to mix homogeneously, obtain
Mixture A；
Step 2：Ethylene waxes, polyaniline, butyl titanate and acid anhydride type curing agent are added to three roller batch mixers by weight
The mixture A being obtained with step one is mixed, three 60-80 rev/min of roller batch mixer rotating speeds, and time 60-90 minute is so as to mixing is equal
Even, then stand 36-48 hour, obtain mixture B；
Step 3：The mixture B that application step two is obtained on release film layer is the second nano wire conductive adhesive layer, using 180-
220 DEG C of low-temperature setting molding；
Step 4：Using sputtering vacuum process by thin copper layer surface gold-plating or silver-plated, obtain metal level；
Step 5：The metal level that step 4 is obtained fits on the second nano wire conductive adhesive layer surface；
Step 6：With coating or transfer printing, the rapid two mixture B being obtained are that the first nano wire conductive adhesive layer is formed at metal level
On surface, using 80-180 DEG C of low-temperature setting molding, obtain the multilamellar different side conductive adhesive film containing nano wire.
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| CN112904625A (en) * | 2021-01-25 | 2021-06-04 | 北海惠科光电技术有限公司 | Preparation method of conductive frame glue, conductive frame glue and display panel |
| CN114283965A (en) * | 2021-12-31 | 2022-04-05 | 深圳市华科创智技术有限公司 | Composite conductive slurry and preparation method thereof |
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